TWM448862U - Stacked type ultrasonic transducer apparatus - Google Patents

Stacked type ultrasonic transducer apparatus Download PDF

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Publication number
TWM448862U
TWM448862U TW101216515U TW101216515U TWM448862U TW M448862 U TWM448862 U TW M448862U TW 101216515 U TW101216515 U TW 101216515U TW 101216515 U TW101216515 U TW 101216515U TW M448862 U TWM448862 U TW M448862U
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Taiwan
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hollow
opening
ring
pin
sensor
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TW101216515U
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Chinese (zh)
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Tzu-Chin Tsai
Chiun-Hua Chang
Shih-Feng Lee
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Tung Thih Electronic Co Ltd
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Priority to TW101216515U priority Critical patent/TWM448862U/en
Priority to US13/756,442 priority patent/US8981622B2/en
Priority to EP13154323.3A priority patent/EP2704140A2/en
Priority to JP2013000698U priority patent/JP3183082U/en
Priority to JP2013024147A priority patent/JP5502214B2/en
Publication of TWM448862U publication Critical patent/TWM448862U/en

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Description

堆疊式超聲波傳感器裝置Stacked ultrasonic sensor device

本新型是有關於一種傳感器裝置,特別是指一種將壓電片的感測訊號傳出的堆疊式超聲波傳感器裝置。The present invention relates to a sensor device, and more particularly to a stacked ultrasonic sensor device for transmitting a sensing signal of a piezoelectric sheet.

參閱圖1,台灣專利M433689揭露一種有關超聲波傳感器裝置之先前技術,該超聲波傳感器裝置具有一中空殼體21、一電路板22、一連接管部23,及一設在中空殼體21內的超聲波傳感器24。連接管部23的一端與中空殼體21連接。電路板22上設有三支接腳221(剖面圖僅顯示其中一支),該等接腳221的一端固定在電路板22上,另一端延伸至連接管部23內並朝向連接管部23另一端的開口231。Referring to FIG. 1, Taiwan Patent No. M433689 discloses a prior art related to an ultrasonic sensor device having a hollow housing 21, a circuit board 22, a connecting tube portion 23, and a hollow housing 21. Ultrasonic sensor 24. One end of the connecting pipe portion 23 is connected to the hollow casing 21. The circuit board 22 is provided with three pins 221 (only one of which is shown in cross section). One end of the pins 221 is fixed on the circuit board 22, and the other end extends into the connecting tube portion 23 and faces the connecting tube portion 23. An opening 231 at one end.

參閱圖2,超聲波傳感器24具有一鋁製中空殼體241、一設置在中空殼體241內底面上的壓電片242,一設置在壓電片242上方的轉接電路板243,以及兩條與電路板22電連接的導線244、245。轉接電路板243透過一第一導線246與壓電片242電連接,並透過一第二導線247而與中空殼體241電連接,之後再透過導線244將第一導線246傳輸的訊號送至電路板22,並透過導線245將第二導線247連接至電路板22,以經由電路板22之其中兩支接腳221輸出訊號及接地。Referring to FIG. 2, the ultrasonic sensor 24 has an aluminum hollow casing 241, a piezoelectric piece 242 disposed on the inner bottom surface of the hollow casing 241, a transit circuit board 243 disposed above the piezoelectric piece 242, and Two wires 244, 245 are electrically connected to the circuit board 22. The transit circuit board 243 is electrically connected to the piezoelectric strip 242 through a first wire 246, and is electrically connected to the hollow casing 241 through a second wire 247, and then transmits the signal transmitted by the first wire 246 through the wire 244. The circuit board 22 is connected to the circuit board 22 via the wires 245 to output signals and ground via the two pins 221 of the circuit board 22.

然而,第二導線247與中空殼體241焊接時,由於中空殼體241是鋁製材質,焊點高,不易焊接。此外,壓電片242需透過轉接電路板243與電路板22電連接,不但增 加材料成本及裝設上的步驟,且容易造成訊號衰減,而且除了第一、二導線246、247的兩端需分別焊接外,導線244、255亦需分別與轉接電路板243和電路板22進行焊接,因而增加作業工時及製程複雜度,而使製造成本相對提高。However, when the second wire 247 is welded to the hollow casing 241, since the hollow casing 241 is made of aluminum, the joint is high and it is difficult to weld. In addition, the piezoelectric piece 242 needs to be electrically connected to the circuit board 22 through the transit circuit board 243, which is not only increased. Add material cost and installation steps, and easily cause signal attenuation, and in addition to the two ends of the first and second wires 246, 247 need to be separately soldered, the wires 244, 255 also need to be respectively connected to the transfer circuit board 243 and the circuit board 22 welding, thereby increasing the working hours and process complexity, and relatively increasing the manufacturing cost.

因此,本新型之目的,即在提供一種容易組裝的堆疊式超聲波傳感器裝置,以降低製程複雜度進而降低製造成本。Therefore, the purpose of the present invention is to provide a stacked ultrasonic sensor device that is easy to assemble to reduce process complexity and thereby reduce manufacturing costs.

於是,本新型超聲波傳感器裝置包含一外殼、一傳感器、一固定環,及一電路板。Therefore, the novel ultrasonic sensor device comprises a casing, a sensor, a fixing ring, and a circuit board.

該外殼包括一中空殼體、一自該中空殼體外表面徑向延伸的連接管部,及三支外接腳。該中空殼體具有在一假想的軸線上且相連通的一第一開口及一第二開口。該連接管部具有一遠離該中空殼體的第三開口。該等外接腳固定在該中空殼體內。每一外接腳具有一朝向該第一開口第一端部,及一延伸至該連接管部內並朝向該第三開口的第二端部。The outer casing includes a hollow casing, a connecting pipe portion extending radially from an outer surface of the hollow casing, and three outer legs. The hollow housing has a first opening and a second opening in communication on an imaginary axis. The connecting tube portion has a third opening remote from the hollow housing. The outer legs are secured within the hollow housing. Each of the outer legs has a first end facing the first opening and a second end extending into the connecting tube portion and facing the third opening.

該傳感器設於該外殼之中空殼體的第二開口處。該傳感器包括一底壁、一由該底壁周緣沿該軸線的方向延伸而與該中空殼體接觸結合的圍繞壁,及一置於該底壁面對該中空殼體之表面的壓電片。該圍繞壁具有一沿該軸線的方向延伸並開口朝向該中空殼體的地線孔。The sensor is disposed at a second opening of the hollow housing of the housing. The sensor includes a bottom wall, a surrounding wall extending from the peripheral edge of the bottom wall in the direction of the axis to be in contact with the hollow casing, and a pressure placed on the surface of the bottom wall facing the hollow casing Electric film. The surrounding wall has a ground hole extending in the direction of the axis and opening toward the hollow housing.

該固定環包括一設置於該中空殼體內且鄰近該傳感器 的環本體,及二設置於該環本體的內接腳。該環本體與該外殼相配合固定該傳感器。每一內接腳具有一較鄰近該中空殼體的第一開口的第一端部,及一較鄰近該第二開口的第二端部。該等內接腳的其中之一的第二端部插入該地線孔,該等內接腳的其中之另一支之第二端部與該壓電片電連接。The fixing ring includes a sensor disposed in the hollow housing adjacent to the sensor The ring body and the inner leg of the ring body are disposed. The ring body cooperates with the outer casing to fix the sensor. Each inner leg has a first end that is closer to the first opening of the hollow housing and a second end that is closer to the second opening. A second end of one of the inner legs is inserted into the ground hole, and a second end of the other of the inner legs is electrically connected to the piezoelectric piece.

該電路板設置在該中空殼體的鄰近該第一開口處,並與該等外接腳之第一端部及該等內接腳之第一端部電連接。The circuit board is disposed adjacent to the first opening of the hollow housing and is electrically connected to the first end of the external legs and the first end of the inner legs.

較佳地,該外殼的中空殼體還具有一設置於該第二開口處而使該第二開口之口徑縮小並具有彈性的第一減震環。該固定環還包括一設置該環本體鄰近該傳感器的一側並具有彈性的第二減震環。該傳感器的圍繞壁具有一自靠第一開口之一側徑向向外延伸,並夾固於該第一減震環與該第二減震環之間的限位凸緣。Preferably, the hollow casing of the outer casing further has a first damper ring disposed at the second opening to reduce the diameter and elasticity of the second opening. The retaining ring further includes a second damper ring that is disposed on a side of the ring body adjacent to the sensor and has elasticity. The surrounding wall of the sensor has a limiting flange extending radially outward from one side of the first opening and being clamped between the first damper ring and the second damper ring.

較佳地,該中空殼體還包括至少一形成於內周面且沿該軸線方向延伸的限位滑槽。該固定環還包括至少一設置於該固定環的環本體外周面並可滑設於該限位滑槽,以限制該固定環沿該軸線方向位移的限位凸塊。Preferably, the hollow housing further includes at least one limiting chute formed on the inner circumferential surface and extending in the axial direction. The fixing ring further includes at least one outer peripheral surface of the ring disposed on the fixing ring and slidably disposed on the limiting sliding slot to limit the limiting protrusion of the fixing ring displaced along the axial direction.

較佳地,定義該固定環的該等內接腳中,第二端部插入該傳感器之地線孔的該內接腳是一第一地線接腳,另一支與該壓電片電連接的該內接腳是一第一訊號接腳。定義該中空殼體的該等外接腳分別是一第二訊號接腳、一第二地線接腳及一電源接腳。該電路板開設有五個穿孔供每一 內接腳的第一端部與每一外接腳的第一端部穿設並電連接。該固定環的該第一訊號接腳輸出一來自該壓電片的感測訊號給該電路板,並經該電路板處理後輸出至該中空殼體的該第二訊號接腳。該第一地線接腳透過該電路板與該第二地線接腳電連接。該電源接腳供給電力給該電路板。Preferably, among the inner pins of the fixing ring, the inner leg of the second end portion inserted into the ground hole of the sensor is a first ground pin, and the other end is electrically connected to the piezoelectric plate. The connected internal pin is a first signal pin. The external pins defining the hollow housing are a second signal pin, a second ground pin and a power pin, respectively. The board has five perforations for each The first end of the inner leg is threaded and electrically connected to the first end of each outer leg. The first signal pin of the fixing ring outputs a sensing signal from the piezoelectric piece to the circuit board, and is processed by the circuit board and output to the second signal pin of the hollow casing. The first ground pin is electrically connected to the second ground pin through the circuit board. The power pin supplies power to the board.

較佳地,該傳感器的底壁與圍繞壁相配合界定出一中空容室。該中空容室灌注一封裝膠,該封裝膠固化而將該壓電片封裝在傳感器內。Preferably, the bottom wall of the sensor cooperates with the surrounding wall to define a hollow chamber. The hollow chamber is filled with an encapsulant, and the encapsulant is cured to encapsulate the piezoelectric sheet in the sensor.

較佳地,該傳感器還包括一壓住該壓電片並用以吸震用的泡棉。Preferably, the sensor further comprises a foam for pressing the piezoelectric sheet and for absorbing the shock.

更佳地,該傳感器的底壁與圍繞壁相配合界定出一中空容室,該中空容室灌注一封裝膠,該封裝膠固化而將該壓電片及該泡棉封裝在傳感器內。More preferably, the bottom wall of the sensor cooperates with the surrounding wall to define a hollow chamber, which is filled with an encapsulant, and the encapsulant is cured to encapsulate the piezoelectric sheet and the foam in the sensor.

較佳地,該中空殼體內還灌注一封裝膠,該封裝膠固化而將該電路板及該固定環封裝在該中空殼體內。Preferably, the encapsulating glue is further filled in the hollow casing, and the encapsulant is cured to encapsulate the circuit board and the fixing ring in the hollow casing.

本新型之功效在於:利用該固定環將該傳感器固定於該外殼的中空殼體內,使的本新型超聲波傳感器裝置的組裝步驟精簡,同時也減少元件數,達到有效提高製造速度並降低製造成本。The utility model has the advantages that the fixing ring is fixed in the hollow casing of the outer casing, the assembly step of the novel ultrasonic sensor device is simplified, and the number of components is also reduced, thereby effectively improving the manufacturing speed and reducing the manufacturing cost. .

有關本新型之前述及其他技術內容、特點與功效,在以下配合參考圖式之一個較佳實施例的詳細說明中,將可清楚地呈現。The foregoing and other technical aspects, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

參閱圖3及圖5,本新型堆疊式超聲波傳感器裝置之 一較佳實施例包含一外殼3、一傳感器4、一固定環5,及一電路板6。Referring to FIG. 3 and FIG. 5, the stacked ultrasonic sensor device of the present invention A preferred embodiment includes a housing 3, a sensor 4, a retaining ring 5, and a circuit board 6.

外殼3包括一中空殼體31、一連接管部32,及三支外接腳33、34、35。中空殼體31具有在一假想的軸線30上且相連通的一第一開口311及一第二開口312,及一具有彈性的第一減震環314。第一減震環314是設置於第二開口312處而使該第二開口312之口徑縮小。中空殼體31還具有三形成於內周面且沿軸線30的方向延伸的限位滑槽313。連接管部32自中空殼體31外表面徑向延伸出。連接管部32具有一遠離中空殼體31的第三開口321。該等外接腳33、34、35固定在中空殼體31內。每一外接腳33、34、35具有一朝向該第一開口311的第一端部331、341、351,及一延伸至連接管部32內並朝向第三開口321的第二端部342(僅於圖5中顯示出外接腳34的第二端部342)。The outer casing 3 includes a hollow casing 31, a connecting pipe portion 32, and three outer legs 33, 34, 35. The hollow casing 31 has a first opening 311 and a second opening 312 connected to an imaginary axis 30, and a first shock absorbing ring 314 having elasticity. The first damper ring 314 is disposed at the second opening 312 to reduce the diameter of the second opening 312. The hollow casing 31 also has three limit chutes 313 formed on the inner peripheral surface and extending in the direction of the axis 30. The connecting pipe portion 32 extends radially from the outer surface of the hollow casing 31. The connecting pipe portion 32 has a third opening 321 away from the hollow casing 31. The outer legs 33, 34, 35 are fixed in the hollow casing 31. Each of the outer legs 33, 34, 35 has a first end portion 331, 341, 351 facing the first opening 311, and a second end portion 342 extending into the connecting tube portion 32 and facing the third opening 321 ( Only the second end 342) of the outer leg 34 is shown in FIG.

傳感器4設於外殼3的中空殼體31的第一減震環314處。傳感器4包括一底壁41、一圍繞壁42、一壓電片43,及一吸震用的泡棉45。底壁41的外徑與中空殼體31的第一減震環314的內徑相符合。圍繞壁42自底壁41周緣沿軸線30的方向延伸。圍繞壁42具有一自靠近中空殼體31的第一開口311之一側徑向向外延伸的限位凸緣421。圍繞壁42還具有一沿軸線30的方向延伸並開口朝向中空殼體31的地線孔44。底壁41與圍繞壁42相配合界定出一中空容室40。壓電片43置於中空容室40內並接觸於底壁41面對中空殼體31之表面。泡棉45置於中空容室40內並壓住壓電片43。The sensor 4 is provided at the first damping ring 314 of the hollow casing 31 of the outer casing 3. The sensor 4 includes a bottom wall 41, a surrounding wall 42, a piezoelectric sheet 43, and a shock absorbing foam 45. The outer diameter of the bottom wall 41 conforms to the inner diameter of the first damper ring 314 of the hollow casing 31. The surrounding wall 42 extends from the periphery of the bottom wall 41 in the direction of the axis 30. The surrounding wall 42 has a stop flange 421 extending radially outward from one side of the first opening 311 of the hollow housing 31. The surrounding wall 42 also has a ground hole 44 extending in the direction of the axis 30 and opening toward the hollow casing 31. The bottom wall 41 cooperates with the surrounding wall 42 to define a hollow chamber 40. The piezoelectric sheet 43 is placed in the hollow chamber 40 and is in contact with the bottom wall 41 to face the surface of the hollow casing 31. The foam 45 is placed in the hollow chamber 40 and pressed against the piezoelectric sheet 43.

固定環5包括一環本體51、一第二減震環52、二內接腳53、54及三限位凸塊55。環本體51設置於中空殼體31內並且鄰近傳感器4。第二減震環52設置於環本體51靠近傳感器4的一側,且第二減震環52的內徑與中空殼體31的第一減震環314的內徑一樣。第二減震環52與中空殼體31的第一減震環314相互配合而將傳感器4的圍繞壁42的限位凸緣421夾設固定其中。該等內接腳53、54設置於環本體51中。每一支內接腳53、54具有一較鄰近中空殼體31的第一開口311的第一端部531、541,及一較鄰近該第二開口312的第二端部532、542。其中一支內接腳53的第二端部532插入傳感器4的圍繞壁42的地線孔44並與地線孔44相互接觸,另一支內接腳54的第二端部542則以打線方式與傳感器4的壓電片43電連接,但不以打線電連接方式為限,也可以直接接觸而電連接。The fixing ring 5 includes a ring body 51, a second damper ring 52, two inner pins 53, 54 and three limiting bumps 55. The ring body 51 is disposed within the hollow housing 31 and adjacent to the sensor 4. The second damper ring 52 is disposed on a side of the ring body 51 close to the sensor 4, and the inner diameter of the second damper ring 52 is the same as the inner diameter of the first damper ring 314 of the hollow casing 31. The second damper ring 52 cooperates with the first damper ring 314 of the hollow housing 31 to clamp the limiting flange 421 of the sensor wall 4 around the wall 42 therein. The inner pins 53, 54 are disposed in the ring body 51. Each of the inner legs 53, 54 has a first end 531, 541 that is closer to the first opening 311 of the hollow housing 31, and a second end 532, 542 that is closer to the second opening 312. The second end portion 532 of one of the inner legs 53 is inserted into the ground hole 44 of the sensor 4 surrounding the wall 42 and is in contact with the ground hole 44, and the second end portion 542 of the other inner pin 54 is lined. The method is electrically connected to the piezoelectric piece 43 of the sensor 4, but it is not limited to the wire bonding method, and may be directly connected and electrically connected.

參閱圖3及圖6,該等限位凸塊55設置於環本體51外周面,並可在中空殼體31的限位滑槽313中相對滑移。藉由該限位凸塊55與限位滑槽313的配合關係限制固定環5僅可沿軸線30的方向移動。Referring to FIGS. 3 and 6 , the limiting protrusions 55 are disposed on the outer circumferential surface of the ring body 51 and are relatively slidable in the limiting sliding slots 313 of the hollow housing 31 . The engagement of the limiting projection 55 with the limiting slot 313 limits the movement of the retaining ring 5 only in the direction of the axis 30.

參閱圖4及圖5,電路板6上形成五個穿孔61。電路板6是設置在外殼3的中空殼體31鄰近第一開口311處。該等外接腳33、34、35之第一端部331、341、351及該等內接腳53、54之第一端部531、541分別插固於該等穿孔61並與電路板6電連接。Referring to Figures 4 and 5, five perforations 61 are formed in the circuit board 6. The circuit board 6 is disposed adjacent to the first opening 311 of the hollow casing 31 of the outer casing 3. The first ends 331 , 341 , 351 of the external legs 33 , 34 , 35 and the first ends 531 , 541 of the internal pins 53 , 54 are respectively inserted in the through holes 61 and electrically connected to the circuit board 6 . connection.

在本較佳實施例中,定義該固定環5的該等內接腳53 、54中,以第二端部532插入傳感器4的圍繞壁42的地線孔44者,也就是圖中內接腳53是一第一地線接腳53;另一支內接腳54是一第一訊號接腳54。定義中空殼體31的該等外接腳33、34、35分別是一第二地線接腳33、一第二訊號接腳34,及一電源接腳35。壓電片43的感測訊號透過第一訊號接腳54傳送給電路板6,並經電路板6處理後輸出至第二訊號接腳34。第一地線接腳53透過電路板6與第二地線接腳33電連接。電源接腳35則供給電力給電路板6。In the preferred embodiment, the inner legs 53 of the retaining ring 5 are defined In FIG. 54, the second end portion 532 is inserted into the grounding hole 44 of the sensor 4 surrounding the wall 42, that is, the inner connecting pin 53 is a first grounding pin 53; the other inner connecting pin 54 is A first signal pin 54. The external pins 33, 34, 35 defining the hollow housing 31 are a second ground pin 33, a second signal pin 34, and a power pin 35, respectively. The sensing signal of the piezoelectric sheet 43 is transmitted to the circuit board 6 through the first signal pin 54 and processed by the circuit board 6 to be output to the second signal pin 34. The first ground pin 53 is electrically connected to the second ground pin 33 through the circuit board 6. The power pin 35 supplies power to the circuit board 6.

本新型堆疊式超聲波傳感器裝置之組裝步驟是先將傳感器4自外殼3的中空殼體31的第一開口311放入中空殼體31中,再將固定環5順著限位滑槽313滑入中空殼體31內進而將傳感器4夾固。固定環5的第一地線接腳53的第二端部532插入傳感器4之圍繞壁42的地線孔44中並與地線孔44連接,再使固定環5的第一訊號接腳54的第二端部542與傳感器4的壓電片43電連接,最後再將電路板6置入中空殼體31內,讓外殼3的該等外接腳33、34、35及固定環5的該等內接腳53、54分別插固在電路板6的該等穿孔61中並與電路板6電連接。The assembling step of the stacked ultrasonic sensor device of the present invention firstly inserts the sensor 4 into the hollow casing 31 from the first opening 311 of the hollow casing 31 of the outer casing 3, and then follows the retaining ring 5 along the limiting chute 313. Slide into the hollow housing 31 to clamp the sensor 4. The second end portion 532 of the first grounding pin 53 of the fixing ring 5 is inserted into the grounding hole 44 of the sensor 4 surrounding the wall 42 and connected to the grounding hole 44, and then the first signal pin 54 of the fixing ring 5 is connected. The second end portion 542 is electrically connected to the piezoelectric piece 43 of the sensor 4, and finally the circuit board 6 is placed in the hollow casing 31, so that the external pins 33, 34, 35 of the outer casing 3 and the fixing ring 5 are The inner pins 53, 54 are respectively inserted into the through holes 61 of the circuit board 6 and electrically connected to the circuit board 6.

於本較佳實施例中,在組裝完成後還可以在傳感器4的中空容室40裡灌注一封裝膠(圖未示),當封裝膠固化後,可將壓電片43及泡棉45封裝在傳感器4內。此外也可在外殼3的中空殼體31內灌注封裝膠,當封裝膠固化後,可將電路板6及固定環5封裝在中空殼體31內。In the preferred embodiment, after the assembly is completed, a package adhesive (not shown) may be poured into the hollow chamber 40 of the sensor 4. After the package is cured, the piezoelectric sheet 43 and the foam 45 may be packaged. In the sensor 4. In addition, the encapsulant can be filled in the hollow casing 31 of the outer casing 3. When the encapsulant is cured, the circuit board 6 and the fixing ring 5 can be encapsulated in the hollow casing 31.

綜上所述,藉由中空殼件與固定環的設置,以及傳感 器外型的設計,即可將傳感器固定在中空殼建中的效果,再搭配該等內接腳及該等外接腳的設置,讓電路板的裝設不需要其他的電線,達到組裝步驟精簡且元件數量減少的效果,故確實能達成本新型之目的。In summary, by the arrangement of the hollow shell and the retaining ring, and sensing The design of the external shape can fix the sensor in the construction of the hollow shell, and then the internal pins and the arrangement of the external pins can be used to make the circuit board installation without other wires, and the assembly steps are completed. The purpose of this novel is indeed achieved by streamlining and reducing the number of components.

惟以上所述者,僅為本新型之較佳實施例而已,當不能以此限定本新型實施之範圍,即大凡依本新型申請專利範圍及新型說明內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent.

【先前技術的元件符號】[Pre-Technical Component Symbols]

21‧‧‧中空殼體21‧‧‧ hollow housing

22‧‧‧電路板22‧‧‧ Circuit board

221‧‧‧接腳221‧‧‧ feet

23‧‧‧連接管部23‧‧‧Connected pipe department

231‧‧‧開口231‧‧‧ openings

24‧‧‧超聲波傳感器24‧‧‧ ultrasonic sensor

241‧‧‧中空殼體241‧‧‧ hollow housing

242‧‧‧壓電片242‧‧‧ Piezo Pieces

243‧‧‧轉接電路板243‧‧‧Transfer board

244‧‧‧導線244‧‧‧ wire

245‧‧‧導線245‧‧‧Wire

246‧‧‧第一導線246‧‧‧First wire

247‧‧‧第二導線247‧‧‧second wire

【本新型的主要元件】[Main components of this new model]

3‧‧‧外殼3‧‧‧ Shell

30‧‧‧軸線30‧‧‧ axis

31‧‧‧中空殼體31‧‧‧ hollow shell

311‧‧‧第一開口311‧‧‧ first opening

312‧‧‧第二開口312‧‧‧ second opening

313‧‧‧限位滑槽313‧‧‧Limit chute

314‧‧‧第一減震環314‧‧‧First damping ring

32‧‧‧連接管部32‧‧‧Connected pipe department

321‧‧‧第三開口321‧‧‧ third opening

33‧‧‧外接腳(第二地線接腳)33‧‧‧External feet (second ground pin)

331‧‧‧第一端部331‧‧‧ first end

332‧‧‧第二端部332‧‧‧ second end

34‧‧‧外接腳(第二訊號接腳)34‧‧‧External pin (second signal pin)

341‧‧‧第一端部341‧‧‧ first end

342‧‧‧第二端部342‧‧‧second end

35‧‧‧外接腳(電源接腳)35‧‧‧External pin (power pin)

351‧‧‧第一端部351‧‧‧ first end

352‧‧‧第二端部352‧‧‧ second end

4‧‧‧傳感器4‧‧‧ sensor

40‧‧‧中空容室40‧‧‧ hollow room

41‧‧‧底壁41‧‧‧ bottom wall

42‧‧‧圍繞壁42‧‧‧ Around the wall

421‧‧‧限位凸緣421‧‧‧Limited flange

43‧‧‧壓電片43‧‧‧ Piezo Pieces

44‧‧‧地線孔44‧‧‧ Ground hole

45‧‧‧泡棉45‧‧•foam

5‧‧‧固定環5‧‧‧Fixed ring

51‧‧‧環本體51‧‧‧ Ring Ontology

52‧‧‧第二減震環52‧‧‧Second damping ring

53‧‧‧內接腳(第一地線接腳)53‧‧‧Internal pin (first ground pin)

531‧‧‧第一端部531‧‧‧First end

532‧‧‧第二端部532‧‧‧second end

54‧‧‧內接腳(第一訊號接腳)54‧‧‧Internal pin (first signal pin)

541‧‧‧第一端部541‧‧‧ first end

542‧‧‧第二端部542‧‧‧second end

55‧‧‧限位凸塊55‧‧‧ Limit bumps

6‧‧‧電路板6‧‧‧Circuit board

61‧‧‧穿孔61‧‧‧Perforation

圖1是一剖視圖,說明一習知超聲波傳感器裝置;圖2是一剖視圖,說明該習知的一傳感器;圖3是一立體分解圖,說明本新型堆疊式超聲波傳感器裝置的一較佳實施例;圖4是一俯視圖,說明該較佳實施例;圖5是一圖4中I-I剖線所取的剖視圖,說明該較佳實施例的各元件關係;及圖6是一俯視圖,未顯示該較佳實施例中的一電路板以顯示各元件間的關係。1 is a cross-sectional view showing a conventional ultrasonic sensor device; FIG. 2 is a cross-sectional view showing the conventional sensor; FIG. 3 is an exploded perspective view showing a preferred embodiment of the stacked ultrasonic sensor device of the present invention. Figure 4 is a plan view showing the preferred embodiment; Figure 5 is a cross-sectional view taken along line II of Figure 4, illustrating the relationship of the components of the preferred embodiment; and Figure 6 is a top view, not shown A circuit board in the preferred embodiment to show the relationship between the various components.

3‧‧‧外殼3‧‧‧ Shell

30‧‧‧軸線30‧‧‧ axis

31‧‧‧中空殼體31‧‧‧ hollow shell

311‧‧‧第一開口311‧‧‧ first opening

313‧‧‧限位滑槽313‧‧‧Limit chute

314‧‧‧第一減震環314‧‧‧First damping ring

32‧‧‧連接管部32‧‧‧Connected pipe department

33‧‧‧外接腳(第二地線接腳)33‧‧‧External feet (second ground pin)

331‧‧‧第一端部331‧‧‧ first end

34‧‧‧外接腳(第二訊號接腳)34‧‧‧External pin (second signal pin)

341‧‧‧第一端部341‧‧‧ first end

35‧‧‧外接腳(電源接腳)35‧‧‧External pin (power pin)

351‧‧‧第一端部351‧‧‧ first end

4‧‧‧傳感器4‧‧‧ sensor

40‧‧‧中空容室40‧‧‧ hollow room

41‧‧‧底壁41‧‧‧ bottom wall

42‧‧‧圍繞壁42‧‧‧ Around the wall

421‧‧‧限位凸緣421‧‧‧Limited flange

43‧‧‧壓電片43‧‧‧ Piezo Pieces

44‧‧‧地線孔44‧‧‧ Ground hole

45‧‧‧泡棉45‧‧•foam

5‧‧‧固定環5‧‧‧Fixed ring

51‧‧‧環本體51‧‧‧ Ring Ontology

52‧‧‧第二減震環52‧‧‧Second damping ring

53‧‧‧內接腳(第一地線接腳)53‧‧‧Internal pin (first ground pin)

531‧‧‧第一端部531‧‧‧First end

532‧‧‧第二端部532‧‧‧second end

54‧‧‧內接腳(第一訊號接腳)54‧‧‧Internal pin (first signal pin)

541‧‧‧第一端部541‧‧‧ first end

542‧‧‧第二端部542‧‧‧second end

55‧‧‧限位凸塊55‧‧‧ Limit bumps

6‧‧‧電路板6‧‧‧Circuit board

61‧‧‧穿孔61‧‧‧Perforation

Claims (8)

一種堆疊式超聲波傳感器裝置,包含:一外殼,包括一中空殼體、一自該中空殼體外表面徑向延伸的連接管部,及三支外接腳,該中空殼體具有在一假想的軸線上且相連通的一第一開口及一第二開口,該連接管部具有一遠離該中空殼體的第三開口,該等外接腳固定在該中空殼體內,每一外接腳具有一朝向該第一開口的第一端部,及一延伸至該連接管部內並朝向該第三開口的第二端部;一傳感器,設於該外殼之中空殼體的第二開口處,該傳感器包括一底壁、一由該底壁周緣沿該軸線的方向延伸而與該中空殼體接觸結合的圍繞壁,及一置於該底壁面對該中空殼體之表面的壓電片,該圍繞壁具有一沿該軸線的方向延伸並開口朝向該中空殼體的地線孔;一固定環,包括一設置於該中空殼體內且鄰近該傳感器的環本體,及二設置於該環本體的內接腳,該環本體與該外殼相配合固定該傳感器,每一內接腳具有一較鄰近該中空殼體的第一開口的第一端部,及一較鄰近該第二開口的第二端部,該等內接腳的其中之一的第二端部插入該地線孔,該等內接腳的其中之另一支之第二端部與該壓電片電連接;及一電路板,設置在該中空殼體的鄰近該第一開口處,並與該等外接腳之第一端部及該等內接腳之第一端部電連接。 A stacked ultrasonic sensor device comprising: a casing comprising a hollow casing, a connecting pipe portion extending radially from an outer surface of the hollow casing, and three external legs, the hollow casing having an imaginary a first opening and a second opening on the axis of the connecting tube, the connecting tube portion has a third opening away from the hollow housing, the external legs are fixed in the hollow housing, each external pin Having a first end facing the first opening and a second end extending into the connecting tube portion and facing the third opening; a sensor disposed at the second opening of the hollow casing of the outer casing The sensor includes a bottom wall, a surrounding wall extending from the peripheral edge of the bottom wall in the direction of the axis to be in contact with the hollow casing, and a surface disposed on the surface of the bottom wall facing the hollow casing a piezoelectric sheet, the surrounding wall has a ground hole extending in a direction of the axis and opening toward the hollow casing; a fixing ring comprising a ring body disposed in the hollow casing adjacent to the sensor, and Second, the inner pin of the ring body is disposed, and the ring is Fixing the sensor in cooperation with the outer casing, each inner leg having a first end adjacent to the first opening of the hollow housing, and a second end adjacent to the second opening, the inner end a second end of one of the pins is inserted into the ground hole, and a second end of the other of the inner pins is electrically connected to the piezoelectric piece; and a circuit board is disposed therein The empty housing is adjacent to the first opening and is electrically connected to the first end of the outer legs and the first end of the inner legs. 根據申請專利範圍第1項所述堆疊式超聲波傳感器裝置,其中,該外殼的中空殼體還具有一設置於該第二開口處而使該第二開口之口徑縮小並具有彈性的第一減震環,該固定環還包括一設置該環本體鄰近該傳感器的一側並具有彈性的第二減震環,該傳感器的圍繞壁具有一自靠第一開口之一側徑向向外延伸,並夾固於該第一減震環與該第二減震環之間的限位凸緣。 The stacked ultrasonic sensor device according to claim 1, wherein the hollow casing of the outer casing further has a first reduction provided at the second opening to reduce the diameter of the second opening and have elasticity. a vibration ring, the fixing ring further includes a second damper ring having a side of the ring body adjacent to the sensor and having elasticity, the surrounding wall of the sensor has a radially outward extension from a side of the first opening, And a limiting flange is clamped between the first damping ring and the second damping ring. 根據申請專利範圍第1項所述堆疊式超聲波傳感器裝置,其中,該中空殼體還包括至少一形成於內周面且沿該軸線方向延伸的限位滑槽;該固定環還包括至少一設置於該固定環的環本體外周面並可滑設於該限位滑槽,以限制該固定環沿該軸線方向位移的限位凸塊。 The stacked ultrasonic sensor device according to claim 1, wherein the hollow housing further includes at least one limiting chute formed on the inner circumferential surface and extending in the axial direction; the fixing ring further comprising at least one And disposed on the outer peripheral surface of the ring of the retaining ring and slidably disposed on the limiting slot to limit the limiting protrusion of the retaining ring displaced along the axial direction. 根據申請專利範圍第1項所述堆疊式超聲波傳感器裝置,其中,定義該固定環的該等內接腳中,第二端部插入該傳感器之地線孔的該內接腳是一第一地線接腳,另一支與該壓電片電連接的該內接腳是一第一訊號接腳,定義該中空殼體的該等外接腳分別是一第二訊號接腳、一第二地線接腳及一電源接腳,該電路板開設有五個穿孔供每一內接腳的第一端部與每一外接腳的第一端部穿設並電連接,該固定環的該第一訊號接腳輸出一來自該壓電片的感測訊號給該電路板,並經該電路板處理後輸出至該中空殼體的該第二訊號接腳,該第一地線接腳透過該電路板與該第二地線接腳電連接, 該電源接腳供給電力給該電路板。The stacked ultrasonic sensor device according to claim 1, wherein the inner leg of the inner leg defining the fixing ring is inserted into the grounding hole of the sensor is a first ground a wire pin, the other inner pin electrically connected to the piezoelectric piece is a first signal pin, and the external pins defining the hollow case are respectively a second signal pin and a second a grounding pin and a power pin, the circuit board is provided with five through holes for the first end of each inner leg to be through and electrically connected to the first end of each outer leg, the fixing ring of the fixing ring The first signal pin outputs a sensing signal from the piezoelectric piece to the circuit board, and is processed by the circuit board and output to the second signal pin of the hollow casing, the first grounding pin Electrically connecting to the second ground pin through the circuit board, The power pin supplies power to the board. 根據申請專利範圍第1項所述堆疊式超聲波傳感器裝置,其中,該傳感器的底壁與圍繞壁相配合界定出一中空容室,該中空容室灌注一封裝膠,該封裝膠固化而將該壓電片封裝在傳感器內。The stacked ultrasonic sensor device according to claim 1, wherein the bottom wall of the sensor cooperates with the surrounding wall to define a hollow chamber, the hollow chamber is filled with an encapsulant, and the encapsulant is cured to The piezoelectric sheet is encapsulated within the sensor. 根據申請專利範圍第1項所述堆疊式超聲波傳感器裝置,其中,該傳感器還包括一壓住該壓電片並用以吸震用的泡棉。The stacked ultrasonic sensor device according to claim 1, wherein the sensor further comprises a foam for pressing the piezoelectric sheet and for absorbing the shock. 根據申請專利範圍第6項所述堆疊式超聲波傳感器裝置,其中,該傳感器的底壁與圍繞壁相配合界定出一中空容室,該中空容室灌注一封裝膠,該封裝膠固化而將該壓電片及該泡棉封裝在傳感器內。The stacked ultrasonic sensor device according to claim 6, wherein the bottom wall of the sensor cooperates with the surrounding wall to define a hollow chamber, and the hollow chamber is filled with an encapsulant, and the encapsulant is cured to The piezoelectric sheet and the foam are encapsulated in a sensor. 根據申請專利範圍第1項所述堆疊式超聲波傳感器裝置,其中,該中空殼體內還灌注一封裝膠,該封裝膠固化而將該電路板及該固定環封裝在該中空殼體內。The stacked ultrasonic sensor device according to claim 1, wherein the hollow housing is further filled with a potting glue, and the encapsulant is cured to encapsulate the circuit board and the fixing ring in the hollow housing.
TW101216515U 2012-08-28 2012-08-28 Stacked type ultrasonic transducer apparatus TWM448862U (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW101216515U TWM448862U (en) 2012-08-28 2012-08-28 Stacked type ultrasonic transducer apparatus
US13/756,442 US8981622B2 (en) 2012-08-28 2013-01-31 Ultrasonic sensor device
EP13154323.3A EP2704140A2 (en) 2012-08-28 2013-02-07 Ultrasonic sensor device
JP2013000698U JP3183082U (en) 2012-08-28 2013-02-12 Ultrasonic sensor device
JP2013024147A JP5502214B2 (en) 2012-08-28 2013-02-12 Ultrasonic sensor device

Applications Claiming Priority (1)

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TW101216515U TWM448862U (en) 2012-08-28 2012-08-28 Stacked type ultrasonic transducer apparatus

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TWM448862U true TWM448862U (en) 2013-03-11

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