TWM446868U - Light bulb heat dissipation device - Google Patents
Light bulb heat dissipation device Download PDFInfo
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- TWM446868U TWM446868U TW101213291U TW101213291U TWM446868U TW M446868 U TWM446868 U TW M446868U TW 101213291 U TW101213291 U TW 101213291U TW 101213291 U TW101213291 U TW 101213291U TW M446868 U TWM446868 U TW M446868U
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- heat dissipation
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
本創作係關於一種燈具散熱裝置,特別是關於一種結合於球泡燈之球泡燈散熱裝置。The present invention relates to a heat sink for a lamp, and more particularly to a bulb heat sink combined with a bulb lamp.
現今照明設施的種類繁多,其中利用電能發光之照明設備皆避免不了的同時產生散熱問題。舉例而言,發光二極體(Light Emitting Diode,簡稱LED)發光雖然具有體積小、驅動電壓低、反應速率快、耐震性特佳、顏色多樣化、點燈速度快、不會產生影像殘留,而且壽命較傳統燈泡長50~100倍之許多優點。然而,發光二極體燈泡在實現上述種種之優點時,也必然會產生高熱能的問題。散熱不佳,不但會因為LED內部量子轉換效率降低而造成亮度降低,還會因熱會降低封裝材料壽命進而影響產品的可靠性。Nowadays, there are many kinds of lighting facilities, and the lighting equipment that utilizes electric energy illumination can not avoid the heat dissipation problem at the same time. For example, Light Emitting Diode (LED) light has small volume, low driving voltage, fast reaction rate, excellent shock resistance, diversified colors, fast lighting speed, and no image sticking. And the life expectancy is 50 to 100 times longer than traditional bulbs. However, when the light-emitting diode bulb achieves the above various advantages, it also inevitably generates a problem of high thermal energy. Poor heat dissipation will not only reduce the brightness due to the lower internal quantum conversion efficiency of the LED, but also reduce the life of the package material due to heat and affect the reliability of the product.
為了改善照明設備的散熱問題,如何設計出提升散熱效率的散熱裝置一直是非常重要之課題。In order to improve the heat dissipation of lighting equipment, how to design a heat sink that improves heat dissipation efficiency has always been a very important issue.
習知的球泡燈散熱裝置是將驅動電路置於塑膠筒並貼附於一導體散熱座內或是將驅動電路以熱縮套管包覆後置於導體散熱座內,導體散熱座同時與球泡燈之發光電路及驅動電路相連接,兩者所產生的熱皆透過導體散熱座散熱。此種方式造成驅動電路所產生的熱導入導體散熱座後,會影響發光電路將熱傳導至導體散熱座,使得球泡燈散熱不易。The conventional bulb cooling device places the driving circuit in a plastic tube and is attached to a conductor heat sink or the driving circuit is covered by a heat shrink sleeve and placed in a conductor heat sink. The conductor heat sink is simultaneously The light-emitting circuit of the bulb and the driving circuit are connected, and the heat generated by both of them is radiated through the heat sink of the conductor. In this way, after the heat generated by the driving circuit is introduced into the heat sink of the conductor, the light-emitting circuit is caused to conduct heat to the heat sink of the conductor, so that the heat dissipation of the bulb is not easy.
緣此,本創作之目的即是提供一種球泡燈散熱裝置,其改善習知技術之問題,以達到較佳的散熱效果。Therefore, the purpose of the present invention is to provide a bulb heat sink that improves the problems of the prior art to achieve better heat dissipation.
本創作為解決習知技術之問題所採用之技術手段為一種球泡燈散熱裝置,結合於一球泡燈,球泡燈具有一發光電路部以及一電連接發光電路部的驅動電路部,其中球泡燈散熱裝置包括一散熱外環體,散熱外環體熱接觸發光電路部且圍設於驅動電路部之外周側,並且散熱外環體與驅動電路部相隔一間距而在散熱外環體與驅動電路部之間形成一散熱通道,以減少發光電路部與驅動電路部之間的熱傳遞。The technical means used in solving the problem of the prior art is a bulb heat sink, which is combined with a bulb lamp, the bulb lamp has a light-emitting circuit portion and a drive circuit portion electrically connected to the light-emitting circuit portion, wherein the ball The heat dissipating device includes a heat dissipating outer ring body, the heat dissipating outer ring body is in thermal contact with the light emitting circuit portion and is disposed around the outer peripheral side of the driving circuit portion, and the heat dissipating outer ring body and the driving circuit portion are spaced apart from each other to dissipate the outer ring body and A heat dissipation path is formed between the driving circuit portions to reduce heat transfer between the light emitting circuit portion and the driving circuit portion.
在本創作的一實施例中,散熱通道之一端連通於發光電路部,散熱通道之另一端延伸連通至球泡燈外部。In an embodiment of the present invention, one end of the heat dissipation channel is connected to the light emitting circuit portion, and the other end of the heat dissipation channel is extended to communicate with the outside of the bulb lamp.
在本創作的一實施例中,散熱通道之一端連通於發光電路部,且散熱外環體在散熱通道之連通端附近具有一側向開孔。In an embodiment of the present invention, one end of the heat dissipation channel is connected to the light emitting circuit portion, and the heat dissipation outer ring body has a side opening near the communication end of the heat dissipation channel.
在本創作的一實施例中,散熱外環體之外環面上更具有向外延伸的複數個散熱鰭片。In an embodiment of the present invention, the outer ring surface of the heat dissipating outer ring body further has a plurality of heat dissipating fins extending outward.
在本創作的一實施例中,散熱鰭片以輻射狀設置於散熱外環體之外環面。In an embodiment of the present invention, the heat dissipating fins are radially disposed outside the outer surface of the heat dissipating outer ring body.
在本創作的一實施例中,散熱鰭片之延伸長度在遠離發光電路部之方向上為漸減。In an embodiment of the present invention, the extension length of the heat dissipation fin is gradually decreasing in a direction away from the light emitting circuit portion.
在本創作的一實施例中,發光電路部包括一LED發光單元,驅動電路部為一LED驅動電路。In an embodiment of the present invention, the light emitting circuit portion includes an LED light emitting unit, and the driving circuit portion is an LED driving circuit.
在本創作的一實施例中,更包括一散熱內環體,熱接觸於驅動電路部之外周側,散熱通道位在散熱內環體與散熱外環體之間。In an embodiment of the present invention, a heat dissipating inner ring body is further disposed to be in thermal contact with the outer peripheral side of the driving circuit portion, and the heat dissipating channel is located between the heat dissipating inner ring body and the heat dissipating outer ring body.
在本創作的一實施例中,更包括一散熱頂板,連接 散熱外環體且熱接觸於發光電路部。In an embodiment of the present invention, a heat sinking top plate is further connected The outer ring body is radiated and thermally contacted with the light emitting circuit portion.
經由本創作所採用之技術手段,能夠大幅地減少球泡燈之發光電路部與驅動電路部之間的熱傳遞,使兩者之散熱機制不直接地互相造成影響,藉此提高散熱效率。再者,藉由散熱通道可以使得球泡燈之內外空氣相互流通,以進行散熱。此外,在較佳實施例中,驅動電路部之外周側由散熱內環體所圍繞,加強驅動電路部之熱傳導,提升散熱效率。According to the technical means adopted in the present invention, heat transfer between the light-emitting circuit portion of the bulb lamp and the drive circuit portion can be greatly reduced, so that the heat dissipation mechanisms of the two are not directly affected by each other, thereby improving heat dissipation efficiency. Moreover, the air inside and outside the bulb can be circulated through the heat dissipation channel to dissipate heat. In addition, in the preferred embodiment, the outer peripheral side of the driving circuit portion is surrounded by the heat dissipating inner ring body to enhance heat conduction of the driving circuit portion and improve heat dissipation efficiency.
本創作所採用的具體實施例,將藉由以下之實施例及附呈圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following examples and accompanying drawings.
同時參閱第1圖至第4圖所示,第1圖係顯示本創作之一實施例之球泡燈散熱裝置結合球泡燈的立體圖,第2圖係顯示本創作之一實施例之球泡燈散熱裝置的側視剖面圖,第3圖係顯示本創作之一實施例之球泡燈散熱裝置的上視剖面圖,第4圖係顯示本創作之一實施例之球泡燈散熱裝置之散熱頂板的上視面圖。Referring to FIG. 1 to FIG. 4, FIG. 1 is a perspective view showing a bulb lamp heat sink combined with a bulb lamp according to an embodiment of the present invention, and FIG. 2 is a view showing a bulb of an embodiment of the present creation. A side cross-sectional view of a lamp heat sink, FIG. 3 is a top cross-sectional view showing a bulb heat sink of one embodiment of the present invention, and FIG. 4 is a view showing a bulb heat sink of an embodiment of the present invention. Upper view of the heat sink top.
如圖所示,本創作之一實施例中,一球泡燈散熱裝置2係結合於一球泡燈1。As shown in the figure, in one embodiment of the present invention, a bulb heat sink 2 is coupled to a bulb 1.
在本實施例中,球泡燈1包括一發光電路部11、一驅動電路部12、及一燈罩13。發光電路部11包含一發光單元111,並電連接於驅動電路部12,燈罩13罩於發光電路部11之上方。其中,發光單元111可為任一可發光元件,其受驅動電路部12以電能驅動發光電路部11而發光,例,發光單元111為一LED發光單元,而驅動電路部12為一LED驅動電路。In the present embodiment, the bulb lamp 1 includes a light emitting circuit portion 11, a driving circuit portion 12, and a lamp cover 13. The light-emitting circuit unit 11 includes a light-emitting unit 111 and is electrically connected to the drive circuit unit 12, and the lamp cover 13 is placed over the light-emitting circuit unit 11. The light-emitting unit 111 can be any light-emitting element that is driven by the driving circuit portion 12 to drive the light-emitting circuit portion 11 with electric energy. For example, the light-emitting unit 111 is an LED light-emitting unit, and the driving circuit portion 12 is an LED driving circuit. .
球泡燈散熱裝置2包括一散熱外環體21。散熱外環體21熱接觸於球泡燈1之發光電路部11,並圍設於驅動電路部12之外周側。散熱外環體21與驅動電路部12之間相隔一間隙,此間隙構成一散熱通道22。散熱通道22之一端連通於球泡燈1之發光電路部11,另一端則延伸連通至球泡燈外部。此外,上述所提及之熱接觸可為兩元件結構直接相互貼附或於兩者之間以任一可幫助散熱之氣體、液體、固體填充之,例,散熱膏。The bulb heat sink 2 includes a heat dissipating outer ring body 21. The heat radiating outer ring body 21 is in thermal contact with the light emitting circuit portion 11 of the bulb lamp 1 and is disposed on the outer peripheral side of the drive circuit portion 12. The heat dissipating outer ring body 21 and the driving circuit portion 12 are separated by a gap, and the gap constitutes a heat dissipating passage 22. One end of the heat dissipation passage 22 communicates with the light-emitting circuit portion 11 of the bulb lamp 1, and the other end extends to communicate with the outside of the bulb lamp. In addition, the above-mentioned thermal contact may be such that the two-element structure is directly attached to each other or filled with any gas, liquid or solid which can help dissipate heat, for example, a thermal grease.
藉由以上所述之結構,球泡燈散熱裝置2之散熱通道22能夠阻隔球泡燈1之驅動電路部12與發光電路部11之間的熱傳遞,使兩者個別之散熱機制不直接地互相造成影響。此外,散熱通道22之一端與球泡燈1外部相通,可利用空氣對流,將球泡燈1之驅動電路部12與發光電路部11工作過程中所產生的熱,散至球泡燈1外,藉此提高整體之散熱效率。With the above structure, the heat dissipation channel 22 of the bulb heat sink 2 can block the heat transfer between the drive circuit portion 12 of the bulb lamp 1 and the light-emitting circuit portion 11, so that the individual heat dissipation mechanisms are not directly Make an impact on each other. In addition, one end of the heat dissipation channel 22 communicates with the outside of the bulb lamp 1, and the air generated by the driving circuit portion 12 and the light-emitting circuit portion 11 of the bulb lamp 1 can be dispersed to the outside of the bulb lamp 1 by air convection. In order to improve the overall heat dissipation efficiency.
此外,為了提升散熱外環體21之散熱效率,在本實施例中,散熱外環體21於其外環面上具有向外延伸的複數個散熱鰭片211,增加其散熱面積。其中,散熱鰭片211之延伸方式及外形可依據不同結構之球泡燈之需求而更改。在本實施例中,散熱鰭片211以輻射狀向外延伸,大量地增加散熱外環體21之散熱面積,且因其散熱需求在熱外環體21靠近發光電路部11處較大,在遠離發光電路部11處較小,故散熱鰭片211的延伸長度在遠離發光電路部11之方向上為漸減,以使散熱鰭片發揮最佳的散熱效果。In addition, in order to improve the heat dissipation efficiency of the heat dissipating outer ring body 21, in the embodiment, the heat dissipating outer ring body 21 has a plurality of heat dissipating fins 211 extending outwardly on the outer ring surface thereof to increase the heat dissipating area thereof. The extension manner and shape of the heat dissipation fins 211 can be changed according to the requirements of the bulb lamps of different structures. In this embodiment, the heat dissipation fins 211 extend outward in a radial direction, and the heat dissipation area of the heat dissipation outer ring body 21 is increased in a large amount, and the heat dissipation outer ring body 21 is larger near the light emitting circuit portion 11 due to the heat dissipation requirement thereof. The distance from the light-emitting circuit portion 11 is small, so that the extending length of the heat-dissipating fins 211 is gradually reduced in the direction away from the light-emitting circuit portion 11 so that the heat-dissipating fins exert an optimal heat-dissipating effect.
另外,較佳地,球泡燈散熱裝置2之散熱外環體21進一步具有一側向開孔212。此側向開孔212的位置靠近散熱通道22與發光電路部11之連通端,而使散熱 通道22與球泡燈1外部相連通。藉此增加散熱通道22與球泡燈1外部之間的空氣對流,以提高散熱效率。In addition, preferably, the heat dissipating outer ring body 21 of the bulb heat sink 2 further has a side opening 212. The position of the lateral opening 212 is close to the communication end of the heat dissipation channel 22 and the light-emitting circuit portion 11, thereby dissipating heat. The passage 22 communicates with the outside of the bulb lamp 1. Thereby, air convection between the heat dissipation passage 22 and the outside of the bulb 1 is increased to improve heat dissipation efficiency.
除此之外,在本實施例中,球泡燈散熱裝置2進一步包括一散熱內環體23。散熱內環體23以一連接部25與散熱外環體21相連接,且熱接觸並圍設於驅動電路部12之外周側。散熱內環體23與散熱外環體21之間即為散熱通道22。藉此加強驅動電路部12之熱傳導,提升散熱效率。In addition, in the present embodiment, the bulb heat sink 2 further includes a heat dissipating inner ring body 23. The heat dissipating inner ring body 23 is connected to the heat dissipating outer ring body 21 by a connecting portion 25, and is thermally contacted and disposed around the outer peripheral side of the driving circuit portion 12. The heat dissipation inner ring body 23 and the heat dissipation outer ring body 21 are the heat dissipation channels 22. Thereby, the heat conduction of the drive circuit portion 12 is enhanced, and the heat dissipation efficiency is improved.
另外一方面,為了使球泡燈1之發光電路部11產生的熱能更加快速地傳導至散熱外環體21並排出球泡燈1外。在本實施例中,球泡燈散熱裝置2還包括一散熱頂板24。如第4圖所示,散熱頂板24具有一連接孔241、一固定孔242、及一開孔243。連接孔241為球泡燈1之發光電路部11與驅動電路部12之電路連接孔。固定孔242供一鎖合件(圖未示,如,螺絲)使用,以使散熱頂板24鎖合於發光電路部11及驅動電路部12之間。On the other hand, in order to allow the heat energy generated by the light-emitting circuit portion 11 of the bulb lamp 1 to be more quickly transmitted to the heat-dissipating outer ring body 21 and discharged outside the bulb lamp 1. In the embodiment, the bulb heat sink 2 further includes a heat dissipation top plate 24. As shown in FIG. 4, the heat dissipation top plate 24 has a connection hole 241, a fixing hole 242, and an opening 243. The connection hole 241 is a circuit connection hole of the light-emitting circuit portion 11 of the bulb lamp 1 and the drive circuit portion 12. The fixing hole 242 is used for a locking member (not shown, for example, a screw) to lock the heat dissipation top plate 24 between the light emitting circuit portion 11 and the driving circuit portion 12.
其中,散熱頂板24之一面與散熱外環體21相連接,另一面則熱接觸於發光電路部11。如此一來,發光電路部11所產生之熱能可經由散熱頂板24迅速傳至散熱外環體21進行散熱或透過開孔243與散熱通道22相連通以熱對流的方式散熱。The one surface of the heat dissipation top plate 24 is connected to the heat dissipation outer ring body 21, and the other surface is in thermal contact with the light emitting circuit portion 11. In this way, the heat energy generated by the light-emitting circuit portion 11 can be quickly transmitted to the heat-dissipating outer ring body 21 via the heat-dissipating top plate 24 to dissipate heat or communicate with the heat-dissipating channel 22 through the opening 243 to dissipate heat in a heat convection manner.
由以上之實施例可知,本創作所提供之球泡燈散熱裝置確具產業上之利用價值,故本創作業已符合於專利之要件。惟以上之敘述僅為本創作之較佳實施例說明,凡精於此項技藝者當可依據上述之說明而作其它種種之改良,惟這些改變仍屬於本創作之創作精神及以下所界定之專利範圍中。It can be seen from the above embodiments that the bulb heat dissipating device provided by the present invention has industrial utilization value, so the original operation has met the requirements of the patent. However, the above description is only for the preferred embodiment of the present invention, and those skilled in the art may make other improvements according to the above description, but these changes still belong to the creative spirit of the creation and the following definitions. In the scope of patents.
1‧‧‧球泡燈1‧‧‧ bulb lamp
11‧‧‧發光電路部11‧‧‧Lighting Circuits Department
111‧‧‧發光單元111‧‧‧Lighting unit
12‧‧‧驅動電路部12‧‧‧Drive Circuit Division
13‧‧‧燈罩13‧‧‧shade
2‧‧‧球泡燈散熱裝置2‧‧‧Bubble lamp heat sink
21‧‧‧散熱外環體21‧‧‧Thermal outer ring
211‧‧‧散熱鰭片211‧‧‧ Heat sink fins
212‧‧‧側向開孔212‧‧‧ lateral opening
22‧‧‧散熱通道22‧‧‧Solution channel
23‧‧‧散熱內環體23‧‧‧heating inner ring
24‧‧‧散熱頂板24‧‧‧heating top plate
241‧‧‧連接孔241‧‧‧connection hole
242‧‧‧固定孔242‧‧‧Fixed holes
243‧‧‧開孔243‧‧‧Opening
25‧‧‧連接部25‧‧‧Connecting Department
第1圖係顯示本創作之一實施例之球泡燈散熱裝置結合球泡燈之立體圖。Fig. 1 is a perspective view showing a bulb lamp heat sink combined with a bulb lamp according to an embodiment of the present invention.
第2圖係顯示本創作之一實施例之球泡燈散熱裝置結合球泡燈之側視剖面圖。Figure 2 is a side cross-sectional view showing the bulb heat sink of one embodiment of the present invention in combination with a bulb.
第3圖係顯示本創作之一實施例之球泡燈散熱裝置之 上視剖面圖。Figure 3 is a diagram showing the bulb heat sink of one embodiment of the present invention. Top view.
第4圖係顯示本創作之一實施例之球泡燈散熱裝置之 散熱頂板之上視圖。Figure 4 is a diagram showing the bulb heat sink of one embodiment of the present invention. The top view of the cooling top plate.
1‧‧‧球泡燈1‧‧‧ bulb lamp
2‧‧‧球泡燈散熱裝置2‧‧‧Bubble lamp heat sink
211‧‧‧散熱鰭片211‧‧‧ Heat sink fins
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW101213291U TWM446868U (en) | 2012-07-10 | 2012-07-10 | Light bulb heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW101213291U TWM446868U (en) | 2012-07-10 | 2012-07-10 | Light bulb heat dissipation device |
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Publication Number | Publication Date |
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TWM446868U true TWM446868U (en) | 2013-02-11 |
Family
ID=48194286
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Application Number | Title | Priority Date | Filing Date |
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TW101213291U TWM446868U (en) | 2012-07-10 | 2012-07-10 | Light bulb heat dissipation device |
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TW (1) | TWM446868U (en) |
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2012
- 2012-07-10 TW TW101213291U patent/TWM446868U/en not_active IP Right Cessation
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Legal Events
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MM4K | Annulment or lapse of a utility model due to non-payment of fees |