M441929 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種應用於暫放半導體設備中的晶圓盒 之晶圓盒裝載淳，尤指一種具有氣體填充結構之晶圓盒裝 载埠。 【先前技術】 半導體元件的製造過程中，晶圓的處理及製造期間係 藉由自動化輸送系統將儲存有晶圓之晶圓盒搬運至不同的 製程區，並藉由裝載設備(Load Port Device)裝載或卸下晶 圓盒内之晶圓，其中晶圓盒係例如為前開式晶圓盒(Front Opening Unified Pod，FOUP) ’裝載設備係藉由裝載埠(Load Port)承載晶圓盒並移動至指定之半導體設備的暫存埠，以 供後續該半導體設備對該晶圓盒進行該晶圓盒之前蓋的開 啟並由輸送臂進行晶圓的卸載。 習知技術中，該裝載埠上係具有複數個定位銷，該等 定位銷的位置係對應於晶圓盒底部之定位凹槽的位置，用 於使晶圓盒正確的定位於裝載埠上，以利於後續自動化之 •過程，例如開啟晶圓盒之前蓋及輸送臂卸載晶圓等。 然而’由於晶圓盒内部係非百分之百完全密封之空 間，其靜置於該半導體設備之暫存埠上時，常會因晶圓盒 内部之氮氣或潔淨空氣(CDA、XCDA)的逸散而造成晶圓盒 内部之儲存環境品質的降低，造成無法有效排除氧氣與水 氣，進而影響後續生產製程與良率。 3 M441929 【新型内容】 本創作之一目的係提供一種具有氣體填充結構之晶圓 盒裝載埠，其係可將氮氣或潔淨氣體裝填於晶圓盒裝載埠 上之晶圓盒内部’以使晶圓盒内部之晶圓可被氣氣或潔淨 氣體所保護。 為達上述目的及其他目的，本創作之一種具有氣體填 充結構之晶圓盒裝載埠，係應用於暫放半導體設備中的晶 圓盒，該晶圓盒裝載埠包含：一基座，係具有用於承載該 晶圓盒之一承載面；複數個定位部，係突設於該承載面上， 該等定位部係用於支撐該晶圓盒；及一氣體填充部，係穿 設於該基座，並對應該晶圓盒之複數個氣體進出口的位置。 於一實施例中，該氣體填充部係包含二第一進氣單元 及二第一出氣單元，其係於該基座上以一矩形之四頂點來 排列。 於一實施例中，該氣體填充部係進一步包含一第二進 • 氣單元及一第二出氣單元，並該第二進氣單元與該第二出 氣單元間於該基座上之連線係平行且長於該矩形之其中一 邊。 於一實施例中，該氣體填充部係包含一氣體通道及一 密封墊，該密封墊係設於該承載面上並環繞在該氣體通道 周圍。 於一實施例中，該晶圓盒裝載琿進一步包含至少一無 線射頻感測器，用於辨識該晶圓盒之一型號識別碼。 於一實施例中，該晶圓盒裝載埠進一步包含至少一位 4 M441929 置感測器，用於感測該晶圓盒之對位狀態。 於一實施例中，該至少一位置感測器之位置係相鄰於 該等定位部的至少其一者。 藉此，本創作之晶圓盒裝載埠係具有氣體填充功能， 其係可於晶圓盒靜置於晶圓盒裝載埠時將氮氣或潔淨氣體 裝填於晶圓盒内’而形成循壤氣流來保護晶圓’並使晶圓 盒内部形成相較於外界環境之正壓狀態，以阻隔外界微粒 I 或粉塵進入晶圓盒中而污染晶圓，精此’可減少晶圓盒裝 * 載埠上的晶圓盒被污染的可能性，進而提高生產良率。 【實施方式】 為充分瞭解本創作之目的、特徵及功效，茲藉由下述 具體之實施例，並配合所附之圖式，對本創作做一詳細說 明，說明如後： 請參照第1圖、第2A圖及第2B圖，第1圖係為本創 _ 作之一實施例中晶圓盒裝載埠的示意圖；第2A圖及第2B 圖係為不同型號種類之晶圓盒底部的示意圖。本創作之一 實施例的晶圓盒裝載琿1係具有氣體填充結構並應用於暫 放半導體設備（圖未示）中的晶圓盒100,以使該半導體設備 之晶圓盒裝載埠1整合氮氣沖洗(N2 Purge)或潔淨氣體沖洗 (CDAPurge)功能，該晶圓盒裝載埠1包含一基座10、複數 個定位部20及一氣體填充部30，其中，該基座10係具有 用於承載該晶圓盒100之一承載面11;該等定位部20係突 設於該承載面11上，該等定位部20係用於支撐該晶圓盒 5 M441929 100並對應該晶圓盒底部的定位孔120的位置（第2A圖及 第2B圖）；該氣體填充部30係穿設於該基座10,並對應該 晶圓盒100底部之複數個氣體進出口 110的位置（第2A圖 及第2B圖）。 請配合參照第2A圖及第2B圖所示，第2A圖及第2B 圖係示例不同型號種類的晶圓盒，其係具有不同之氣體進 出口之配置方式；本創作一實施例之晶圓盒裝載埠中，該 氣體填充部30係包含二第一進氣單元30a及二第一出氣單 ® 元30b，其係於該基座10上以一矩形之四頂點來排列，且 如第2A圖所示之晶圓盒100a底部的氣體進出口 110係對 應該等第一進氣單元30a及該等第一出氣單元30b的位 置，具體而言，當該晶圓盒l〇〇a裝載於該晶圓盒裝載埠1 上時，該等第一出氣單元30b對應於位在接近該晶圓盒 100a前蓋之氣體進出口 110的位置，該等第一進氣單元30a 對應於位在遠離該晶圓盒l〇〇a前蓋之氣體進出口 110的位 φ 置，該等第一進氣單元30a及該等第一出氣單元30b係連 接至該晶圓盒l〇〇a底部101的氣體進出口 110而連通於該 晶圓盒100a内部，以供氮氣或潔淨氣體藉由該等第一進氣 單元30a進入於該晶圓盒100a内部，並藉由該等第一出氣 單元30b排出該晶圓盒100a之外，而於該晶圓盒100a内 部形成一穩定氣流以保護晶圓；然該氣體填充部30中該等 第一進氣單元30a及該等第一出氣單元30b之位置配置亦 可配置成其他可形成穩定氣流之型式，而不限於本實施例 之示例。此外，於一較佳實施例中，該晶圓裝載埠1可進 6 M441929 一步包含一第二進氣單元30c及一第二出氣單元30d，並該 第二進氣單元30c與該第二出氣單元30d間於該基座10上 之連線係平行且長於該矩形之其中一邊，如圖所示，該第 二進氣單元30c與該第二出氣單元30d之間的連線係長於 且平行該等第一出氣單元30b之間的連線，且如第2B圖所 示之晶圓盒l〇〇b底部101的二個氣體進出口 110係對應該 第二進氣單元30c與該第二出氣單元30d的位置，以供氮 氣或潔淨氣體藉由該第二進氣單元30c進入於該晶圓盒 • 100a内部，並藉由該第二出氣單元30d排出該晶圓盒100a 之外。據此，本創作之晶圓盒裝載埠1係可適用於不同型 號種類之晶圓盒100，而無須更換整個暫存埠。 於本創作之實施例中，該氣體填充部30係包含一氣體 通道31及一密封墊32，即該等第一進氣單元30a、該等第 一出氣單元30b、該第二進氣單元30c及該第二出氣單元 30d中至少一者係具有氣體通道31及密封墊32，該氣體通 • 道31係貫穿該基座10,當該晶圓盒裝載埠1連接於外部的 氣體供應器（圖未示）並裝載該晶圓盒100時，由氣體供應器 所提供之氮氣或潔淨氣體係通過該氣體通道31進出於該晶 圓盒100内部；各該密封墊32係設於該承載面11上並環 繞在各該氣體通道31周圍，各該密封墊32係可為例如橡 膠之彈性材質，當該晶圓盒100藉由定位部20裝載於該晶 圓盒裝載埠1上時，該氣體通道31係連通該晶圓盒100之 内部，且各該密封墊32係用於使該氣體填充部30與該晶 圓盒100之間達成氣密狀態，以確保該晶圓盒100内部的 7 不會浪漏;此外’該等第-進氣單元術、 單-,a亂早703013、該第二進氣單元30c及該第二出氣 式（例^1 至者更可包含一 f線接頭33或其他連接方 以藉由夕^通道Μ底端之螺紋表面或卡固結構等）’ 由外部官線連接至氣體供應器。 至：：創作之實施例中，該晶圓盒裳載埠】進一步包含 號識：頻感測器40，用於辨識該晶圓盒1 〇〇之-型 二:：：晶圓盒100係可袭設有-無線射頻標籤， 頻感、^ί〇載於該晶圓盒裝载埠1上時，該無線射 型;^ 感應該無線射頻標籤以辨識該日日日圓盒之 的二=中並將該型號識別碼之訊息傳送至半導體設備 控“中’以進行該氣體填充部3G中該等第一進氣單 第-出氣單元30b、該第二進氣單元Μ該 孔早凡30d與乳體供應器間的切換等控制操作。 於本創作之實施财，該㈣盒裝載埠〗進―步包含 離H置制n 5〇’用於感測該晶圓盒1〇〇之對位狀 二二、5亥至少一位置感測器50之位置係相鄰於該等定位 =㈣'其一者;如圖所示，該基座10之裝載面η上 …又-個位置感測器50，其係相鄰於該等定位部2〇，各 該位置感測器50係可藉由下麼接觸來判斷該晶圓盒⑽是 否有正確置放及對位於該基座1〇上，並可傳送該晶圓盒 ⑽之對絲S訊鼓半導體設備的主控電腦。 藉此，本創作之晶圓盒裝载痒係具有氣體填充功能， 其係可於晶圓盒靜置於晶圓盒褒裁埠時將氮氣或潔淨氣體 M441929 裝填於晶圓盒内，而形成猶環氣流來保護晶圓，並使晶圓 -内料成相較於外界每境之正愿狀態，以阻隔外界微粒 f粉塵進入晶圓盒中而污染晶圓；藉此，可減少晶圓盒裝 載埠上的晶圓盒被污染的可能性，進而提高生產良率。 本創作在上文中已以較佳實施例揭露，然熟習本項 射應理解的是，該實施例僅用於·本創作，而不庫解 =為限制梢作之範圍。應注意較，舉凡與該實施例等 1 文之變化與置換，均狀為涵蓋於本創作之斜内。因此， 本創作之賴當以”專難騎界定者為準。 【圖式簡單說明】 =圖為本創作之-實施例中晶圓盒裝解的示意圖。 的示圖及第扭圖為係為不同型號種類之晶圓盒底部 【主要元件符號說明】 1 晶圓金裝載埠 10 基座 11 承載面 20 定位部 30 氣體填充部 30a 第一進氣單元 30b 第一出氣單元 30c 弟~進氣單元 9 M441929M441929 V. New Description: [New Technology Field] This is a wafer cassette loading cassette for a wafer cassette used in a temporary semiconductor device, especially a wafer cassette with a gas-filled structure. . [Prior Art] In the manufacturing process of a semiconductor device, the wafer cassette in which the wafer is stored is transported to a different process area by an automated transport system during processing and manufacturing of the wafer, and by a load port device (Load Port Device) Loading or unloading the wafer in the wafer cassette, wherein the wafer cassette is, for example, a Front Opening Unified Pod (FOUP). The loading device carries the wafer cassette and moves by loading the load port. The temporary storage of the designated semiconductor device for subsequent semiconductor device to open the front cover of the wafer cassette and unload the wafer by the transfer arm. In the prior art, the loading cassette has a plurality of positioning pins, and the positions of the positioning pins correspond to the positions of the positioning grooves at the bottom of the wafer cassette for correctly positioning the wafer cassette on the loading cassette. In order to facilitate the subsequent automation process, such as opening the front cover of the wafer cassette and unloading the wafer by the transfer arm. However, because the inside of the wafer cassette is not 100% completely sealed, it is often placed on the temporary storage of the semiconductor device, which is often caused by the escape of nitrogen or clean air (CDA, XCDA) inside the wafer cassette. The reduction of the storage environment quality inside the wafer cassette makes it impossible to effectively exclude oxygen and moisture, thereby affecting the subsequent production process and yield. 3 M441929 [New Content] One of the purposes of this creation is to provide a wafer cassette loading cassette with a gas-filled structure, which can be filled with nitrogen or clean gas inside the wafer cassette on the wafer cassette loading cassette. The wafer inside the round box can be protected by gas or clean gas. For the above purposes and other purposes, a wafer cassette loading cassette having a gas-filled structure is used for a wafer cassette in a temporary semiconductor device, the cassette loading cassette comprising: a pedestal having And a plurality of positioning portions are disposed on the bearing surface, wherein the positioning portions are used for supporting the wafer cassette; and a gas filling portion is disposed on the mounting surface The pedestal, and the position of the gas inlet and outlet of the wafer cassette. In one embodiment, the gas filling portion includes two first air intake units and two first air outlet units, which are arranged on the base by four vertices of a rectangle. In one embodiment, the gas filling unit further includes a second air inlet unit and a second air outlet unit, and the connection between the second air intake unit and the second air outlet unit on the base Parallel and longer than one side of the rectangle. In one embodiment, the gas filling portion includes a gas passage and a gasket disposed on the bearing surface and surrounding the gas passage. In one embodiment, the cassette loading cassette further includes at least one wireless RF sensor for identifying a model identification code of the cassette. In one embodiment, the cassette loading cassette further includes at least one 4 M441929 sensor for sensing the alignment state of the wafer cassette. In one embodiment, the position of the at least one position sensor is adjacent to at least one of the positioning portions. Therefore, the created wafer cassette loading system has a gas filling function, which can fill the wafer cassette when the wafer cassette is placed in the wafer cassette loading chamber, and nitrogen or clean gas is filled in the wafer cassette to form a soil-flowing airflow. To protect the wafer and to form a positive pressure state inside the wafer cassette compared to the external environment, to block the external particles I or dust from entering the wafer cassette and contaminating the wafer, which can reduce the wafer cassette loading The possibility that the wafer cassette on the crucible is contaminated, thereby increasing production yield. [Embodiment] In order to fully understand the purpose, features and effects of this creation, the following specific examples and the accompanying drawings are used to explain this creation in detail, as explained below: Please refer to Figure 1 2A and 2B, FIG. 1 is a schematic view of the wafer cassette loading cassette in one embodiment of the invention; FIGS. 2A and 2B are schematic views of the bottom of the wafer cassette of different model types. . The wafer cassette loading cassette 1 of one embodiment of the present invention has a gas filling structure and is applied to a wafer cassette 100 in a temporary semiconductor device (not shown) to enable the wafer cassette loading of the semiconductor device to be integrated. The N2 Purge or CDAPurge function includes a susceptor 10, a plurality of positioning portions 20, and a gas filling portion 30, wherein the susceptor 10 has Carrying a bearing surface 11 of the wafer cassette 100; the positioning portions 20 are protruded from the bearing surface 11, and the positioning portions 20 are used to support the wafer cassette 5 M441929 100 and the bottom of the wafer cassette The position of the positioning hole 120 (Figs. 2A and 2B); the gas filling portion 30 is passed through the base 10, and corresponds to the position of the plurality of gas inlets and outlets 110 at the bottom of the wafer cassette 100 (2A) Figure and Figure 2B). Please refer to FIG. 2A and FIG. 2B. FIG. 2A and FIG. 2B illustrate different types of wafer cassettes, which have different gas inlet and outlet configurations; the wafer of one embodiment of the present invention is created. In the cartridge loading chamber, the gas filling portion 30 includes two first air intake units 30a and two first air outlet sheets 30b, which are arranged on the base 10 by four vertices of a rectangle, and are as shown in FIG. 2A. The gas inlet and outlet 110 at the bottom of the wafer cassette 100a shown in the figure corresponds to the position of the first air intake unit 30a and the first air outlet unit 30b, specifically, when the wafer cassette 10a is loaded When the cassette is loaded on the cassette 1, the first air outlet unit 30b corresponds to a position close to the gas inlet and outlet 110 of the front cover of the wafer cassette 100a, and the first air intake unit 30a corresponds to a position away from The first inlet unit 30a and the first outlet unit 30b are connected to the bottom 101 of the wafer cassette 10a. The gas inlet and outlet 110 is connected to the inside of the wafer cassette 100a for supplying nitrogen or clean gas by the first The air intake unit 30a enters the inside of the wafer cassette 100a, and the first air outlet unit 30b is discharged from the wafer cassette 100a, and a stable airflow is formed inside the wafer cassette 100a to protect the wafer; The positional arrangement of the first air intake unit 30a and the first air outlet unit 30b in the gas filling unit 30 may be configured in other types that can form a stable airflow, and is not limited to the example of the embodiment. In addition, in a preferred embodiment, the wafer loading cassette 1 can enter 6 M441929 and include a second air intake unit 30c and a second air outlet unit 30d, and the second air intake unit 30c and the second air outlet unit. The connection between the unit 30d and the base 10 is parallel and longer than one of the sides of the rectangle. As shown, the connection between the second air intake unit 30c and the second air outlet unit 30d is longer and parallel. a connection between the first air outlet units 30b, and two gas inlets and outlets 110 of the bottom portion 101 of the wafer cassette 10b as shown in FIG. 2B correspond to the second air intake unit 30c and the second The position of the air outlet unit 30d is such that nitrogen or clean gas enters the inside of the wafer cassette 100a through the second air intake unit 30c, and is discharged from the wafer cassette 100a by the second air outlet unit 30d. Accordingly, the created wafer cassette loading cassette 1 can be applied to wafer cassettes 100 of different model types without having to replace the entire temporary cassette. In the embodiment of the present invention, the gas filling portion 30 includes a gas passage 31 and a gasket 32, that is, the first air intake unit 30a, the first air outlet unit 30b, and the second air intake unit 30c. And at least one of the second air outlet unit 30d has a gas passage 31 and a gasket 32, and the gas passage 31 extends through the base 10 when the cassette loading cassette 1 is connected to an external gas supply device ( When the wafer cassette 100 is loaded and loaded, a nitrogen or clean gas system provided by a gas supply enters the interior of the wafer cassette 100 through the gas passage 31; each of the gaskets 32 is disposed on the bearing surface 11 and surrounding the gas passages 31, each of the gaskets 32 may be an elastic material such as rubber. When the wafer cassette 100 is loaded on the wafer cassette loading cassette 1 by the positioning portion 20, The gas passages 31 are connected to the inside of the wafer cassette 100, and each of the gaskets 32 is used to achieve an airtight state between the gas filling portion 30 and the wafer cassette 100 to ensure the inside of the wafer cassette 100. 7 will not leak; in addition, 'the first-intake unit, single-, a chaos 7030 13. The second air intake unit 30c and the second air outlet type (examples may further include an f-wire joint 33 or other connecting party for the threaded surface or the fastening structure of the bottom end of the tunnel) )' is connected to the gas supply by an external official line. To:: In the embodiment of the creation, the wafer cassette is further included: the frequency sensor 40 is used to identify the wafer cassette 1 - type 2::: wafer cassette 100 series The wireless radio frequency tag is transmitted, and the radio frequency type is transmitted on the cassette loading cassette 1; the wireless radio frequency tag is sensed to identify the second day of the Japanese yen box. Transmitting and transmitting the message of the model identification code to the semiconductor device control "middle" to perform the first air intake single-exhaust unit 30b in the gas filling portion 3G, the second air intake unit, the hole is 30d earlier Control operation such as switching between the milk supply device. In the implementation of the present creation, the (four) box loading 埠 step into the step includes the setting of the n 5 〇 ' for sensing the wafer cassette 1 〇〇 The position of the position sensor 22 is at least one position adjacent to the position=(four)'; as shown in the figure, the loading surface η of the base 10 is... a sense of position The detector 50 is adjacent to the positioning portions 2, and each of the position sensors 50 can determine whether the wafer cassette (10) is correctly placed and aligned by the next contact. The susceptor of the wafer cassette (10) can be transported to the susceptor of the wafer cassette (10). The cradle of the present invention has a gas filling function. Nitrogen or clean gas M441929 is loaded into the wafer cassette when the wafer cassette is placed in the wafer cassette, and a gas stream is formed to protect the wafer, and the wafer-inner material is compared with the outside world. The state of the environment is to block the external particles f dust from entering the wafer cassette and contaminate the wafer; thereby reducing the possibility of contamination of the wafer cassette on the cassette loading cassette, thereby increasing the production yield. The creation has been disclosed in the above preferred embodiments, but it should be understood that this embodiment is only used for the present creation, and the solution is not limited to the scope of the limitation. The variations and permutations of this embodiment and the like are included in the oblique direction of the present creation. Therefore, the creation of this creation is based on the definition of "the difficulty of riding." [Simple description of the figure] = Figure is a schematic diagram of the wafer cassette assembly in the embodiment. The diagram and the twist diagram are the bottoms of the wafer cassettes of different model types. [Main component symbol description] 1 Wafer gold loading cassette 10 Base 11 Bearing surface 20 Positioning portion 30 Gas filling portion 30a First air intake unit 30b First air outlet unit 30c brother ~ air intake unit 9 M441929
30d 第二出氣單元 31 氣體通道 32 密封墊 33 管線接頭 40 無線射頻感測器 50 位置感測器 100 晶圓盒 100a 晶圓盒 100b 晶圓盒 101 底部 110 氣體進出口 120 定位孑L30d second air outlet unit 31 gas channel 32 gasket 33 pipe joint 40 wireless RF sensor 50 position sensor 100 wafer cassette 100a wafer cassette 100b wafer cassette 101 bottom 110 gas inlet and outlet 120 positioning 孑L