M440292 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種晶片搬運裝置，特別是關於一種 以旋轉方式在晶片取料面與晶片放料面之間搬運晶片 的晶片搬運裝置。 【先前技術】 晶片（chip)是半導體製程所常用的物料，可製作為 集成電路所用的載體。晶片的生產流程包含了許多種處 理方式，包括感光劑塗佈、曝光、顯影、腐姓、及滲透 等等，以製成具有多層線路的元件，並經由檢測、封裝， 而製成實際可用的積體電路成品。 由於晶片製程中之各種處理方式所使用的設備不 同以及使用設備分佈於不同位置，且為了避免人為操作 而產生的錯誤，以及環境中微塵於製造過程中所產生的 影響，晶片的製程大多利用自動化的設備並於無塵室中 進行。因而，在半導體製程中，常使用一晶片搬運裝置 以運輸晶片，以使晶片製程之各個處理步驟可相互銜 接。或是藉由晶片搬運裝置以搬運檢測篩選後的晶片以 分群歸類。 【新型内容】 本創作所欲解決之技術問題 習知的晶片搬運裝置之晶片取料面與晶片放料面 為面向同一方向。因此’在晶片取料面與晶片放料面上 晶片數目增多的情況下，為了使晶片搬運裝置能夠取放 位於遠離旋轉中心之位置處的晶片，裝置尺寸必須對應 加長。如此一來，使得整體轉動慣量增加，影響了機構 3 M440292 的穩定度，也會使搬運晶片的時間加長。 緣此，本創作之目的即是提供一種晶片搬運裝 置，其改善習知技術之問題，以達到較佳的機構穩定度 及減少搬運晶片的時間。 本創作解決問題之技術手段 本創作為解決習知技術之問題所採用之技術手段 為一種晶片搬運裝置，用以於一晶片取料面與一晶片放 料面之間搬運一晶片，晶片搬運裝置包含一旋轉機構、 一旋轉桿、及一取放件，旋轉機構以一旋轉中心旋轉， 晶片取料面與晶片放料面設置面向旋轉中心’旋轉桿自 旋轉機構延伸出，取放件設置於旋轉桿之延伸端，並經 旋轉機構旋轉而朝向晶片取料面與晶片放料面，以使取 放件在晶片取料面提取晶片而於晶片放料面置放晶片。 在本創作的一實施例中，旋轉中心與晶片取料面 及與晶片放料面的距離相同。 在本創作的一實施例中，取放件在晶片取料面與 晶片放料面時為停留。 在本創作的一實施例中，晶片放料面具有一黏著 件。 在本創作的一實施例中，晶片取料面與晶片放料 面相互平行。 在本創作的"一實施例中’晶片取料面與晶片放料 面為平面。 在本創作的一實施例中，更包括一晶片取料台， 沿著晶片取料面之延伸方向平移，晶片取料面位於晶片 取料台。 在本創作的一實施例中，更包括一晶片放料台， 沿者晶片放料面之延伸方向平移’晶片放料面位於晶片 4 M440292 取料台。 在本創作的一實施例中，旋轉桿沿著旋轉機構之 旋轉半徑方向延伸。 在本創作的一實施例中，晶片取料面與晶片放料 面相互面對。 在本創作的一實施例中，晶片取料面與晶片放料 面相夹一夾角。 本創作對照先前技術之功效 經由本創作所採用之技術手段，能使晶片於晶片 取料面之提取位置以及於晶片放料面之置放位置不會 因為旋轉桿的長度為一定而受到限制，因而可於晶片取 料面與晶片放料面之間搬運大置的晶片。換s之’在晶 片取料面與晶片放料面上晶片數目增多的情況下，旋轉 桿的長度、轉動慣量可維持固定，而使得在晶片搬運上 有較佳的穩定度而減少晶片搬運的時間。 本創作所採用的具體實施例，將藉由以下之實施 例及附呈圖式作進一步之說明。 【實施方式】 同時參閱第1圖及第2圖所示，第1圖係顯示本創 作之第一實施例之晶片搬運裝置之立體圖，第2圖係顯 示本創作之第一實施例之晶片搬運裝置之側視圖。本創 作之晶片搬運裝置100包括一旋轉機構1、一旋轉桿2、 及一取放件3。 在本實施例中，旋轉機構1包括一驅動源（圖未 示）以及受驅動源驅動而旋轉的一旋轉軸11。旋轉機 構1以一旋轉中心C而沿一旋轉方向R旋轉。 旋轉桿2連接於旋轉機構1，由旋轉機構1之旋轉 5 M440292 軸11延伸出。在本實施例中，旋轉桿2係沿著旋轉機 構1之旋轉轴11之旋轉半徑方向延伸出。 取放件3設置於旋轉桿2之延伸端，而執行取放 晶片之動作。在本實施例中，取放件3連接一吸放機構 (圖未示），例如，空氣抽吸機，而可用吸放方式提取 晶片或置放晶片。 藉由上述結構，在實際應用時，晶片搬運裝置100 能夠於一晶片取料面F1與一晶片放料面F2之間搬運一 晶片6。其中，晶片取料面F1與晶片放料面F2相互面 對並設置面向旋轉中心C。較佳地，晶片取料面F1與 晶片放料面F2為平面且兩平面相互平行。藉由旋轉桿 2隨著旋轉機構1旋轉，使得當取放件3朝向晶片取料 面F1時為停留，並在晶片取料面F1提取晶片6，以及 當取放件3朝向晶片放料面F2時為停留’並在晶片放 料面F2置放晶片6。 此外，在旋轉桿2為固定長度，且旋轉桿2連接 之旋轉機構1的所在位置亦為固定的情況中，為了使取 放件3得以於晶片取料面F1與晶片放料面F2上的任意 位置取放晶片6，在本實施例中，係藉由使晶片取料面 F1所在的一晶片取料台4沿著晶片取料面F1之延伸方 向Dl、D2平移，以及使晶片放料面F2所在的一晶片 放料台5沿著晶片放料面F2之延伸方向D1、D2平移， 即可將欲取放晶片6的位置調整至對應處，而供取放件 3進行取放。 其中’為了使晶片取料台4或晶片放料台5上晶 片6不會偏離其置放位置。在晶片取料面F1、晶片放 料面F2上可進一步提供有一黏著件7 (例，藍膜），以 使晶片6能夠固定黏著於晶片取料面F1、晶片放料面 6 F2上的置放位置。 同時參閱第3圖及第4圖所示’第3圖係顯示本 創作之第二實施例之晶片搬運裝置之立體圖，第4圖传 本創作之第二實施例之晶片搬運裝置之側視圖。本實施 例之晶片搬運裝置l〇〇a與第一實施例之晶片搬運農置 100之結構及其作動方式大致相同，故對於這些部分將 不再贅述，而相同的元件以相同符號表示，其差別在 於’在本實施例中’晶片搬運裝置1 〇〇a設有二個旋轉 桿2a，分別自旋轉機構1之旋轉軸η沿旋轉半經方向 延伸出，而二個取放件3則分別位於各個旋轉桿2a之 延伸端。藉由二個旋轉桿2a的反向設置，使得在其中 一個旋轉桿2a旋轉至朝向晶片取料面F1時，另—個旋 轉桿2a則旋轉至朝向晶片放料面F2，如此可由其各自 的取放件3分別執行提取及置放晶片6之動作。相較於 第一實施例中僅具有一個取放件3的設置，在旋轉、取 放等動作所花費的時間為相同的情況下，本實施例之晶 片搬運裝置l〇〇a在相同時間搬運之晶片數量可達到第 一實施例之二倍。 參閱第5圖所示，其係本創作之第三實施例之晶 片搬運裝置之侧視圖。本實施例之晶片搬運裝置1〇〇b 與第二實施例之晶片搬運裝置l〇〇a之結構及其作動方 式大致相同，故對於這些部分將不再贅述，而相同的元 件以相同符號表示，其差別在於，在本實施例中，晶片 搬運裝置l〇〇b包括四個旋轉桿2b，而四個取放件3則 分別位於個別旋轉桿2b之延伸端。藉由旋轉桿2b及取 放件3數量的增加，能夠在同樣旋轉36〇。的情況下進 行更多次的取放動作，進一步提升晶片搬運的效率。 參閱第6圖所示，其係本創作之第四實施例之晶 M440292 片搬運裝置之侧視圖。本實施例之晶片搬運裝置100c 與第三實施例之晶片搬運裝置l〇〇b之結構及其作動方 式大致相同，故對於這些部分將不再贅述，而相同的元 件以相同符號表示，其差別在於，在本實施例中，具有 二晶片取料面F1、F1/位於—晶片取料台4c、4c·，以及 二晶片放料面F2、F2'位於二晶片放料台5c、5c'，且晶 片取料面FI、F1'與晶片放料面F2、F2'相夾一夾角（9。 在本實施例中，夾角Θ為90° 。 其中，在本實施例中，其晶片取料面之個數為第 二實施例中晶片取料面之個數之二倍，同樣地，其晶片 放料面之個數亦為第二實施例中晶片放料面之個數之 二倍。藉由晶片取料面與晶片放料面以及旋轉桿與取放 件之數量的同時增加，能夠在更小的旋轉角度中完成更 多次的搬運。如此一來，在相同時間之情況下，本實施 例之晶片搬運裝置100c可搬運之晶片數量可進一步超 過第三實施例之晶片搬運裝置。 除此之外，本實施例之晶片放料面F2、F2'亦可運 用於進行不同之晶片製程之步驟，以依照不同半導體製 程之流程需求分配應用。 由以上之實施例可知，本創作所提供之晶片搬運 裝置確具產業上之利用價值，故本創作業已符合於專利 之要件。惟以上之敘述僅為本創作之較佳實施例說明， 凡精於此項技藝者當可依據上述之說明而作其它種種 之改良，惟這些改變仍屬於本創作之創作精神及以下所 界定之專利範圍中。 【圖式簡單說明】 第1圖係顯示本創作之第一實施例之晶片搬運裝置之 8 M440292 立體圖。 第2圖係顯示本創作之第一實施例之晶片搬運裝置之 側視圖。 第3圖係顯示本創作之第二實施例之晶片搬運裝置之 立體圖。 第4圖係顯示本創作之第二實施例之晶片搬運裝置之 側視圖。 第5圖係顯示本創作之第三實施例之晶片搬運裝置之 側視圖。 第6圖係顯示本創作之第四實施例之晶片搬運裝置之 側視圖。 【主要元件符號說明】 100 、 100a 、 100b 、 100c 晶片搬運裝置 1 旋轉機構 11 旋轉軸 2、2a、2b 旋轉桿 3 取放件 4、4c、4c' 晶片取料台 5、5c、5c' 晶片放料台 6 晶片 7 黏著件 C 旋轉中心 D1、D2 方向 FI、FI' 晶片取料面 F2 ' F2' 晶片放料面 M440292 R 旋轉方向 θ 夾角M440292 V. New Description: [New Technical Field] This is a wafer transfer device, and more particularly to a wafer transfer device that transfers a wafer between a wafer take-up surface and a wafer discharge surface in a rotating manner. [Prior Art] A chip is a material commonly used in a semiconductor process and can be fabricated as a carrier for an integrated circuit. The wafer production process includes a variety of processing methods, including sensitizer coating, exposure, development, rot, and infiltration, etc., to make components with multilayer wiring, and to make practical use through inspection and packaging. The finished circuit is finished. Due to the different equipment used in the various processes in the wafer process and the use of devices distributed in different locations, and in order to avoid errors caused by human operation, and the impact of dust in the manufacturing process in the environment, the wafer process is mostly automated. The equipment is also carried out in a clean room. Thus, in semiconductor processes, a wafer handler is often used to transport the wafers so that the various processing steps of the wafer process can be coupled to each other. Alternatively, the wafers to be screened by the wafer handling device are sorted by sorting. [New content] Technical problem to be solved by the present invention The wafer take-up surface of the conventional wafer transfer device and the wafer discharge surface face in the same direction. Therefore, in the case where the number of wafers on the wafer take-up surface and the wafer discharge surface is increased, the size of the device must be lengthened in order to enable the wafer transfer apparatus to pick up and place the wafer located at a position away from the center of rotation. As a result, the overall moment of inertia is increased, which affects the stability of the mechanism 3 M440292, and also lengthens the time required to transport the wafer. Accordingly, the object of the present invention is to provide a wafer handling apparatus that improves the problems of the prior art to achieve better mechanism stability and reduced time to handle wafers. The technical means for solving the problem of the prior art is a wafer transfer device for transporting a wafer between a wafer take-up surface and a wafer discharge surface, the wafer transfer device The utility model comprises a rotating mechanism, a rotating rod and a pick-and-place member, wherein the rotating mechanism rotates at a center of rotation, and the wafer take-up surface and the wafer discharge surface are arranged to face the rotating center, and the rotating rod extends from the rotating mechanism, and the pick-and-place member is disposed on the rotating rod The extended end of the rotating rod is rotated by the rotating mechanism toward the wafer take-up surface and the wafer discharge surface, so that the pick-and-place member extracts the wafer on the wafer take-up surface and places the wafer on the wafer discharge surface. In an embodiment of the present invention, the center of rotation is the same as the distance between the wafer take-up surface and the wafer discharge surface. In an embodiment of the present invention, the pick-and-place member is stopped while the wafer take-up surface is facing the wafer discharge surface. In an embodiment of the present invention, the wafer discharge mask has an adhesive member. In an embodiment of the present invention, the wafer take-up surface and the wafer discharge surface are parallel to each other. In an "an embodiment" of the present invention, the wafer take-up surface and the wafer discharge surface are planar. In an embodiment of the present invention, a wafer take-up station is further included, which translates along the extending direction of the wafer take-up surface, and the wafer take-up surface is located at the wafer take-up station. In an embodiment of the present invention, a wafer discharge station is further included, which translates along the direction in which the wafer discharge surface extends. The wafer discharge surface is located on the wafer 4 M440292 take-up station. In an embodiment of the present creation, the rotating rod extends in the direction of the radius of rotation of the rotating mechanism. In an embodiment of the present invention, the wafer take-up surface and the wafer discharge surface face each other. In an embodiment of the present invention, the wafer take-up surface is at an angle to the wafer discharge surface. According to the technical means adopted by the present invention, the creation position of the wafer on the wafer take-up surface and the placement position on the wafer discharge surface are not limited by the length of the rotating rod. Thus, a large wafer can be transferred between the wafer take-up surface and the wafer discharge surface. In the case where the number of wafers on the wafer take-up surface and the wafer discharge surface is increased, the length and the moment of inertia of the rotating rod can be kept fixed, so that the wafer handling is better and the wafer handling is reduced. time. The specific embodiments used in the present application will be further illustrated by the following examples and accompanying drawings. [Embodiment] Referring to FIG. 1 and FIG. 2 together, FIG. 1 is a perspective view showing a wafer transfer device according to a first embodiment of the present invention, and FIG. 2 is a view showing a wafer transfer of the first embodiment of the present invention. Side view of the device. The wafer carrying device 100 of the present invention comprises a rotating mechanism 1, a rotating rod 2, and a pick-and-place member 3. In the present embodiment, the rotary mechanism 1 includes a drive source (not shown) and a rotary shaft 11 that is driven to be rotated by the drive source. The rotating mechanism 1 rotates in a rotational direction R with a center of rotation C. The rotary lever 2 is coupled to the rotary mechanism 1 and extends from the rotary shaft 5 M440292 shaft 11 of the rotary mechanism 1. In the present embodiment, the rotary lever 2 extends in the direction of the radius of rotation of the rotary shaft 11 of the rotary mechanism 1. The pick-and-place member 3 is disposed at the extended end of the rotary lever 2 to perform the action of picking up and dropping the wafer. In the present embodiment, the pick-and-place member 3 is connected to a suction and discharge mechanism (not shown), for example, an air suction machine, and the wafer can be taken up or placed by suction and discharge. With the above configuration, in practical use, the wafer transfer apparatus 100 can carry a wafer 6 between a wafer take-up surface F1 and a wafer discharge surface F2. Here, the wafer take-up surface F1 and the wafer discharge surface F2 face each other and are disposed to face the rotation center C. Preferably, the wafer take-up surface F1 and the wafer discharge surface F2 are planar and the two planes are parallel to each other. By the rotation of the rotating rod 2 with the rotating mechanism 1, the staying member 3 is stopped when facing the wafer take-up surface F1, and the wafer 6 is taken out at the wafer take-up surface F1, and when the pick-and-place member 3 faces the wafer discharge surface At F2, it is stopped and the wafer 6 is placed on the wafer discharge surface F2. Further, in the case where the rotating lever 2 is of a fixed length and the position of the rotating mechanism 1 to which the rotating lever 2 is attached is also fixed, in order to allow the pick-and-place member 3 to be on the wafer take-up surface F1 and the wafer discharge surface F2 The wafer 6 is taken and placed at any position. In the present embodiment, the wafer take-up stage 4 where the wafer take-up surface F1 is located is translated along the extending direction D1, D2 of the wafer take-up surface F1, and the wafer is discharged. The wafer discharge table 5 where the surface F2 is located is translated along the extending direction D1 and D2 of the wafer discharge surface F2, so that the position of the wafer 6 to be picked up and lowered can be adjusted to the corresponding position, and the pick-and-place unit 3 can be taken and placed. In order to prevent the wafer 6 on the wafer take-up stage 4 or the wafer discharge table 5 from deviating from its placement position. An adhesive member 7 (for example, a blue film) may be further provided on the wafer take-up surface F1 and the wafer discharge surface F2 so that the wafer 6 can be fixedly adhered to the wafer take-up surface F1 and the wafer discharge surface 6 F2. Put the position. Referring to Fig. 3 and Fig. 4, the third embodiment shows a perspective view of the wafer transfer apparatus of the second embodiment of the present invention, and Fig. 4 is a side view of the wafer transfer apparatus of the second embodiment. The wafer transfer device 10a of the present embodiment is substantially the same as the structure and the operation of the wafer transfer farm 100 of the first embodiment, and therefore, the same components are denoted by the same reference numerals, and the same components are denoted by the same reference numerals. The difference is that in the present embodiment, the wafer transfer device 1 〇〇a is provided with two rotating rods 2a extending from the rotation axis η of the rotation mechanism 1 in the direction of the rotation half, and the two pick-and-place members 3 respectively Located at the extended end of each of the rotating rods 2a. By the reverse arrangement of the two rotating rods 2a, when one of the rotating rods 2a is rotated toward the wafer take-up surface F1, the other rotating rod 2a is rotated to face the wafer discharge surface F2, so that it can be The pick-and-place member 3 performs an action of extracting and placing the wafer 6, respectively. Compared with the arrangement in which only one pick-and-place member 3 is provided in the first embodiment, the wafer transfer device 10a of the present embodiment is carried at the same time in the case where the time taken for the operations of rotation, pick-and-place, etc. is the same. The number of wafers can be twice as large as in the first embodiment. Referring to Fig. 5, it is a side view of the wafer carrying device of the third embodiment of the present invention. The structure of the wafer transfer device 1b of the present embodiment and the operation of the wafer transfer device 10a of the second embodiment are substantially the same, and therefore, the same components are denoted by the same reference numerals. The difference is that, in the present embodiment, the wafer transfer device 10b includes four rotary levers 2b, and the four pick and place members 3 are respectively located at the extended ends of the individual rotary levers 2b. By the increase in the number of the rotating lever 2b and the pick-and-place member 3, it is possible to rotate 36 turns in the same manner. In the case of more pick-and-place operations, the efficiency of wafer handling is further improved. Referring to Fig. 6, there is shown a side view of the crystal M440292 sheet handling device of the fourth embodiment of the present invention. The structure of the wafer transfer device 100c of the present embodiment and the operation of the wafer transfer device 100b of the third embodiment are substantially the same, and therefore, the same components are denoted by the same reference numerals, and the difference is the same. In this embodiment, the two wafer take-up surfaces F1, F1/ are located at the wafer take-up stations 4c, 4c, and the two wafer discharge surfaces F2, F2' are located at the two wafer discharge tables 5c, 5c', And the wafer take-up surface FI, F1' is at an angle with the wafer discharge surface F2, F2' (9. In the embodiment, the angle Θ is 90°. Wherein, in the embodiment, the wafer take-up surface The number is the same as the number of the wafer take-up surface in the second embodiment. Similarly, the number of wafer discharge faces is twice the number of the wafer discharge surface in the second embodiment. By increasing the number of wafer take-up surfaces and wafer discharge surfaces and the number of rotating rods and pick-and-place members, it is possible to perform more transports in a smaller angle of rotation. Thus, at the same time, this The number of wafers that can be carried by the wafer carrier 100c of the embodiment can further exceed The wafer transfer device of the third embodiment. In addition, the wafer discharge surfaces F2, F2' of the present embodiment can also be applied to perform different wafer processing steps to distribute applications according to the process requirements of different semiconductor processes. As can be seen from the above embodiments, the wafer handling device provided by the present invention has industrial use value, and the present invention has been in conformity with the requirements of the patent. However, the above description is only a description of the preferred embodiment of the present invention. The artist may make other improvements according to the above description, but these changes still belong to the creative spirit of the creation and the scope of patents defined below. [Simplified illustration] Figure 1 shows the creation of this creation. 8 M440292 perspective view of the wafer transfer apparatus of the first embodiment. Fig. 2 is a side view showing the wafer transfer apparatus of the first embodiment of the present invention. Fig. 3 is a view showing the wafer transfer apparatus of the second embodiment of the present invention. Fig. 4 is a side view showing the wafer transfer device of the second embodiment of the present invention. Fig. 5 is a view showing the crystal of the third embodiment of the present invention. Fig. 6 is a side view showing the wafer transfer device of the fourth embodiment of the present invention. [Main component symbol description] 100, 100a, 100b, 100c wafer transfer device 1 rotary mechanism 11 rotary shaft 2 2a, 2b Rotating rod 3 Pick-and-place 4, 4c, 4c' Wafer pick-up station 5, 5c, 5c' Wafer discharge table 6 Wafer 7 Adhesive C Rotation center D1, D2 Direction FI, FI' Wafer take-up surface F2 ' F2' wafer discharge surface M440292 R rotation direction θ angle