TWM438642U - Apparatus for capturing image and LEN device - Google Patents

Apparatus for capturing image and LEN device Download PDF

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Publication number
TWM438642U
TWM438642U TW101208767U TW101208767U TWM438642U TW M438642 U TWM438642 U TW M438642U TW 101208767 U TW101208767 U TW 101208767U TW 101208767 U TW101208767 U TW 101208767U TW M438642 U TWM438642 U TW M438642U
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TW
Taiwan
Prior art keywords
lens
sapphire
glue
housing
axis
Prior art date
Application number
TW101208767U
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Chinese (zh)
Inventor
Wei-Hsiang Wang
Chen-Hui Wu
Original Assignee
Tera Xtal Technology Corp
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Application filed by Tera Xtal Technology Corp filed Critical Tera Xtal Technology Corp
Priority to TW101208767U priority Critical patent/TWM438642U/en
Priority to RU2012136722/28A priority patent/RU2012136722A/en
Publication of TWM438642U publication Critical patent/TWM438642U/en
Priority to KR1020120133831A priority patent/KR101353381B1/en
Priority to DE102012024801A priority patent/DE102012024801A1/en

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/02Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of crystals, e.g. rock-salt, semi-conductors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • G02B13/001Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • G03B17/12Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B29/00Combinations of cameras, projectors or photographic printing apparatus with non-photographic non-optical apparatus, e.g. clocks or weapons; Cameras having the shape of other objects
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly

Abstract

An image capture apparatus comprises a lens device and a sapphire lens. The lens device includes a first shell body. The sapphire lens are directly joined with the first shell body for protecting the apparatus with camera lens, wherein the axis of crystal is one of a group consisted of c-axis (0001), a-axis including [(110), (110 ), (20), (20), (110), and(20)], m-axis including [(010), (100), (010), (100), (100), and (010)], and r-axis including [(101), (01), (01), (011), (10), and (101)].

Description

M438642 五、新型說明: 【新型所屬之技術領域】 本案是關於一種取像裝置’特別是關於一種具有藍寶石鏡 片的取像裴置。 【先前技術】 具有照相功能的消費型手持裝置近年來大量地推陳出M438642 V. New description: [New technical field] The present invention relates to an image taking device, in particular to an image capturing device having a sapphire lens. [Prior Art] Consumer handheld devices with camera functions have been extensively introduced in recent years.

新’由於半導體技術的發展,光學設計的技術突飛猛進,使得 光學元件的尺寸能夠愈作愈小,因此數位照相機鏡頭可被大量 運用在消費猜動裝置上’例如手機、手持式遊戲機、刪 隨身聽、筆記型電腦、平板電腦、GPS全球定位裝置、以及行 車紀錄器等。 由於數位照相機鏡頭的感光元件之晝素愈來愈高,因此數 位照相機裝㈣祕品質之要求也愈高。現行扣上具有照相 功能的行動裝置所使用的保護鏡片的材料—般為透明的壓克 ^材料或是其贿_高分子_,這些材料作摘保護鏡片 提供了數触城綱本倾,並聽触相機裝置不受 购而可正常地成像,但是往往在使用者操作數位照相機裝置 ::間後’壓克力材料或是透明高分子材料作成嶋 曰因^使用上的摩擦或撞擊而造成保護鏡片的表面的損傷,此 滅鏡頭透過受傷的_鏡㈣表面來取 ^:會造錢像的品財佳,轉致感光元件無法正確有效 地判_攝物體的成像而有雜關輪出,進而造成數位昭相機 3 裝置的功能降低或失效。 請參閱第一圖⑻和第一圖(b),第一圖⑻為習知取像裝置 正面的示意圖,第一圖(b)則為習知取像裝置背面的示意圖。 在第一圖(a)中,習知取像裝置1〇包含前蓋殼體ιοί、液晶螢 幕102、以及實體按鍵103。在第一圖⑼中,習知取像裝置1〇 包含保護鏡片104以及背蓋殼體105。 請參閱第二圖,其為習知取像裝置結構12之示意圖。取 像裝置結構12包括一保護鏡片1〇4、一背蓋殼體1〇5、以及一 鏡頭模組106。保護鏡片1〇4配置於背蓋殼體1〇5的上方,用 以保護其下方的鏡頭模組106,保護鏡片104的材料以高分子 為主’其包括壓克力或碳酸樹脂。 請參閱第三圖,其為習知取像裝置結構12的剖面之示意 圖。在第三圖中’取像裝置結構12更包含液晶螢幕1〇2以及 一電路板107 ’鏡頭模組ι〇6與電路板1〇7電性連接,電路板 107位於背蓋殼體105的下方,背蓋殼體1〇5環繞著鏡頭模組 1〇6,而鏡頭模組106位於保護鏡片1〇4的下方,因此可受到 保護鏡片104的保護。 在第三圖中’強化玻璃也可作為鏡頭模組1〇6的保護鏡片 104 ’雖然強化玻璃比高分子材料提供更高的硬度的保護,但 是其仍售會因為使用頻繁而被刮傷,而且若不慎將取像裝置 10掉至硬質面上(如地面上),則會使強化玻璃受外力之撞擊而 破裂,破碰的破裂面具有制的尖肖而極易造成使用者的割 劃傷’因此使用強化玻璃作為鏡頭模組1〇6的保護鏡片撕有 潛在的危險性。 另外一種習知技術是使用多層材料的疊合來作為保士蔓f 片104 ’而多層材料的疊合則會造成光的損耗,亦會導致成像 不佳且有雜訊的產生。 請參閱第四圖,其為習知取像裝置結構14的示旁圖。在 中華民國專利公開號M267775的新型創作中,取像裝置結構 14包含一多層材料保護鏡片109、背蓋殼體ι〇5、鏡頭模組 、電路板107、以及液晶螢幕1〇2。多層材料保護鏡片ι〇9 包含一保護鏡片104以及一保護層1〇8。保護層1〇8雖可以增 強多層材料保護鏡片109的保護能力,但是多了保護層1〇8會 大幅降低光穿透濾,從而影響到鏡頭模組1〇6取像的品質。 【新型内容】 本創作提供一種藍寶石以作為保護鏡片的材料,藍寶石具 有早晶結構與不_晶體轴向項作為取像裝錢相機鏡頭模 、、且的保魏>}。藍f;5的硬度僅次於鑽石,以藍寶^作為保護 =片的材料可達到防刮、抗磨、以及抗衝擊的特性。此外,藍 :石優異的機械特性不但可以免除在加工過程中因外力的碰 細導致的良率雜_下降,且可減少製程巾_送所造成 的損失,更提供鏡片強大的防刮傷之功能。 依據上述構想,一種取像震置被提出,該取像裝置包含一 2裝置以及—藍寶石鏡片。該鏡頭裝置包含—第—殼體。該 皿二石鏡>|與該第—殼體直接接合,以保護該綱裝置,其中 該監寶石鏡片具有—晶體結構以及-晶體轴向,該晶體結構為 一單晶結構,且該晶體轴向為c-軸向(0001)、a-軸向[包括 (1云0)、(100)、(2ΪΪ0)、(ΪΪ20)、($110)、以及(Ϊ2Ϊ0)]、m-轴向[包括 (ioio)、(iioo)、(οιίο)、(ιοϊο)、(ιϊοο)、以及(oiio)]、和 r-轴向[包 括(10Ϊ1)、(Ϊ01Ϊ)、(01ΪΪ)、(0Ϊ11)、(1Ϊ0Ϊ)、以及(Ϊ101)]的其中之一。 依據上述構想,一種取像裝置被提出,該取像裝置包含一 鏡頭裝置以及一藍寶石鏡片。該鏡頭裝置具有一凹陷區域。該 藍寶石鏡片位於該凹陷區域以保護該鏡頭裝置,其中該藍寶石 鏡片具有一晶體結構以及一晶體軸向,該晶體結構為一單晶結 構’且該晶體軸向為c-軸向(0001)、a-軸向[包括(i3i〇)、(11¾)、 (2ΪΪ0)、(ΪΪ20)、(5110)、以及(Ϊ2Ϊ0)]、m-軸向[包括(Ϊ010)、(i100)、 (0110) 、(ioio)、(ιϊοο)、以及(0Ϊ10)]、和 r·轴向[包括(10Ϊ1)、(Ϊ01Ϊ)、 (0111) 、(οϊιι)、(ii〇i)、以及(ϊ101)]的其中之_。 依據上述想,一種取像裝置被提出,該種取像裝置包含一 鏡頭裝置以及一藍寶石鏡片。該藍寶石鏡片與該鏡頭裝置直接 接合,其中該藍寶石鏡片具有一晶體結構以及一晶體軸向,該 晶體結構為一單晶結構,且該晶體軸向為c_軸向(〇〇〇1)、a_軸 向[包括(1210)、(出0)、(;2Π〇)、(Π20)、㈤〇)、以及(ί2ί〇刀、m_ 轴向[包括(1010)、(Ϊ100)、(01ϊ〇)、⑽〇)、(ύ〇〇)、以及_)]、和 Γ·軸向[包括⑽)、(_、(師)、(〇ϊ11)、(ii〇i)、以及⑽〇]的其 中之一。 依據上述縣,—齡像裝置被提出,絲像裝置包含一 鏡頭裂置與-㈣;。該藍寶;5制與該綱裝置直接接 合0 依據上述構想, 一種取像裝置被提出,該鏡頭裝置包含一 鏡頭模組以及一藍寶石鏡項鏡片 鏡頭模組以構成該鏡頭裝置。 【實施方式】 。該藍寶石鏡頭鏡片裝設於該 。月參閱第五圖(a)和第五圖⑻,第五圖 像裝置2〇正面的示意圖,第五_則為本案第I 土貫&例取像f置20背φ的示意目。在第五圖⑷巾,取像裝 置2〇包含職殼體201、液晶顯示螢幕202、以及實體按鍵 2〇3。在第五剛中,取像褒置π包含藍寶石鏡片綱以及 背蓋殼體205。取料置2()在第五_、⑻中較佳為具有相 機功月b的手持裝置’藍寶石鏡片2()4亦可應用於例如手持式遊 戲機、MP3隨身聽、筆記型電腦、平板f腦、Gps全球定位 裝置、以及行車紀錄器等。 請參閱第五圖(c),其為本案第一較佳實施例取像裝置結構 22的剖面之示意圖。取像襞置結構22包含藍寶石鏡片2⑽、 一接合膠210、一鏡頭裝置208、以及液晶螢幕202。鏡頭裝 置208包括一鏡頭模組206、一電路板2〇7、以及背蓋殼體2〇5。 鏡頭模組206與電路板207耦接。背蓋殼體205例如為一手機 背蓋’其位於液晶螢幕2〇2上且環繞該鏡頭模組2〇6。背蓋殼 體205在鏡頭模組2〇6的位置上具有一開口區域209,以使該 鏡頭模組206能夠攝取影像。該接合膠210用於在相對於室溫 的一第一高溫下直接接合藍寶石鏡片204與鏡頭裝置208。 該藍寶石鏡片204具有一晶體軸向、一晶體結構和一透光 率’其中該晶體軸向為c_軸向(〇〇〇1)、&-軸向[包括(151〇)、〇1如)、 M438642 (2110) ^ (Π20) . (2Π0) .,X^(i2i〇)] , m^^[^(i〇i〇) ^ (-〇〇) ^New' Due to the development of semiconductor technology, the technology of optical design has advanced by leaps and bounds, making the size of optical components smaller and smaller. Therefore, digital camera lenses can be used in a large number of consumer guessing devices, such as mobile phones, handheld game consoles, and portable devices. Listening, notebook computers, tablets, GPS global positioning devices, and driving recorders. Since the quality of the photosensitive elements of the digital camera lens is getting higher and higher, the requirements for the quality of the digital camera are higher. The material of the protective lens used in the current camera-attached mobile device is generally a transparent embossing material or a bribe _ polymer _, these materials provide a number of tentacles, and The camera device can be imaged normally without being purchased, but it is often caused by friction or impact on the use of acrylic materials or transparent polymer materials after the user operates the digital camera device: To protect the surface of the lens from damage, the lens is taken through the surface of the injured mirror. The quality of the money-making image is good, and the photosensitive element cannot correctly and effectively judge the image of the object. , causing the function of the digital camera 3 to be reduced or disabled. Referring to the first figure (8) and the first figure (b), the first figure (8) is a schematic view of the front side of the conventional image taking device, and the first figure (b) is a schematic view of the back side of the conventional image taking device. In the first diagram (a), the conventional image taking device 1A includes a front cover casing ιοί, a liquid crystal screen 102, and a physical button 103. In the first figure (9), the conventional image taking device 1A includes a protective lens 104 and a back cover case 105. Please refer to the second figure, which is a schematic diagram of a conventional image taking device structure 12. The imaging device structure 12 includes a protective lens 1〇4, a back cover housing 1〇5, and a lens module 106. The protective lens 1〇4 is disposed above the back cover case 1〇5 to protect the lens module 106 underneath, and the material of the protective lens 104 is mainly composed of a polymer, which includes acrylic or carbonated resin. Please refer to the third drawing, which is a schematic view of a cross section of a conventional image taking device structure 12. In the third figure, the image capturing device structure 12 further includes a liquid crystal screen 1〇2 and a circuit board 107. The lens module 〇6 is electrically connected to the circuit board 1〇7, and the circuit board 107 is located in the back cover housing 105. Below, the back cover housing 1〇5 surrounds the lens module 1〇6, and the lens module 106 is located below the protective lens 1〇4, and thus can be protected by the protective lens 104. In the third figure, 'tempered glass can also be used as the protective lens 104 of the lens module 1〇6. Although the tempered glass provides higher hardness protection than the polymer material, it is still sold because it is scratched due to frequent use. Moreover, if the image capturing device 10 is accidentally dropped onto a hard surface (such as on the ground), the tempered glass is broken by the impact of an external force, and the broken surface of the rupture has a sharp tip which is easy to cause the user to cut. Scratch' Therefore, the use of tempered glass as a protective lens for the lens module 1〇6 is potentially dangerous. Another conventional technique is to use a stack of multiple layers of material as the barrier slab 104' and the superposition of multiple layers of material causes loss of light, which also results in poor imaging and noise. Please refer to the fourth figure, which is a side view of the conventional image taking device structure 14. In the novel creation of the Republic of China Patent Publication No. M267775, the image taking device structure 14 includes a multilayer material protective lens 109, a back cover housing ι5, a lens module, a circuit board 107, and a liquid crystal screen 1〇2. The multi-layer material protective lens ι 9 includes a protective lens 104 and a protective layer 1 〇 8. Although the protective layer 1〇8 can enhance the protection ability of the multilayer material protection lens 109, the protective layer 1〇8 greatly reduces the light penetration filter, thereby affecting the quality of the lens module 1〇6 image. [New content] This creation provides a sapphire as a material for protecting the lens. The sapphire has an early crystal structure and a non-crystal axial axis as an image pickup lens model, and Bao Wei>}. Blue f; 5 hardness is second only to diamonds, with sapphire ^ as a material for protection = sheet material can achieve scratch, anti-wear, and impact resistance. In addition, the excellent mechanical properties of the blue: stone not only can avoid the yield fluctuation caused by the external force during the processing, and can reduce the loss caused by the process towel, and provide the lens with strong scratch resistance. Features. According to the above concept, an image pickup is proposed, and the image capturing device comprises a device and a sapphire lens. The lens device includes a - first housing. The second stone mirror>| is directly joined to the first housing to protect the device, wherein the gemstone lens has a crystal structure and a crystal axial direction, the crystal structure is a single crystal structure, and the crystal axis The direction is c-axis (0001), a-axis [including (1 cloud 0), (100), (2ΪΪ0), (ΪΪ20), ($110), and (Ϊ2Ϊ0)], m-axis [including (ioio), (iioo), (οιίο), (ιοϊο), (ιϊοο), and (oiio)], and r-axis [including (10Ϊ1), (Ϊ01Ϊ), (01ΪΪ), (0Ϊ11), ( One of 1Ϊ0Ϊ), and (Ϊ101)]. According to the above concept, an image taking device is proposed which comprises a lens device and a sapphire lens. The lens device has a recessed area. The sapphire lens is located in the recessed area to protect the lens device, wherein the sapphire lens has a crystal structure and a crystal axial direction, the crystal structure is a single crystal structure 'and the crystal axis is c-axis (0001), A-axial [including (i3i〇), (113⁄4), (2ΪΪ0), (ΪΪ20), (5110), and (Ϊ2Ϊ0)], m-axis [including (Ϊ010), (i100), (0110) , (ioio), (ιϊοο), and (0Ϊ10)], and r·axial [including (10Ϊ1), (Ϊ01Ϊ), (0111), (οϊιι), (ii〇i), and (ϊ101)] Among them _. According to the above, an image taking device is proposed which comprises a lens device and a sapphire lens. The sapphire lens is directly coupled to the lens device, wherein the sapphire lens has a crystal structure and a crystal axial direction, the crystal structure is a single crystal structure, and the crystal axis is c_axial (〇〇〇1), A_Axis [including (1210), (out 0), (;2Π〇), (Π20), (5)〇), and (ί2ί〇刀, m_ axis [including (1010), (Ϊ100), (01ϊ) 〇), (10) 〇), (ύ〇〇), and _)], Γ·Axis [including (10)), (_, (teacher), (〇ϊ11), (ii〇i), and (10)〇] According to the above-mentioned county, the age-image device is proposed, the wire image device includes a lens split and - (4); the sapphire; 5 system directly engages with the device 0. According to the above concept, an image capturing device It is proposed that the lens device comprises a lens module and a sapphire lens lens module to form the lens device. [Embodiment] The sapphire lens is mounted on the lens. See Figure 5 (a) and Figure 5 (8), the schematic diagram of the front side of the fifth image device 2〇, and the fifth _ is the first example of the case of the case In the fifth figure (4), the image taking device 2 includes a job housing 201, a liquid crystal display screen 202, and a physical button 2〇3. In the fifth frame, the image capturing unit π includes a sapphire lens and a back cover housing. 205. Retrieving device 2 () in the fifth _, (8) is preferably a handheld device with a camera power b] sapphire lens 2 () 4 can also be applied to, for example, a handheld game console, MP3 player, notebook computer Please refer to FIG. 5(c), which is a schematic diagram of a cross-section of the image capturing device structure 22 of the first preferred embodiment of the present invention. The image capturing device structure 22 is shown in FIG. The sapphire lens 2 (10), a bonding glue 210, a lens device 208, and a liquid crystal screen 202. The lens device 208 includes a lens module 206, a circuit board 2〇7, and a back cover housing 2〇5. The back cover housing 205 is coupled to the lens module 2〇2 and surrounds the lens module 2〇6. The back cover housing 205 is at the lens module 2〇6. There is an open area 209 at the location to enable the lens module 206 to capture images. The bonding glue 210 is used to directly join the sapphire lens 204 and the lens device 208 at a first high temperature relative to room temperature. The sapphire lens 204 has a crystal axial direction, a crystal structure and a light transmittance 'where the crystal axis The direction is c_axis (〇〇〇1), &-axis [including (151〇), 〇1 as), M438642 (2110) ^ (Π20) . (2Π0) ., X^(i2i〇) ] , m^^[^(i〇i〇) ^ (-〇〇) ^

(_、_)、(_、以及(_]、和 r_ 轴向[包括(10il)、(i011_)、 (〇1Π)、(Oiu)、_)、以及(ϊ101)]的其中之—,該晶體結構為一 單晶結構’且該透光率大於或等於80%。該藍寶石鏡片2〇4 由於其材脸賴次於_,且频強度Α、防刮、以及抗腐 韻’因此適合作為該取像裝置20的保護鏡片。但並非所有種 類的藍寶騎適合作為賴制,対I黯構為單晶結構的 藍寶石因透光率達80〇/〇以上而較適合;多晶結構則不適合,因 其透光率多在60%以下,故不符合需求。 此外晶體軸向不㈤,藍寶石鏡片204的物理或光學特性亦 不同。物雜性例如包含硬度、揚氏係數、抗壓強度、熱傳導 係數、以及潤濕角度的至少其中之—。光學雜例如包含透光(_, _), (_, and (_), and r_ axial [including (10il), (i011_), (〇1Π), (Oiu), _), and (ϊ101)], The crystal structure is a single crystal structure 'and the light transmittance is greater than or equal to 80%. The sapphire lens 2〇4 is suitable for the surface of the sapphire lens _, and the frequency strength is Α, scratch-resistant, and anti-corrosion rhyme As the protective lens of the image capturing device 20, it is not suitable for all kinds of sapphire riding, and the sapphire having a single crystal structure is suitable for light transmittance of 80 〇/〇 or more; polycrystalline structure It is not suitable, because its light transmittance is more than 60%, so it does not meet the demand. In addition, the crystal axis is not (5), the physical or optical properties of the sapphire lens 204 are also different. The impurity properties include, for example, hardness, Young's modulus, and compression resistance. At least one of strength, heat transfer coefficient, and wetting angle.

率下列表1列出藍寶石鏡片綱的各晶體軸向與強化玻璃在 爸g特性與光學特性h的比較。Table 1 below shows a comparison of the crystal axes of the sapphire lens and the tempered glass characteristics and optical properties h.

當晶體軸向為C_軸向' a_軸向、m_軸向、和Γ_軸向的其中 8 任何之一時,藍寶石鏡片204的硬度、楊氏係數、抗壓強度、 和熱傳導係數的每一特性都遠超過強化玻璃,而在透光率上藍 寳石鏡片204雖比強化玻璃低一點’但還是有不錯的透光率特 性。 在一實施例中’為了k南監寶石鏡片204的透光率,藍寶 石鏡片204未與为蓋威體205接合之前,一抗反射層(未顯示) 可先鑛於該監寶石鏡片204上以增加該藍寶石鏡片204的透光 率,其中該抗反射層的一層數與一厚度與該透光率相關,該層 數是至少一層以上,較佳地約數十層,每一層的厚度約3〜5 微米。 該抗反射層可形成於藍寶石鏡片2〇4的表面211或是表面 212,在該抗反射層未形成於藍寶石鏡片2〇4上時,該透光率 至少_以上,在該抗反射層形成於藍寶石鏡片綱上後,該 ,光率至何達95%社。該抗反射層可藉由—物理氣相沉積 i體=相沉積來形成’且該抗反射層包含金屬氧化物或半 2 ^^例+,嫩f錢請tb—崎料更能夠 耐❿皿以及抗顧性,因此在其與背蓋殼體加接 油墨印刷層(未顯示)或一裝飾性 製程在她μ 峡增(賴τ)可利用-特定 ^該^第二高溫下形成於該藍寶石鏡片上 射雕刻 '-絲綢印刷、或喷塗。 ^儿贿膜、-雷 在另貫施例中,該抗反射層與該油墨印刷層可依照不同 M438642 32的剖面之示意圖。取像裝置結構32包含藍寶石鏡片3〇4、 複數接合夥310、一鏡頭裝置308、以及液晶螢幕302。鏡頭 裝置308包括一鏡頭模組3〇6、一電路板3〇7、以及第二背蓋 叙體305。鏡頭模組306與電路板3〇7耦接,第二背蓋殼體3〇5 例如為手機背蓋’其位於液晶營幕3G2上且環繞該鏡賴組 306。第二背蓋殼體3〇5在鏡頭模組3〇6的位置上具有一開口 區域309。When the crystal axis is any one of C_axial 'a_axial, m_axial, and Γ_axial, the hardness, Young's modulus, compressive strength, and thermal conductivity of the sapphire lens 204 Each feature far exceeds the tempered glass, while the sapphire lens 204 is a little lower than the tempered glass in terms of light transmission, but still has good light transmission characteristics. In an embodiment, an anti-reflective layer (not shown) may be first mineralized on the gemstone lens 204 before the sapphire lens 204 is not bonded to the cover 205 for the light transmittance of the sapphire lens 204. Increasing the light transmittance of the sapphire lens 204, wherein the number of layers and the thickness of the anti-reflective layer are related to the light transmittance, the number of layers is at least one layer, preferably about several tens of layers, and each layer has a thickness of about 3 ~5 microns. The anti-reflection layer may be formed on the surface 211 or the surface 212 of the sapphire lens 2〇4. When the anti-reflection layer is not formed on the sapphire lens 2〇4, the light transmittance is at least _ or more, and the anti-reflection layer is formed. After the sapphire lens, the light rate is 95%. The anti-reflection layer can be formed by physical vapor deposition i body = phase deposition and the anti-reflection layer comprises a metal oxide or a half of the ^^^+, and the tb-saki material is more resistant to the dish. And resistance, so that an ink-printing layer (not shown) or a decorative process is added to the back cover housing at the second high temperature that is available to the μ gorge Sapphire lenses are shot on the '- silk printing, or sprayed. ^Break film, - Ray In another embodiment, the anti-reflective layer and the ink printed layer can be schematic according to the profile of different M438642 32. The image taking device structure 32 includes a sapphire lens 3〇4, a plurality of partners 310, a lens device 308, and a liquid crystal screen 302. The lens unit 308 includes a lens module 3〇6, a circuit board 3〇7, and a second back cover body 305. The lens module 306 is coupled to the circuit board 3〇7, and the second back cover housing 3〇5 is, for example, a mobile phone back cover ‘which is located on the liquid crystal screen 3G2 and surrounds the mirror group 306. The second back cover housing 3〇5 has an open area 309 at the position of the lens module 3〇6.

^請參閱第六圖⑷’其為藍寶石鏡>n〇4的俯視之示意圖。 在第,、圖(d)中,藍寶石鏡片3〇4具有複數通孔313,第一背蓋 成體311亦具有一開口區域312,開口區域312以及開口區域 309皆位於鏡頭模組3〇6的位置,贿該鏡頭模組裏能夠攝 取影像。 _睛參閱第六_),其為第一背蓋殼體川與藍寶石鏡片接 合3〇4的不意圖。該藍寶石鏡片3〇4具有一凸部315,該凸部 ϋ與該鏡頭模組306的位置對齊,如第六圖(a)所示。第-背^Please refer to the sixth figure (4)' which is a schematic view of the sapphire mirror > n〇4. In the figure (d), the sapphire lens 3〇4 has a plurality of through holes 313, and the first back cover body 311 also has an opening area 312, and the opening area 312 and the opening area 309 are located in the lens module 3〇6. The location, bribe the lens module can capture images. _ Eyes refer to the sixth _), which is the intention that the first back cover shell is combined with the sapphire lens 3〇4. The sapphire lens 3〇4 has a convex portion 315 which is aligned with the position of the lens module 306 as shown in Fig. 6(a). First-back

=體311具有複數熱炫柱314,當該第一背蓋殼體與該 藍寶石鏡片304在疊合時,該複數齡柱3M穿過該複數通孔 313/並透過加熱該複數熱熔柱314使該第一背蓋殼體311與 該^石鏡片304接合’該複數熱溶柱314會因加熱而熔解成 合勝310’其中該複數熱溶柱314的成分為一熱塑型塑 =益藍寶石鏡片304與第一背蓋殼體如之間可直接接合,益 須藉由加熱該複數熱熔柱314。 與本案第-較佳實施例相同地,在藍寶石鏡片3〇4進行接 11 M438642 二先在藍寶石鏡片304上鑛臈,例如該抗反射層、該 ’ ^ 1 s、或魏飾性_相增加it級與美觀。 請參閱第七_)和第七_,第 =像裝置4〇正面的示意圖,第七_為權= 只也歹1取像裝置40背面的示意圖。在第七The body 311 has a plurality of thermal columns 314. When the first back cover is overlapped with the sapphire lens 304, the plurality of columns 3M pass through the plurality of through holes 313/ and heat the plurality of heatsinks 314. The first back cover shell 311 is joined to the stone mirror 304. The plurality of hot melt columns 314 are melted into a win 310 by heating, wherein the composition of the plurality of hot melt columns 314 is a thermoplastic mold = Yi sapphire The lens 304 can be directly joined to the first back cover housing, for example, by heating the plurality of heat stakes 314. In the same manner as the first preferred embodiment of the present invention, the sapphire lens 3〇4 is connected to the first sapphire lens 304, for example, the anti-reflective layer, the '^ 1 s, or the Wei _ _ phase is increased. It level and beautiful. Please refer to the seventh _) and the seventh _, the first picture of the front side of the device 4 ,, the seventh _ is the right = only the picture of the back of the image taking device 40. At the seventh

二,殼體401、液晶顯示榮幕搬、以及實體按鍵 七圖⑼中,取像裝置40包含藍寶石鏡片404以及 是盖殼體405,該背蓋殼體4〇5具有一凹陷區域413用以炭入 該藍寶石鏡片404。 月’閱第七圖(c)’其為本案第三較佳實施例取像裝置結構 42的剖面之示意圖。取像裝置結構犯包含藍寶石鏡片姻、 接合膠410、背级體405、鏡頭裝置、以及液晶榮幕. 鏡頭襞置408包括背蓋殼體4〇5、鏡頭模組鄕、以及電路板 月蓋;v又體405更具有-開口區域4〇9以利鏡頭模組撕 取像。藍寶石鏡片404具有複數凹槽414。Second, the housing 401, the liquid crystal display screen, and the physical button seven (9), the image capturing device 40 includes a sapphire lens 404 and a cover housing 405, the back cover housing 4 〇 5 has a recessed area 413 for Charcoal is incorporated into the sapphire lens 404. Figure 7 is a schematic view showing a cross section of the image pickup device structure 42 of the third preferred embodiment of the present invention. The image capturing device structure includes a sapphire lens, a bonding glue 410, a backing body 405, a lens device, and a liquid crystal screen. The lens device 408 includes a back cover housing 4〇5, a lens module, and a circuit board cover. The v body 405 has a more open area 4〇9 to facilitate the lens module to tear the image. The sapphire lens 404 has a plurality of grooves 414.

+同樣地’在藍寶石鏡片304炭入背蓋殼體4〇5之前,可先 在】寶石鏡片404上鍍膜,例如該抗反射層 '該油墨印刷層' 或該裝飾性薄膜層以增加透光性與美觀。 藍寳石鏡片404炭入的方式係利用射出成形的技術。首 先,可藉由研磨或蝕刻的方式在藍寶石鏡片4〇4上形成複數凹 槽414。然後將藍寶石鏡片404置於一模具内(未顯示),該模 具具有與背蓋殼體405相同的外型’藍寶石鏡片彻係置於相 當於凹陷區域413的位置。紐將—塑膠流體(未顯示)在相對 12 於室溫的一第四rlj溫下灌入該模具内,並藉由一射出成形技術 形成該背蓋殼體405,以使該藍寶石鏡片埋入該背蓋殼體4〇5 内的該凹陷區域413。 在一實施例中,背蓋殼體405的材質為一塑膠,當該接合 膠410接合該藍寶石鏡片404與該背蓋殼體405時,該複數凹 槽414具有疏導該塑膠流體以及該接合膠41〇的功能,因為在 該第四高溫下塑膠流體以及該接合膠410會溢膠到藍寶石鏡 片404的表面411以及表面412的其中之一或兩者,而複數凹 槽414能夠防止溢膠狀況發生。在另一實施例中,接合膠41〇 可以不必使用,而複數凹槽414能夠防止該塑膠流體溢膠狀況 的發生,在射出成形後藍寶石鏡片404自然地炭入背蓋殼體 405的凹陷區域413中。 請參閱第八圖,其為本案第四較佳實施例取像裝置結構 52的剖面之示意圖。取像裝置結構52包含一鏡頭裝置5〇8以 及一液晶螢幕502。取像裝置結構52更包含一殼體5〇5 ^該鏡 頭裝置508包括一鏡頭模組5〇6以及一藍寶石鏡頭鏡片5〇4。 該藍寶石鏡頭鏡片504 f設於該鏡頭模組’ %直接作為綱模 組506的攝像用光學鏡片,同時亦兼具有高硬度、防刮、抗磨、 以及抗衝擊的特性。 實施例 1.種取像裝置,該取像裝置包含一鏡頭裝置以及一藍 寶石鏡片。該鏡頭裝置包含一第一殼體。該藍寶石鏡片與該^ 一殼體直接接合,以保護該鏡頭裝置,其中該藍寶石鏡片具有 a曰體結構以及一晶體轴向’該晶體結構為一單晶結構,且該 晶體轴向為c-轴向(0001)、a-轴向[包括(ώο)、(ιι5〇)、(元〇)、 (1120)、(^)、以及(Ϊ2Ϊ0)]、m-軸向[包括(ioio)、(i100)、(〇li〇)、 (i〇i〇)、(ιϊοο)、以及(〇ii〇)]、和 r-軸向[包括(_)、(加)、(〇迅)、 (oili)、(ιϊοί)、以及(ϊ101)]的其中之一。 2.如實施例1所述的裝置,其中該鏡頭裝置更包含一鏡 頭模組、以及一電路板,該第一殼體環繞該鏡頭模組,且該電 路板與該鏡頭模組耦接。該藍寶石鏡片在相對於室溫為一第一 高溫下藉由一接合膠與該第一殼體接合,其中該接合膠為一高 分子膠,且該高分子膠在該第一高溫下具有一接合反應,該高 分子膠包括一高溫反應膠、光敏膠(例如UV膠)、或雙組成份 膠。該藍寶石鏡片在相對於該室溫為一第二高溫下與該第一殼 體進行一異質接合。該第一殼體為一手機蓋。該取像裝置更包 含一液晶螢幕,該鏡頭裝置位於該液晶螢幕上。 3·如實施例1〜2所述的裝置,其中該鏡頭裝置更包含一 第二殼體、一鏡頭模組、以及一電路板。該藍寶石鏡片藉由一 接合膠與該第一殼體接合,其中該接合膠為一高分子膠,該高 分子膠包括一高溫反應膠、光敏膠(例如Uy膠)、或雙組成份 膠。該第-殼體具有複數熱馳,該藍f石鏡#具有複數通 孔。當該第-殼體與該藍寶石鏡片在疊合時,該複數熱溶柱穿 過該複數通孔’並透過加熱該複數熱熔柱使該第一殼體與該藍 寶石鏡片接合’其中該複數熱溶柱的成分包括一熱塑型塑膠。 M438642 該藍寳石鏡片具有-凸部’該凸部與該鏡頭模組的位置對齊。 該第二殼體祕該麵,且該電路板與該鏡麵組輕接。 該第-殼縣-電池蓋,該第二殼體為—手機蓋。該取像裝置 更包含一液晶螢幕,該鏡頭裝置位於該液晶螢幕上。 4. -種取像裝置’該取像裝置包含—麵裝置以及一藍 寶石鏡片。該鏡贼置具有-凹陷區域。該藍f石鏡片位於該 凹陷區域以保護該鏡頭裝置’其中該藍寶石鏡片具有—晶體結+ Similarly, before the sapphire lens 304 is charcoaled into the back cover housing 4〇5, the gemstone lens 404 may be first coated, for example, the anti-reflective layer 'the ink printed layer' or the decorative film layer to increase light transmission. Sex and beauty. The manner in which the sapphire lens 404 is charcoal is a technique that utilizes injection molding. First, a plurality of recesses 414 can be formed in the sapphire lens 4〇4 by grinding or etching. The sapphire lens 404 is then placed in a mold (not shown) having the same profile as the back cover housing 405, the sapphire lens being placed in a position corresponding to the recessed region 413. a plastic fluid (not shown) is poured into the mold at a temperature of a fourth rlj relative to room temperature, and the back cover housing 405 is formed by an injection molding technique to embed the sapphire lens. The recessed area 413 in the back cover housing 4〇5. In an embodiment, the back cover housing 405 is made of a plastic material. When the bonding glue 410 engages the sapphire lens 404 and the back cover case 405, the plurality of grooves 414 have a plastic fluid and a bonding glue. The function of 41〇, because at the fourth high temperature, the plastic fluid and the bonding glue 410 may overflow into one or both of the surface 411 and the surface 412 of the sapphire lens 404, and the plurality of grooves 414 can prevent the overflow condition. occur. In another embodiment, the bonding glue 41〇 may not be used, and the plurality of grooves 414 can prevent the plastic fluid overflow condition from occurring. After the injection molding, the sapphire lens 404 naturally carbonizes into the recessed area of the back cover housing 405. 413. Please refer to the eighth figure, which is a schematic cross-sectional view of the structure 52 of the image taking device of the fourth preferred embodiment of the present invention. The image capture device structure 52 includes a lens device 5A8 and a liquid crystal screen 502. The image taking device structure 52 further includes a housing 5〇5. The lens unit 508 includes a lens module 5〇6 and a sapphire lens lens 5〇4. The sapphire lens lens 504 f is provided in the lens module '% directly as the imaging optical lens of the mode group 506, and also has high hardness, scratch resistance, abrasion resistance, and impact resistance. Embodiment 1. An image taking device comprising a lens device and a sapphire lens. The lens device includes a first housing. The sapphire lens is directly engaged with the housing to protect the lens device, wherein the sapphire lens has an asteroid structure and a crystal axial direction. The crystal structure is a single crystal structure, and the crystal axis is c- Axial (0001), a-axial [including (ώο), (ιι5〇), (yuan〇), (1120), (^), and (Ϊ2Ϊ0)], m-axial [including (ioio), (i100), (〇li〇), (i〇i〇), (ιϊοο), and (〇ii〇)], and r-axis [including (_), (plus), (〇迅), ( One of oili), (ιϊοί), and (ϊ101)]. 2. The device of embodiment 1, wherein the lens device further comprises a lens module, and a circuit board, the first housing surrounds the lens module, and the circuit board is coupled to the lens module. The sapphire lens is joined to the first casing by a bonding glue at a first high temperature relative to the room temperature, wherein the bonding glue is a polymer glue, and the polymer glue has a first high temperature. In the bonding reaction, the polymer gel comprises a high temperature reaction gel, a photosensitive glue (for example, UV glue), or a two-component glue. The sapphire lens is heterogenously bonded to the first shell at a second elevated temperature relative to the room temperature. The first housing is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen. 3. The device of any of embodiments 1 to 2, wherein the lens device further comprises a second housing, a lens module, and a circuit board. The sapphire lens is joined to the first casing by a bonding glue, wherein the bonding glue is a polymer glue comprising a high temperature reaction glue, a photosensitive glue (e.g., Uy glue), or a two-component glue. The first housing has a plurality of heats up, and the blue f stone mirror # has a plurality of through holes. When the first housing is overlapped with the sapphire lens, the plurality of hot-melting columns pass through the plurality of through holes 'and the first housing is coupled to the sapphire lens by heating the plurality of heat-melting columns' The composition of the hot melt column includes a thermoplastic plastic. M438642 The sapphire lens has a - convex portion which is aligned with the position of the lens module. The second housing is in the surface, and the circuit board is lightly connected to the mirror group. The first shell-battery cover, the second casing is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen. 4. - Image capture device 'The image capture device comprises a face device and a sapphire lens. The mirror thief has a recessed area. The blue f stone lens is located in the recessed area to protect the lens device' wherein the sapphire lens has a crystal junction

構以及-晶體軸向,該晶體結構為_單晶結構,且該晶體轴向° 為〇軸向_1)、七轴向[包括(心)、(_)、_)、(_、(_)、 αΑ(Ϊ2ίο)] ^ . (ϊ1〇〇) ^ (〇-〇) ^ (ι〇.〇) ^ (ι_〇〇) ^ 以及(_、和Γ-轴向[包括⑽)、⑽)、㈣)、(〇iii)、_ ^ 以及(iioi)]的其中之一。And the crystal axial direction, the crystal structure is a single crystal structure, and the crystal axial direction is 〇 axial _1), seven axial directions [including (heart), (_), _), (_, ( _), αΑ(Ϊ2ίο)] ^ . (ϊ1〇〇) ^ (〇-〇) ^ (ι〇.〇) ^ (ι_〇〇) ^ and (_, and Γ-axis [including (10)), One of (10)), (4)), (〇iii), _^ and (iioi)].

5,,貫施例4所述的裝置,其中該鏡頭裝置包含—殼體、 鏡頭彳U以及-電路板,該殼體魏該鏡賴組,且該電 路板與該鏡頭模_接。該殼體具有該凹陷區域,當該該寶石 鏡片置於—模制時,藉由—射出成形技術贿職寶石鏡片 ==___該籃f石編由一接合膠與該 吏該監寶石鏡片賴該鏡頭裝置,其中該接 =二—高溫反應膠、光敏膠(例 殼__ A 該藍f石鏡片具有複數凹槽,該 時當該接合膠接合該藍寶石鏡片與該殼體 機蓋。該取像;狀況發生。該殼體為一手 像裝置更包含-液晶榮幕,該鏡頭裝置位於該液晶 M438642 營幕上。 6· —種取像裝置’該種取像裝置包含—鏡頭裝置以及一 藍寶石鏡片。該藍寶石鏡片與該鏡頭裝置直接接合,其中該藍 寶石鏡片具有一晶體結構以及一晶體軸向,該晶體結構為一單 晶結構’且該晶體軸向為c-軸向(0001)、a-軸向[包括(ώ〇)、 (mo)、(2π〇)、(π2〇)、(5ll0)、以及(ί2ί〇)]、軸向[包括(i〇i〇)、 (iioo)、(oiio)、(1〇ϊ〇)、(1ϊ〇0)、以及(〇ί1())]、和 Γ_軸向[包括、 (ioii)、(0111)、(〇ΐη)、(1Ϊ0Ϊ)、以及(_)]的其中之一。 7.如實施例6所述的裝置,其中該鏡頭襞置包含一殼體、 -鏡頭模組、以及-電路板,該韻環繞該鏡賴組,且該電 路板與賴_接。該藍料鏡聽由—接合雜該鏡頭 裝f接合’以使該藍寶石鏡片保護該鏡頭裝置,其中該接合膠 為-南分子膠’該高分诗包括_高溫反鱗、練卵列如 UVj)、或雙組成份膠。該藍f石鏡片在相對於室溫為一第 1溫下·該高分子顯驗體接合。該㈣石鏡片在相對 為-第二高溫下與該殼體進行—異質接合。該殼體為 y曰2。該取錄置更包含-液晶#幕,該鏡置位於該 液晶螢幕上。 *如Α例6〜7所述的裝置,其巾該鏡職置包含一第 一殼體、一第二殼體、一鏡頭模組、以及一電路板。該薛寶石 鏡片藉由一接合膠與該鏡頭農置接合,以使該藍寶石鏡Γ㈣ 該鏡頭裝置,其中該接合膠為—高分子膠,該高二St 高溫反應路、光敏膠(例如_)、或雙組成份膠。該第-殼 16 體具有複數熱熔柱,該藍寶石鏡片具有複數通孔。當該第一殼 體與該藍寶石鏡片疊合時,該複數贿柱穿過該複數通孔,且 該第-殼體與該藍寶石鏡>}藉由該複數舰㈣受熱而接 合,其中該複數熱溶柱的成分包括一熱塑型歸。該藍寶石鏡 片具有一凸部’該凸部與該鏡頭模組的位置對齊。該第二殼體 環繞該鏡頭模組’且該電路板與該鏡頭模組耦接。該第一殼體 為-電池蓋’該第二殼體為-手機蓋0該取像裝置更包含一液 晶螢幕’該鏡頭裝置位於該液晶螢幕上。 9. 一種取像裝置,該取像裝置包含一鏡頭裝置與一藍寶 石鏡片。該藍寶石鏡片與該鏡頭裝置直接接合。 10. 如實施例9所述的裝置,其中該藍寶石鏡片具有一晶 體結構以及一晶體軸向,該晶體結構為一單晶結構,且該晶體 軸向為 c-軸向(0001)、a-軸向[包括(由0)、(11$〇)、(2Π〇)、(Π2〇)、 (5ιι〇)、以及(Ϊ2ίο)]、m-軸向[包括(i〇10)、(1-100)、(〇ιί〇)、⑽〇)、 (11〇〇)、以及(oiio)]、和 γ-軸向[包括(―)、⑽ϊ)、(〇ιΠ)、(〇ϊη)、 (hoi)、以及(ϊιοι)]的其中之一。該鏡頭裝置包含一殼體、一鏡 頭模組、以及一電路板,該殼體環繞該鏡頭模組,且該電路板 與該鏡頭模組耦接。該藍寶石鏡片藉由一接合膠與該鏡頭裝置 接合,以使該藍寶石鏡片保護該鏡頭裝置,其中該接合膠為一 同分子膠,該高分子膠包括一高溫反應膠、光敏膠(例如UV 膠)、或雙組成份膠。該藍寶石鏡片在相對於室溫為一第一高 溫下利用該高分子膠與該殼體接合,其中該高分子膠在該第一 高溫下具有一接合反應。該藍寶石鏡片在相對於該室溫為一第 M438642 二尚溫下與該殼體進行-異質接合。該殼體為—手機蓋。該取 像裝置更包含-液晶營幕,該鏡頭襄置位於該液晶榮幕上。 11.如實施例9〜1G所述錄置,其中該藍寶石鏡片具有 -晶體結構以及-晶體軸向’該晶體結構為—單晶結構,且該 晶體軸向為〇軸向(0001)、a_軸向[包括(ώ〇)、㈤〇)、㈣)、 (謂)、(2110)、以及_]、m•轴向[包括(i〇i〇)、⑽)、(㈣、 _)、_、以及⑽。)]、和r•軸向[包括㈣、⑽)、(〇ιΠ)、 (0111)、⑽)、以及(i101)]的其中之一。該鏡頭裝置包含一第一 殼體、一第二殼體、—鏡頭模組、以及一電路板。該藍寶石鏡 片藉由-接合膠與該鏡職置接合,以使該藍寶石鏡片保護該 鏡頭裝置,其巾該接合膠為—高分子膠,該高分子膠包括一高 ’皿反應膠、光敏膠、或雙組成份膠。該第一殼體具有複數熱炼 柱田該藍貞石鏡片具有複數通孔。當該第一殼體與該藍寶石鏡 片s合% ’該複數熱溶柱穿過該複數通孔,且該第一殼體與該 藍寶石鏡片藉由該複數熱溶柱的受熱而接合,其中該減熱熔 • 柱的成分包括-熱塑麵膠。該藍寶石鏡片具有—凸部,該凸 部與該鏡職、_位置對齊。該第二^^環_鏡賴組,且 =電路板與該鏡賴_接。該第—殼體為—電池蓋,該第二 殼體為-手機蓋。該取像裝置更包含一液晶螢幕,該鏡頭裝置 位於該液晶螢幕上。 鉍12.如實施例9〜π所述的裝置,其中該鏡頭裝置包含一 殼體、-铜模組、叹_電路板,該殼體雜該賴模組, 且該電路贿魏賴_接。鋪料制私雜頭裝置 18 M438642 中。該殼體具有一凹陷區域,當該藍寶石鏡片置於一模具内 時’藉由一射出成形技術以使該藍寶石鏡片埋入該殼體内的該 凹陷區域。該藍寶石鏡片藉由一接合膠與該鏡頭裝置接合,以 使該藍寶石鏡片保護該鏡頭裝置,其中該接合膠為一高分子 膠,該高分子膠包括一高溫反應膠、光敏膠、或雙組成份膠。 該藍寶石鏡片具有複數凹槽,該殼體的材質為一塑膠,當該接 合膠接合該藍寶石鏡片與該殼體時,該複數凹槽防止該塑膠以5. The device of embodiment 4, wherein the lens device comprises a housing, a lens mount U and a circuit board, the housing is a mirror assembly, and the circuit board is coupled to the lens. The housing has the recessed area, and when the gemstone lens is placed in the mold, the gemstone lens is formed by the injection molding technique ==___ The basket f is made of a bonding glue and the gemstone lens In the lens device, wherein the connection is two-high temperature reaction adhesive, photosensitive adhesive (example shell __ A) the blue f stone lens has a plurality of grooves, when the bonding glue engages the sapphire lens and the casing cover. The image capture occurs; the housing is a hand image device further comprising a liquid crystal glory, the lens device is located on the liquid crystal M438642 camp. 6·---------------------------------- a sapphire lens directly coupled to the lens device, wherein the sapphire lens has a crystal structure and a crystal axial direction, the crystal structure is a single crystal structure 'and the crystal axis is c-axis (0001) , a-axial [including (ώ〇), (mo), (2π〇), (π2〇), (5ll0), and (ί2ί〇)], axial [including (i〇i〇), (iioo ), (oiio), (1〇ϊ〇), (1ϊ〇0), and (〇ί1())], and Γ_axis [including, (i One of oii), (0111), (〇ΐη), (1Ϊ0Ϊ), and (_). 7. The device of embodiment 6, wherein the lens arrangement comprises a housing, a lens module a group, and - a circuit board, the rhyme surrounds the mirror group, and the circuit board is connected to the ray. The blue mirror is spliced by the lens to make the sapphire lens protect the lens device, wherein The bonding glue is - southern molecular glue 'the high score poem includes _ high temperature anti-scale, oozing column such as UVj), or double component glue. The blue f stone lens was joined at a first temperature with respect to room temperature. The (four) stone lens is heterojuntically bonded to the housing at a relatively high temperature. The housing is y曰2. The recording device further includes a liquid crystal screen, and the mirror is placed on the liquid crystal screen. * The apparatus of any of the examples 6-7, wherein the mirror position comprises a first housing, a second housing, a lens module, and a circuit board. The sapphire lens is joined to the lens by a bonding glue to make the sapphire mirror (4) the lens device, wherein the bonding glue is a polymer glue, the high-two St high-temperature reaction path, a photosensitive glue (for example, _), Or a double component glue. The first shell 16 has a plurality of heat stakes, the sapphire lens having a plurality of through holes. When the first housing is overlapped with the sapphire lens, the plurality of briquettes pass through the plurality of through holes, and the first housing and the sapphire mirror are joined by the plurality of ships (four) being heated, wherein The composition of the plurality of hot-melt columns includes a thermoplastic type. The sapphire lens has a convex portion that is aligned with the position of the lens module. The second housing surrounds the lens module and the circuit board is coupled to the lens module. The first housing is a battery cover. The second housing is a mobile phone cover. The image capture device further includes a liquid crystal screen. The lens device is located on the liquid crystal screen. 9. An image capture device comprising a lens device and a sapphire lens. The sapphire lens is directly engaged with the lens device. 10. The device of embodiment 9, wherein the sapphire lens has a crystal structure and a crystal axial direction, the crystal structure is a single crystal structure, and the crystal axis is c-axial (0001), a- Axial [including (from 0), (11$〇), (2Π〇), (Π2〇), (5ιι〇), and (Ϊ2ίο)], m-axial [including (i〇10), (1 -100), (〇ιί〇), (10)〇), (11〇〇), and (oiio)], and γ-axial [including (―), (10)ϊ), (〇ιΠ), (〇ϊη), One of (hoi), and (ϊιοι)]. The lens device includes a housing, a lens module, and a circuit board. The housing surrounds the lens module, and the circuit board is coupled to the lens module. The sapphire lens is joined to the lens device by a bonding glue, so that the sapphire lens protects the lens device, wherein the bonding glue is a molecular glue, and the polymer glue comprises a high temperature reaction glue and a photosensitive glue (for example, UV glue). Or double component glue. The sapphire lens is bonded to the casing by the polymer glue at a first high temperature relative to room temperature, wherein the polymer gel has a bonding reaction at the first high temperature. The sapphire lens is heterogenously bonded to the housing at a temperature of a temperature of M438642. The housing is a mobile phone cover. The imaging device further includes a liquid crystal screen, and the lens is disposed on the liquid crystal screen. 11. Recording as described in Embodiments 9 to 1G, wherein the sapphire lens has a - crystal structure and - the crystal axis is 'the crystal structure is a single crystal structure, and the crystal axis is an 〇 axial direction (0001), a _Axis [including (ώ〇), (5) 〇), (4)), (predicted), (2110), and _], m•axial [including (i〇i〇), (10)), ((four), _) , _, and (10). )], and r•axial [including (4), (10)), (〇ιΠ), (0111), (10)), and (i101)]. The lens device includes a first housing, a second housing, a lens module, and a circuit board. The sapphire lens is bonded to the mirror by a bonding glue, so that the sapphire lens protects the lens device, and the bonding glue is a polymer glue, and the polymer glue comprises a high-reagent glue and photosensitive glue. Or double component glue. The first housing has a plurality of hot-melt columns. The ochre lens has a plurality of through holes. When the first housing is combined with the sapphire lens s%, the plurality of hot-melting columns pass through the plurality of through holes, and the first housing and the sapphire lens are joined by heat of the plurality of hot-melting columns, wherein Reduced heat melting • The composition of the column includes - thermoplastic surface glue. The sapphire lens has a convex portion that is aligned with the mirror position and the _ position. The second ^^ ring_mirror group, and = the board is connected to the mirror. The first housing is a battery cover and the second housing is a mobile phone cover. The image capturing device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen. The device of any one of embodiments 9 to π, wherein the lens device comprises a casing, a copper module, an slap circuit board, the housing is mixed with the slab module, and the circuit is bribed. . The paving system is made up of 18 M438642. The housing has a recessed area for burying the sapphire lens into the recessed area within the housing by an injection molding technique when the sapphire lens is placed in a mold. The sapphire lens is joined to the lens device by a bonding glue, so that the sapphire lens protects the lens device, wherein the bonding glue is a polymer glue, and the polymer glue comprises a high temperature reaction glue, a photosensitive glue, or a double composition. Part of the glue. The sapphire lens has a plurality of grooves, and the casing is made of a plastic material. When the bonding glue engages the sapphire lens and the casing, the plurality of grooves prevent the plastic from being

及該接合_-溢膠肢發生。該殼體為—手機蓋。該取像衆 置更包含一液晶螢幕,該鏡頭裝置位於該液晶螢幕上。 13. -種取料置,該鏡頭裝置包含—鏡顯組以及一藍 寶石鏡頭鏡片。該藍寶石鏡頭鏡片裝設於該鏡頭模组以構成該 鏡頭裝置。 综上所述’本創作的說明與實施例已揭露於上,然1非用 來限制本解,凡f知此技藝者,在顿離本創作哺神與範And the joint _- overflow rubber limb occurs. The housing is a mobile phone cover. The image capture device further includes a liquid crystal screen, and the lens device is located on the liquid crystal screen. 13. - Pick-up device, the lens device includes a mirror display group and a sapphire lens lens. The sapphire lens is mounted on the lens module to form the lens device. In summary, the description and examples of the present work have been disclosed above, but 1 is not used to limit the solution. Anyone who knows this skill is in the spirit of this creation.

圍,下,當可做各種更動與修飾,其仍應屬在本創作專利的涵 盍範圍之内。 【圖式簡單說明】 f 一圖⑻:習知取鮮置正_示意圖; 第一圖(b): f知取像裝背面的示意圖; 第二圖 置正面的示意圖 一:習知取像裝置結構之示意圖; ί三圖:習知取料置結構的之示意圖; 弟四圖··習知取像裝置結構的示意圖; 第五圖问.本案第—較佳實施例取像裝 19 M438642 第五_):本案第—較佳實施例取像裝置f _示意圖; 第玉圖⑹:本案第—較佳實關取像裝置結構的剖面之示意 園, 第六圖⑻:本案第二較佳實施例取像裝置正面的示意圖; 第六圖(b).本案第二較佳實施例取像裝置背面的示意圖; 第六圖⑻:本案第二較佳實施例取像裝置結構的剖面之示意 第六圖(d):藍寶石鏡片的俯視之示意圖;Circumference, down, when all kinds of changes and modifications can be made, it should still be within the scope of this patent. [Simple diagram of the figure] f A picture (8): the conventional image is taken as a schematic diagram; the first picture (b): f is a schematic view of the back side of the image; the second picture is a schematic view of the front side: a conventional image capturing device Schematic diagram of the structure; ί三图: a schematic diagram of a conventional material take-up structure; a schematic diagram of the structure of the conventional image capturing device; the fifth figure is asked. The first embodiment of the present invention takes the image pack 19 M438642 V_): The first embodiment of the present invention is a schematic diagram of the image capturing device f _; the jade figure (6): the first embodiment of the structure of the image capturing device structure of the present invention, and the sixth figure (8): the second preferred embodiment of the present invention The schematic diagram of the front side of the image taking device of the second preferred embodiment of the present invention; and the sixth figure (8): the schematic view of the structure of the image capturing device of the second preferred embodiment of the present invention Figure 6 (d): a schematic view of the sapphire lens;

第六圖(e):第一背蓋殼體與藍寶石鏡片接合的示意圖; 第七圖(a).本案第三較佳實施例取像裝置正面的示意圖; 第七圖(b):本案第三較佳實施例取像裝置背面的示意圖; 第七圖(c).本案第三較佳實施例取像裝置結購的剖面之示意 圖;以及 第八圖:本案第四較佳實施例取像裝置結購的剖面之示意圖。 【主要元件符號說明】Figure 6 (e) is a schematic view of the first back cover housing engaged with the sapphire lens; Figure 7 (a). The front view of the image taking device of the third preferred embodiment of the present invention; seventh figure (b): 3 is a schematic view of the back side of the image taking device; FIG. 7(c) is a schematic view showing the cross section of the image capturing device of the third preferred embodiment of the present invention; and FIG. 8 is a fourth embodiment of the present invention. Schematic diagram of the profile of the device purchase. [Main component symbol description]

10, 20, 30,40:取像襞置 102, 202, 302, 402:液晶螢幕 104 :保護鏡片 204, 304, 404:藍寶石鏡片 106, 206, 306, 406 :鏡頭模組 107, 207, 307, 407:電路板 208, 308, 408:鏡頭裝置 209,309,312,409:開 口區域 101,201,301,401 :前蓋殼體 103, 203, 303, 403 :實體按鍵 105, 205, 405:背蓋殼體 311:第一背蓋殼體 305:第二背蓋殼體 108 :保護層 109:多層材料保護鏡片 210, 310, 410:接合膠 20 M438642 211, 212, 411,412:藍寶石鏡12, 14:習知取像裝置結構 片表面 22 :本案第一較佳實施例取32 :本案第二較佳實施例取 像裝置結構 像裝置結構 42 :本案第三較佳實施例取313:複數通孔 像裝置結構 314 :複數熱熔柱 315 :藍寶石鏡片凸部 413 :凹陷區域 414:複數凹槽 2110, 20, 30, 40: image pickup device 102, 202, 302, 402: liquid crystal screen 104: protective lens 204, 304, 404: sapphire lens 106, 206, 306, 406: lens module 107, 207, 307 , 407: circuit board 208, 308, 408: lens device 209, 309, 312, 409: open area 101, 201, 301, 401: front cover housing 103, 203, 303, 403: physical keys 105, 205, 405: back cover housing 311 : first back cover housing 305: second back cover housing 108: protective layer 109: multi-layer material protective lens 210, 310, 410: bonding glue 20 M438642 211, 212, 411, 412: sapphire mirror 12, 14: conventionally taken The first preferred embodiment of the present invention is 32. The second preferred embodiment of the present invention is a device structure 42. The third preferred embodiment of the present invention is 313: a plurality of through-hole image device structures 314. : plural heat-melting column 315 : sapphire lens protrusion 413 : recessed area 414 : plural groove 21

Claims (1)

M438642 '頭模组、以及一電路 3.如申請專利範圍第1項所述的裝置,其中 該鏡頭裝置更包含一第二殻體、—' 板; 尚溫反應耀_、光敏璆、 該藍寶石鏡片藉由一接合勝與該第一殼人 合膠為一高分子膠,該高分子膠包括一 σ /、 ^ 或雙組成份膠;The device of claim 1 , wherein the lens device further comprises a second housing, a 'plate; a temperature response _, a photosensitive cymbal, the sapphire The lens is a polymer glue by combining the first shell and the first shell, and the polymer gel comprises a σ /, ^ or double component glue; =^體具有複數齡柱’該藍寶石鏡片具有複數通孔; Ρ亥弟-咸體與該藍寶石鏡片在疊合時,該複數熱炫柱穿 過該複數通孔,並透過加熱該複數熱熔柱使該第—殼體虚該藍 寶石鏡片接合,其t該複數醜柱的成分包括—熱_瓣「 該藍寶石鏡片具有-凸部,該凸部與該鏡頭模組的位置對 齊; 該第二殼體環繞魏頭模組,且該電路板與該鏡頭模組輕 接; 該第一殼體為一電池蓋,該第二殼體為一手機蓋;以及 該取像裝置更包含一液晶螢幕,該鏡頭裝置位於該液晶螢 幕上。 4. 一種取像裝置,包含: 一鏡頭裝置’具有一凹陷區域;以及 一藍寶石鏡片,位於該凹陷區域,以保護該鏡頭裝置,其 中該藍寶石鏡片具有一晶體結構以及一晶體軸向,該晶體結構 為一單晶結構,且該晶體軸向為c-軸向(〇〇〇1)、a-軸向[包括 23 M.438642 (liio)、(11知)、(2ΪΪ0)、(ΪΪ20)、(3ll〇)、以及(Ϊ2Ϊ0)]、m-韩向[包括 (1010) 、(iioo)、(οιϊο)、(ιοϊο)、(ιϊοο)、以及(οϊιο)]、和 r-轴向[包括 (1011) 、(ioii)、(oiii)、(οϊιι)、(出)ϊ)、以及(ϊιοι)]的其中之一。 5. 如申請專利範圍第4項所述的裝置,其中: 該鏡頭裝置包含一殼體、一鏡頭模組、以及一電路板,該 殼體環繞該鏡頭模組,且該電路板與該鏡頭模組耦接; 該殼體具有該凹陷區域,當該藍寶石鏡片置於一模具内 _ 時,藉由-射出成形技術以使該藍寶石鏡片埋入該殼體内的該 凹陷區域; 該藍寶石鏡片藉由一接合膠與該鏡頭裝置接合,以使該藍 寶石鏡片保籩該綱裝置,其中該接合膠為—高分子修,該高 刀子谬=括〜南溫反應膠、光敏膠、或雙組成份膠; 該監寶石鏡片具有複數凹槽,該殼體的材質為一塑膠,當 該接合膠接合該藍寶石鏡片與該殼體時,該複數凹槽防土該塑 g 膠的一溢膠狀況發生; 該殼體為一手機蓋;以及 «亥取像装置更包含—液晶絲,該鏡頭裝置位於該液晶螢 幕上。 6. —種取像裝置,包含: 一鏡頭裝置;以及 一藍寶石鏡片,與該鏡戦置直接接合,其中該藍寶石鏡 24 M438642 片具有一晶體結構以及一晶體轴向,該晶體結構為一單晶結 構’且該晶體轴向為c_軸向(0001)、a_轴向[包括(由〇)、(u如)、 (2110)、(1120)、(511〇)、以及(Ϊ210)]、m•軸向[包括(ϊ〇1〇)、(ϊι〇〇)、 (0110) 、(Κ)ϊ〇)、(ΰ〇0)、以及(ΟΪΗ))]、和 r_軸向[包括⑽ι}、⑽、 (0111) 、(0Ϊ11)、(版)、以及(hoi)]的其中之一。 7.如申請專利範圍第6項所述的裝置,其中:The body has a plurality of columns of sapphire lenses having a plurality of through holes; and when the sapphire and the sapphire lens are superposed, the plurality of heat slabs pass through the plurality of through holes and heat the plurality of heats The column causes the first shell to imaginaryly engage the sapphire lens, wherein the component of the plurality of ugly pillars includes a heat slab "the sapphire lens has a convex portion that is aligned with a position of the lens module; the second The housing surrounds the Wei head module, and the circuit board is lightly connected to the lens module; the first housing is a battery cover, the second housing is a mobile phone cover; and the image capturing device further comprises a liquid crystal screen The lens device is located on the liquid crystal screen. 4. An image capturing device comprising: a lens device having a recessed area; and a sapphire lens located in the recessed area to protect the lens device, wherein the sapphire lens has a The crystal structure and a crystal axial direction, the crystal structure is a single crystal structure, and the crystal axial direction is c-axis (〇〇〇1), a-axis [including 23 M.438642 (liio), (11 Know), (2ΪΪ0), (ΪΪ20) (3ll〇), and (Ϊ2Ϊ0)], m-han direction [including (1010), (iioo), (οιϊο), (ιοϊο), (ιϊοο), and (οϊιο)], and r-axis [including One of (1011), (ioii), (oiii), (οϊιι), (out), and (ϊιοι). 5. The device of claim 4, wherein: the lens The device includes a housing, a lens module, and a circuit board surrounding the lens module, and the circuit board is coupled to the lens module; the housing has the recessed area when the sapphire lens is disposed In the mold, the sapphire lens is embedded in the recessed area in the casing by an injection molding technique; the sapphire lens is joined to the lens device by a bonding glue to protect the sapphire lens The device, wherein the bonding glue is a polymer repair, the high knife 谬=including a south temperature reaction glue, a photosensitive glue, or a double component glue; the gemstone lens has a plurality of grooves, and the material of the shell is a plastic, when the bonding glue engages the sapphire lens and the housing, The number of grooves is anti-soil, and the glue is in a state of overflow; the casing is a mobile phone cover; and the image capture device further includes a liquid crystal wire, and the lens device is located on the liquid crystal screen. The image device comprises: a lens device; and a sapphire lens directly coupled to the mirror device, wherein the sapphire mirror 24 M438642 has a crystal structure and a crystal axis, the crystal structure is a single crystal structure and the The crystal axis is c_axial (0001), a_axial [including (by 〇), (u), (2110), (1120), (511〇), and (Ϊ210)], m•axis To [including (ϊ〇1〇), (ϊι〇〇), (0110), (Κ)ϊ〇), (ΰ〇0), and (ΟΪΗ))], and r_axis [including (10)ι}, One of (10), (0111), (0Ϊ11), (version), and (hoi). 7. The device of claim 6, wherein: 該藍寶石鏡片藉由一接合膠與該 該鏡頭裝置包含一殼體、一鏡頭模組、以及一電路板,該 殼體環繞該麵模組,且該電路板__模_接; 鏡碩裝置接合,以使該藍 寶石鏡片保護該鏡頭裝置,其中該接八 八謂白f、wr= °膠為-高分子膠,該高 刀子膠〇括一尚>皿反應膠、光敏膠、 哕萨窗r於μ —上 Α雙級成份膠; 泫i貝石鏡片在相對於室溫為一 一 膠與該殼雜合; ㈣下_該高分子 該藍寶石鏡片在相對於該室溫為〜一、The sapphire lens comprises a casing, a lens module, and a circuit board by a bonding glue, the casing surrounds the surface module, and the circuit board is connected to the lens module; Engaging, so that the sapphire lens protects the lens device, wherein the sapphire is white, the wr=° glue is a polymer glue, and the high knife glue includes a sip filter, a photosensitive glue, a sassafras The window r is in the μ-upper two-stage component glue; the 泫i bei stone lens is heterozygous with the shell at a room temperature; (4) the polymer sapphire lens is at a relative temperature to the room temperature , 行一異質接合; 第〜南溫下與該殼體進 該殼體為一手機蓋;以及 該取像裝置更包含一液晶螢幕,_ 幕上。 Λ鏡碩裝置位於該液晶螢 8.如申請專利範圍第6項所述的裝置,. 該鏡頭裝置包含—第一殼體、—士 以及一電路板; 乐〜域體、一鏡頭模組、 25 K438642 該藍寶石鏡>1藉由-接合膠與該鏡頭裝置接合,以使該藍 寳石鏡片保護該鏡頭裝置,其中該接合膠為—高分子膠,該高 分子膠包括-高溫反應膠、光轉、4雙組成份膠; 該第-殼有複雜雜’該藍f;5具有複數通孔; 當該第-殼體與該藍寶石鏡片疊合時,該複數熱熔柱穿過 該複數通孔,且該第-殼體與該藍f石則藉由賴數熱熔柱 的文熱而接合,其中該複數熱溶柱的成分包括一熱塑型塑膠; 該藍寶石鏡片具有-凸部,該凸部與該鏡頭模組的位置對 齊; 該第二殼體環繞該鏡頭模組,且該電路板與該鏡頭模組輕 接; 該第一殼體為一電池蓋,該第二殼體為一手機蓋 ;以及 該取像裝置更包含一液晶螢幕,該鏡頭裝置位於該液晶螢 幕上。 φ 9· 一種取像裝置,包含: 一鏡頭裝置;以及 一k寶石鏡片,與該鏡頭裝置直接接合。 10.如申請專利範圍第9項所述的裝置,其中: 該数寶石鏡片具有一晶體結構以及一晶體轴向’該晶體結 構為一單晶結構’且該晶體軸向為c-軸向(0001)、a-軸向[包括 (氐〇)、(ιΰο)、(2ϊϊο)、(ΰ2〇)、(310)、以及(ί2Ϊο)]、m-轴向[包括 26 M438642 (ioio)、(hoo)、(oiio)、(i〇i〇)、(doo)、以及(〇i丨〇)]、和 Γ_軸向[包括 (ιοίι)、(ϊοιί)、(οιϊΐ)、(οϊιι)、(ii〇i)、以及(ϊι〇ι)]的其中之一; 該鏡頭裝置包含一殼體、一鏡頭模組、以及一電路板,該 殼體環繞該鏡頭模組,且該電路板與該鏡頭模組耦接; 該藍寶石鏡片藉由一接合膠與該鏡頭裝置接合,以使該藍 寶石鏡片保護該鏡頭裝置,其中該接合膠為一高分子膠,該高 分子膠包括一高溫反應膠、光敏膠、或雙組成份膠; 該藍寶石鏡片在相對於室溫為一第一高溫下利用該高分子 • 膠與該殼體接合,其中該高分子膠在該第一高溫下具有一接合 反應; 該藍寶石鏡片在相對於該室溫為一第二高溫下與該殻體進 行一異質接合; 該殼體為一手機蓋;以及 該取像裝置更包含一液晶螢幕,該鏡頭裝置位於該液晶螢 幕上。 11.如申請專利範圍第9項所述的裝置,其中: 該藍寶石鏡片具有一晶體結構以及一晶體軸向’該晶體結 構為一單晶結構,且該晶體軸向為c_軸向(〇〇〇1)、a-軸向[包括 (l5l〇)、(llio) ' (2ΪΪ0)、(ΪΪ20)、(5ll0)、以及(Ϊ2Ϊ0)]、m-軸向[包括 (ίοιο)、(iioo)、(οιϊο)、(i〇i〇)、(ii〇〇)、以及(oiio)]、和 r-軸向[包括 (ιοϊι)、(ίοιϊ)、(οιϊΐ)、(〇in)、(ii〇i)、以及(iioi)]的其中之一; 該鏡頭裝置包含一第一殼體、一第二殼體、一鏡頭模組、 27 财 38642 以及一電路板; 該藍寶石鏡片藉由-接合膠與該鏡職置接合,以使該藍 寶石鏡片保護該鏡難置’其中該接合縣_高分子膠,該高 分子谬包括-高溫反麟、綠膠、或雙組成份膠; 該第-殼體具有複數熱溶柱,該藍寶石鏡片具有複數通孔; 當該第-殼體與該藍寶石鏡片疊合時,該複數熱溶柱穿過 該複數通孔’且該第-殼體與該藍寶石制藉由該複數熱溶柱 的受熱而接合,其巾該複數舰㈣成分包括-熱麵塑膠; 該監寶石鏡片具有-凸部’該凸部與該鏡頭模組的位置對 齊; 該第二殼體環賴鏡賴組,且該電路板無鏡頭模組搞 接; 該第-殼體為-電池蓋,該第二殼體為一手機蓋;以及 該取像裝置更包含-液晶螢幕,該鏡頭裝置位於該液晶營 幕上。 12.如申請專利範圍第9項所述的震置,其中: 該鏡頭裝置包含一殼體、一鏡頭模組、以及一電路板,該 殼體環繞該鏡頭模組,且該電路板與該鏡頭模組耦接; 該藍寶石鏡片埋入該鏡頭裝置中; 該殼體具有一凹陷區域,當該藍寶石鏡片置於一模具内 時’藉由一射出成形技術以使該藍寶石鏡片埋入該殼體内的該 凹陷區域; 28 該藍寳石鐘Η 寳石鏡片i 稽由一接合膠與該鏡頭裝置接合,以使該藍 分子膠射該接合縣—高分子膠,該高 該=一两溫反應膠、光敏膠、或雙組成份膠; 該接合:接ί鏡片具有複數凹槽,該殼體的材質為一塑膠,當 趿合該藍寳石鏡片與該殼體時,該複數凹槽防止該塑 膠以及該私_ —轉狀況發生; 該设體為一手機蓋;以及 該取像ft置更包含—液晶勞幕,該綱裝置位於該液晶營 幕上。 13. —鏡頭裴置,包含: 一鏡頭模組;以及 一藍寶石鏡頭鏡片,裝設於該鏡頭模組以構成該鏡頭裝置。 29A heterojunction is performed; the first south temperature and the casing enter the casing as a mobile phone cover; and the image capturing device further comprises a liquid crystal screen, _ on the screen. The apparatus of the present invention is located in the liquid crystal firefly. The apparatus of claim 6, wherein the lens device comprises a first housing, a singularity, a circuit board, a music body, a lens module, 25 K438642 The sapphire mirror >1 is joined to the lens device by a bonding glue, so that the sapphire lens protects the lens device, wherein the bonding glue is a polymer glue, and the polymer glue comprises a high temperature reaction glue, a light-turning, four-component component; the first-shell has a complex impurity 'the blue f; 5 has a plurality of through holes; when the first-shell is overlapped with the sapphire lens, the plurality of hot-melt columns pass through the plurality a through hole, and the first case and the blue f stone are joined by a heat of a heat-melting column, wherein the component of the plurality of hot-melt columns comprises a thermoplastic plastic; the sapphire lens has a convex portion The protrusion is aligned with the position of the lens module; the second housing surrounds the lens module, and the circuit board is lightly connected to the lens module; the first housing is a battery cover, and the second housing The body is a mobile phone cover; and the image capturing device further comprises a liquid crystal screen, the mirror Firefly means disposed on the liquid crystal screen. φ 9· An image taking device comprising: a lens device; and a k-stone lens directly engaged with the lens device. 10. The device of claim 9, wherein: the gemstone lens has a crystal structure and a crystal axis 'the crystal structure is a single crystal structure' and the crystal axis is c-axial ( 0001), a-axis [including (氐〇), (ιΰο), (2ϊϊο), (ΰ2〇), (310), and (ί2Ϊο)], m-axis [including 26 M438642 (ioio), ( Hoo), (oiio), (i〇i〇), (doo), and (〇i丨〇)], and Γ_axis [including (ιοίι), (ϊοιί), (οιϊΐ), (οϊιι), One of (ii〇i), and (ϊι〇ι); the lens device includes a housing, a lens module, and a circuit board surrounding the lens module, and the circuit board is The sapphire lens is coupled to the lens device by a bonding glue, so that the sapphire lens protects the lens device, wherein the bonding glue is a polymer glue, and the polymer glue comprises a high temperature reaction glue. a photosensitive adhesive or a two-component adhesive; the sapphire lens utilizes the polymer gel at a first high temperature relative to room temperature Body bonding, wherein the polymer glue has a bonding reaction at the first high temperature; the sapphire lens is hetero-engaged with the housing at a second high temperature relative to the room temperature; the housing is a mobile phone cover And the image capturing device further comprises a liquid crystal screen, the lens device is located on the liquid crystal screen. 11. The device of claim 9, wherein: the sapphire lens has a crystal structure and a crystal axis 'the crystal structure is a single crystal structure, and the crystal axis is c_axial (〇 〇〇1), a-axis [including (l5l〇), (llio) '(2ΪΪ0), (ΪΪ20), (5ll0), and (Ϊ2Ϊ0)], m-axis [including (ίοιο), (iioo ), (οιϊο), (i〇i〇), (ii〇〇), and (oiio)], and r-axis [including (ιοϊι), (ίοιϊ), (οιϊΐ), (〇in), ( One of ii〇i), and (iioi); the lens device includes a first housing, a second housing, a lens module, a 27386, and a circuit board; the sapphire lens is by- The bonding glue is engaged with the mirror to make the sapphire lens protect the mirror from being difficult to be 'in the joint county _ polymer glue, the polymer 谬 includes - high temperature reverse lin, green glue, or double component glue; The housing has a plurality of hot-melt columns, the sapphire lens having a plurality of through holes; and when the first case is overlapped with the sapphire lens, the plurality of hot-melt columns pass through the complex a through hole 'and the first housing and the sapphire are joined by heat of the plurality of hot-melting columns, the towel (four) component comprising - hot surface plastic; the gemstone lens having a - convex portion Aligning with the position of the lens module; the second housing is attached to the mirror assembly, and the circuit board has no lens module; the first housing is a battery cover, and the second housing is a mobile phone cover And the image capturing device further comprises a liquid crystal screen, the lens device being located on the liquid crystal screen. 12. The shock device of claim 9, wherein: the lens device comprises a housing, a lens module, and a circuit board, the housing surrounds the lens module, and the circuit board and the circuit board The lens module is coupled; the sapphire lens is embedded in the lens device; the housing has a recessed area, and the sapphire lens is embedded in the shell by an injection molding technique when the sapphire lens is placed in a mold The recessed area in the body; 28 the sapphire clock gemstone lens i is joined to the lens device by a bonding glue, so that the blue molecule is glued to the bonding county-polymer glue, the high=the two-temperature reaction a glue, a photosensitive adhesive, or a two-component adhesive; the joint: the lens has a plurality of grooves, and the material of the shell is a plastic, and the plurality of grooves prevent the plurality of grooves when the sapphire lens is coupled to the shell The plastic and the private _ turn condition occurs; the body is a mobile phone cover; and the image capture ft includes a liquid crystal screen, the device is located on the LCD screen. 13. A lens arrangement comprising: a lens module; and a sapphire lens lens mounted to the lens module to form the lens device. 29
TW101208767U 2011-12-27 2011-12-27 Apparatus for capturing image and LEN device TWM438642U (en)

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RU2012136722/28A RU2012136722A (en) 2011-12-27 2012-08-28 IMAGE CAPTURE DEVICE
KR1020120133831A KR101353381B1 (en) 2011-12-27 2012-11-23 Image capturing device
DE102012024801A DE102012024801A1 (en) 2011-12-27 2012-12-19 Image capture device

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US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
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US9617639B2 (en) 2013-03-18 2017-04-11 Apple Inc. Surface-tensioned sapphire plate
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US10328605B2 (en) 2014-02-04 2019-06-25 Apple Inc. Ceramic component casting
US9342727B2 (en) 2014-03-04 2016-05-17 Apple Inc. Field shaping channels in a substrate above a biometric sensing device
US10639746B1 (en) 2014-06-20 2020-05-05 Apple Inc. Ceramic-based components having laser-etched markings
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components
US10280504B2 (en) 2015-09-25 2019-05-07 Apple Inc. Ion-implanted, anti-reflective layer formed within sapphire material
US10144107B2 (en) 2015-09-30 2018-12-04 Apple Inc. Ultrasonic polishing systems and methods of polishing brittle components for electronic devices
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US11734942B2 (en) 2019-11-11 2023-08-22 Apple Inc. Biometric key including a textured ceramic cover

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