M435113 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種攝影監視裝置，特別是一種具有紅外 線面射型雷射光源的監視裝置。 【先前技術】 一般安全監控器為了要在能在夜間或光線不良之場所持 續進行監控，多半以紅外線發光二極體作為光源，然而由於 發光二極體所發出之光線為散射光，距離只要超過40公尺， 拍攝到的影像便會不清晰。如果遇到煙霧狀況下，便要加強 其強度讓光能夠穿越煙霧，容易導致影像遠的拍不清楚而近 的又過於曝光，造成監控品質低落的缺點。故不利於長距離 的安全監控的使用，例如海防、邊境或監獄等場所。因而傳 統以紅外線發光二極體為光源的安全監控器，存在有遠端影 像不清晰與攝影機散熱不良問題。況且傳統的雷射遠距離光 源系統係利用固態、氣態或邊射型半導體雷射，其製作成本 且耗電量都非常高並不利於大量生產製造。 【新型内容】 為了解決上述問題，本創作目的之一係提供一種紅外線 面射型雷射監視器，藉由使用面射型雷射元件作為紅外線光 源。 本創作目的之一係提供一種紅外線面射型雷射監視器， 藉由面射型雷射元件得到一可朝長距離遠方投射之紅外線光 源，達成遠距離清晰監控的效果。 3 面射目的之—係提供—種㈣㈣射光學模組，使用 二:::=外線光源具有光消耗低、降低電力成 型二L達二上述目本創作一實施例之-種紅外線面射 .,^^^^ 攝〜機主體，係包含一容置空間與 Ϊ間的一上開口與—下開口； -影像感測器，係 ;於二：間内亚朝向上開口；-紅外線光源模組，係設 杜谷尸間内’其中紅外線光源模組係使用-面射型雷射 :且匕含多個雷射晶片面向上開口方向設置；以及一光學 =:二係設置並覆蓋於上開口，其中光學透鏡模組具有 H衫像感測器的-透光區域以及對應紅外線光源模組的一 透鏡區域用以使多個雷射晶片所發出之光線均勻射出。 以下藉由具體實施例配合所附的圖式詳加說明，當更容 易瞭解本創作之目的、技_容、特點及其所達成之功效。 【實施方式】 其詳細㈣如T，所述較佳實施例僅做一說明非用以限 定本創作。 立本創作不同實施例之紅外線面射型雷射監視器之分解示 思圖如圖1、®2與圖3所示。其中圖卜圖2與圖3所示之 不意圖僅概略呈現各部件之相對位置，未顯示各部件之細部 結構，合先敘明。於本創作中，面射型雷射元件係為一垂直 共振腔面射型雷射（Vertical-Cavity Surface-Emitting Laser VCSEL) ’ 圖1所示為本創作一實施例紅外線面射型雷射監視器之 示意圖，如圖1所示，一紅外線面射型雷射監視器係至少包 M435113 括一攝影機主體10、一影像感測器20、一紅外線光源模組 30以及一光學透鏡模組40。其中，攝影機主體10包括一容 置空間12與對應容置空間12的一上開口 14與一下開口 16。 影像感測器20是設置組裝於容置空間12内且影像感測器20 係朝向攝影機主體10之上開口 14。紅外線光源模組30設置 於容置空間12内。於本創作中，紅外線光源模組30係使用 一面射型雷射元件。此面射型雷射元件包括多個雷射晶片 32。其中，雷射晶片32係面向攝影機主體10之上開口 14 方向設置。 於本創作中，面射型雷射元件係可為單元件封裝模組， 如表面黏著型(SMD type)封裝件或直插式（lamp type)封裝件。於 一實施例中，本創作面射型雷射元件之雷射波長約為840nm 至 860nm。 接續上述說明，光學透鏡模組40係設置並覆蓋於攝影機 主體10之上開口 14。光學透鏡模組40具有對應影像感測器 20的一透光區域42與具有對應紅外線光源模組30的一透鏡 區域44。光學透鏡模組40之透鏡區域44係用以使雷射晶片 32所發出之光線由攝影機主體10内均勻射出。 接著，於一實施例中，請參照圖1，紅外線光源模組30 與影像感測器20係設置於攝影機主體10之下開口 16。 更進一步，於一實施例中，影像感測器20係沿著容置空 間12之軸心（如圖中軸線所示）設置，而紅外線光源模組30 之多個雷射晶片32沿著攝影機主體10容置空間12之轴心環 繞設置於影像感測器20旁。如此，光學透鏡模組40的透光 區域42係位於攝影機主體10容置空間12之軸心位置，而紅 外線光源模組30的透鏡區域44則環繞透光區域42設置。 請繼續參照圖1，紅外線光源模組30與影像感測器20 5 M435113 係設置於一底板50上。此底板50之材質可為金屬或高導熱 材料，藉由材質的選擇可將紅外線光源模組3 0與影像感測器 20所產生的熱量快速地散出。可理解的是，圖上未示，紅外 線光源模纟且與影像感測器亦可為獨立模組再加以組合成所需 架構。如圖3所示，於不同實施例中，底板50(如圖1)亦可 為一下蓋50’同時可用以覆蓋攝影機主體10之下開口 16。 如圖2所示，於一實施例中，一驅動元件接頭60可設置 於底板50之上表面或下表面（如圖2)。驅動元件接頭60係用 以驅動面射型雷射元件。 於本創作中，光學透鏡模組40的透光區域42與透鏡區 域44係分別對應影像感測器20與紅外線光源模組30設置。 其中，透鏡區域44的光學透鏡結構可為一菲淫爾（Fresnel)透 鏡，惟本創作並不限於此，透鏡區域44的光學透鏡結構亦可 為複數個可調整距離及角度之透鏡陣列，抑或為可移動及調 整角度之單一透鏡，藉以調整與面射型雷射元件之間的距 離，而得到一均勻且射出距離遠之雷射光。 根據上述，本創作藉由面射型雷射元件所發出光線具有 準直特性，有效入射至光學透鏡結構，進而以大致平行光方 式朝長距離之遠方投射面狀光源，相對於習知發光二極體的 使用而言，具備有光消耗低及降低電力成本之優點。再者， 面狀投射光源的區域可經由調整雷射晶片的角度或與光學透 鏡結構之間距，具有使用彈性佳之優點。 綜合上述，本創作使用面射型雷射元件作為紅外線監視 器的光源，特別是雷射波長約為840nm至860nm面射型雷射 元件。雷射元件為高指向性同調光源，具有低發散性，光束 不容易散開，可保持極細且直的光束，光束本身攜帶的能量 很高，同時消耗功率小，投射距離比發光二極體遠且溫度穩 6 M435113 定。因此，紅外線監視器只要由鋁合金機殼散熱即可，無須 另設散熱器或風扇散熱，故故障率極低而維修成本也相對降 低。另外，由於本創作紅外線面射型雷射監視器提供高品質 紅外線光源模組，應用於監視器内可增加拍攝距離，即使氣 候不佳下雨大霧的環境下，雷射光仍可穿透，拍出來的影像 更加清晰。本創作可解決目前使用發光二極體光源的監視器 存在的缺點，如產品壽命短、夜視效果差、高熱耗電大及成 本偏高等缺點，本創作可有效符合環保低碳的趨勢。 以上所述之實施例僅係為說明本創作之技術思想及特 點，其目的在使熟習此項技藝之人士能夠瞭解本創作之内容 並據以實施，當不能以之限定本創作之專利範圍，即大凡依 本創作所揭示之精神所作之均等變化或修飾，仍應涵蓋在本 創作之專利範圍内。 7 M435113 【圖式簡單說明】 圖1為本創作一實施例之分解示意圖。 圖2為本創作一實施例之分解示意圖。 圖3為本創作一實施例之分解示意圖。 【主要元件符號說明】M435113 V. New description: [New technical field] This creation is related to a kind of photography monitoring device, especially a monitoring device with infrared line-type laser light source. [Prior Art] In order to continuously monitor in places where nighttime or poor lighting, the general safety monitor mostly uses an infrared light-emitting diode as a light source. However, since the light emitted by the light-emitting diode is scattered light, the distance is only exceeded. At 40 meters, the captured image will be unclear. If you encounter smoke, you should strengthen its intensity so that light can pass through the smoke. It is easy to cause the image to be unclear and too close to the exposure, resulting in the disadvantage of poor monitoring quality. Therefore, it is not conducive to the use of long-distance safety monitoring, such as coastal defense, borders or prisons. Therefore, a conventional safety monitor using an infrared illuminating diode as a light source has problems in that the far-end image is unclear and the camera has poor heat dissipation. Moreover, conventional laser long-distance light source systems utilize solid-state, gaseous or edge-emitting semiconductor lasers, which are costly to manufacture and consume a lot of power, which is not conducive to mass production. [New content] In order to solve the above problems, one of the objects of the present invention is to provide an infrared radiation type laser monitor by using a surface-emitting laser element as an infrared light source. One of the purposes of the present invention is to provide an infrared radiation type laser monitor that obtains an infrared light source that can be projected far away from a long distance by a surface-emitting laser element to achieve a clear monitoring effect at a long distance. 3 The purpose of the face-to-face is to provide a kind of (4) (four) optical module, use two:::= external light source has low light consumption, reduce power molding, two L to two, the above-mentioned object creation, an infrared radiation. ^^^^ Photographing machine main body, which includes an upper opening and a lower opening between a receiving space and a turn; - an image sensor, a system; a second: an inner opening toward the inner side; - an infrared light source module In the Dugu corpse, where the infrared light source module is used - the surface-emitting laser: and the plurality of laser wafers are arranged facing the upper opening direction; and an optical =: the second system is disposed and covers the upper opening The optical lens module has a light-transmitting region of the H-shirt sensor and a lens region corresponding to the infrared light source module for uniformly emitting light emitted by the plurality of laser wafers. The following is a detailed description of the specific embodiments and the accompanying drawings, and it is easier to understand the purpose, skill, features and functions of the present invention. [Embodiment] In detail (4), as in T, the description of the preferred embodiment is merely illustrative of the present invention. An exploded view of the infrared surface-emitting laser monitor of different embodiments of the present invention is shown in Fig. 1, 2, and 3. 2 and FIG. 3 are not intended to show the relative positions of the components, and the detailed structure of each component is not shown. In this creation, the surface-emitting laser element is a Vertical-Cavity Surface-Emitting Laser VCSEL. FIG. 1 shows an infrared surface-emitting laser monitoring according to an embodiment of the present invention. As shown in FIG. 1 , an infrared surface-emitting laser monitor includes at least a camera body 10 , an image sensor 20 , an infrared light source module 30 , and an optical lens module 40 . The camera body 10 includes an upper opening 14 and a lower opening 16 of the accommodating space 12 and the corresponding accommodating space 12. The image sensor 20 is disposed in the accommodating space 12 and the image sensor 20 is oriented toward the upper opening 14 of the camera body 10. The infrared light source module 30 is disposed in the accommodating space 12. In the present creation, the infrared light source module 30 uses a one-shot laser element. The surface-emitting laser element includes a plurality of laser wafers 32. Among them, the laser chip 32 is disposed facing the opening 14 of the camera body 10. In the present invention, the surface-emitting laser component can be a single-element package module, such as a surface mount type (SMD type) package or a direct type (lamp type) package. In one embodiment, the laser of the inventive surface-emitting laser element has a laser wavelength of about 840 nm to 860 nm. Following the above description, the optical lens module 40 is disposed and covers the upper opening 14 of the camera body 10. The optical lens module 40 has a light transmissive area 42 corresponding to the image sensor 20 and a lens area 44 having a corresponding infrared light source module 30. The lens area 44 of the optical lens module 40 is used to uniformly emit light emitted from the laser chip 32 from within the camera body 10. Next, in an embodiment, referring to FIG. 1 , the infrared light source module 30 and the image sensor 20 are disposed on the lower opening 16 of the camera body 10 . Further, in an embodiment, the image sensor 20 is disposed along the axis of the accommodating space 12 (shown as an axis in the figure), and the plurality of laser chips 32 of the infrared light source module 30 are along the camera. The axis of the main body 10 accommodating space 12 is disposed around the image sensor 20 . Thus, the light-transmitting region 42 of the optical lens module 40 is located at the axial center of the housing space 12 of the camera body 10, and the lens region 44 of the infrared light source module 30 is disposed around the light-transmitting region 42. Referring to FIG. 1 , the infrared light source module 30 and the image sensor 20 5 M435113 are disposed on a bottom plate 50 . The material of the bottom plate 50 can be metal or a highly thermally conductive material, and the heat generated by the infrared light source module 30 and the image sensor 20 can be quickly dissipated by the material selection. It can be understood that the infrared light source module is not shown, and the image sensor can also be a separate module and then combined into a required structure. As shown in Fig. 3, in various embodiments, the bottom plate 50 (Fig. 1) can also be used as a lower cover 50' to cover the lower opening 16 of the camera body 10. As shown in Figure 2, in one embodiment, a drive member connector 60 can be disposed on the upper or lower surface of the base plate 50 (Fig. 2). The drive element connector 60 is used to drive a surface-emitting laser element. In the present invention, the light-transmitting region 42 and the lens region 44 of the optical lens module 40 are respectively disposed corresponding to the image sensor 20 and the infrared light source module 30. The optical lens structure of the lens region 44 can be a Fresnel lens, but the creation is not limited thereto. The optical lens structure of the lens region 44 can also be a plurality of lens arrays with adjustable distance and angle, or It is a single lens that can move and adjust the angle to adjust the distance between the laser beam and the surface-emitting laser element to obtain a uniform and long-range laser light. According to the above, the light emitted by the surface-emitting laser element has a collimating characteristic, and is effectively incident on the optical lens structure, thereby projecting the planar light source toward the long distance in a substantially parallel light manner, compared with the conventional light-emitting device. In terms of the use of the polar body, it has the advantages of low light consumption and reduced power cost. Furthermore, the area of the planar projection light source can be adjusted by adjusting the angle of the laser wafer or the distance from the optical lens structure. In summary, the present invention uses a surface-emitting laser element as a light source for an infrared monitor, particularly a laser-emitting element having a laser wavelength of approximately 840 nm to 860 nm. The laser element is a high directivity homology light source, has low divergence, the light beam is not easy to spread, and can maintain a very thin and straight beam, the light beam itself carries high energy, and the power consumption is small, and the projection distance is farther than the light emitting diode. The temperature is stable at 6 M435113. Therefore, the infrared monitor can be dissipated by the aluminum alloy casing, and there is no need to provide a radiator or a fan to dissipate heat, so the failure rate is extremely low and the maintenance cost is relatively low. In addition, since the infrared radiation type laser monitor of the present invention provides a high-quality infrared light source module, it can be used in a monitor to increase the shooting distance, and the laser light can penetrate even in a weather with poor weather and rain. The images taken are clearer. This creation can solve the shortcomings of current monitors using light-emitting diode light sources, such as short product life, poor night vision, high heat consumption and high cost, etc. This creation can effectively meet the trend of environmental protection and low carbon. The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent changes or modifications made by the people in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation. 7 M435113 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of an embodiment of the present invention. FIG. 2 is an exploded perspective view of an embodiment of the present invention. FIG. 3 is an exploded perspective view of an embodiment of the present invention. [Main component symbol description]
10 攝影機主體 12 容置空間 14 上開口 16 下開口 20 影像感測器 30 紅外線光源模組 32 雷射晶片 40 光學透鏡模組 42 透光區域 44 透鏡區域 50 底板 50, 下蓋 60 驅動元件接頭10 Camera body 12 accommodating space 14 Upper opening 16 Lower opening 20 Image sensor 30 Infrared light source module 32 Laser wafer 40 Optical lens module 42 Light-transmitting area 44 Lens area 50 Base plate 50, Lower cover 60 Drive component connector