M434989 五、新型說明： 【新型所屬之技術領域】 本創作是關於一種觸控面板，特別是指可降低短路機 率的單板式觸控面板。 【先前技術】 請參考圖4與圖5所示的一單板觸控面板（t〇uch 〇n lens)，該觸控面板包含有一基板3〇、複數χ軸電極串 31袓數Y軸電極串32與一保護層33，該些χ、γ軸電 極串31、32形成在該基板30的表面，且該些X軸電極串 31絕緣交錯於該些γ轴電極串32，該保護層33形成在該 基板30上且覆蓋X、γ軸電極串、32。 各X軸電極串31包含有複數個X電極31〇，兩相鄰 的X電極310之間係由一 X導線311連接。各γ軸電極 串32包含有複數個γ電極320，兩相鄰的γ電極320之 間係由一架橋導線321連接，該Χ導線31彳與該架橋導線 321之間設有一絕緣層34 ,該絕緣層34係用於避免X電 極310電性連接至丫電極32〇而導致χ、γ軸電極串 31、32短路。 當製造前述單板觸控面板的時候，首先在基板3〇的 表面形成-透明導電層；接著，透過一微影蝕刻製程以圖 案化該透明導電層，使之成為該些X軸電極串31與Υ電 極320接著，形成一第—絕緣膜，再透過一微影姓刻製 程以圖案化該第-絕緣瞑’使第一絕緣膜形成☆ X導線 31 1上方而構成絕緣層34，絕緣層34對應於將形成的架 M434989 橋導線321的區域；接著’形成一金屬膜，再透過一微影 钱刻製程以令金屬膜構成前述的架橋導線321，該X導線 31 1與架橋導線321之間設有前述的絕緣層34 ;最後，形 成一保護層33，使保護層33覆蓋該些X、γ軸電極串 31 ' 32 〇 然而’在形成該架橋導線321之步驟中，可參考圖4 所示，架橋導線321在基板30上所佔的面積相當微小， 在對金屬膜進行蝕刻時，除了架橋導線321以外的金屬膜 理論上皆需完全被蝕刻移除，所保留的金屬膜面積係遠小 於需要被移除的金屬膜。在進行微影蝕刻製程之後，容易 因蝕刻不完全而產生不必要殘留金屬322，若殘留金屬 322恰位在兩個相鄰的X、γ電極31〇、32〇上’將使得 X、丫軸電極串31、32構成電性連接而短路，降低觸控面 板的生產良率。 【新型内容】 有鑒於觸控面板的製程中，已知的觸控面板結構容 因殘留金屬而導致Χ、γ轴電極串短路的情形，因此心 作的主要目的在於提供—種可降低短路機率的單板式觸4 面板’根據該觸控面板的結構，在其製程中，可大幅 殘留金屬導致Χ、γ軸電極串短路的機率。 為達前揭目的，本創作所採用的技術手段是令續可？ 低短路機率的單板式觸控面板包含有： 一基板，具有一表面； 複數第一雷；)¾虫 w 冤極串，並列地形成於該基板上，各 t 極串包含有： " M434989 複數個第一電極，形成在該基板表面；及 後數個第一導線，形成在該基板表面且分別連接 兩相鄰的第一電極..； 複數第二電極，形成於該基板的表面，且分別位在該 些第一電極之間； 一第一絕緣層，包含有： 複數導線絕緣層，覆蓋在該些第一導線表面；及 電極保護層，覆蓋在該些第一電極與第二電極 的表面且形成在各導線絕緣層的外圍，該電極保護層與各 導線絕緣層之間構成開窗區域，開窗區域使相鄰第二電極 的局部表面外露； 複數架橋導線，分別形成在開窗區域，且形成於導線 絕緣層表面而連接兩相鄰的第二電極，其中該些架橋導線 與第一電極構成與該些第一電極串絕緣交錯的複數第二電 極串；以及 一第二絕緣層，包含有複數架橋導線保護層，分別覆 蓋該些架橋導線及外露的第二電極。 根據本創作的結構，在其進行架橋導線的製程之前， 已在基板上形成第一電極串與第二電極，並於第一電極串 與第二電極上形成一絕緣膜，該絕緣膜將被圖案化而成為 該些導線絕緣層與電極保護層，該電極保護層係覆蓋了大 部分的第一電極串與第二電極表面。 相對於先前技術’在蝕刻金屬膜之後，若有殘留的金 屬膜’亦是殘留在電極保護層的表面而未接觸第一'第二 電極，可大幅降低第一 '第二電極被殘留金屬膜短路的機 5 率，藉此提高觸控面板的生產良率。 【實施方式】 -月參考圖1與圖2所示本創作的觸控面板，其包含有 一基板10、複數第_ «•权士 〜 电極串11、複數第二電極串12、複 數個周邊線路16、一第一絕緣層與一第二絕緣層。 該基板10具有—表面。 …該m極串n並列地形成在該基板1G表面，各 弟一電極串11包含有複數個第—電肖110以及連接在兩 相鄰第一電極110之間的第一導線m。 Λ二第一電極串12形成在該基板10上且與該些第一 電極串11絕緣交錯，舉例而言，若該第-電極串^之轴 向為X軸，則該第二電極串12之軸向為Υ轴，反之，若 該第-電極串η之軸向為丫軸，則該第二電極串η之軸 〇 軸各第—電極串12包含有複數個第二電極120 與複數個架橋導線121，該些第二電#12。形成在該基板 的表面且分別位在該些第一電極，架構導線 121之結構容後說明之。 該第-絕緣層係覆蓋該些第一電極串H肖第二電極 =面，其中覆蓋於第一導表面的第一絕緣層 疋義為導線絕緣層13,覆蓋於該些第—電極m盘第二電 Π0表面的第一絕緣層定義為電極保護層14,電極保護 曰係形成於該些導線絕緣層13的外圍。κ絕緣層 13與電極保護層14之間形成複數個開窗區域140,該此 =窗區域_分別對應於各第—電極_ u與第二電料 父錯區域’使兩相鄰第二電極12〇的局部表面得以外 M434989 露。 架橋導線121形成在導線絕緣層13表面，於每一個 開窗區域140中’兩相鄰第二電⑬12Q的局部表面係呈現 外露狀態，使架橋導線14〇橋接兩相鄰的第二電極12〇， 因導線絕緣層13係、形成在第—導線川與架橋導線121 之間’故使第-電極串H肖第二電極串12相互絕緣隔 離。 該些周邊線路16分別電連接該些第一、第二電極串 11、12，各周邊線路16可為多層結構，即包含有一基底 層160與一金屬| 161，該些基底層16〇形成在基板1〇 表面並分別電連接該第一電極11〇與第二電極12〇，該金 屬層161形成在該基底層160的表面。 該第二絕緣層係用於覆蓋架橋導線.彳21、外露的第 一、第二電極110 ' 120以及周邊線路16，該第二絕緣層M434989 V. New description: [New technical field] This creation is about a touch panel, especially a single-panel touch panel that can reduce the probability of short circuit. [Previous Art] Please refer to a single-plate touch panel (t〇uch 〇n lens) shown in FIG. 4 and FIG. 5, the touch panel includes a substrate 3〇, a plurality of x-axis electrode strings 31, and a number of Y-axis electrodes. The string 32 and a protective layer 33 are formed on the surface of the substrate 30, and the X-axis electrode strings 31 are insulated and staggered to the γ-axis electrode strings 32. The protective layer 33 It is formed on the substrate 30 and covers the X and γ-axis electrode strings, 32. Each of the X-axis electrode strings 31 includes a plurality of X electrodes 31A, and the adjacent X electrodes 310 are connected by an X-wire 311. Each of the γ-axis electrode strings 32 includes a plurality of γ electrodes 320. The two adjacent γ electrodes 320 are connected by a bridge wire 321 , and an insulating layer 34 is disposed between the Χ wire 31 彳 and the bridge wire 321 . The insulating layer 34 is used to prevent the X electrode 310 from being electrically connected to the 丫 electrode 32 〇 and causing the χ and γ axis electrode strings 31, 32 to be short-circuited. When the single-panel touch panel is manufactured, a transparent conductive layer is first formed on the surface of the substrate 3; then, the transparent conductive layer is patterned by a lithography etching process to become the X-axis electrode strings 31. Next, a first insulating film is formed, and a first insulating film is patterned by patterning the first insulating film to form an insulating layer 34. The insulating layer is formed by patterning the first insulating film. 34 corresponds to the area of the bridge wire 321 of the frame M434989 to be formed; then 'forming a metal film, and then through a lithography process to make the metal film constitute the aforementioned bridge wire 321 , the X wire 31 1 and the bridge wire 321 The foregoing insulating layer 34 is disposed; finally, a protective layer 33 is formed, so that the protective layer 33 covers the X, γ-axis electrode strings 31' 32. However, in the step of forming the bridging conductor 321 , reference may be made to FIG. 4 . As shown, the area occupied by the bridge wire 321 on the substrate 30 is relatively small. When the metal film is etched, the metal film except the bridge wire 321 is theoretically completely removed by etching, and the retained metal film area is Far from small For the metal film that needs to be removed. After the lithography process, it is easy to produce unnecessary residual metal 322 due to incomplete etching. If the residual metal 322 is located on two adjacent X and γ electrodes 31〇, 32〇, the X and x axis will be made. The electrode strings 31 and 32 constitute an electrical connection and are short-circuited, which reduces the production yield of the touch panel. [New content] In view of the manufacturing process of the touch panel, the known touch panel structure is caused by the residual metal, which causes the short circuit of the Χ and γ-axis electrode strings. Therefore, the main purpose of the work is to provide a short-circuit rate. The single-plate type touch panel 4' according to the structure of the touch panel, in the process of the process, the probability of the metal being largely left to cause a short circuit of the Χ and γ-axis electrode strings. In order to achieve the goal, what is the technical means used in this creation? The low-short-rate single-panel touch panel comprises: a substrate having a surface; a plurality of first ray; a 3⁄4 worm w 冤 string, juxtaposed on the substrate, each t-string includes: " M434989 a plurality of first electrodes are formed on the surface of the substrate; and a plurality of first wires are formed on the surface of the substrate and respectively connected to two adjacent first electrodes. The plurality of second electrodes are formed on the surface of the substrate. And respectively located between the first electrodes; a first insulating layer comprising: a plurality of wire insulation layers covering the first wire surfaces; and an electrode protection layer covering the first electrodes and the second a surface of the electrode is formed on a periphery of each of the wire insulation layers, and a window opening region is formed between the electrode protection layer and each of the wire insulation layers, and the window opening region exposes a partial surface of the adjacent second electrode; the plurality of bridge wires are respectively formed at Opening a window region, and forming a surface of the wire insulation layer to connect two adjacent second electrodes, wherein the bridge wires and the first electrode form a plurality of second electrodes that are insulated from the first electrode strings And a second insulating layer comprising a plurality of bridge wire protection layers covering the bridge wires and the exposed second electrodes, respectively. According to the structure of the present invention, before the process of the bridge wire is performed, the first electrode string and the second electrode are formed on the substrate, and an insulating film is formed on the first electrode string and the second electrode, and the insulating film is to be The patterning is formed into the wire insulating layer and the electrode protective layer, and the electrode protective layer covers most of the first electrode string and the second electrode surface. Compared with the prior art 'after etching the metal film, if the residual metal film' remains on the surface of the electrode protective layer without contacting the first 'second electrode, the first 'second electrode' residual metal film can be greatly reduced Short-circuit machine 5 rate, thereby improving the production yield of the touch panel. [Embodiment] - The touch panel of the present invention shown in FIG. 1 and FIG. 2 includes a substrate 10, a plurality of _ «• 士 士 ～ electrode strings 11 , a plurality of second electrode strings 12 , and a plurality of periphery The line 16, a first insulating layer and a second insulating layer. The substrate 10 has a surface. The m-pole strings n are formed side by side on the surface of the substrate 1G, and each of the electrode arrays 11 includes a plurality of first-electrode strings 110 and a first wire m connected between the two adjacent first electrodes 110. The second electrode string 12 is formed on the substrate 10 and is insulated from the first electrode strings 11 . For example, if the axial direction of the first electrode string is the X axis, the second electrode string 12 The axial direction is the Υ axis, and if the axial direction of the first electrode string η is the 丫 axis, the first electrode group 12 of the second electrode string η has a plurality of second electrodes 120 and a plurality The bridge wires 121 are the second wires #12. Formed on the surface of the substrate and respectively located on the first electrodes, the structure of the structure wires 121 is described later. The first insulating layer covers the first electrode string H and the second electrode=face, wherein the first insulating layer covering the first guiding surface is a wire insulating layer 13 covering the first electrode The first insulating layer on the surface of the second electrode 0 is defined as an electrode protective layer 14 formed on the periphery of the wire insulating layers 13. A plurality of window-opening regions 140 are formed between the κ insulating layer 13 and the electrode protection layer 14 , and the window region _ corresponds to each of the first electrode _ u and the second electrode parent-along region ‘the two adjacent second electrodes respectively The partial surface of the 12 inch is exposed outside the M434989. The bridge wires 121 are formed on the surface of the wire insulation layer 13. In each of the window openings 140, the partial surface of the two adjacent second electrodes 1312Q is exposed, so that the bridge wires 14 bridge the two adjacent second electrodes 12〇. Since the wire insulating layer 13 is formed between the first wire and the bridge wire 121, the second electrode string 12 of the first electrode string H is insulated from each other. The peripheral lines 16 are electrically connected to the first and second electrode strings 11 and 12, respectively. Each of the peripheral lines 16 may have a multi-layer structure, that is, a base layer 160 and a metal layer 161, and the base layers 16 are formed on the periphery. The first surface 11 〇 and the second electrode 12 电 are electrically connected to the surface of the substrate 1 , and the metal layer 161 is formed on the surface of the base layer 160 . The second insulating layer is used to cover the bridging conductors 彳21, the exposed first and second electrodes 110'120, and the peripheral lines 16, the second insulating layer
包含有複數個架橋導線保護層15與一周邊線路保護層 17 » S 該些架橋導線保護層15形成的區域係位該電極保護 層14的内侧，用於覆蓋該些架橋導線121與外露的第 一、第二電極1 1 0、120，架橋導線保護層1 5係用於將架 橋導線121及外露的第一、第二電極11〇 ' 12〇隔絕於空 氣以避免架橋導線121與該些電極11〇、120發生氧化 的情形；該周邊線路保護層1 7係覆蓋該些周邊線路彳6， 用於將周邊線路16隔絕於空氣，避免周邊線路16發生氧 化的情形。 本創作之電極保護層14及導線絕緣層13係利用同一 M434989 絕緣膜構成，當基板10上形成第—電極串u與第二電極 120後，在第一電極串彳彳與第二電極12〇表面形成一絕 緣膜’再透過-微影钮刻製程以圖案化該絕緣膜，請參考 圖3所不，絕緣膜被移除的區域形成前述的開窗區域 140，開窗區域1 4〇供後續的架橋導線j 2彳連接相鄰的第 二電極120，而被保留的部分形成前述的電極保護層14以 及導線絕緣層1 3。 在架橋導線的製程中，形成一金屬膜，該金屬膜係覆 蓋了電極保護層14、導線絕緣層a以及開窗區域14〇區 域；接著透過一微影蝕刻製程以圖案化該金屬膜，令該金 屬膜形成該些架橋導線121，因此在形成架橋導線121的 過程中，僅有部份的金屬膜會在開窗區域14〇中直接接觸 第一電極120以構成架橋導$ 121，纟餘的金屬膜係覆蓋 在電極保護層14的表面並將被移除。 忒架橋導線保護層15與周邊線路保護層彳73係利用 同絕緣膜構成，當基板10上形成架橋導線121與周邊 線路1 6後，在開窗區域14〇與周邊線路彳6表面形成絕緣 膜，再透過一微影蝕刻製程以圖案化絕緣膜，使之成為架 橋導線保護層15與周邊線路保護層173。 相對於先前技術，在蝕刻金屬膜之後，若有殘留的金 屬膜，亦是殘留在電極保護層14的表面，電極保護層14 為絕緣層，而可大幅降低第一、第二電極11〇、12〇受到 殘留的金屬膜影響而發生短路的機率，藉此提高觸控面板 的生產良率。 【圖式簡單說明】 M434989 圖1 :本創作較佳實施例的上視示意圖。 圖2 :本創作較佳實施例的側視示意圖。 圖- 3 _:…於-基板上__形_成-導-線絕緣_層_與-電-極-保護-層-的-上視 示意圖。 圖4:已知觸控面板的上視示意圖。 圖5 :已知觸控面板的側視示意圖。A plurality of bridge wire protection layers 15 and a peripheral line protection layer 17 » S are formed by the inner surface of the electrode protection layer 14 for covering the bridge wires 121 and the exposed 1. The second electrode 1 1 0, 120, the bridging conductor protection layer 15 is used for isolating the bridging conductor 121 and the exposed first and second electrodes 11 〇 ' 12 于 from the air to avoid the bridging conductor 121 and the electrodes 11〇, 120 is oxidized; the peripheral line protection layer 17 covers the peripheral lines 彳6 for isolating the peripheral line 16 from the air to avoid oxidation of the peripheral line 16. The electrode protective layer 14 and the wire insulating layer 13 of the present invention are formed by the same M434989 insulating film. After the first electrode string u and the second electrode 120 are formed on the substrate 10, the first electrode string and the second electrode 12 are formed. The surface is formed with an insulating film 're-transmission-lithography button engraving process to pattern the insulating film. Please refer to FIG. 3, the area where the insulating film is removed forms the aforementioned window opening area 140, and the window opening area is provided for Subsequent bridging conductors j 2 彳 connect the adjacent second electrodes 120, and the remaining portions form the aforementioned electrode protective layer 14 and the wire insulating layer 13. In the process of bridging the conductor, a metal film is formed, which covers the electrode protection layer 14, the wire insulation layer a, and the fenestration region 14 ; region; and then the lithography process is used to pattern the metal film. The metal film forms the bridging wires 121. Therefore, in the process of forming the bridging wires 121, only a part of the metal film directly contacts the first electrode 120 in the window opening region 14A to form a bridging guide $121. The metal film is overlaid on the surface of the electrode protection layer 14 and will be removed. The truss bridge wire protection layer 15 and the peripheral line protection layer 彳73 are formed by the same insulating film. When the bridge wire 121 and the peripheral line 16 are formed on the substrate 10, an insulating film is formed on the surface of the window opening region 14 and the peripheral circuit 彳6. Then, the insulating film is patterned by a lithography process to make the bridge wire protective layer 15 and the peripheral line protection layer 173. Compared with the prior art, after the metal film is etched, if there is a residual metal film remaining on the surface of the electrode protection layer 14, the electrode protection layer 14 is an insulating layer, and the first and second electrodes 11 〇 can be greatly reduced. 12〇 The probability of a short circuit caused by the residual metal film, thereby improving the production yield of the touch panel. BRIEF DESCRIPTION OF THE DRAWINGS M434989 FIG. 1 is a top plan view of a preferred embodiment of the present invention. Figure 2 is a side elevational view of the preferred embodiment of the present invention. Fig. - 3 _: ... on the substrate - __ shape _ into - conduction - line insulation _ layer _ and - electric - pole - protection - layer - - top view. Figure 4: A top view of a known touch panel. Figure 5: A side view of a known touch panel.
【主要元件符號說明】 10基板 1 1第一電極串 1 10第一電極 111第一導線 12第二電極串 120第二電極 1 21架橋導線 1 3導線絕緣層 14電極保護層 140開窗區域 1 5架橋導線保護層 1 6周邊線路 160基底層 1 61金屬層 1 7周邊線路保護層 30基板 31 X軸電極串 31 0 X電極 31 1 X導線 32 丫轴電極串 320 Y電極 321架橋導線 322殘留金屬 33保護層 34絕緣層[Major component symbol description] 10 substrate 1 1 first electrode string 1 10 first electrode 111 first wire 12 second electrode string 120 second electrode 1 21 bridge wire 1 3 wire insulation layer 14 electrode protection layer 140 window opening area 1 5 bridge wire protection layer 1 6 peripheral line 160 base layer 1 61 metal layer 1 7 peripheral line protection layer 30 substrate 31 X-axis electrode string 31 0 X electrode 31 1 X wire 32 丫-axis electrode string 320 Y electrode 321 bridge wire 322 residue Metal 33 protective layer 34 insulation layer