M429059 五、新型說明： 【新型所屬之技術領域】 本創作係一種LED反射燈，乃使LED反射之燈光柔和 、及更佳之散熱功效。 【先前技術】 查，習知之LED反射燈之結構，大體皆是設成：散熱 體組裝具有反光面之燈罩，於燈罩反光面之底部中央位置 裝設LED發光晶片，LED發光晶片發光之光線照射於周邊 之反光面’再由反光面反射光線；上述結構，其實存在有 下列缺點： (1) LED發光晶片設於反光面底部中央位置，其並未予遮 掩’因此，LED發光晶片呈外露，發光時必然會有光 點，而顯較刺眼、產生眩光。 (2) LED發光晶片並未接觸到散熱體，換言之，L5：D發光 晶片產生之熱溫係呈間接散熱體吸收、非是直接傳導 給散熱體，故其散熱效果較慢、效率較差。 【新型内容】 本創作即是為改良習知之缺點，主要技術、目的為： 於燈罩反光面中設懸空之導熱座，LE：D發光晶片設於燈罩 中心且呈向側邊照射，led發光晶片之光線呈照射於反光 面再反射，因此，led發光晶片發光時其光點可被導熱座 遮掩，達到不刺眼、不產生眩光、柔和之效果。又，導熱 座直接與政熱體連接一體，而得直接導熱增進散熱功效。 【實施方式】 3 M429059 請參閱圖一、二、三、四，係包含：散熱體1〇、具有 反光面14之燈罩12、導熱座20、LED發光晶片22,散熱 體10設有定位槽11、中心具有凸座1〇丨，燈罩12設有通 孔13、中心具有底孔15，通孔13對應於散熱體1〇之定位 槽11，凸座101穿過底孔15而凸入燈罩12中，導熱座2〇 穿過燈罩12之通孔13而組合於散熱體1〇之定位槽u， 幵y成導熱座20、燈罩12、散熱體10組合一體，又，導熱 座20设有定位槽21嵌合於凸座1〇1，凸座1〇1雙側組裝 LED發光晶片22形成LED發光晶片22光線呈向側邊照射 於燈罩12之反光面14，導熱座20並包覆凸座1〇1而得直 接傳導LED發光晶片22產生之熱溫。 藉由上述結構，可得下列之功效、優點： ⑴如圖二、三所示，LED發光晶片22係設於導熱座20 中央位置之底部之凸座1〇1雙側，LED發光晶片没 發光時，其祕呈側邊騎於反光罩之反光面14再 反射，可被導熱座20遮掩，而得不刺眼、防止產生 眩光之功效。且，光線呈向側it照射於反光面14後 再反射，得光線較柔和之效果。 (2)如圖三、四所示，導熱座2〇與凸座1〇1接觸、且貫 穿燈罩12與散熱體1〇直接接觸組合一體，而得直 將⑽發光晶片22產生之熱溫傳導至散熱體1〇散熱 ，達到散熱速度快之功效。 斤述本創作之結構，確實具有極佳實用性與增 進功效，誠符合新型專旨，懇請賜准專利。” 4 M429059 【圖式簡單說明】 圖一，本創作立體分解圖 圖二，本創作組合立體圖 圖三，本創作組合正視剖視圖 圖四，本創作組合側視剖視圖 【主要元件符號說明】 10散熱體 14反光面 11、21定位槽 15底孔M429059 V. New Description: [New Technology Field] This creation is an LED reflector lamp that makes the LED reflection light softer and better. [Prior Art] The structure of the conventional LED reflector lamp is generally set as follows: the heat sink is assembled with a reflector having a reflective surface, and an LED light-emitting chip is disposed at the center of the bottom of the reflector surface of the lampshade, and the light of the LED light-emitting chip is illuminated. The reflective surface of the periphery reflects light again by the reflective surface. The above structure has the following disadvantages: (1) The LED light-emitting chip is disposed at the center of the bottom of the reflective surface, which is not obscured. Therefore, the LED light-emitting chip is exposed. When there is light, there will be a spot of light, which is more glaring and glare. (2) The LED light-emitting chip does not touch the heat sink. In other words, the heat temperature generated by the L5:D light-emitting chip is absorbed by the indirect heat sink, and is not directly transmitted to the heat sink, so the heat dissipation effect is slow and the efficiency is poor. [New content] This creation is to improve the shortcomings of the conventional knowledge. The main technology and purpose are as follows: a floating heat-conducting seat is arranged in the reflective surface of the lampshade, and the LE:D light-emitting chip is arranged in the center of the lampshade and is illuminated to the side, the LED light-emitting chip The light is reflected on the reflective surface and then reflected. Therefore, when the LED light-emitting chip emits light, its light spot can be covered by the heat-conducting seat, so as to achieve no glare, no glare, and soft effect. Moreover, the heat conduction seat is directly connected with the political heat body, and direct heat conduction is used to enhance the heat dissipation effect. [Embodiment] 3 M429059 Please refer to FIG. 1 , 2 , 3 , and 4 , which includes a heat sink 1 , a lamp cover 12 having a reflective surface 14 , a heat conducting base 20 , and an LED light emitting chip 22 . The heat sink 10 is provided with a positioning groove 11 . The center has a protrusion 1 , the lamp cover 12 is provided with a through hole 13 , and the center has a bottom hole 15 . The through hole 13 corresponds to the positioning groove 11 of the heat sink 1 , and the protrusion 101 protrudes through the bottom hole 15 and protrudes into the lamp cover 12 . The heat-conducting seat 2 is disposed through the through-hole 13 of the lamp cover 12 and combined with the positioning groove u of the heat-dissipating body 1 , and the heat-conducting seat 20 , the lamp cover 12 and the heat sink 10 are integrated, and the heat-conducting seat 20 is positioned. The heat sink 20 is coated on the reflective surface 14 of the lamp cover 12, and the heat transfer seat 20 is covered with the protrusion. The heat temperature generated by the LED light-emitting chip 22 is directly transmitted by 1〇1. With the above structure, the following functions and advantages can be obtained: (1) As shown in FIGS. 2 and 3, the LED light-emitting chip 22 is disposed on both sides of the protrusion 1〇1 at the bottom of the central position of the heat-transfer holder 20, and the LED light-emitting chip does not emit light. At the same time, the secret side is then reflected on the reflective surface 14 of the reflector, and can be covered by the heat conducting seat 20, so as not to glare and prevent glare. Moreover, the light is reflected to the side of the reflective surface 14 and then reflected, resulting in a softer light effect. (2) As shown in FIG. 3 and FIG. 4, the heat conducting seat 2〇 is in contact with the boss 1〇1, and is integrally connected with the heat sink 1〇 through the lampshade 12, and the heat conduction of the (10) light emitting chip 22 is directly performed. Dissipate heat to the heat sink 1 to achieve fast heat dissipation. The structure of the creation of the book is indeed of great practicality and efficiency, and it is in line with the new purpose. 4 M429059 [Simple description of the diagram] Figure 1 is a three-dimensional exploded view of the creation, the third is a three-dimensional exploded view of the creation, and the front view of the creation is a cross-sectional view of the creation of the combination. 14 reflective surface 11, 21 positioning groove 15 bottom hole
12燈罩 20導熱座 13通孔 22 LED發光晶片 101凸座12 lampshade 20 thermal pad 13 through hole 22 LED light emitting chip 101 boss