M428871 五、新型說明： 【新型所屬之技術領域】 本創作係屬一種壓合墊結構改良’尤指改良一種適用於印刷 電路板之壓合墊，而具有乾淨平整之壓合效果。 【先前技術】 因裝載積體電路所使用之印刷電路板(Primed Circuit Boards)，無論是屬於單面板、雙面板或多層板，都需要將銅 箔線路壓合於玻璃纖維樹脂膠片上，並經固化(Curing)處理 後，即可做為搭載電子零件，並連通電路之支撐载具。 如上述使用壓合銅箔線路與玻璃纖維樹脂膠片兩者，經固結 為一體之加工過程中，是以高溫為重壓，因此其壓力須要求能 被均勻地分佈在電路板上，且溫度的傳導亦須控制如預期，因 此通常使用做為壓合墊之表面層，乃以耐高溫與高壓之鐵氟龍 (Teflon)層為其首選。 由如上述壓合墊之表面層固為鐵氟龍層，但中間核心之緩衝 结構因採石夕膠之故，雖於珍膠之外再被覆有不織布層，但屢經 熱壓後其矽膠分子結構已遭受破壞，以致穿透不織布層而釋放 出大量之石夕膠油’非但污染了印刷電路板，易造成品質異常， 也為製程帶來諸多的困擾與麻煩，因而該種壓合墊之缺失，自 有再加以研究改善之必要性與迫切性。 如本創作之壓合墊結構改良係將表面層保留，但中間層改良 3 以氣塾層做為-具有緩衝效果之壓合墊，而氣塾層之原理乃係 運用如複合麟(Kevlar：)^·有麵後㈣蚁^裡纖維氣 室之質性所成’因而不再渗流出污染物至印刷電路板，並能維 持壓合作業之乾淨平整的持續製程。 【新型内容】 本創作係Λ -種壓合塾結構改良，依其賴，係由表面層與 中間層組合所成，其中表面層為耐高溫層，而以雙面夾覆中間 層。 如本創作係屬-麵合塾結構改良，依其結構，係由表面層 與中間層組合所成’其中中間層為氣墊層，能於鬆壓時吸入空 氣’而形成以空氣為，緩衝^ 【實施方式】 請參閱第一圖係習用壓合墊結構示意圖，其中壓合墊1〇係 由表面層11、内層12及核心層13三者組合所成，因核心層 13採用矽膠做為緩衝層，致當受到高溫高壓之擠壓時，其分 子結構遭受破壞，而釋放出大量之妙膠油，經穿透内層12之 不織布包覆層，以致污染了被壓合於其間的印刷電路板，如此 非但造成其品質異常之情況發生，並為製程帶來莫大的困擾， 而為其既有缺失。 请參閱第二圖係本創作壓合塾結構示意圖，其中壓合墊 係由表面層21與中間層22組合所成，.其中表面層21係採耐 高溫之鐵氤龍(Teflon-聚四氟乙烯)層，而以雙面夾覆中間層 22 ;其中尹間層22為氣墊層，改良以複合纖維(Kevlar-聚對 苯二甲酸對苯醯胺)取代矽膠，使其能於鬆壓時吸入空氣，而 形成以空氣為緩衝介質。如此，藉由本創作結構之提供，可讓 印刷電路板之壓合祕鋪乾料整，马虞找之情形發 生15 【圖式簡單說明】 第一圖係習用壓合墊結構示意圖。 第二圖係本創作壓合墊結構示意圖。 【主要元件符號說明】 10—壓合墊11 一表面層12—内層13—·核心層 20—壓合墊21—表面層 22 —中間層M428871 V. New description: [New technical field] This creation is a kind of improvement of the structure of the press pad, especially the improvement of a press pad suitable for printed circuit boards, and has a clean and flat pressing effect. [Prior Art] Due to the use of the printed circuit boards (Primed Circuit Boards) used in the integrated circuit, whether it is a single-panel, double-panel or multi-layer board, it is necessary to press the copper foil circuit onto the glass fiber resin film, and After the curing process, it can be used as a support carrier for carrying electronic components and connecting the circuits. As described above, both the press-bonded copper foil line and the glass fiber resin film are used in the process of consolidation, and the pressure is high temperature, so the pressure must be uniformly distributed on the circuit board, and the temperature is required. Conduction must also be controlled as expected, so the surface layer used as a press pad is usually used, and the Teflon layer with high temperature and high pressure is preferred. The surface layer of the above-mentioned pressure pad is solidified as a Teflon layer, but the buffer structure of the intermediate core is coated with a non-woven layer in addition to the precious rubber, but the rubber molecules are repeatedly pressed by hot pressing. The structure has been damaged, so that the penetration of the non-woven layer and the release of a large amount of Shijiao rubber oil not only pollutes the printed circuit board, but also causes quality abnormalities, which also brings many troubles and troubles to the process, and thus the press pad Missing, the necessity and urgency of research and improvement. For example, the improvement of the press-pad structure of this creation retains the surface layer, but the intermediate layer is improved by 3 with the gas layer as a cushioning pad with a cushioning effect, and the principle of the gas layer is applied as a composite collar (Kevlar:)^ · After the surface (four) ant ^ Li fiber chamber is made of quality - thus no longer seep out pollutants to the printed circuit board, and can maintain a clean and continuous process of pressure cooperation. [New content] This creation is based on the combination of a surface layer and an intermediate layer. The surface layer is a high temperature resistant layer, and the intermediate layer is sandwiched on both sides. If the structure of the creation is a combination of surface and surface structure, according to its structure, it is composed of a combination of a surface layer and an intermediate layer, wherein the middle layer is an air cushion layer, which can take in air when loosened, and is formed by air as a buffer. [Embodiment] Please refer to the first diagram of the structure of the conventional pressure pad, wherein the pressure pad 1 is formed by a combination of the surface layer 11, the inner layer 12 and the core layer 13, because the core layer 13 is made of silicone. Layer, when subjected to high temperature and high pressure extrusion, its molecular structure is destroyed, and a large amount of wonderful rubber oil is released, which penetrates the non-woven coating layer of the inner layer 12, thereby contaminating the printed circuit board pressed therebetween This is not only caused by the abnormal quality of the situation, but also caused a lot of trouble for the process, but it is both missing. Please refer to the second figure for a schematic diagram of the embossed structure of the present invention, wherein the pressure pad is formed by combining the surface layer 21 and the intermediate layer 22, wherein the surface layer 21 is a high temperature resistant iron scorpion (Teflon-polytetrafluoroethylene). a layer of ethylene, and sandwiching the intermediate layer 22 on both sides; wherein the inter-growth layer 22 is an air cushion layer, and the conjugate fiber (Kevlar-polyphenylene terephthalate) is modified to replace the silicone rubber, so that it can be loosened. Air is taken in and air is used as a buffer medium. In this way, with the provision of the creation structure, the printed circuit board can be pressed and dried, and the situation of the horse is found. 15 [Simple description of the drawing] The first figure is a schematic diagram of the structure of the conventional pressure pad. The second picture is a schematic diagram of the structure of the press pad. [Description of main component symbols] 10 - press pad 11 a surface layer 12 - inner layer 13 - core layer 20 - press pad 21 - surface layer 22 - intermediate layer