M427770 五、新型說明： 【新型所屬之技術領域】 [0001] 一種散熱單元之散熱結構，尤指一種可提升散熱單元内 部工作流體汽液循環效率的散熱單元之散熱結構。 【先前技術】 [0002] 現行電子設備内部為講求高散熱效率已大量選擇熱管、 均溫板、環路熱管、熱交換器等熱傳元件進行熱傳導工 作。 並，該等熱傳元件其熱傳導率是銅、鋁等金屬的.數倍至 數十倍左右而相當的優異，因此是作為冷卻用元件而被 運用於各種熱對策相關機器。從形狀來看，熱管可分成 圓管形狀的熱管、扁平形狀及D型形狀的熱管。為了冷卻 CPU或其他因執行運算或工作而產生熱之電子零件等的電 子機器的被冷卻零件，基於容易安裝於被冷卻零件且能 獲得寬廣接觸面積的觀點，也採用均溫板或扁平型熱管 或薄型熱交換器來進行散熱。隨著冷卻機構的小型化、 省空間化，在使用熱管的冷卻機構的情況，更有嚴格要 求該熱管的極薄型化之必要。 所述該等熱傳元件内部工作流體欲進行汽液循環時，其 内部需設置具有毛細力之毛細結構（溝槽、金屬網格體 結構、燒結結構等），使得令工作流體得以順利於該熱 傳元件進行汽液循環之工作。 若該等熱傳元件需使用於較為窄小之處，則勢必需製成 薄型化，而該内部之毛細結構則將會是除了熱傳元件本 身厚度問題外，令該熱傳元件無法製成薄型化最主要之 表單編號A0101 第3頁/共19頁 M427770 問題。 再者，製成薄型化後之毛細結構則會因薄型化後其毛細 力亦下降，影響該熱傳元件之内部工作流體汽液循環效 率進而令熱傳導效率大幅降低，故習知技術具有下列缺 點： 1. 熱傳效率不佳； 2. 熱傳元件薄型化有限。 【新型内容】 [0003] 爰此，為解決上述習知技術之缺點，本創作之主要目的 ，係提供一種可提升導熱及散熱效率的散熱單元之散熱 結構。 本創作次要目的係提供一種提升薄型化之散熱裝置其内 部工作流體汽液循環的散熱單元之散熱結構。 為達上述之目的，本創作係提供一散熱單元之散熱結構 ，係包含：一散熱單元本體具有一腔室，所述腔室設有 至少一奈米級線狀體結構層及一工作流體，該奈米級線 狀體結構層延伸設於該腔室内壁。 所述散熱單元本體係可為熱管及環路熱管及平板式熱管 及均溫板及熱交換器其中任一。 所述奈米級線狀體結構層係可大幅提升該散熱單元本體 内部工作流體之汽液循環之效率，並因其結構縝密，令 該散熱裝置薄型化時仍可維持其毛細力，令散熱單元本 體内部工作流體得以順利進行汽液循環。 【實施方式】 [0004] 本創作之上述目的及其結構與功能上的特性，將依據所 表單編號A0101 第4頁/共19頁 附圖式之較佳實施例予以說明。 請參閱第1、2、2A圖，係為本創作之散熱單元之散熱結 構第一實施例之立體及A-A剖視及局部放大圖，如圖所示 ’所述散熱單元之散熱結構，係包含：一散熱單元本體1 具有一腔室U ’所述腔室11設有至少一奈米級線狀體結 構層111及一工作流體112，該奈米級線狀體結構層^^ 係完整或局部的延伸設置於該腔室n内壁，該奈米級線 狀體結構層111係由複數奈米級線狀體所構成，該奈米級 線狀體之一端係為固結端被設置於該腔室丨丨内壁上，其 另一端朝腔室11内部延伸形成自由端’該自由端係為銳 狀及鈍狀其中任一，或銳狀及鈍狀二者之交錯配置者。 所述散熱單元本體1係為均溫板及平板式熱管及環路熱'管 及熱交換器其中任一 ’本創作係以平板式熱管作為說明 ’但並不引以為限，並所述腔室n内壁係為平滑壁面。 請參閱第3圖，係為本創作之散熱單元之散熱結構第二實 施例之剖視圖’如圖所示’本實施例散熱單元本體丨係以 熱管作為說明’但並不引以為限’該奈米級線狀體結構 層111轴向延伸設於該熱管之腔室11内壁。 請參閱第4圖，係為本創作之散熱單元之散熱結構第三實 施例之钊視圖’如圖所示，本實施例散熱單元本體丨係以 熱管作為說明，但並不引以為限，所述腔室1丨更具有至 少一第一區段113及一第二區段"ll4及一第三區段115， 所述第一、二、三區段113、114、115相互連接，所述 奈米級皞狀體結構層111係選擇設置於所述第一區段n3 、第二區段114及第三區段11 5其中任一，本實施例係將 奈米級線狀體結構層111僅設置於該第二區段114，但並 A0101 第5頁/共19頁 M427770 不引以為限。 請參閱第5圖，係為本創作之散熱單元之散熱結構第四實 施例之剖視圖，如圖所示，本實施例係與前述第三實施 例部分結構相同，故在此將不再贅述，惟本實施例與前 述第三實施例之不同處係為所述腔室11更設有一鍍膜2( 具有超親水性及超疏水性之特性），該鍍膜2係選擇設置 於所述第一區段113及第二區段114及第三區段11 5其中 任一，本實施例該鍍膜2係設置於該第三區段115。 請參閱第6圖，係為本創作之散熱單元之散熱結構第五實 施例之剖視圖，如圖所示，本實施例係與前述第三實施 例部分結構相同，故在此將不再贅述，惟本實施例與前 述第三實施例之不同處係為所述腔室11更具有一鍍膜2， 該鍍膜2可被同時設置於所述第一區段11 3及第三區段11 5 〇 請參閱第7圖，係為本創作之散熱單元之散熱結構第六實 施例之剖視圖，如圖所示，本實施例係與前述第二實施 例部分結構相同，故在此將不再贅述，惟本實施例與前 述第二實施例之不同處係為所述腔室11内壁與該奈米級 線狀體結構層111間更具有一毛細結構3，所述所述毛細 結構3係為燒結粉末及網格體及纖維體及多孔性結構體及 溝槽其令任一，或其兩兩相加組合，本實施例係以溝槽 、 作為說明但並不引以為限，所述溝槽凹設於該腔室11内 壁，並該奈米級線狀體結構層111同時彼附於該溝槽及腔 室11内壁。 « 請參閱第8圖，係為本創作之散熱單元之散熱結構第七實 施例之剖視圖，如圖所示，本實施例係與前述第二實施 表單编號A0101 第6頁/共19頁 M427770 例。卩分結構相同，故在此將不再贅述，惟本實施例與前 述第一實施例之不同處係為所述腔室11内壁與該奈米級 線狀體結構層111間更具有一鍍膜2。 請參閱第9圖’係為本創作之散熱單元之散熱結構第八實 施例之剖視圖，如圖所示，本實施例係與前述第三實施 例部分結構相同，故在此將不再贅述，惟本實施例與前 述第三實施例之不同處係為所述腔室1丨更具有至少一第 一區段113及一第二區段114及一第三區段115，所述第 % ―、二、三區段113、114、115相互連接，所述第二區 段114上之奈米級線狀體結構層1H係分佈較密。 S奢參閱第10圖，係為本創作之散熱單元之散熱結構第九 實施例之剖視圖，如圖所示，本實施例係與前述第三實 施例部分結構相同’故在此將不再贅述，惟本實施例與 前述第三實施例之不同處係為所述腔室U更具有至少一 第一區段113及一第二區段114及一第三區段115，所述 第一、二、三區段113、114、115相互連接，所述第一 % 、三區段113、115上之奈米級線狀體結構層lu係分佈 較密。 請參閱第11圖’係為本創作之散熱單元之散熱結構第十 實施例之剖視圖，如圖所示，本實施例係與前述第一實 施例部分結構相同，故在此將不再贅述，惟本實施例與 前述第一實施例之不同處係為所述散熱單元本體1係為一 均溫板’該均溫板之腔室11内壁面設有前述奈米級線狀 體結構層111。 請參閱第12圖’係為本創作之散熱單元之散熱結構第十 一實施例之剖視圖，如圖所示，本實施例係與前述第十 表單鴣蜣麵1 第7頁/共19頁 M427770 實施例部分結構相同，故在此將不再贅述，惟本實施例 與前述第十實施例之不同處係為所述均溫板之腔室11内 壁面與前述奈米級線狀體結構層111間更具有一鍍膜2。 於該熱管及均溫板及平板式熱管及環路熱管中將其内 部設置奈米級線狀體結構層111，該奈米級線狀體結構層 111係可改變該工作流體112於其内部之表面張力，加快 回流速度而具有極佳之汽液循環效率，藉以大幅提升熱 傳效能者。 【圖式簡單說明】 [0005] 第1圖係為本創作之散熱單元之散熱結構第一實施例之立 體圖； 第2圖係為本創作之散熱單元之散熱結構第一實施例之 A _ A剖視圖； 第2A圖係為本創作之散熱單元之散熱結構第一實施例之 A-A剖視之局部放大圖； 第3圖係為本創作之散熱單元之散熱結構第二實施例之剖 視圖， 第4圖係為本創作之散熱單元之散熱結構第三實施例之剖 視圖， 。第5圖係為本創作之散熱單元之散熱結構第四實施例之剖 視圖； 第6圖係為本創作之散熱單元之散熱結構第五實施例之剖 視圖； 第7圖係為本創作之散熱單元之散熱結構第六實施例之剖 視圖， 第8圖係為本創作之散熱單元之散熱結構第七實施例之剖 表單編號A0101 第8頁/共19頁 M427770 視圖， 第9圖係為本創作之散熱單元之散熱結構第八實施例之剖 視圖， 第10圖係為本創作之散熱單元之散熱結構第九實施例之 剖視圖； 第11圖係為本創作之散熱單元之散熱結構第十實施例之 剖視圖； 第12圖係為本創作之散熱單元之散熱結構第十一實施例 之剖視圖。 【主要元件符號說明】 [0006]散熱單元本體1 腔室11 奈米級線狀體結構層111 工作流體112 第—區段113 第一區段114 φ 第三區段115 鍍骐2 毛細結構3 第9頁/共19頁 I單編號A0101M427770 V. New Description: [New Technology Field] [0001] A heat dissipation structure of a heat dissipation unit, especially a heat dissipation structure of a heat dissipation unit that can improve the vapor-liquid circulation efficiency of a working fluid inside a heat dissipation unit. [Prior Art] [0002] In the current electronic equipment, a heat transfer element such as a heat pipe, a temperature equalizing plate, a loop heat pipe, and a heat exchanger has been selected for heat conduction in order to achieve high heat dissipation efficiency. In addition, these heat transfer elements are excellent in electrical conductivity of several times to several tens of times, such as copper or aluminum. Therefore, they are used as components for cooling measures. In terms of shape, the heat pipe can be divided into a heat pipe in the shape of a circular pipe, a heat pipe having a flat shape and a D shape. In order to cool a CPU or other cooled parts of an electronic device that generates hot electronic parts or the like by performing calculations or work, a temperature equalizing plate or a flat type heat pipe is also adopted from the viewpoint of easy attachment to a cooled part and a wide contact area. Or a thin heat exchanger for heat dissipation. With the miniaturization and space saving of the cooling mechanism, in the case of a cooling mechanism using a heat pipe, it is necessary to strictly reduce the thickness of the heat pipe. When the internal working fluid of the heat transfer elements is to be subjected to vapor-liquid circulation, a capillary structure having a capillary force (groove, metal mesh structure, sintered structure, etc.) is required inside, so that the working fluid can be smoothly operated. The heat transfer element performs the work of vapor-liquid circulation. If the heat transfer elements are to be used in a relatively narrow area, they must be made thinner, and the internal capillary structure will be made in addition to the thickness of the heat transfer element itself, so that the heat transfer element cannot be made. The most important form number for thinning is A0101 Page 3 of 19 M427770. Furthermore, the capillary structure after the thinning is reduced, the capillary force of the thinned structure is also reduced, which affects the internal working fluid vapor-liquid circulation efficiency of the heat-transfer element, thereby greatly reducing the heat transfer efficiency. Therefore, the prior art has the following disadvantages. : 1. The heat transfer efficiency is not good; 2. The heat transfer component is limited in thickness. [New Content] [0003] In order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a heat dissipation structure of a heat dissipation unit that can improve heat conduction and heat dissipation efficiency. The secondary objective of the present invention is to provide a heat dissipation structure for a heat dissipating unit that enhances the internal working fluid vapor-liquid circulation of a thinned heat sink. For the purpose of the above, the present invention provides a heat dissipating structure of a heat dissipating unit, comprising: a heat dissipating unit body having a chamber, the chamber being provided with at least one nano-scale linear structure layer and a working fluid. The nano-scale linear structure layer extends over the inner wall of the chamber. The heat dissipating unit may be any one of a heat pipe and a loop heat pipe, a flat plate heat pipe, and a temperature equalizing plate and a heat exchanger. The nano-scale linear structure layer can greatly improve the efficiency of the vapor-liquid circulation of the working fluid in the heat-dissipating unit body, and the structure is dense, so that the heat-dissipating device can maintain the capillary force when the thinning device is thinned, so that the heat dissipation The working fluid inside the unit body can smoothly perform vapor-liquid circulation. [Embodiment] The above object of the present invention and its structural and functional characteristics will be described in accordance with a preferred embodiment of the drawing No. A0101, page 4 of the accompanying drawings. Please refer to the figures 1, 2, and 2A, which are the three-dimensional and AA cross-sectional views and the partial enlarged view of the first embodiment of the heat dissipation structure of the heat dissipation unit of the present invention, as shown in the figure, the heat dissipation structure of the heat dissipation unit includes The heat dissipating unit body 1 has a chamber U'. The chamber 11 is provided with at least one nano-scale linear structure layer 111 and a working fluid 112. The nano-scale linear structure layer is complete or a partial extension is disposed on the inner wall of the chamber n, and the nano-scale linear structure layer 111 is composed of a plurality of nano-scale linear bodies, and one end of the nano-scale linear body is a fixed end The inner wall of the chamber has its other end extending toward the inside of the chamber 11 to form a free end. The free end is either a sharp or a blunt shape, or a staggered arrangement of both sharp and blunt. The heat dissipating unit body 1 is a uniform temperature plate and a flat plate heat pipe and a loop heat pipe and a heat exchanger. The present invention uses a flat heat pipe as an illustration, but is not limited thereto, and is not limited thereto. The inner wall of the chamber n is a smooth wall. Please refer to FIG. 3 , which is a cross-sectional view of the heat dissipation structure of the heat dissipation unit of the present invention. As shown in the figure, the heat dissipation unit body of the present embodiment is described by a heat pipe as a description, but is not limited thereto. The nano-scale linear structure layer 111 extends axially on the inner wall of the chamber 11 of the heat pipe. Please refer to FIG. 4 , which is a side view of the third embodiment of the heat dissipation structure of the heat dissipation unit of the present invention. As shown in the figure, the heat dissipation unit body of the embodiment is described by a heat pipe, but is not limited thereto. The chamber 1 further has at least a first section 113 and a second section < ll4 and a third section 115, wherein the first, second and third sections 113, 114, 115 are connected to each other. The nano-scaled body structure layer 111 is selected to be disposed in any one of the first segment n3, the second segment 114, and the third segment 115. In this embodiment, the nano-scale linear body is used. The structural layer 111 is only disposed in the second segment 114, but is not limited to A0101 page 5/19 pages M427770. Referring to FIG. 5, it is a cross-sectional view of a fourth embodiment of the heat dissipation structure of the heat dissipation unit of the present invention. As shown in the figure, the embodiment is identical to the structure of the third embodiment, and therefore will not be further described herein. However, the difference between the embodiment and the third embodiment is that the chamber 11 is further provided with a coating 2 (having characteristics of super hydrophilicity and superhydrophobicity), and the coating 2 is selectively disposed in the first region. In any of the segments 113 and the second segment 114 and the third segment 115, the plating film 2 is disposed in the third segment 115 in this embodiment. Please refer to FIG. 6 , which is a cross-sectional view of a fifth embodiment of the heat dissipation structure of the heat dissipation unit of the present invention. As shown in the figure, the embodiment is identical to the structure of the third embodiment, and therefore will not be further described herein. However, the difference between the embodiment and the foregoing third embodiment is that the chamber 11 further has a coating 2, and the coating 2 can be simultaneously disposed on the first section 11 3 and the third section 11 5 Please refer to FIG. 7 , which is a cross-sectional view of a sixth embodiment of the heat dissipation structure of the heat dissipation unit of the present invention. As shown in the figure, the embodiment has the same structure as that of the foregoing second embodiment, and therefore will not be further described herein. The difference between this embodiment and the foregoing second embodiment is that there is a capillary structure 3 between the inner wall of the chamber 11 and the nano-scale linear structure layer 111, and the capillary structure 3 is sintered. The powder and the mesh body and the fibrous body and the porous structure and the groove are either added or combined with each other, and the embodiment is a groove, which is for illustrative but not limited, the groove The groove is recessed in the inner wall of the chamber 11, and the nano-scale linear structure layer 111 When it is attached to the inner wall of the trench 11 and chamber. « Please refer to Fig. 8, which is a cross-sectional view of a seventh embodiment of the heat dissipation structure of the heat dissipation unit of the present invention. As shown in the figure, this embodiment is related to the aforementioned second implementation form No. A0101, page 6 of 19, M427770 example. The structure of the enthalpy is the same, so it will not be described here. However, the difference between this embodiment and the first embodiment is that there is a coating between the inner wall of the chamber 11 and the nano-scale linear structure layer 111. 2. Referring to FIG. 9 is a cross-sectional view showing the eighth embodiment of the heat dissipation structure of the heat dissipation unit of the present invention. As shown in the figure, the embodiment is identical to the structure of the third embodiment, and therefore will not be described again. The difference between the embodiment and the foregoing third embodiment is that the chamber 1 further has at least a first section 113 and a second section 114 and a third section 115, and the first ― The second and third sections 113, 114, and 115 are connected to each other, and the nano-scale linear structure layer 1H on the second section 114 is densely distributed. Referring to FIG. 10, it is a cross-sectional view of a ninth embodiment of the heat dissipation structure of the heat dissipation unit of the present invention. As shown in the figure, the embodiment is identical to the structure of the third embodiment described above, and thus will not be described herein. The difference between the embodiment and the foregoing third embodiment is that the chamber U further has at least a first section 113 and a second section 114 and a third section 115. The second and third segments 113, 114, and 115 are connected to each other, and the nano-scale linear structure layer on the first and third segments 113 and 115 is densely distributed. Referring to FIG. 11 is a cross-sectional view showing a heat dissipation structure of the heat dissipation unit of the present invention. As shown in the figure, the embodiment is identical to the structure of the first embodiment, and therefore will not be described again. The difference between the embodiment and the first embodiment is that the heat dissipating unit body 1 is a temperature equalizing plate. The inner wall surface of the chamber 11 of the temperature equalizing plate is provided with the nano-scale linear structure layer 111. . Please refer to FIG. 12, which is a cross-sectional view of the eleventh embodiment of the heat dissipating structure of the heat dissipating unit of the present invention. As shown in the figure, the present embodiment is the same as the foregoing tenth sheet. Page 7 of 19 M427770 The embodiment has the same structure, and therefore will not be described herein again. However, the difference between the embodiment and the foregoing tenth embodiment is that the inner wall surface of the chamber 11 of the temperature equalizing plate and the nano-scale linear structure layer. The 111 rooms have a coating 2. In the heat pipe and the temperature equalizing plate and the flat heat pipe and the loop heat pipe, a nano-scale linear structure layer 111 is disposed inside, and the nano-scale linear structure layer 111 can change the working fluid 112 in the interior thereof. The surface tension, which accelerates the reflow speed and has excellent vapor-liquid circulation efficiency, can greatly improve the heat transfer efficiency. BRIEF DESCRIPTION OF THE DRAWINGS [0005] FIG. 1 is a perspective view of a first embodiment of a heat dissipation structure of a heat dissipation unit of the present invention; FIG. 2 is a first embodiment of a heat dissipation structure of the heat dissipation unit of the present invention. 2A is a partial enlarged view of a first embodiment of the heat dissipation structure of the heat dissipation unit of the present invention; FIG. 3 is a cross-sectional view of the second embodiment of the heat dissipation structure of the heat dissipation unit of the present invention, the fourth embodiment The figure is a cross-sectional view of a third embodiment of the heat dissipation structure of the created heat dissipation unit. 5 is a cross-sectional view showing a fourth embodiment of the heat dissipation structure of the heat dissipation unit of the present invention; FIG. 6 is a cross-sectional view showing a fifth embodiment of the heat dissipation structure of the heat dissipation unit of the present invention; FIG. 8 is a cross-sectional view of a sixth embodiment of the heat dissipating structure of the present invention. FIG. 8 is a cross-sectional form No. A0101 of the seventh embodiment of the heat dissipating unit of the present invention. The eighth drawing is a view of the M427770. The heat dissipating structure of the heat dissipating unit is a cross-sectional view of the eighth embodiment, and the tenth drawing is a cross-sectional view of the ninth embodiment of the heat dissipating structure of the heat dissipating unit of the present invention. FIG. 11 is a tenth embodiment of the heat dissipating structure of the heat dissipating unit of the present invention. Fig. 12 is a cross-sectional view showing the eleventh embodiment of the heat dissipation structure of the heat dissipation unit of the present invention. [Main component symbol description] [0006] heat dissipating unit body 1 chamber 11 nano-scale linear structure layer 111 working fluid 112 first-section 113 first section 114 φ third section 115 rhodium-plated 2 capillary structure 3 Page 9 of 19 I single number A0101