M423913 五、新型說明： 【新型所屬之技術領域】 且特別是有關於 本新型是有關於置放晶圓之裝置 一種置放晶圓層板之裝置。 【先前技術】 晶舟為現有置放晶圓層板的裝置，亦可稱為彈度。 現今習用的晶舟為了避免晶圓層板滑出，會在㈣的旦 中-開放端加設底板’同時在底板上設有磁性件，此磁 ^牛會讓底板具有磁性，進而吸附每—個置放㈣的金 屬層板，不僅達到止擋晶圓層板的效果，亦可讓晶圓層 板穩定的置放於架體中。 然而’從晶圓層板置人架體’至穩定被磁性件吸附 的過程中，晶圓層板會有重覆碰撞磁性件的情況發生， 如此將產生磁性件f於自底板脫落，或因重覆撞擊而破 損的問題。 【新型内容】 因此，本新型之一技術態樣在於提供一種晶舟，以克 服上述磁性件易於自底板脫落及因重覆撞擊而破損的問 題。 依據本技術態樣一實施方式，提出一種晶舟，其包含 条體、一底板、至少一磁性件及至少一緩衝件。架體具 有一直線通道，架體用以置放多數個晶圓層板，晶圓層板 由直線通道的一端置入。底板垂直直線通道，且底板位於 M423913 直線通道的另一端與架體連接。磁性件與直線通道平行地 設置於底板，且磁性件與晶圓層板相對。緩衝件與直線通 道平行地連接底板，用以止擋晶圓層板，且緩衝件自底板 垂直高出於磁性件。 _ 更進一步的說，在本技術態樣其他實施方式中，磁性 件可設置於底板及缓衝件連接的交界處。再者，緩衝件垂 直凸出於磁性件的距離範園可為〇 〇1公釐至〇 5公釐。另M423913 V. New description: [New technology field] and especially related to this invention is a device for placing wafers. A device for placing wafer laminates. [Prior Art] The wafer boat is a device for placing a wafer laminate, which may also be called a camber. In order to prevent the wafer laminate from slipping out, the wafer boat used in the present invention will be provided with a magnetic plate at the open end of the (four) and a magnetic member on the bottom plate. The magnetic cathode will make the bottom plate magnetic, and then adsorb each of them. The placement of the (four) metal laminate not only achieves the effect of stopping the wafer laminate, but also allows the wafer laminate to be stably placed in the frame. However, in the process of "from the wafer layer board to the human body" to the stable adsorption by the magnetic member, the wafer layer plate may repeatedly collide with the magnetic member, so that the magnetic member f may be detached from the bottom plate, or Repeated impact and damage. [New content] Therefore, one of the technical aspects of the present invention is to provide a crystal boat to overcome the problem that the magnetic member is easily detached from the bottom plate and broken due to repeated impact. According to an embodiment of the present technology, a wafer boat is provided, which comprises a strip body, a bottom plate, at least one magnetic member and at least one buffer member. The frame body has a linear passage, and the frame body is used for placing a plurality of wafer layers, and the wafer layer is placed by one end of the linear channel. The bottom plate is perpendicular to the straight channel, and the bottom plate is connected to the frame at the other end of the M423913 linear channel. The magnetic member is disposed in parallel with the linear passage on the bottom plate, and the magnetic member is opposed to the wafer laminate. The buffer member is connected to the bottom plate in parallel with the straight channel for stopping the wafer laminate, and the buffer member is vertically higher from the bottom plate than the magnetic member. Further, in other embodiments of the present technology, the magnetic member may be disposed at the junction of the bottom plate and the buffer member. Further, the distance between the cushion member and the magnetic member may be from 公1 mm to 〇5 mm. another
一方面，底板可具有一轉折部，而轉折部的長度可為7公 釐。此外’架體可為一結構鋼架體》 依據本技術態樣另一實施方式，提出一種晶舟其包 含一架體、一底板、至少一磁性件及至少一緩衝件。架體 具有直線通道，架體用以置放多數個晶圓層板，直^通 道具有一置入端，用以供晶圓層板置入直線通道。底板連 接於架體。磁性件没置於底板並與晶圓層板相對，磁性件 由底板向置入端延伸，且磁性件平行於直線通道的方向具 有一磁性件厚度。緩衝件與底板連接，用以止擋晶圓層板， 緩衝件由底板向置入端延伸’且緩衝件平行於直線通道的 方向具有一緩衝件厚度，緩衝件厚度大於磁性件厚度。 更進一步的說，在本技術態樣其他實施方式中，緩衝 件厚度大於磁性件厚度的範圍可為0.01公釐至〇 5公營。 依據本技術態樣又一實施方式，提出一種晶舟，其包 含一架體、一底板、至少一磁性件及至少一缓衝件。架體 具有一直線通道，架體用以置放多數個晶圓層板，直線通 道具有一置入端，用以供晶圓層板置入直線通道。底板連 接於架體。磁性件設置於底板，且磁性件與晶圓層板相訝， 4 M423913 磁性件沿著平行於直線通道的方向與置入端具有一第一間 距緩衝件與底板連接，用以止擋晶圓層板，緩衝件沿著 平行於直線通道的方向與置入端具有一第二間距，且第二 間距小於第一間距。 更進一步的说，在本技術態樣其他實施方式中，第二 間距小於第一間距的範圍可為θ θΐ公釐至〇 5公釐。 因此，上述諸實施方式利用缓衝件來止擔晶圓層板， 如此一來，不僅可防止磁性件自底板脫落，亦可避免磁性 ^ 件因重覆撞擊而破損的狀況。 【實施方式】 第1圖繪示本技術態樣一實施方式之晶舟的立體圖。 如第1圖所示’晶舟100包含一架體U0、一底板12〇、至 少一磁性件130及至少一緩衝件140。本實施方式藉由設 置緩衝件140來達到防止磁性件130脫落及損壞的效果。 第2圖繪示第1圖之晶舟的分解圖。第3圖繪示第1 # 圖之晶舟的局部放大圖。如第2圖及第3圖所示，架體110 具有一直線通道111，架體110用以置放多數個晶圓層板 112，晶圓層板112由直線通道Π1的一端置入，在此將晶 圓層板112置入直線通道111的那端定義為一置入端113。 另外’本實施方式的架體110為一結構鋼架體。底板120 連接於架體110，且底板120可被磁性物質磁化，進而吸 附晶圓層板112，底板120除了是可被磁性物質磁化的材 料外，本實施方式之底板120本身即為磁性材質，讓磁性 件130可直接吸附於上。在本實施方式中底板12()垂直於 5 M423913 直線通道111，且底板120位於直線通道nl相對於置入端 113的另一端。 第4圖繪示第1圖之晶舟的局部上視圖。如第4圖所 示，磁性件130與直線通道111平行地設置於底板120，且 磁性件130與晶圓層板112相對。其中，磁性件丨3〇設置 於底板120的方式為習知技術，在本實施方式中磁性件130 以黏貼的方式固定在底板120 ’除了黏貼固定外，由於本 實方&方式之底板120本身即具有磁性。如此·—來，可增加 φ磁性吸附的固定力量’使磁性件130能更穩固的設置於底 板120上。 緩衝件140與直線通道平行地連接底板12〇，用以止 擋晶圓層板112，且緩衝件140自底板12〇垂直高出於磁 =件130 ;前述「垂直高出」的比較基準是磁性件13〇及 緩衝件140並排於底板120上的情況，而緩衝件14〇高出 ，性件130的距離即第4圖中的高度H，在本實施方式中 高度H的範圍為〇.〇1公釐至0.5公釐。 _ 換句話說，磁性件130由底板120向直線通道U1的 ^入端113延伸’且磁性件13〇平行於直線通丨lu的方 :、有磁性件厚度Τι。緩衝件140與底板120連接，用 的i日日圓層板Π2，緩衝件140由底板120向通道π! 方入端113延伸，且緩衝件14〇平行於直線通道ui的 τ，°具、2一緩衝件厚度T2,緩衝件厚度了2大於磁性件厚度 (/οΠ衝件厚度丁2與磁性件厚度Tl差值Τ2-Τι的範圍為 ·υΐ公釐至0.5公釐。 再換個方式來說，磁性件13〇沿著平行於直線通道】η 6 M423913 的方向與置入端113具有一第—間距Di。緩衝件14〇與底 板120連接，用以止擋晶圓層板112，緩衝件14〇沿著平 行於直線通道111的方向與置入端113具有一第二間距 D2 ’且第二間距D2小於第—間距Di，而第一間距Di與第 二間距D2差值D2的範圍亦為〇 〇1公釐至〇 5公釐。 另一方面，本實施方式的磁性件13〇呈條狀，且分成 二大段S又置於底板120及緩衝件14〇連接的交界處；分段 δ又置有節省成本的效果，而將磁性件13〇設置於底板12〇 •及緩衝件連接的交界處有容易定位的功效。 值得一提的是，本實施方式中底板12〇的形式可有很 多種選擇，除了第1圖至第4圖中的形式，請參照第5圖， 第5圖繪示本技術態樣另一實施方式之晶舟的立體圖。如 第5圖所示，底板120具有一轉折部pi，而轉折部121 的長度L為7公釐，此轉折部121的功效在於使底板12〇 易於加工，除此之外，本實施方式其餘皆與上述實施方式 大略相同，在此不予贅述。 # 第6圖繪示本技術態樣又一實施方式之晶舟的立體 圖。如第6圖所示，本實施方式具有兩個緩衝件14〇，前 述兩個緩衝件140與底板120形成U型，而磁性件13〇即 置放在U型的凹槽中。如此一來，可加強緩衝件止擋 晶圓層板112的力道，並延長緩衝件140的使用壽命。除 此之外，本實施方式其餘同上述實施方式，在此亦不予瞀 述。 由上述實施方式可知，應用本技術態樣之晶舟藉由緩 衝件140來止擋晶圓層板112，不僅可避免磁性件13〇 7 M423913 底板120脫落，亦可減少磁性件130損壞的情形。 雖然本技術態樣已以諸實施方式揭露如上，然其並非 用以限定本技術態樣，任何熟習此技藝者，在不脫離本技 術態樣之精神和範圍内，當可作各種之更動與潤飾，因此 本技術態樣之保護範圍當視後附之申請專利範圍所界定者 為準。 【圖式簡單說明】 第1圖繪示本技術態樣一實施方式之晶舟的立體圖。 第2圖繪示第1圖之晶舟的分解圖。 第3圖繪示第1圖之晶舟的局部放大圖。 第4圖繪示第1圖之晶舟的局部上視圖。 第5圖繪示本技術態樣另一實施方式之晶舟的立體 圖。 第6圖繪示本技術態樣又一實施方式之晶舟的立體 圖。 【主要元件符號說明】 100 晶舟 110 架體 111 直線通道 112 晶圓層板 113 置入端 120 底板 130 磁性件 M423913 140 :缓衝件 D!:第一間距 D2 :第二間距 Η :高度 L .長度 Α :磁性件厚度 T2 :緩衝件厚度In one aspect, the bottom plate can have a turn and the length of the turn can be 7 mm. In addition, the frame body can be a structural steel frame body. According to another embodiment of the present technical aspect, a wafer boat includes a frame body, a bottom plate, at least one magnetic member and at least one buffer member. The frame has a straight channel, the frame is used for placing a plurality of wafer layers, and the straight-through prop has a placement end for the wafer layer to be placed in a straight channel. The bottom plate is connected to the frame. The magnetic member is not placed on the bottom plate and opposed to the wafer laminate, the magnetic member extends from the bottom plate toward the insertion end, and the magnetic member has a magnetic member thickness parallel to the direction of the linear passage. The buffer member is connected to the bottom plate for stopping the wafer laminate. The buffer member extends from the bottom plate toward the insertion end and the buffer member has a buffer thickness in a direction parallel to the linear passage, and the buffer member has a thickness greater than the thickness of the magnetic member. Furthermore, in other embodiments of the present technology, the thickness of the buffer member may be greater than the thickness of the magnetic member in the range of 0.01 mm to 公 5 metric. According to still another embodiment of the present technology, a wafer boat is provided, which comprises a frame body, a bottom plate, at least one magnetic member and at least one buffer member. The frame has a straight channel, the frame is used for placing a plurality of wafer layers, and the straight-through props have a placement end for the wafer layer to be placed in a straight channel. The bottom plate is connected to the frame. The magnetic member is disposed on the bottom plate, and the magnetic member is in surprise with the wafer laminate. The 4 M423913 magnetic member is connected to the bottom plate along a direction parallel to the linear passage and the insertion end to stop the wafer. The laminate has a second spacing from the insertion end in a direction parallel to the linear passage, and the second spacing is smaller than the first spacing. Furthermore, in other embodiments of the present technical aspect, the second pitch may be less than the first pitch and may range from θ θ ΐ mm to 〇 5 mm. Therefore, in the above embodiments, the buffer layer is used to stop the wafer layer, so that the magnetic member can be prevented from falling off from the bottom plate, and the magnetic member can be prevented from being damaged by repeated impact. [Embodiment] FIG. 1 is a perspective view of a wafer boat according to an embodiment of the present technology. As shown in Fig. 1, the wafer boat 100 includes a body U0, a bottom plate 12, at least one magnetic member 130, and at least one cushion member 140. In the present embodiment, the buffer member 140 is provided to prevent the magnetic member 130 from coming off and being damaged. Fig. 2 is an exploded view of the boat of Fig. 1. Fig. 3 is a partial enlarged view of the boat of the first #图. As shown in FIG. 2 and FIG. 3, the frame body 110 has a linear channel 111 for arranging a plurality of wafer layers 112, and the wafer layer 112 is placed by one end of the linear channel ,1. The end at which the wafer laminate 112 is placed in the linear passage 111 is defined as an insertion end 113. Further, the frame body 110 of the present embodiment is a structural steel frame body. The bottom plate 120 is connected to the frame body 110, and the bottom plate 120 is magnetized by the magnetic substance to adsorb the wafer layer plate 112. The bottom plate 120 is magnetically material except the material that can be magnetized by the magnetic substance. The magnetic member 130 can be directly adsorbed thereon. In the present embodiment, the bottom plate 12 () is perpendicular to the 5 M423913 linear passage 111, and the bottom plate 120 is located at the other end of the linear passage n1 with respect to the insertion end 113. Figure 4 is a partial top plan view of the boat of Figure 1. As shown in Fig. 4, the magnetic member 130 is disposed in parallel with the linear passage 111 on the bottom plate 120, and the magnetic member 130 is opposed to the wafer laminate 112. The magnetic member 130 is disposed on the bottom plate 120 in a conventional manner. In the embodiment, the magnetic member 130 is fixed to the bottom plate 120 ′ in a manner of being adhered, and the bottom plate 120 of the present embodiment is used. It is magnetic in itself. Thus, the fixed force of φ magnetic adsorption can be increased, so that the magnetic member 130 can be more stably disposed on the bottom plate 120. The buffer member 140 is connected to the bottom plate 12A in parallel with the linear passage for stopping the wafer laminate 112, and the buffer member 140 is vertically higher from the bottom plate 12 from the magnetic member 130; the aforementioned "vertical height" comparison is The magnetic member 13A and the buffer member 140 are arranged side by side on the bottom plate 120, and the buffer member 14 is raised. The distance between the member 130 is the height H in FIG. 4. In the present embodiment, the height H is in the range of 〇. 〇1 mm to 0.5 mm. _ In other words, the magnetic member 130 extends from the bottom plate 120 toward the entrance end 113 of the linear passage U1 and the magnetic member 13 is parallel to the straight passage of the 丨lu: the magnetic member has a thickness Τι. The buffer member 140 is connected to the bottom plate 120, and the Japanese yen layer plate 2 is used. The buffer member 140 extends from the bottom plate 120 toward the channel π! square entrance end 113, and the buffer member 14 is parallel to the τ of the linear channel ui, and has 2 A buffer member thickness T2, the thickness of the cushion member is 2 is greater than the thickness of the magnetic member (/ Π Π thickness of the punch 2 and the thickness of the magnetic member Tl Τ 2-Τι range from υΐ mm to 0.5 mm. The magnetic member 13 has a first spacing Di from the insertion end 113 along a direction parallel to the linear channel η 6 M423913. The buffer member 14 is connected to the bottom plate 120 for stopping the wafer laminate 112, the buffer member 14〇 has a second spacing D2′ along the direction parallel to the linear channel 111 and the insertion end 113 and the second spacing D2 is smaller than the first spacing Di, and the range of the difference D2 between the first spacing Di and the second spacing D2 is also The magnetic member 13 of the present embodiment is in the form of a strip, and is divided into two large sections S and placed at the junction of the bottom plate 120 and the buffer member 14〇; The segment δ is also provided with a cost-saving effect, and the magnetic member 13 is disposed on the bottom plate 12 and the buffer member is connected. The junction has an easy positioning function. It is worth mentioning that in the present embodiment, the form of the bottom plate 12〇 can be variously selected, except for the forms in the first to fourth figures, please refer to the fifth figure, the fifth The figure shows a perspective view of a wafer boat according to another embodiment of the present technology. As shown in FIG. 5, the bottom plate 120 has a turning portion pi, and the length L of the turning portion 121 is 7 mm, and the effect of the turning portion 121 The rest of the present embodiment is substantially the same as the above-described embodiment, and is not described here. #FIG. 6 is a perspective view of a boat according to still another embodiment of the present technology. As shown in FIG. 6, the embodiment has two buffering members 14〇, and the two buffering members 140 form a U-shape with the bottom plate 120, and the magnetic members 13 are placed in the U-shaped grooves. In addition, the force of the buffer member to stop the wafer laminate 112 can be enhanced, and the service life of the buffer member 140 can be extended. Otherwise, the rest of the embodiment is the same as the above embodiment, and will not be described herein. The method can be seen that the application of the technical aspect of the boat can be slowed down. The device 140 stops the wafer laminate 112, which not only prevents the magnetic member 13〇7 M423913 from falling off, but also reduces the damage of the magnetic member 130. Although the technical aspect has been disclosed in the above embodiments, it is not In order to limit the technical aspect of the present invention, any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the technical aspect. Therefore, the scope of protection of the technical aspect is to be attached to the application. BRIEF DESCRIPTION OF THE DRAWINGS [Brief Description of the Drawings] Fig. 1 is a perspective view of a wafer boat according to an embodiment of the present technology. Fig. 2 is an exploded view of the boat in Fig. 1. Fig. 3 is a partial enlarged view of the boat of Fig. 1. Figure 4 is a partial top plan view of the boat of Figure 1. Fig. 5 is a perspective view of a wafer boat according to another embodiment of the present technology. Figure 6 is a perspective view of a wafer boat according to still another embodiment of the present technology. [Main component symbol description] 100 Crystal boat 110 frame 111 Linear channel 112 Wafer layer 113 Inserting end 120 Base plate 130 Magnetic member M423913 140: Buffer member D!: First pitch D2: Second pitch Η: Height L Length Α : Magnetic part thickness T2 : cushion thickness