TWM423836U - Probe card for circuit-testing and structure of probe substrate thereof - Google Patents

Abstract

A probe card for circuit-testing and the structure of the probe substrate thereof are disclosed herein to effectively narrow down the pitch of testing points of the probe card for circuit-testing. The probe card for circuit-testing utilizes a probe substrate to respectively electrically connecting with the circuit board and a plurality of probes, wherein the improvement is that the probe substrate comprises: a main body of the substrate having a plurality of upper contact points of a upper surface thereon; and a plurality of wires penetrating through and arranged in the main body of the substrate. Wherein, two ends of each wire are exposed on the upper surface and the lower surface of the main body; the pitch between wires exposed on the upper surface is larger than the pitch between wires exposed on the lower surface; and each wire is respectively electrically connecting with each upper contact point.

Description

The card and its probe substrate structure can effectively provide a reduction in the distance between the circuit and the test point of the probe test card. The probe substrate structure of the present embodiment includes: a substrate body having an upper contact on an upper surface of the substrate body, wherein the main substrate of the substrate has a plurality of upper surfaces of the substrate and the substrate - a plurality of upper openings corresponding to the lower surface and corresponding to the through holes are larger than a plurality of lower openings per-space of the corresponding through holes; and a plurality of wires, which are - conductive and penetrate the through holes and the ends of the wires are different Each of the upper surface of the substrate body and the lower surface of the substrate is exposed to the upper surface by a distance greater than each of the corresponding wires exposed to the lower surface; and each of the wires protrudes from the upper opening and respectively Electrically connected to each upper contact. The probe substrate structure of the present invention further comprises: a substrate body, wherein the plate-shaped body has a hollow interior, wherein the plate-shaped body comprises a plurality of upper contacts and a plurality of upper openings are disposed on the _ The surface and the plurality of lower openings are disposed on the lower surface, and each of the adjacent upper openings is greater than each of the corresponding lower openings; and the plurality of wires are _ electrically conductive wires and are threaded at both ends thereof In the upper opening and the lower opening, wherein the wires are electrically isolated from each other and the wires protrude from the upper opening and are electrically connected to one of the adjacent upper contacts, respectively. The circuit test probe card of another embodiment of the present invention is characterized in that the upper surface of the probe substrate is electrically connected to a circuit board and a plurality of probes respectively, wherein the probe substrate comprises: a substrate body having The plurality of upper contacts are on an upper surface of the substrate body, wherein the substrate main system has a plurality of through holes penetrating the upper surface and the lower surface of the substrate body, and the plurality of upper openings corresponding to the through holes are each larger than the corresponding plurality of through holes Each of the lower openings has a spacing; and the plurality of wires are a conductive wire and are through the through hole and the two ends of the wire are respectively exposed to the upper surface and the lower surface of the substrate body, so that the adjacent wires are exposed to the upper surface Each of the pitches is greater than each of the corresponding wires exposed to the lower surface; and the parent wire is protruded from the upper opening and electrically connected to each of the upper contacts. In the following, the specific embodiments and the accompanying drawings are explained in detail, and it is easier to understand the purpose, technical content, features and functions achieved by the present X0S313S74S-0 [Embodiment]. The detailed description is as follows. The preferred embodiment is only for the purpose of limiting the present invention. Please refer to 11 2 for a reference to the structure of the probe substrate structure. As shown in Fig. 2, in the present embodiment, the probe substrate m includes: a substrate body 1〇 and a plurality of wires 4〇. The wire 4 is disposed through the substrate body ι. Both ends of the wire shame are exposed to the upper surface and the lower surface of the substrate main body 10, respectively. The upper surface of the substrate body ι has a plurality of upper contacts 2 〇, and each of the wires 4 〇 is connected to each of the wires 2 ,, and the wires 40 are exposed to the upper surface __, greater than The wire is like a storm path between the lower surfaces and h. Following the above, in the present embodiment, the wires 4Q are protruded from the substrate to be electrically connected. As shown in Fig. 2, the upper contact 2〇 can be a metal welding table. In the example, the drawing does not show whether the wire 40 protrudes from the substrate body 1 and breaks the miscellaneous money. The surface of the recording plate field 1G is exposed. For example, the Wei mode position is applied to the surface of the wire 4G exposed to the outside. , =:=== In the example, the substrate main _ has a plurality of lower and "" faces and the lower surface form a multi-red opening 32 and a lower pain opening 34. The through holes 3 are for passing through the wires 4, and the pitch of the through holes is larger than the pitch of the openings 34 below the through holes 30. 〃, point ^1ΰ(10) face can be set to a plurality of 4 〇 electrical connections. For example, if the lightning ray is too high, the wire is exposed on the outer surface, as shown in FIG. 3β 杂 丝 成 成 成 于 于 于 于 于 于 于 于 于 于 于 于 于 于 , , , , , , , , , , , , , , Fortunately, the three-dimensional can not bear to map. Wherein, the upper surface of the board body 1 is used to test the circuit in the probe card with the circuit

Aomz 102313974S-0 6 10021S479N01 The board corresponds to the electrical connection, so the position of the upper contact 20 is set to the corresponding board. The upper opening 32 of the substrate body 10 is correspondingly disposed beside the upper contact 2〇. As shown in the figure: It is obvious that the distance between the lower openings 34 is significantly smaller than the distance between the upper openings 32. Referring to FIG. 5 and FIG. 于, in a tenth embodiment, the probe substrate 11A includes a main body system of the slab and a plurality of wires 4'. Wherein, the plate-shaped body ^ has a hollow interior. The plate-like body ΐσ includes a plurality of upper contacts 2〇 and a plurality of upper openings=32 disposed on an upper surface, and a plurality of lower openings 34 are disposed on the lower surface. Continuing with the above description, the two ends of the wire 4 are threaded through the upper opening 32 and the lower opening 34, and the distance between the upper openings 32 is greater than the distance between the lower openings σ 34 . The wires 4Q protrude from the upper opening 32 and are electrically connected to the adjacent upper contacts 2, respectively. In addition, the wires 40 are electrically isolated from each other in the plate-like body. Referring to FIG. 5B in the embodiment, the filling material 5G fills the gap between the hollow interior of the plate-like body (9) and the wire 4〇. In one embodiment, the lower surface of the plate-shaped body further includes a plurality of lower contacts 22 disposed thereon for electrically connecting to the wires 4 . Referring to the above description and Figs. 6A, 6B, 6C and Fig., the body ίο' can be composed of an upper cover 12 and a lower cover 14. As shown in Fig. 6a, in an embodiment, the upper contact 20 and the upper opening σ 32 are disposed on the upper surface of the upper cover 12. In the center, the upper opening 32 extends through the upper cover 12. The lower opening σ 34 is disposed on the lower surface of the lower cover 14 and penetrates the lower cymbal 14. As described above, the distance between the upper openings 32 is greater than the distance between the lower openings. The size of the upper opening 32 and the lower opening % shown in Figure 6 is equivalent to the size of the wire. This creation does not limit the size of the opening, and it is possible to wear a wire and fix it. The two ends of the wire shame are disposed on the upper opening α 32 and the lower opening σ 34. As shown in FIG. 6C, in the present creation, the upper opening 32 ” lower opening 34 is not the same distance, but can be made small by the drilling technique. The lower opening 34 of the spacing. Referring to FIG. 6C and FIG. 6D, after the wire 4 is completed, the excess wire 4 is removed and the wire 40 is electrically connected to the upper contact 2 接着. The filling material M) fills the plate-shaped body 1〇, and the gap between the interior and the wire (9) is hollowed out. In one embodiment, 7 M423836, the lower contact 22 is disposed on the lower surface of the lower cover 14 and electrically connected to the guide (4). In this creation, the material of the substrate may be ceramic materials or related materials applied to the circuit board, such as FR-4, FR_5 or Bp, etc. In addition to the metal material of the conductive effect, the wire material may also be a thief. The anti-line____iauawe impedance ensures the quality of the circuit signal transmission. * The reference is to FIG. 7A and FIG. 7B, which is the intention of the circuit test probe card of the present invention. In this implementation, the circuit test probe card system The surface of the probe substrate ig is respectively connected to the circuit board (10) and the plurality of probes 13 〇 Electrical connection, as shown in Figure 7A.

Continuing to Fig. 7B is a partially enlarged schematic view of the substrate body, which has no wires on the wire to read 1Q, and the wire is turned into the substrate body H). Both ends of the wire 4 are respectively exposed to the lower surface of the upper surface of the substrate body 1 , and the wires 4G are electrically connected to each of the upper contacts 2 (), respectively. The wire is exposed to the upper surface (3) and the wire is exposed to the lower wire. In the implementation of the financial, the lower contact 22 is set in the silk continuous wire 1Q under the wire 4Q button connection. The electric (four) connection ^ as shown in Figure 7A, the electrical connection can be

Following the above description, in the embodiment, as shown in FIG. 3A and FIG. 3A, the substrate body has a plurality of through holes 30 penetrating through the upper surface and the lower surface of the substrate body 1 and the opening 32 of the through hole 30 is larger than The σ% spacing is opened below the through hole 3〇. The ―= species' wire 4G may protrude from the upper opening σ 32 and be electrically connected to the upper contact, as shown in the figure. However, in an embodiment, not shown, the wire 4〇 can be only 32, and the upper contact is directly disposed on the wire 4〇 exposed to the upper opening %^: face, as shown in FIG. 5B, the substrate body It can be a plate-shaped body and has =^. In this creation, the gap between the filler material and the wire 40 can be selectively used. Further, the plate-like body 1 〇 can be composed of: = cover 14, as shown in Fig. 6D. Gongyingu Xingyi Please continue to refer to Figure 7A, detail 7B. In the embodiment, the electric probe card is ^^^〇2lS^79tM01, the curtain 妁53⁄4 ACB02 I0EB1B274S-0 8 M423836 pin substrate no, and the circuit board The new connection method of (10) can be electrically connected to the dummy substrate H)0 by setting the anisotropic conductive film ve fllm ' ACF to the probe substrate ιι. Alternatively, a plurality of solder balls (not shown) are disposed on the upper contacts 2A for electrically connecting to the circuit board 100. In the present creation-embodiment, the substrate body or the plate-like body may be formed by combining an upper cover or a lower cover. By drilling techniques and material selection, openings can be made and provided with a small pitch arrangement. The structure of the probe substrate is designed to provide a solution for reducing the spacing. It is well known that the biliary structure of the biliary can be used as the structure of the probe.

The difference in the spacing of the surface contacts, not the arrangement of the upper and lower surface contacts. The arrangement of the contacts on the upper and lower surfaces depends on the arrangement of the contacts on the board in the circuit probe test card and the arrangement of the multiple probes. According to the previous month, the creation of the probe substrate structure can effectively reduce the pitch (P_ directly from the pitch of the board contacts to a small pitch. For example, the grade can be reduced to the micrometer level. When the structure of the product is not close to the eye, the structure design of the probe plate can be the same as the _ grade change, so that the electric Cong pin test card can measure the test point after the § type narrows the gap. Therefore, the above system is integrated. >_The circuit of Lai_ka and its bribe substrate structure

The circuit test probe card for the small pitch test point can be tested for the job title. The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable a person familiar with the art to understand the scope of the creation and the patent scope that cannot be created according to the fragmentation. Any changes or modifications made by the spirit of the disclosure should still be covered by the scope of this patent. 9 M423836 [Simple Description of the Drawings] Figure 1 is a schematic diagram of a conventional circuit test probe card. FIG. 2 is a schematic diagram of an embodiment of the creation. 3A and 3B are schematic views of an embodiment of the creation. 4A and 4B are schematic views of a substrate body in an embodiment of the present invention. 5A and 5B are schematic views of an embodiment of the creation.

6A, 6B, 6C and 6D are schematic views of an embodiment of the creation. 7A and 7B are views of an embodiment of the present invention. [Main component symbol description]

100 circuit board 102 contact 110 probe substrate 110, probe substrate 112 solder ball 114 inner contact 120 probe holder 130 probe 140 fixing ring 150 reinforcing pad 10 substrate body 10, plate body 10 10021S479?\!01 Pymffi A0302 103313S74S-0 M423836

12 Upper cover 14 Lower cover ^ 20 Upper contact 22 Lower contact 30 Through hole 32 Upper opening 34 Lower opening 40 Conductor 50 Filling material 60 Anisotropic conductive film Η Spacing h Spacing

11 IV021547SK01 ΑΟυ02 10S313374S-0 if April <日观更) Original new patent specification (this description ^ format, order; / Do not change any 1 part of the mark please do not fill out) ※Application number: write) ※Application曰: Classification: Today "夂" First, the new name. Η Chinese / English] (>〇〇ς>〇ί^ circuit test probe card and its probe substrate structure STRUCTURE op

PROBE CARD FOR CIRCUIT-TESTING AND PROBE SUBSTRATE THEREOF II. New Chinese Abstract: - The circuit-based probe card and its (4) substrate structure can effectively provide the narrowing of the probe measurement and the spacing of the card test points. The circuit test probe card is electrically connected to a circuit board and a plurality of probes by using a lower surface of a probe substrate, wherein the probe substrate comprises an i-substrate body and has a plurality of upper contacts on the substrate. An upper surface of the main body; and a plurality of f wires are disposed in the main body of the substrate, and the two ends of the wire are respectively exposed to the upper surface and the lower surface of the substrate #, wherein the distance between the wires exposed to the upper surface is larger than the wire rod The distance between the lower surfaces is exposed; and each of the wires is electrically connected to each of the upper contacts. A probe card for circuit-testing and the structure of the probe substrate thereof are disclosed herein to the service narrow down the pitch of testing points of the probe card for circuit-testing. The probe card for circuitkesting utilizes a Probe substrate to respectively electrically connecting with the circuit board and a plurality of probes, wherein the improvement is that the probe substrate includes: a main body of the iC3313S7«8-〇