M422074 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種電子模組之測試治具，特別是 有關於一種利用一局部隔熱裝置與一溫度調控晶片 來為一待測電子模組提供一測試溫度環境，藉以對電 子模組進行耐溫運作性能測試之治具。 【先前技術】 環顧目前之電子裝置，特別是具有顯示面板模組 之電子裝置，多半具有複雜之電子運算系統，藉以對 複雜之系統軟體與應用軟體進行運算。然而，由於運 算内容越來越複雜，要求完成運算的時限越來越短， 因此，電子裝置的工作負載量也越來越大。 由於電子裝置的工作負載量也越來越大的緣 故’其本身各組_成構件在工作時的溫度也會越來越 高，因而對電子裝置的運算性能造成了不少負面性的 影響。為了確認電子裝置在高溫狀態下運作時，仍能 發揮一定水準的運作性能。不論是製造商或使用者， 多半會對電子裝置之模組（組件）、半成品或成品在 較為嚴苛的條件（特別是較為環境溫度較高或運算頻 率較高）下進行運作性能測試，藉以判斷該電子裝置 是否具備足夠的運作穩定性，此即為一般常見的燒機 測試（Burn-In Test)。 此外，為了因應特定之低溫運作環境下的使用需 求（譬如在高緯度地區冬季時的低溫運作環境；或者 在高海拔高度地區、高空或太空中的低溫運作環 境。），通常還會要求電子裝置在低溫環境下，仍然 能夠穩定地運作。因此，針對特定電子裝置之模組（組 件）、半成品，、” 性能的測試D I常也會對其在低溫狀態下進行運作 在以上前接 子镇代表性的習知技術中，在 電子楔紐。然後，將1 —與待測電子模組搭配 '電：以反上’使待測電ί 2 Γ Π模㈣答接於預定 接而組成電子穿置 '、、且與搭配電子模組彼此 接著，备料 乂 預定功能電路。 盥拄、目丨+ g將預定功能電跟妃r a 〃、待測電子模組全部都 板（包含搭配電子模組） '座控制裝置之測試腔^ 1 —個容積龐大的恆溫怪 由壓縮機、膨)冷=利用恆溫恒澄控制裝置中 組成:::::_統^== 能輕易理解，由中^通常知識者應該都 有較大的容積，才完，必須使測試腔室具 含搭配電子模組)與待測i;模：疋=電，板(包 溫怪卿展置來調控測試腔= 二士在利用惶 須耗費極高的電力，而且還減費較長必 腔室内之輯持穩定。由以上敛=日=測試 知技術對待測電子模組進行測試時，f遍會;^用^ 成本昂貴的嚴重問題。 胃&成測试 【新型内容】 本創作所欲解決之技術問題與目的： 由於在習知技術中，普遍會存在測試成本尸主 嚴重問題；緣此，本創作之彡要目的在於提供二^新 搭配電子模組)的測試溫度:竟，(; 試時所需之電力與時間。 兄轉以減少測 本創作解決問題之技術手段： 段係f:〜習，技術之問題所採用之技術手 係用以測;，治具，其 上力述之電子模組之耐溫 产:調〔一電路板、-局部隔熱裝置與-溫 n ΐί功能電路板包含—待測模組設置區、-烬配 搭配電子模組。待測楔組設= 於待；ίί:ίί，。搭配模組設置區係電性連接 於=則杈，.且叹置區。搭配電子模組係設置於 =以電性連接於待測電子模組而‘預定 局部：熱裝置可包含一隔熱底板與至少一隔埶 ί:之二?繼預定功能電路板與待瞻 S室2以:ΐ體係蓋合於隔熱底板而圍構出隔熱 工 猎將待/則電子模組熱隔絕於搭配電子模組。 溫度調控晶片係鄰接設置於隔熱腔室 隔f腔；内之溫度調控為-測試溫度，藉4:置: 測電子模組提供上述之測試溫度環 ^ ’皿又凋控晶片係為一致熱晶片、一致冷晶 人二一致熱兼致冷晶片’並可嵌設於隔熱罩體上。在 預疋功能電路運作—預定功能後，待測電子模組係供 藉以測試待測電子 ，性連接於—運作性能測試裝置，藉 模組於測試溫度環境之運作性能。、曰M422074 V. New Description: [New Technology Field] This is a test fixture for an electronic module, especially for a part of the electronic module to be tested using a partial thermal insulation device and a temperature control chip. A test temperature environment is provided for the temperature test of the electronic module. [Prior Art] Looking around the current electronic devices, especially electronic devices with display panel modules, most of them have complex electronic computing systems for computing complex system software and application software. However, as the operational content becomes more and more complex, the time limit for completing the calculation is becoming shorter and shorter, and therefore, the workload of the electronic device is also increasing. Due to the increasing workload of electronic devices, the temperature of each group of components is higher and higher during operation, which has a lot of negative effects on the computing performance of electronic devices. In order to confirm that the electronic device operates at a high temperature, it can still perform a certain level of operational performance. Whether it is a manufacturer or a user, most of the modules (components), semi-finished products or finished products of electronic devices are tested for operational performance under more severe conditions (especially higher ambient temperature or higher operating frequency). It is judged whether the electronic device has sufficient operational stability, which is a commonly-used Burn-In Test. In addition, in order to meet the needs of use in a specific low temperature operating environment (such as low temperature operating environment in winter at high latitudes; or low temperature operating environment in high altitude areas, high altitude or space), electronic devices are usually required. It can still operate stably in low temperature environments. Therefore, the module (component), semi-finished product, and performance test for a specific electronic device often also operate in a low temperature state in the prior art of the former town, in the electronic wedge Then, 1 - with the electronic module to be tested, 'electricity: to reverse the 'to make the test ί 2 Π Π die (4) 答 connect to the predetermined connection to form the electronic through ', and with the electronic module with each other Then, prepare the function circuit. 盥拄, 丨+ g will be the predetermined function electric 妃ra 〃, all the electronic modules to be tested (including the electronic module) The huge volume of the constant temperature monster is compressed by the compressor, and the cold is controlled by the constant temperature control device:::::_^^== It can be easily understood, and the general knowledge should have a large volume. After that, the test chamber must be equipped with a matching electronic module) and the test to be tested; the mode: 疋 = electricity, board (including the temperature of the strange singularity to control the test cavity = the use of electricity is extremely expensive, Moreover, the fee reduction will be stable within a long period of time. When testing the electronic module for testing, it will be a serious problem. ^Use the costly and serious problem. Stomach & test [new content] The technical problems and objectives to be solved by this creative: Because in the prior art Generally, there will be serious problems with the cost of testing the corpse; therefore, the purpose of this creation is to provide the test temperature of the new electronic module): actually, (; the power and time required for the test. The technical means to reduce the problem of the original creation of the problem: the section f: ~ Xi, the technical problem is used to test the technical hand; the fixture, the electronic module of the above-mentioned force is resistant to temperature production: The circuit board, the local thermal insulation device and the -temperature n ΐί function circuit board include - the module setting area to be tested, the - 烬 matching electronic module. The wedge to be tested = 待; ίί: ίί,. The setting area is electrically connected to the = 杈, and the sigh area. The electronic module is set to be electrically connected to the electronic module to be tested and the predetermined part: the thermal device may include a heat insulating bottom plate and at least A gap 埶: the second? Following the scheduled function board and the waiting room S 2 to: ΐ The cover is sealed on the heat insulation bottom plate and the heat insulation work is to be sealed and the electronic module is thermally insulated from the electronic module. The temperature control chip is adjacent to the heat insulation chamber, and the temperature regulation is - Test temperature, by 4: Placement: The test electronics module provides the above test temperature loop, and the control chip is a uniform thermal wafer, a uniform cold crystal, a uniform heat and a cold wafer, and can be embedded in On the heat shield body. After the pre-function function circuit operates - the predetermined function, the electronic module to be tested is used to test the electronic device to be tested, and is connected to the operational performance test device, and the module is used to test the operating performance of the temperature environment.曰
隔熱罩體更具有一隔板，藉以將 隔熱底板可由一隔熱泡 少—穿孔，以供待測電 藉以將隔熱腔室分隔為 能電路板。此 一溫度調節腔室與一The heat shield body further has a partition to allow the heat insulating floor to be vented by a heat-insulating hole for the electrical power to be tested to separate the insulated chamber into a circuit board. This temperature regulating chamber and one
熱腔至内，藉以感應隔熱腔室内之溫度而產生—溫产 ，應信號。控制單元可電性連接於溫度感應器與溫^ 凋控晶片，藉以依據溫度感應信號來調控上述之測試 Μ度丨導流風扇可設置於隔熱腔室内，藉以產生一溫 度调節氣流，使隔熱腔室内之溫度均勻地被維持在上 述之測试溫度。外接散熱模組包含一散熱基座、複數 個散熱鰭片與一散熱風扇，其中，散熱基座可熱連会士 於隔熱罩體；散熱鰭片可自散熱基座突伸出；散熱^ 扇可鄰接於散熱鰭片，藉以輔助調控隔熱腔室内之、、w 度。 狐 較佳者，上述之待測電子模組可為一隨機存取記 憶體（Random Access Memory ; RAM)模組，且上 述之預定功能電路板可為一電子裝置主機板。 本創作對照先前技術之功效： 相較於在習知技術中，係將預定功能電路板（包 M422074 ii a i I^ ^ ^ it - ^ s 於在本創作中，係 if之測5式腔室進行測試，由 調控晶片，為待測条：彳：局部隔熱裝置與-溫度 不僅可以有效二之測試溫度環境；因此， 較短的時間内使m而耗費之電力，更可在 態。 n里度核境内之溫度達到穩定狀 之耐溫運由本創作所提供之電子模組 模組進fri5式治具，可以有效降低_^^^ 、'、—^耐溫運作性能測試所需之測試成本。 例及=權=實施例’將藉由以下之實施 【實施方式】 們所提供之電子模組之财溫運作性能 1斌>α具，可廣泛運用於對多種電子模組進行上述之 =運作性能測試，其組合實施方式更是不勝枚舉， f在此不再一一贅述，僅列舉其中一個較佳實施例來 加以具體說明。 —請參閱第一圖至第四圖，第一圖係顯示本創作較 佳實施例所提供之電子模組之耐溫運作性能測試治 具主要結構分解圖；第二圖係顯示將隔熱底板覆蓋於 一=定功能電路板，並使待測電子模組穿過隔熱底板 之芽孔之結構示意圖；第三圖係顯示將隔熱罩體蓋合 於隔熱底板之示意圖；以及第四圖係顯示沿第三圖 A-A視角之剖面圖。 如第一圖至第四圖所示，一電子模级之耐溫運作 M422074 彳試治具】00 (以下簡稱「測試治具1〇0」）係用 拉二5式至少一待測電子模組（在第一圖尹只針對—個 处’彳電子模組200 )在一測試溫度環境之一運作性 Ξ熱=具」00包含一預定功能電路板1、-局部 广:f置2、—溫度調控晶片3、至少一溫度感應器 5、在弟丨四圖繪製一個溫度感應器4)、一控制單元 、至少一導流風扇（在第四圖中僅繪製一個導流風 +與至少—外接散熱模組（在第四圖中僅標示— 個外接散熱模組7)。 μ» t員定功能電路板】包含一待測模組設置區Π、一 個ΐ區12、至少一搭配電子模 '组13以及兩 待剛f ΐ4與15。待測模組設置區11係供搭接 能電路搭配模組設置區12係藉由預定功 於待測2” m連f電路(圖未示）而電性連接 模組13係設置於搭 而組点一 ί 電性連接於待測電子模組2〇〇 15係— 功能電路（圖未示）。電路板風扇14與 能-XL?於搭配模組設置區12,藉以在預定功 月匕包路運作時，提供必要的散熱功能。 置主者’上述之預定功能電路板1可為一電子裝The heat chamber is inside, and the temperature is generated by sensing the temperature inside the insulated chamber. The control unit can be electrically connected to the temperature sensor and the temperature control chip, so as to adjust the test temperature according to the temperature sensing signal, and the diversion fan can be disposed in the heat insulation chamber to generate a temperature regulation airflow. The temperature inside the insulated chamber is uniformly maintained at the above test temperature. The external heat dissipation module comprises a heat dissipation base, a plurality of heat dissipation fins and a heat dissipation fan, wherein the heat dissipation base can be connected to the heat insulation cover body; the heat dissipation fin can protrude from the heat dissipation base; The fan can be adjacent to the heat dissipating fin to assist in regulating the degree of w in the insulating chamber. Preferably, the electronic module to be tested may be a random access memory (RAM) module, and the predetermined functional circuit board may be an electronic device motherboard. This creation compares the efficacy of the prior art: compared to the prior art, the predetermined functional circuit board (package M422074 ii ai I^ ^ ^ - - s in the present creation, is the 5th chamber of the if) The test is carried out by the regulating chip, which is the strip to be tested: 局部: The local thermal insulation device and the temperature can not only effectively test the temperature environment; therefore, the electricity consumed by the m in a shorter period of time is more in a state. The temperature inside the Ridu nuclear core reaches a stable temperature. The electronic module module provided by the creation of the fri5 type jig can effectively reduce the test required for the _^^^, ', -^ temperature operation test. Cost and example = the right embodiment will be implemented by the following [Embodiment] The economical operation performance of the electronic module provided by the company is widely used in various electronic modules. The operational performance test, the combined implementation of the implementation is even more numerous, f will not be repeated here, only one of the preferred embodiments will be specifically described. - Please refer to the first to fourth figures, A picture shows a preferred embodiment of the present creation The main structure exploded view of the temperature-resistant operation test fixture of the electronic module; the second figure shows that the heat-insulating base plate is covered on a fixed-function circuit board, and the electronic module to be tested passes through the bud of the heat-insulating base plate Schematic diagram of the structure of the hole; the third figure shows a schematic view of the heat shield body covering the heat insulation floor; and the fourth figure shows a sectional view along the AA angle of the third figure. As shown in the first to fourth figures , an electronic mold-level temperature-resistant operation M422074 彳 test fixture 00 (hereinafter referred to as "test fixture 1 〇 0") is the use of pull two 5 type at least one electronic module to be tested (in the first picture Yin only for -彳 彳 彳 彳 ) ) ) 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 5, drawing a temperature sensor 4), a control unit, and at least one flow guiding fan in the fourth drawing of the younger brother (in the fourth figure, only one guiding wind + and at least - an external heat sink module is drawn (in the fourth figure) Only the external thermal module 7) is indicated. μ» t定定功能电路板]包A module to be tested is set in the area, a buffer area 12, at least one matching electronic module 'group 13 and two waiting groups f ΐ 4 and 15. The module setting area 11 to be tested is used for the lapping circuit with the module setting area 12 By means of a predetermined 2" m-connected circuit (not shown), the electrical connection module 13 is disposed on the set and electrically connected to the electronic module 2〇〇15 of the electronic module to be tested. The function circuit (not shown), the circuit board fan 14 and the energy-XL are matched with the module setting area 12, so as to provide the necessary heat dissipation function when the predetermined power circuit is operated. The circuit board 1 can be an electronic device
型電腦、平板電腦、桌USComputer, tablet, table US
Aslfa：； ^ (-rs〇nal Digltal 板。上述之待測電子模組;00 j之主2 (Random Access Mem〇rv . 、蚧械存取記憶體 進行耐溫運作Μ)模組或其他需要 為搭配於以搭配電子模組13 電子模組組成預定功能電路之 料運算電路、電力八配雨^ I為貝料存取電路、資 %力刀配^或具有其他預定功能之電 譬如：當上述之預定功能電路板1為一桌上型電 腦主機板時，且待測電子核組200為·一 RAM模組時， 上述之預定功能電路可為一資料存取電路；上述之預 定功能可為資料存取功能；且上述之搭配電子模組13 係指與RAM模組搭配，藉以組成可執行資料存取功 能之其餘必要的電子模組。 上述之局部隔熱裝置2可包含一隔熱底板21與 至少一隔熱罩體（在本實施例中，有兩個隔熱罩體， 第一圖中只標示其中一個隔熱罩體22 )。隔熱底板21 可設置於預定功能電路板1與待測電子模組200之 間，並且可由一隔熱泡棉材料所組成。同時，隔熱底 板21尚可開設至少一穿孔，在第一實施例中係開設 四個穿孔211、212、213與214。其中，穿孔211係 供待測電子模組200穿過隔熱底板21而插接於預定 功能電路板1;穿孔212係供電路板風扇14穿過隔熱 底板21而連接預定功能電路板1 ;穿孔213與214 之用途係分別與穿孔211以及212相似，以下不再予 以贅述。 隔熱罩體22可蓋合於隔熱底板21而圍構出一隔 熱腔室TIC，藉以將待測電子模組200熱隔絕於搭配 電子模組13。此外，隔熱罩體22更具有一隔板221， 藉以將隔熱腔室TIC分隔為一溫度調節腔室AC與一 運作環境腔室OC，且溫度調節腔室AC與運作環境 腔室OC係彼此連通。在溫度調節腔室AC中，係在 隔熱罩體22開設一開孔（未標號），以供溫度調控晶 片3嵌合，藉以使溫度調控晶片3鄰接設置於隔熱腔 室TIC之溫度調節腔室AC。運作環境腔室OC則可 供容置待測電子模組200。在本實施例中，上述之溫 欵熱晶片 度調控晶片3可為 兼致冷晶片。 致冷晶片或一致熱 '温度感應器4可設罟认 腔室A C (如第四圖所干复f隔熱腔室T1C之溫度調節 之運作環境腔室可設置於隔熱腔室TIC 度調節腔f AC與運作^ 用上，亦可同時在溫 器。控制單元5可為一腔室0C都設置溫度感應 度控制電路板，並可電^於隔熱罩體22外壁之溫 度感應器4與導流風屬：連巧溫度調控晶片3、溫 腔室TIC之溫度調節腔室=風扇6可設置於隔熱 外接散熱模組7包含w 鯖片72與-散熱風扇 結於隔熱罩體22 ;散熱鈐:政”、、基座71可熱連 出；熱風扇73可鄰接：散：自散 接於控制單元5。 —、0片72 ’亚可笔性連 ，行測♦ ’必須先將隔熱腔室TIC之溫度調 控為上述之測試溫度。此眭π #丄 ·"^皿没# 應隔熱腔室™内之溫度;^ 4感 後將溫度感應信號傳送至】^度控 =元號二 L—傳送至: ‘此時、’溫度調控晶片3可利驗據溫度感應信號 '生之溫度控制信號來將隔熱腔室TIC之溫产調 控為^述之測試溫度，藉以對上述之待測電子&= 2〇〇提供上述之測試溫度環境。同時，導流風扇6可 依據風扇控制信號開始運作，藉以產生—溫度 流AF，使隔熱腔室TIC内之溫度均勻地被維 = 述之測試溫度。此外，外接散熱模組7之散熱風 =日党到控制單元5的控制而配合運作，藉以 巧熱腔室内之溫度。值得強調的是，上述之^调 度係依據測試標準或產品性能規格而定， 一4〇它至85t。 、电可為 σ 在完成測試溫度的調控後，可依據測試榡造 ，性能規格，使預定功能電路運作一預定功能，或產 ，持一預設時間。在完成運作之後，可將待測命 、、且電性連接於一運作性能測試裝置，藉以測試^二 t模組於_溫度環境之運作性能。譬如，可^ U 模組和電子裝置主機板所組成之資料存取電路 運作8小時的資料存取功能，在此期間RAM曰二 終處於上述之測試溫度環境中。在完成運作之德、、、^ 將RAM模組取出，電性連接於一運作性能測梦: (如RAM模組之資料讀取器或資料比對器），^ 輸入RAM模組之資料、RAM模組所儲存之資二 RAM所匯出之資料之間的資料吻合度比對， RAM模組在測試溫度環境之運作性能（即 = 性能）。 皿逻讣 士相仏舉凡在所屬技術領域中具有通常知識者，在 閱讀以上·紅技術後，應卿能理解，相較於在 支:f巾’⑽預定功能電路板（包含搭配子 餘全部㈣進—個容魏大的恆显 =空制裝置之測試腔室進行測試，由於在本創作 3為Hi ^局部隔ΐ裝置2與一溫度調控晶片 且容積較小之測試溫度環 ί短㈣内使測試溫度環境内之溫度達到穩定ί M422074 11 待測模組設置區 12 搭配模組設置區 13 搭配電子模組 14、15 電路板風扇 2 局部隔熱裝置 21 隔熱底板 211 、 212 、.213 、 214 穿孔 22 隔熱罩體 221 隔板 3 溫度調控晶片 4 溫度感應益 5 控制單元 6 導流風扇 7 外接散熱模組 71 散熱基座. 72 散熱鰭片 73 散熱風扇 TIC 隔熱腔室 AC 溫度調節腔室 OC 運作環境腔室 AF 溫度調節氣流 13Aslfa:; ^ (-rs〇nal Digltal board. The above-mentioned electronic module to be tested; 00 j main 2 (Random Access Mem〇rv., mechanical access memory for temperature operation) module or other needs In order to match the electronic circuit module with the electronic module 13 to form a predetermined function circuit material computing circuit, power eight with rain ^ I for the shell material access circuit, capital% force knife with ^ or other predetermined functions such as: When the predetermined function circuit board 1 is a desktop computer motherboard, and the electronic core group 200 to be tested is a RAM module, the predetermined function circuit may be a data access circuit; the predetermined function may be For the data access function; and the above-mentioned electronic module 13 is used in conjunction with the RAM module to form the remaining necessary electronic modules for performing the data access function. The partial thermal insulation device 2 may include an insulation. The bottom plate 21 and the at least one heat insulating cover body (in the present embodiment, there are two heat insulating cover bodies, only one of the heat insulating cover bodies 22 is indicated in the first figure). The heat insulating bottom plate 21 can be disposed on the predetermined functional circuit board. 1 between the electronic module 200 to be tested, and An insulating foam material is formed. At the same time, the insulating bottom plate 21 can be provided with at least one perforation. In the first embodiment, four perforations 211, 212, 213 and 214 are formed. The perforation 211 is for the electronic device to be tested. The module 200 is inserted into the predetermined functional circuit board 1 through the heat insulation substrate 21; the through hole 212 is connected to the circuit board fan 14 through the heat insulation substrate 21 to connect the predetermined function circuit board 1; the use of the holes 213 and 214 are respectively The perforations 211 and 212 are similar, and will not be described below. The heat shield body 22 can be covered by the heat insulating bottom plate 21 to form a heat insulating chamber TIC, thereby thermally isolating the electronic module 200 to be tested from the electronic mold. In addition, the heat shield body 22 further has a partition plate 221 for separating the heat insulating chamber TIC into a temperature regulating chamber AC and a working environment chamber OC, and the temperature regulating chamber AC and the operating environment chamber The chambers OC are connected to each other. In the temperature adjustment chamber AC, an opening (not labeled) is formed in the heat shield body 22 for the temperature regulating wafer 3 to be fitted, so that the temperature regulating wafer 3 is adjacently disposed in the heat insulation. Temperature adjustment chamber AC of chamber TIC. Operating environment chamber OC The electronic module 200 to be tested can be accommodated. In the embodiment, the temperature-heating wafer control wafer 3 can be a cold wafer. The cooling wafer or the uniform heat sensor 40 can be configured as a chamber. AC (As shown in the fourth figure, the operating environment chamber of the temperature-regulating chamber T1C can be set in the thermal chamber TIC adjustment chamber f AC and operation, or at the same time. The unit 5 can be provided with a temperature sensing control circuit board for a chamber 0C, and can be electrically connected to the temperature sensor 4 and the guiding wind of the outer wall of the heat insulating cover 22: the temperature control wafer 3 and the temperature chamber TIC The temperature regulating chamber=the fan 6 can be disposed on the heat-insulating external heat-dissipating module 7 including the w-shaped blade 72 and the heat-dissipating fan attached to the heat-insulating cover 22; the heat-dissipating heat-dissipating body; and the base 71 can be thermally connected; The heat fan 73 can be adjacent to: the air: self-scattering to the control unit 5. —, 0 piece 72 ‘ 亚可笔性连,行测♦ ’ The temperature of the insulated chamber TIC must first be adjusted to the above test temperature. This 眭π #丄·"^皿不# should be in the temperature of the insulated chamber TM; ^ 4 sense the temperature sensing signal is transmitted to the ^^ degree control = yuan number two L - transmitted to: 'this time,' The temperature control chip 3 can test the temperature control signal of the temperature sensing signal to adjust the temperature of the thermal insulation chamber TIC to the test temperature, thereby providing the above-mentioned electronic device to be tested & Test the temperature environment. At the same time, the diversion fan 6 can be operated according to the fan control signal, thereby generating a temperature flow AF, so that the temperature in the insulated chamber TIC is uniformly measured by the test temperature. In addition, the heat dissipation of the external heat dissipation module 7 is controlled by the control of the party to the control unit 5, whereby the temperature in the hot chamber is used. It is worth emphasizing that the above-mentioned adjustment is based on the test standard or product performance specifications, from 4 to 85t. The electric energy can be σ. After the control temperature is adjusted, the predetermined function circuit can be operated according to the test manufacturing and performance specifications, and the predetermined function can be operated for a predetermined time. After the operation is completed, the life to be tested can be connected to an operational performance test device to test the operation performance of the system. For example, the data access circuit composed of the U module and the electronic device motherboard can operate for 8 hours of data access, during which the RAM is finally in the above test temperature environment. After completing the operation, the RAM module is taken out and electrically connected to a performance test dream: (such as a RAM module data reader or data comparator), ^ input RAM module data, The data between the data sent by the RAM module stored in the RAM module is compared with the data, and the performance of the RAM module in the test temperature environment (ie, performance).讣 讣 讣 仏 凡 凡 凡 凡 凡 凡 凡 凡 凡 凡 凡 凡 凡 凡 凡 凡 凡 凡 凡 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读 阅读(4) Into the test chamber of Rong Weida's Hengxian = air-based device, because in this creation 3 is the Hi ^ partial isolation device 2 and a temperature-controlled wafer and the smaller test temperature loop is shorter (4) Internally, the temperature in the test temperature environment is stabilized. ί M422074 11 Module setting area to be tested 12 with module setting area 13 with electronic module 14, 15 circuit board fan 2 partial heat insulation device 21 insulation board 211, 212,. 213, 214 perforation 22 heat shield 221 partition 3 temperature control wafer 4 temperature sensing benefit 5 control unit 6 diversion fan 7 external cooling module 71 cooling base. 72 heat sink fins 73 cooling fan TIC insulation chamber AC Temperature Regulating Chamber OC Operating Environment Chamber AF Temperature Regulating Airflow 13