五 新型說明： 【新型所屬之技術領域】 本創作係有關於—種封裝結構。 【先前技術】 -框:封巧構在進行卿作業時，會在基板上先設ί W㈣亚1^著雜架將封㈣材圍堵於框架内，以避免 料㈣縣。目—結構已改制如陶篆基 =更餘硬的线基板作為晶片的賴，無機基板通常 反大且其表面為光滑φ，當無機基板上結*有絕緣框 二則、.、&、’彖框木谷易脫落，如此一來’即無法透過點膠 式將封裝膠材點佈於無機基板上，而僅能透過嗔塗的方 又容易產生尺寸不精確及厚度 $封裝科料於無縣板上㈣顏縣賴。惟， 貝塗方式形成的封裝曝體 不一致的問題。 、，彖疋本創作人有感上述問題之可改善，乃潛心研究 ^己。子理之運用’而提出—種設計合理且有效 問題之本創作。 < 【新型内容】 本_實_提供—_裝結構，其無板與絕緣 框术之間具有較強的接著力，絕緣框架不會脫落。 本創作實施例提供-種封I结構，包括：一平板狀的 …、機基板’該無機基板具有—承载平面，該承载平面上形 3/8 M417650 成一咬合接著部；以及一絕緣框架，其 形成於έ亥承載平面的咬合接著部今p ，八以射出成型的方式 該絕緣框架具有一圍繞 壁及由5亥圍繞壁界定而成的容置空間 本創作實施例具有以下有益致果：Five new description: [New technology field] This creation department has a kind of package structure. [Prior Art] - Box: When the seal is in the work of Qing, it will be set on the substrate first. W W (4) Sub-1^ The miscellaneous frame will enclose the seal (four) material in the frame to avoid the material (4) counties. The structure of the mesh has been modified, such as the ceramic base = the harder wire substrate is used as the wafer. The inorganic substrate is usually large and its surface is smooth φ. When the inorganic substrate is bonded, there are two insulating frames, ..., & 'The framed wood grain is easy to fall off, so that the package glue can not be dispensed on the inorganic substrate through the dispensing method, and the size can be inaccurate and the thickness can be easily produced only by the smear coating. On the board (four) Yan County Lai. However, the problem of inconsistent package exposure formed by the bead coating method. The creators of Sakamoto feel that the above problems can be improved, but they are concentrating on research. The use of sub-theory is proposed to create a reasonable and effective problem. < [New content] This _ real _ provides - _ assembly structure, there is no strong adhesion between the plate and the insulation frame, the insulation frame will not fall off. The present invention provides an I-structure, comprising: a flat plate, a machine substrate, the inorganic substrate has a bearing plane, the bearing plane has a shape of 3/8 M417650 into a nip joint, and an insulating frame. The occlusal portion formed on the bearing plane of the έhai is in the form of injection molding. The insulating frame has a surrounding space and an accommodating space defined by the surrounding wall. The present embodiment has the following beneficial effects:
供參考與說明用， ’並非用來對本創作加以限制者。 【實施方式】 〔弟一貫施例〕 。月參閱圖1及圖2所示，本實施例提供一種封裝結構 包括 平板狀的無機基板10及一絕緣框架20。其中該 無機基，10可為陶曼基板(例如：氮化銘基板}或石夕基板，鲁 但不限^。此外，該無機基板1〇具有一承載平面η，且在 該承載平面11上形成一咬合接著部12。在本實施例中，該 · 咬合接著_ 12是凹陷形成於該承載平面]丨的多個溝槽， 其間隔地分佈在該承載平面u的適當位置。 絕緣框架2 0是利用射出成型的方式形成於該承载平面 11的咬合接著部12，該絕緣框架2〇具有一圍繞壁21及至少 一容置空間22，容置空間是由該圍繞壁21界定而成，其 數量未有限定，圖式中是以兩個為例說明，當然，容置空 4/8 M417650 間22也可僅設置有—個； 封裝結構。 上场成本創作之For reference and explanation, ' is not intended to limit the creation of this creation. [Embodiment] [The brother has always applied examples]. Referring to FIG. 1 and FIG. 2, the present embodiment provides a package structure including a flat inorganic substrate 10 and an insulating frame 20. The inorganic substrate 10 may be a Tauman substrate (for example, a nitride substrate) or a stone substrate, but is not limited to. Further, the inorganic substrate 1 has a bearing plane η and is on the bearing plane 11 A nip joint 12 is formed. In the present embodiment, the occlusion _ 12 is a plurality of grooves formed in the bearing plane 丨, which are spaced apart at appropriate positions of the bearing plane u. 0 is a nip joint 12 formed on the bearing plane 11 by means of injection molding. The insulating frame 2 〇 has a surrounding wall 21 and at least one accommodating space 22 defined by the surrounding wall 21 . The number is not limited. The figure is illustrated by two examples. Of course, the space 4/8 M417650 22 can be set only with one; package structure.
請配合參閱圖3所千，士 A 30、兩導線40及-封裝膜創作封裝結構還包括-晶片 置於該無機基板H)的；X:，晶片3〇及兩導線40皆設 22内。該晶片30經㈣1卜且收容於該容置空間 二田。亥兩導線4〇而雪性璀拯 板】0。該封裝膠體5G是利用點踢將無機基 該容置空間22内而形成，且該封裝频5;=特點佈於 30及該兩導線40。 _ 匕设住該晶片 舉例來說’晶片3〇為一级， 含有螢光粉的螢光膠材1^二極體晶片，封裝膠材為 十丄，厂 ^而对裝膠體50則為螢光胰触, 此-來，本創作所製得的封裝結構 /肢’如 結構。 ”’、毛光一廢體封裝 據此，在以點膠方式點佈封 絕緣框架2〇的圍繞壁21圍堵，並二在容置;=到 故封裝膠料會產生料的縣 = ，且無機細的承載平面]〗形成 ^象木歡_咬合接著力量，使得絕緣框架20不會脫 〔弟二貫施例〕 請參閱圖4及圖5所示，為本創作封裝結構之第 施例，其中相同之科仍與第—實施例採用相同的標號表 示，該第二實施例與第—實施例之差異處在於： 5/8 M417650 該咬合接著部12’是以電鍍方式形成於該承載平面11 的金屬層，或是以喷砂方式形成於該承載平面11的喷砂層 。藉此，在承載平面〗]形成非平坦的接著區域，以增強無 機基板10與絕緣框架20之間的咬合接著力量，可達成與 第一實施例相同的功效。 由上述可知，本創作實施例在無機基板上結合有絕緣 框架，使得封裝膠材受圍繞壁的圍堵，而被限位於容置空 間内，避免造成封裝膠材溢流現象，而且無機基板與絕緣 框架之間具有較強的接著力，令絕緣框架不會自無機基板 脫落。 惟以上所述僅為本創作之實施例，其並非用以侷限本 創作之專利範圍。 【圖式簡單說明】 圖1是本創作之第一實施例之無機基板的立體示意圖。 圖2是本創作之第一實施例的立體示意圖（一）。 圖3是本創作之第一實施例的立體示意圖（二）。 圖4是本創作之第二實施例的立體示意圖（一）。 圖5是本創作之第二實施例的立體示意圖（二）。 6/8 M417650 【主要元件符號說明】 10無機基板 II承載平面 ]2咬合接著部 12’咬合接著部 20絕緣框架 2]圍繞壁 22容置空間 30晶片 40導線 50封裝膠體Please refer to FIG. 3, the A 30, the two wires 40 and the package film creation package structure further include a wafer placed on the inorganic substrate H); X: the wafer 3 and the two wires 40 are disposed in the same. The wafer 30 is accommodated in the accommodating space Er Tian via (4) 1 . The two wires of the sea are 4 inches and the snow is sturdy. The encapsulant 5G is formed by inserting an inorganic base into the accommodating space 22 by a kick, and the package frequency is 5; the feature is distributed on the 30 and the two wires 40. _ 匕 Set the wafer as an example, 'The wafer 3 is a grade 1 Light pancreas touch, this - come, the package structure / limb 'made as the structure made by this creation. "', the hair light a waste body package according to this, in the dispensing method to seal the surrounding frame 21 of the insulating frame 2 围, and the second is in the accommodating; = to the package material will produce the material of the county =, and The inorganic fine bearing plane] is formed into the same example as the creation of the package structure. The structure of the encapsulation structure is shown in Figure 4 and Figure 5. Wherein the same subject is still denoted by the same reference numeral as the first embodiment, and the difference between the second embodiment and the first embodiment is: 5/8 M417650 The occlusal portion 12' is formed by electroplating on the carrier a metal layer of the plane 11 or a sandblasting layer formed by sandblasting on the bearing plane 11. Thereby, a non-flat following region is formed on the bearing plane to enhance the between the inorganic substrate 10 and the insulating frame 20. The occlusion and the force can achieve the same effect as the first embodiment. As can be seen from the above, the present embodiment combines an insulating frame on the inorganic substrate, so that the encapsulant is surrounded by the surrounding wall and is confined to the accommodating space. Inside, avoid causing encapsulation Overflow phenomenon, and strong adhesion between the inorganic substrate and the insulating frame, so that the insulating frame does not fall off from the inorganic substrate. However, the above description is only an embodiment of the present invention, and is not intended to limit the patent of the creation. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of an inorganic substrate according to a first embodiment of the present invention. Fig. 2 is a perspective view (1) of a first embodiment of the present invention. Fig. 3 is the first embodiment of the present invention. Fig. 4 is a perspective view (1) of a second embodiment of the present invention. Fig. 5 is a perspective view (2) of a second embodiment of the present invention. 6/8 M417650 [Main components DESCRIPTION OF REFERENCE NUMERALS 10 inorganic substrate II bearing plane] 2 nip joint 12' nip joint 20 insulating frame 2] accommodating space around wall 22 wafer 40 wire 50 encapsulant colloid