M416079 五、新型說明： 【新型所屬之技術領域】 ^創作係有關於氣體量測裝特別是—種應用 泡烤相裝置_，用以量測氣體含量之氣體含量感測裝置。 【先前技術】 *習知⑽泡烤箱，似高壓與高溫施於膠著材料之上， 藉由高溫使膠著材料產生黏度降低之變化，再藉由高壓 在於膠著材料中之氣泡因麼力差而將氣泡排除於膠著材料 之外或因壓力差而將膠著材料中之氣泡縮小，進而提升供烤 產品的品質及可靠性。此習知之技術已廣泛用於半導體封震 之晶片黏著膠材上，其係可以—種工—加壓除泡烤箱裝置 提供，該加壓除麟箱裝置係連接烤箱外部高壓氣體作為氣 壓源並以-電熱裝置提供烤箱内部所需減，以位於烤箱外 部之一驅動馬達驅動裝置於電熱裝置中央之設有攪拌裴置 之一風扇旋轉，進而使烤箱内受熱的高溫高壓氣體流動且均 勻分佈，進而使置於烤箱中的半導體材料可均勻地受熱。 由於特定先進製程的考量，使用者欲量測烤箱内部之特 疋氣體含量時’由於習知的氣體含量量測設備之壓力耐受度 相當有限，無法直接於加壓除泡烤箱内部此種高溫高壓的環 土兄下對氣體進行量測，因此產生相當程度的困擾。 【新型内容】 本創作之主要目的，係提供一種壓力容器之氣體含量感 ^416079 測裝置，其可應料例如半導體封裝加玉所使狀加壓除泡 裝置内置空間等之―高溫高屡環境下，用以量測且 中之氣體含量。 〃 本創作解決問《I之技術手段，係、於以—連通管將一氣體 =量感測裝置，與-加壓烤箱裝置之—腔體内部所形成之一 ，置空間相連通，以量測容置空間中氣體含量。其中氣體含 垔感測裝置包括：一氣體含量感測器以及一氣體參數調節M416079 V. New description: [New technical field] ^There is a gas content sensing device for gas measurement, especially for the application of a bubble phase device. [Prior Art] * Conventional (10) soaking oven, like high pressure and high temperature applied to the adhesive material, the viscosity of the adhesive material is reduced by high temperature, and then the high pressure is caused by the difference in the bubble in the adhesive material. The bubbles are excluded from the glue material or the bubbles in the glue material are reduced due to the pressure difference, thereby improving the quality and reliability of the baked product. This prior art technology has been widely used in semiconductor sealing materials for wafer adhesives, which can be provided by a seed-pressure defoaming oven device, which is connected to a high pressure gas outside the oven as a gas pressure source. The electric heating device provides a required reduction inside the oven, and one of the outside of the oven drives the motor driving device to rotate the fan in the center of the electric heating device with a stirring device, so that the heated high temperature and high pressure gas in the oven flows and is evenly distributed. The semiconductor material placed in the oven is then uniformly heated. Due to the consideration of specific advanced processes, the user wants to measure the special gas content inside the oven. 'Because the pressure tolerance of the conventional gas content measuring equipment is quite limited, it cannot be directly used in the pressure defoaming oven. The gas is measured under the high pressure of the earth, so it has a considerable degree of trouble. [New content] The main purpose of this creation is to provide a gas container with a gas content sense 416079 measuring device, which can be used for materials such as semiconductor packaging and jade, such as the built-in space of the pressurized defoaming device, etc. Next, used to measure and determine the gas content. 〃 This creation solves the technical means of "I", which is connected to the space inside the cavity by a connecting tube and a gas-measuring device, and is connected to the space to measure The gas content in the accommodation space. The gas sensing device includes: a gas content sensor and a gas parameter adjustment
\氣體含量感測器係用以對氣體含量進行感測；氣體參數 調節器係連接於連通管與氣體含量感測器之間，用以對自連 通管流入之氣體進行調節，以使氣體中之—個或多個特定參 數符合氣體含量感測ϋ之量測範圍，進而供氣體含量感測器 進行感測。 在本創作之-較佳實_中，更包括有—延伸連通管連 接於連通管，而該延伸連通管係為一盤管。The gas content sensor is used to sense the gas content; the gas parameter regulator is connected between the communication tube and the gas content sensor for regulating the gas flowing in from the communication tube to make the gas One or more specific parameters are in accordance with the measurement range of the gas content sensing ,, and then are sensed by the gas content sensor. In the present invention, the present invention further includes an extension communication tube connected to the communication tube, and the extension communication tube is a coil.
在本創作之另-較佳實施例中’氣體參數調節器包括一 流量調速閥、以及-電磁閥，其中流量調㈣係用以調整流 入氣體之流量以及流速以達成降壓之目的，電磁閥可用以控 制待測氣體是否流入氣體含量感測器。 工 【實施方式】 請參閱第i圖及第2圖，本創作之氣體含量感測裝置 100係以-連通管8與例如半導體封裝加卫之加壓除泡烤* 裝置之-烤箱裝置9之―腔體内部所形成之一容置空間二 相連通。 M416079 烤箱裝置9的腔體中係設置有至少一加熱模組92，以 使容置空間91達到一預定溫度以及一預定升溫速率。 容置空間91具有一進氣口 93、以及一出氣口 94，進氣 口 93係透過一加壓控制組件72連通於例如一廠務管路等之 —壓力源71,以使容置空間91維持於一預設壓力。在本創 作實施例中，該烤箱裝置9之容置空間91中之壓力係大於 2大氣壓。此處，連通管8除了與容置空間91直接連通之In another preferred embodiment of the present invention, the 'gas parameter regulator includes a flow rate regulating valve and a solenoid valve, wherein the flow rate adjustment (4) is used to adjust the flow rate and flow rate of the inflowing gas to achieve the purpose of reducing pressure, and electromagnetic The valve can be used to control whether the gas to be tested flows into the gas content sensor. [Embodiment] Referring to FIG. 1 and FIG. 2, the gas content sensing device 100 of the present invention is an oven-connecting device 8 and a pressurizing defoaming* device such as a semiconductor package. One of the accommodation spaces formed inside the cavity is connected in two phases. M416079 The oven device 9 is provided with at least one heating module 92 in the cavity to bring the accommodating space 91 to a predetermined temperature and a predetermined heating rate. The accommodating space 91 has an air inlet 93 and an air outlet 94. The air inlet 93 is connected to a pressure source 71 such as a factory pipeline through a pressure control assembly 72 to make the accommodating space 91. Maintain at a preset pressure. In the present embodiment, the pressure in the accommodation space 91 of the oven unit 9 is greater than 2 atmospheres. Here, the communication tube 8 is directly connected to the accommodation space 91.
外，如第2圖所示，亦可透過進氣口 93與容置空間9ι相連 通。 谷置空間91中係設置有一渦輪風扇96、至少一溫度减 測器97、以及至少一壓力感測器98,渦輪風扇96係由ς連 接之一馬達95驅動轉動，進而可使容置空間91中的氣體流 動，溫度感測器97與壓力感測器98係分別對容置空間^ 中的溫度及壓力進行感測。 氣體含量感測裝置100包括一氣體參數調節器b 氣Further, as shown in Fig. 2, it can also be connected to the accommodating space 9 through the air inlet 93. The turbulent space 91 is provided with a turbo fan 96, at least one temperature damper 97, and at least one pressure sensor 98. The turbo fan 96 is driven to rotate by a motor 95 connected to the cymbal, thereby accommodating the accommodating space 91. In the gas flow, the temperature sensor 97 and the pressure sensor 98 respectively sense the temperature and pressure in the accommodating space. The gas content sensing device 100 includes a gas parameter regulator b gas
體含量感測器2、以及-延伸連通管3，延伸連通管3係與 ，通管8相連接，氣體參數調節器！係連接純體含量感測 器2與延伸連通管3之間。 其中，氣體參數調節器1用以對自延伸連通管3流入的 氣體進行調節，以使流入氣體之例如溫度、壓力、流：等之 特定參數符合氣體含量感測H 2的量職圍，進而供盆進行 感測。氣體參數調節器i可包括一流量調速閥u、：及一 2磁閥12,其中流量調速閥u可用以調整供應至氣體含 怎測益2的氣體流量以及流速’電磁閥12纟一控制器（未示） 5 M416079 的控制之下’可用以控制容置空間91中的待測氣體是否流 =氣體含量感測器。氣體含量感測器2可用以感測氣體含 量。延伸連iff 3較佳係為—盤管，容置空間％中的待測 氣體經過該延伸連通管3後，可使溫度降低。The body content sensor 2, and the extension communication tube 3, the extension communication tube 3 are connected to the flow tube 8, and the gas parameter regulator! It is connected between the pure body content sensor 2 and the extended communication tube 3. The gas parameter adjuster 1 is configured to adjust the gas flowing in from the extended communication pipe 3 so that the specific parameters of the inflowing gas such as temperature, pressure, flow, etc. are in accordance with the gas content sensing H 2 amount, and further The basin is used for sensing. The gas parameter regulator i may include a flow rate regulating valve u, and a 2 magnetic valve 12, wherein the flow regulating valve u may be used to adjust the gas flow rate and the flow rate supplied to the gas containing the benefit 2 The controller (not shown) 5 can be used under the control of M416079 to control whether the gas to be tested in the accommodating space 91 flows = gas content sensor. The gas content sensor 2 can be used to sense the gas content. The extension iff 3 is preferably a coil, and the gas to be tested in the accommodating space % passes through the extension communication tube 3 to lower the temperature.
由以上之實施例可知，本創作所提供之氣體含量感測褒 置確具產業上之利用價值，故本創作業已符合於專利之 件。惟以上之敘述僅為本創作之較佳實施例說明，凡精 項技藝者當可依據上述之說明而作其它種種之改良，惟二 改變仍屬於賴狀創作精神及以下所界定之專利範圍^ 【圖式簡單說明】 第1圖係本創作之一較佳實施例之示意圖。 第2圖係本創作之另一較佳實施例之示意圖 【主要元件符號說明】 1 氣體參數調節器 100 氣體含量感測裝置 11 流量調速閥 12 電磁閥 2 氣體含量感測器 3 延伸連通管 71 壓力源 72 加壓控制組件 8 連通管 6 M416079 9 烤箱裝置 91 容置空間 92 加熱模組 93 進氣口 94 出氣口 95 馬達 96 滿輪風扇 97 溫度感測器 98 壓力感測器It can be seen from the above embodiments that the gas content sensing device provided by the present invention has industrial utilization value, so the original operation has been in compliance with the patent. However, the above description is only for the description of the preferred embodiment of the present invention. Anyone who is skilled in the art can make other improvements according to the above description, but the change is still in the spirit of creation and the scope of patents defined below^ BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a preferred embodiment of the present invention. Figure 2 is a schematic view of another preferred embodiment of the present invention. [Main component symbol description] 1 Gas parameter adjuster 100 Gas content sensing device 11 Flow speed regulating valve 12 Solenoid valve 2 Gas content sensor 3 Extended communication tube 71 Pressure source 72 Pressure control unit 8 Connecting tube 6 M416079 9 Oven unit 91 Housing space 92 Heating module 93 Inlet 94 Outlet 95 Motor 96 Full-wheel fan 97 Temperature sensor 98 Pressure sensor