M415461 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係關於一種電連接器組合及其電連接器，尤其涉 及一種連接晶片模組至電路板之電連接器組合及其電連 接器。 【先前技術】 [0002] 習知技術之一種電連接器組合包括絕緣本體、收容於絕 緣本體之晶片模組及安裝於晶片模組上方之散熱裝置。 如美國專利公告第7, 619, 895號所揭示之電連接器組合 ，其散熱裝置放置於晶片模組上，一壓板固定於絕緣本 體並抵壓於散熱裝置上，從而使得散熱裝置保持於晶片 模組上。然，散熱裝置係通過蓋板與絕緣本體之固定結 合抵壓於晶片模組上，散熱裝置之尺寸受限制，若尺寸 設置不當會造成蓋板與絕緣本體不能牢固組裝在一起或 者蓋板不能抵壓散熱裝置等問題。因此，該電連接器組 合所適用之散熱裝置種類較少。 [0003] 故，有必要提供一種改進之電連接器組合及其電連接器 ，以克服相關技藝之缺陷。 【新型内容】 [0004] 本創作要解決之技術問題係提供一種靈活適用散熱裝置 之電連接器組合及其電連接器。 [0005] 本創作提供一種電連接器組合，包括：絕緣本體；蓋體 ，蓋設於絕緣本體上方；及散熱裝置，其自蓋體上方固 定於蓋體。 表單編號A0101 第3頁/共11頁 M415461 [0006] 本創作還提供一種電連接器，包括：絕緣本體；及蓋體 ，蓋設於絕緣本體上方，蓋體上表面之週邊向上凸伸設 有固定柱。 [0007] 本創作再提供一種電速接器組合，包括：絕緣本體；晶 片模組，係承靠於絕緣本體；蓋體，蓋設於絕緣本體上 方，設有抵壓於晶片模組週側之抵壓片；及散熱裝置， 係自蓋體上方固定於蓋體且抵壓於晶片模組中部以使晶 片模組受到均勻的下壓力。 [0008] 與先前技術相比，本創作散熱裝置安裝於蓋體上，散熱 裝置之形狀及尺寸不受限制，可靈活適用多種散熱裝置 〇 【實施方式】 [0009] 請參閱第一圖至第三圖，本創作電連接器組合100包括絕 緣本體1、收容於絕緣本體1之導電端子（未圖示）、組裝 於絕緣本體1内之晶片模組2、蓋設於絕緣本體1上方並固 定晶片模組2之蓋體3及組裝於蓋體3上方之散熱裝置4。 [0010] 蓋體3中部設有中央開口 31，晶片模組2部分凸伸於中央 開口 31並與散熱裝置4接觸。蓋體3於中央開口 31之邊緣 向下凹陷形成抵壓片32，以抵壓晶片模組2。蓋體3上表 面之週邊向上凸伸設有四個固定柱33，固定柱33對稱設 置於蓋體3之四角。固定柱33設有螺孔331，電連接器組 合100還設有鎖固於螺孔331之螺栓5，從而將散熱裝置4 鎖固於蓋體3上。蓋體3側邊設有向外延伸之固板部34， 固板部34設有通孔340，電連接器組合100設有穿過通孔 表單編號A0101 第4頁/共11頁 M415461 340之鎖固件6，從而將蓋體3固定於電路板7上。 [0011] 散熱裝置4自蓋體3上方固定於蓋體3，其包括承載體41及 結合於承載體41之散熱管42，承載體41設有套設於固定 柱33之固定孔411。固定柱33、固定孔411及螺栓5之組 裝結合將散熱裝置4組裝於蓋體3上。散熱裝置4四點固定 於蓋體3上，可改變散熱裝置4之組裝方向，從而可改變 散熱管42之延伸方向。而且對稱四點固定可以使得散熱 裝置4對蓋體3之壓力均勻分佈，蓋體3將壓力傳遞至晶片 模組2，從而晶片模組2受力均勻。散熱裝置4安裝於蓋體 3上使得散熱裝置4形狀及尺寸不受限制，從而本創作可 適用於各種類型之散熱裝置4。 [0012] 綜上所述，本創作符合新型專利要件，爰依法提出專利 申請。惟，以上所述者僅為本創作之較佳實施方式，本 創作之範圍並不以前述實施方式為限，舉凡熟習本案技 藝之人士援依本創作之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0013] 第一圖係本創作電連接器組合之立體組合圖。 [0014] 第二圖係本創作電連接器組合之部分分解圖。 [0015] 第三圖係本創作電連接器組合之立體分解圖。 【主要元件符號說明】 [0016] 絕緣本體：1 [0017] 電連接器組合：100 表單编號A0101 第5頁/共11頁 M415461 [0018] 晶片拉組· 2 [0019] 蓋體：3 [0020] 中央開口 ： 31 [0021] 抵壓片：32 [0022] 固定柱：3 3 [0023] 螺孔：331 [0024] 固板部：34 [0025] 通孔：340 [0026] 散熱裝置：4 [0027] 承載體：41 [0028] 固定孔：411 [0029] 散熱管：42 [0030] 螺栓：5 [0031] 鎖固件：6 [0032] 電路板：7 表單編號A0101 第6頁/共11頁M415461 V. New Description: [New Technology Field] [0001] The present invention relates to an electrical connector assembly and an electrical connector thereof, and more particularly to an electrical connector assembly for connecting a chip module to a circuit board and an electrical connection thereof Device. [Prior Art] [0002] An electrical connector assembly of the prior art includes an insulative housing, a wafer module housed in the insulating body, and a heat sink mounted on the wafer module. In the electrical connector assembly disclosed in U.S. Patent No. 7,619,895, the heat dissipating device is placed on the wafer module, and a pressing plate is fixed to the insulating body and pressed against the heat dissipating device, so that the heat dissipating device is held on the wafer. On the module. However, the heat dissipating device is pressed against the chip module by the fixed combination of the cover plate and the insulating body, and the size of the heat dissipating device is limited. If the size is improperly set, the cover plate and the insulating body cannot be firmly assembled or the cover plate cannot be resisted. Problems such as pressure heat sinks. Therefore, there are fewer types of heat sinks for this electrical connector assembly. [0003] Therefore, it would be desirable to provide an improved electrical connector assembly and electrical connector thereof to overcome the deficiencies of the related art. [New Content] [0004] The technical problem to be solved by this creation is to provide an electrical connector assembly and an electrical connector thereof that are flexible and suitable for a heat sink. [0005] The present invention provides an electrical connector assembly comprising: an insulative housing; a cover body disposed over the insulative housing; and a heat dissipating device secured to the cover body from above the cover body. Form No. A0101 Page 3 of 11 M415461 [0006] The present invention also provides an electrical connector comprising: an insulating body; and a cover body disposed above the insulating body, the periphery of the upper surface of the cover body is upwardly protruded Fixed column. [0007] The present invention further provides an electric speed connector assembly comprising: an insulative housing; a wafer module that bears against the insulative housing; and a cover body that is disposed above the insulative housing and is provided to be pressed against the peripheral side of the wafer module And the heat dissipating device is fixed on the cover body from above the cover body and pressed against the middle of the chip module to receive a uniform downward pressure on the wafer module. Compared with the prior art, the heat sink of the present invention is mounted on the cover body, and the shape and size of the heat sink device are not limited, and the heat sink device can be flexibly applied. [Embodiment] [0009] Please refer to the first figure to the first In the third embodiment, the present invention is composed of an insulative housing 1 , a conductive terminal (not shown) received in the insulative housing 1 , and a chip module 2 mounted in the insulative housing 1 . The cover 3 of the wafer module 2 and the heat sink 4 assembled above the cover 3. [0010] A central opening 31 is defined in the middle of the cover 3, and the wafer module 2 partially protrudes from the central opening 31 and is in contact with the heat sink 4. The cover body 3 is recessed downward at the edge of the central opening 31 to form a pressing piece 32 for pressing against the wafer module 2. Four fixing posts 33 are protruded upward from the periphery of the upper surface of the cover body 3. The fixing posts 33 are symmetrically disposed at the four corners of the cover body 3. The fixing post 33 is provided with a screw hole 331. The electric connector assembly 100 is further provided with a bolt 5 locked to the screw hole 331 to lock the heat dissipating device 4 to the cover body 3. The side of the cover body 3 is provided with an outwardly extending solid plate portion 34, and the solid plate portion 34 is provided with a through hole 340. The electrical connector assembly 100 is provided through the through hole form number A0101, page 4/11, M415461 340. The fastener 6 is locked to fix the cover 3 to the circuit board 7. The heat dissipating device 4 is fixed to the cover body 3 from above the cover body 3. The heat dissipating device 4 includes a carrier body 41 and a heat dissipating tube 42 coupled to the carrier body 41. The carrier body 41 is provided with a fixing hole 411 which is sleeved on the fixing post 33. The assembly of the fixing post 33, the fixing hole 411, and the bolt 5 is assembled to the heat sink 4 on the cover 3. The heat dissipating device 4 is fixed to the cover body 4 at four points, and the assembly direction of the heat dissipating device 4 can be changed, so that the extending direction of the heat dissipating tube 42 can be changed. Moreover, the symmetrical four-point fixing can uniformly distribute the pressure of the heat sink 4 to the cover body 3, and the cover body 3 transmits the pressure to the wafer module 2, so that the wafer module 2 is evenly stressed. The heat sink 4 is mounted on the cover 3 so that the shape and size of the heat sink 4 are not limited, so that the present invention can be applied to various types of heat sinks 4. [0012] In summary, the creation complies with the new patent requirements, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the foregoing embodiments, and any equivalent modification or change made by a person familiar with the skill of the present invention in accordance with the spirit of the present invention is It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0013] The first figure is a three-dimensional combination diagram of the present combination of electrical connectors. [0014] The second figure is a partially exploded view of the present electrical connector assembly. [0015] The third figure is an exploded perspective view of the assembled electrical connector assembly. [Main component symbol description] [0016] Insulating body: 1 [0017] Electrical connector combination: 100 Form number A0101 Page 5 / Total 11 pages M415461 [0018] Wafer pull group · 2 [0019] Cover: 3 [ 0020] Center opening: 31 [0021] Pressing piece: 32 [0022] Mounting post: 3 3 [0023] Screw hole: 331 [0024] Solid plate part: 34 [0025] Through hole: 340 [0026] Heat sink: 4 [0027] Carrier: 41 [0028] Mounting hole: 411 [0029] Heat pipe: 42 [0030] Bolt: 5 [0031] Locking: 6 [0032] Board: 7 Form No. A0101 Page 6 / Total 11 pages