_ 100年06月10日按正替換頁 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作涉及一種電連接器，尤其涉及一種電性連接晶片 模組與印刷電路板之電連接器。 [先前技術] [0002] 美國專利第7 7 8 512 4號所揭示之一種用於測試晶片模組之 電連接器，其包括一用來容納晶片模組之基體、收容於 基體中並用於承载晶片模組之承載件及連接於基體並可 相對於基體轉動之蓋體。惟，所述承載件之收容區域内 只能收容一個晶片模組，在測試的過程中，亦只能逐一 地測試測晶片模組’則需要較多測試及更換晶片模組之 時間，或可通過複數個電連接器分別測試晶片模組，則 需要購買足夠多的電連接器，其成本較高。 闕鑒於此，實有必要提供-種改進之電連制，以克服上 述電連接器之缺陷。 【新型内容】 [0004].本劍作所解決之技術問題為提供一種可同時收容複數晶 片模組之電連接器。 [_本創作之目的係通過以下技術方案實現的：一種電連接 器，可連接晶片模組，其包括：導電端子、容納有複數 導電端子之座體、連接於座體並可相對於座體轉動之蓋 體及組裝於蓋體上之承載座，承載座設有複數可收容晶 片模組之收容區域。 _純於習知技術，本創作之電連接器之承載座上設有將 表單編號A0101 第3頁/共13頁 M415448 100年06月10日按正替換頁 承載座區分複數收容區域之定位塊，可同時收容及測試 複數晶月模組。 【實施方式】 [_]帛-圖至第三圖為本創作之電連接器之較佳實施例，電 連接器1包括座體2，連接於座體2並可相對於座體2轉動 之蓋體3。其中座體2中組裝有承載座4，座體2及承載座4 中收容有複數導電端子6，晶片模組5承載於承載座4之上 〇 - [_]座體2包括-具有枚容空間之基座2〇、組裝於基座2〇底部 < 之固定板21。固定板21上設有複數組裝導電端子6之端子 孔210 °基座20之相對兩端分別具有一轉軸22、23，用 於和蓋體3相連接。 [_] 1_體3包括基板3〇及組裝於基板3G之上的金屬加強片3ι。 基板30之一端通過轉軸22而樞接於基座20，相對之另一 端通過一轉轴33連接於加強片31之上。加強片31可通過 轉轴33相對於基板30轉動。同時，加強片31於靠近轉軸 · 33兩端處各延伸出—卡勾310，當蓋體3向下翻轉後，卡 < 勹可扣合於轉“23之兩端。加強片31於遠離於轉轴 33之另一端通過另—轉轴34而連接一卡扣32，卡扣32可 扣合於基座20上。通過加強片31之卡勾310及卡扣32， 可將蓋趙3牢固地鎖合於閉合狀態。 咖]所述承載座4可組裝於基座20内 ，大致呈方形結構，其包 括用於承載晶片模組5之收容區40、於收容區40表面設 有收谷導電端子6之複數端子收容孔41、自收容區4〇中部 表單編sTaL向上凸出並大致呈十字型結構之定位塊4 2 '於收容 第4頁/共13頁 M415448 • 100年06月10日按正替换頁 區40四周設有向上延伸之側牆43、自收容區40之四個角 部設有向上凸伸用於定位晶片模組5之定位部44及自定位 部44下方設有向下延伸並組裝於基座20中之固持勾45。 其>，所述定位塊42係承載座4一體成型於收容區40之上 表面，定位塊42端部設有用於導引晶片模組5之導引部 420。所述定位塊42將收容區40分為四個面積較小且結構 相同之收容區域421，四個收容區域421内可同時收容並 測試四個晶片模組5，相對於先前技術而言，不但可縮短 測試及更換晶片模組之時間還可節省測試廠商購買電連 接器1的成本。 [0011] 本創作之承載座4之定位塊42除了一體成型外，還可通過 獨立之定位塊組裝於收容區之上表面，亦可同時收容並 測試多個晶片模組5。 [0012] 本創作之電連接器1之承載座4之定位塊42可將收容區40 分為四個面積較小之收容區域4 21，可同時收容並測試四 個晶片模組5。 ® . [0013] 綜上所述，本創作確已符合新型專利之要件，爰依法提 出專利申請。惟，以上所述者僅係本創作之較佳實施方 式，本創作之範圍並不以上述實施方式為限，舉凡熟習 本案技藝之人士援依本創作之精神所作之等效修飾或變 化，皆應涵蓋於以下申請專利範圍内。 [0014] 【圖式簡單說明】 第一圖為本創作之電連接器之立體組合圖； [0015] 第二圖為本創作之電連接器之立體分解圖；及 表單編號A0101 第5頁/共13頁 M415448 100年06月10日修正替換頁 [0016] 第三圊為本創作之電連接器之承載座及晶片模組之立體 分解圖。 【主要元件符號說明】 [0017] 電連接器：1 [0018] 座體：2 [0019] 基座：20 [0020] 固定板：21 [0021] 端子孔：210 [0022] 轉軸：22、23、33、34 [0023] 蓋體：3 [0024] 基板：30 [0025] 加強片：31 [0026] 卡勾：310 [0027] 卡扣：32 [0028] 承載座：4 [0029] 收容區：40 [0030] 收容孔：41 [0031] 定位塊：42 [0032] 導引部：420 [0033] 收容區域：421 表單編號A0101_ 100 years, June 10, according to the replacement page 5, the new description: [New technology field] [0001] The present invention relates to an electrical connector, in particular to an electrical connection between the chip module and the printed circuit board Device. [Pre-Technology] [0002] An electrical connector for testing a wafer module disclosed in US Pat. No. 7,78,512, which includes a substrate for accommodating a wafer module, is housed in a substrate, and is used for carrying a carrier of the wafer module and a cover coupled to the substrate and rotatable relative to the substrate. However, only one wafer module can be accommodated in the receiving area of the carrier, and in the process of testing, the test chip module can only be tested one by one, and more time for testing and replacing the chip module is required, or Testing the wafer module separately through a plurality of electrical connectors requires purchasing a sufficient number of electrical connectors, which is costly. In view of this, it is necessary to provide an improved electrical connection to overcome the above-mentioned electrical connector defects. [New content] [0004]. The technical problem solved by this sword is to provide an electrical connector that can accommodate a plurality of wafer modules at the same time. [The purpose of this creation is achieved by the following technical solutions: an electrical connector, which can be connected to a wafer module, comprising: a conductive terminal, a seat body accommodating a plurality of conductive terminals, connected to the base body and opposite to the seat body The rotating cover body and the carrier seat assembled on the cover body, the carrier seat is provided with a plurality of receiving areas for accommodating the wafer module. _ purely in the conventional technology, the carrier of the present invention is provided with a positioning block for the form number A0101, page 3/13 pages, M415448, June 10, 10, according to the replacement page carrier to distinguish the plurality of storage areas. , can accommodate and test multiple Crystal Moon modules at the same time. [Embodiment] [_] 帛 - to 3 is a preferred embodiment of the electrical connector of the present invention. The electrical connector 1 includes a base 2 connected to the base 2 and rotatable relative to the base 2 Cover body 3. The base 2 is assembled with a carrier 4, and the base 2 and the carrier 4 house a plurality of conductive terminals 6 . The wafer module 5 is carried on the carrier 4 - [_] the body 2 includes - has a feature The base of the space 2 is fixed to the bottom plate of the base 2 and the fixed plate 21 of the base. The fixing plate 21 is provided with a plurality of terminals for assembling the conductive terminals 6. The opposite ends of the base 20 have a rotating shaft 22, 23 for connecting with the cover 3. [_] The 1_body 3 includes a substrate 3A and a metal reinforcing sheet 3ι assembled on the substrate 3G. One end of the substrate 30 is pivotally connected to the base 20 via a rotating shaft 22, and the other end is connected to the reinforcing sheet 31 via a rotating shaft 33. The reinforcing piece 31 is rotatable relative to the substrate 30 via the rotating shaft 33. At the same time, the reinforcing sheet 31 extends from each of the two ends of the rotating shaft 33 to the hook 310. When the cover body 3 is turned down, the card < 勹 can be fastened to the ends of the rotating portion 23. The reinforcing sheet 31 is away from the reinforcing sheet 31. At the other end of the rotating shaft 33, a buckle 32 is connected through the other shaft 34, and the buckle 32 can be fastened to the base 20. The hook 310 and the buckle 32 of the reinforcing piece 31 can be used to cover the cover 3 The carrier 4 is assembled in the base 20 and has a substantially square structure. The housing 4 includes a receiving area 40 for carrying the wafer module 5 and is disposed on the surface of the receiving area 40. The plurality of terminal receiving holes 41 of the valley conductive terminal 6 and the positioning block of the self-receiving area 4 〇 central form sTaL protruding upward and having a substantially cross-shaped structure 4 2 'in the housing page 4 / total 13 pages M415448 • 100 years June On the 10th, there is an upwardly extending side wall 43 around the positive replacement page area 40. The four corners of the self-receiving area 40 are provided with an upwardly protruding positioning portion 44 for positioning the wafer module 5 and a self-positioning portion 44. There is a holding hook 45 extending downward and assembled in the base 20. The positioning block 42 is integrally formed in the receiving area by the bearing block 4 The upper surface of the positioning block 42 is provided with a guiding portion 420 for guiding the wafer module 5. The positioning block 42 divides the receiving area 40 into four receiving areas 421 having a small area and the same structure. The four wafer modules 5 can be accommodated and tested simultaneously in the receiving area 421, which not only shortens the time for testing and replacing the wafer modules, but also saves the cost of the test manufacturer purchasing the electrical connectors 1 compared with the prior art. The positioning block 42 of the carrier 4 of the present invention can be assembled on the upper surface of the receiving area by a separate positioning block in addition to the integral molding, and can simultaneously accommodate and test the plurality of wafer modules 5. [0012] The positioning block 42 of the carrier 4 of the electrical connector 1 can divide the receiving area 40 into four smaller receiving areas 421, and can simultaneously accommodate and test four wafer modules 5. [0013] As mentioned, this creation has indeed met the requirements of the new patent, and has filed a patent application according to law. However, the above is only the preferred implementation of this creation, and the scope of this creation is not limited to the above-mentioned implementation. Skilled person Equivalent modifications or variations made by the spirit of the present invention should be covered by the following patent application. [0014] [Simple description of the drawings] The first figure is a three-dimensional combination diagram of the electrical connector of the present invention; [0015] The second figure is an exploded view of the electrical connector of the creation; and the form number A0101 page 5 / 13 pages M415448 100 June 10 revised replacement page [0016] The third is the carrying of the electrical connector of the creation 3D exploded view of the base and chip module. [Main component symbol description] [0017] Electrical connector: 1 [0018] Seat: 2 [0019] Base: 20 [0020] Fixed plate: 21 [0021] Terminal hole :210 [0022] Shaft: 22, 23, 33, 34 [0023] Cover: 3 [0024] Substrate: 30 [0025] Reinforcement: 31 [0026] Cue: 310 [0027] Clamp: 32 [0028] Carrier: 4 [0029] Containment area: 40 [0030] Reception hole: 41 [0031] Positioning block: 42 [0032] Guide: 420 [0033] Containment area: 421 Form No. A0101
第6頁/共13頁 M415448 [0034] 側牆：43 [0035] 定位部：44 [0036] 固持勾：45 [0037] 晶片模組· [0038] 導電端子：1 表單編號A0101 第7頁/共13頁 100年06月10日修正替換頁Page 6 of 13 M415448 [0034] Sidewall: 43 [0035] Positioning section: 44 [0036] Holding hook: 45 [0037] Wafer module · [0038] Conductive terminal: 1 Form number A0101 Page 7 / A total of 13 pages, 100 years, June 10, revised replacement page