TWM413879U - LED backlight module with foldable circuit layer - Google Patents

Description

M413879 V. New Description: [New Technology Field] This creation is about an LED backlight module, especially an LED backlight module with a folded circuit layer that can increase the circuit layout area. [Prior Art] A liquid crystal display is a display product that is currently widely used. A liquid crystal display controls the light transmittance of each pixel position by a liquid crystal layer of the liquid crystal panel, so that the liquid crystal display can correctly display an image. At present, liquid crystal displays have been widely used in televisions, mobile phones, smart phones, notebook computers, and personal digital assistants (PDAs). However, since the liquid crystal panel is a non-self-luminous display material, the liquid crystal display needs to be provided with a backlight module to provide its light source. Please refer to the first circle, which is a perspective view of a conventional LED backlight module. As shown in the first figure, the conventional (four) backlight module! Mainly comprising: a cover U, an insulating thermal conductive adhesive 12', a circuit layer 13, a plurality of LED elements 14', and a light guide plate 2, wherein the circuit layer 13 has a specific width W, and the circuit layer 13 is attached to the inside of the cover 11' by the hot glue 12; the plurality of LED elements are attached to the circuit layer 13'; the light guide 2 is With one light incident

The 167 faces receive the light emitted by the LED element 14 for the plurality of LED elements 14'. The conventional I^D backlight module shown in the first figure has the advantages of simple structure, easy assembly of 3 M413879, and good light-receiving effect. The conventional LED backlight module 1' is widely used in various applications. In the liquid crystal display products; however, since the user's requirements for the weight and thickness of the liquid crystal display are higher and higher, the computer manufacturer has continuously introduced a lighter and thinner liquid crystal display in response to the needs of the user. It is conceivable that for a thin liquid crystal display, the LED backlight module mounted on it is also a thin LED backlight module. However, for an LED backlight module of a large-sized liquid crystal display, the system must be equipped with a large number of LED backlight modules. The LED component is capable of providing a sufficient brightness backlight to the display panel of the liquid crystal display. However, in order to carry a large number of LED components, the circuit layer must have a certain width and length, so that the circuit layer can provide sufficient circuit layout area of the LED components; however, the circuit layer having a certain width cannot be set to a thin shape. Inside the LED backlight module. Therefore, it can be known from the above that, based on the limitation of the width of the circuit layer, the thin LED backlight module cannot be applied to the large-sized liquid crystal ",' In view of this, the creator of the case tried to research and create, and finally developed an LED backlight module with a folded circuit layer to provide sufficient circuit layout area of the LED component through the folded circuit layer, thereby making The thin (four) backlight module can be used in various sizes of liquid crystal displays. [New content] The purpose of this creation is to provide an LED backlight module with a folded circuit layer 4 m413879, which uses a combination of a long piece and a short piece to accommodate a plurality of covers. The LED component is coupled to a light guide plate, and a circuit layer is foldedly disposed on a folded portion of the elongated member to increase a circuit layout area of the circuit layer. The second object of the present invention is to provide an LED backlight module having a folded circuit layer, which is a combination of a long member and a short member, and accommodates a plurality of LED elements and a guide. a light plate, such that when the plurality of LED elements respectively pass through the plurality of first holes of the accommodating cover and the plurality of second holes of the first heat conductive layer and are soldered to the inner surface of the circuit layer, the first A hole and a second hole can assist in the soldering positioning of the LED elements. - π π 刈 八 搜 之 之 LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED A reflector member inside the accommodating cover body has a first-class sulcus, and when the light guide plate is disposed in the accommodating cover body, the rafter can be completely attached to the light guide plate. 'To prevent the light from being leaked by the light guide plate, the space between the cover and the cover is leaked. Therefore, in order to achieve the first object, the second object and the third object of the present invention, the creator of the present invention proposes a coffee machine having a folded circuit layer; the optical module includes: a long piece having a plurality of first And a second accommodating space, wherein The opening is in the ι system, facing the outer surface of the long piece and the folding portion; the short piece is combined with the long piece to form a receiving cover body in the manner of being embedded in the second accommodating space; It is attached to the main jig by bending along the shape of the folded portion. The surface of the surface is extended into the first accommodating space to be attached to the inner surface of the portion of the accommodating space; the circuit layer is bent and disposed on the insulating layer of the insulating layer along the shape of the folded portion In the above, the circuit layer is attached to the insulating and thermally conductive layer with its outer surface; a first heat conducting layer is bent and attached to the inner surface of the circuit layer along the shape of the folded portion, and has a plurality of second holes relative to the plurality of first holes;

a plurality of LED elements respectively passing through the plurality of first holes and the plurality of second holes and disposed on an inner surface of the circuit layer; a reflecting member disposed in the receiving cover and having a relative In the plurality of (four) three holes of the plurality of first holes, when the reflecting member is disposed inside the accommodating cover, the light emitting surface of the plurality of LED elements respectively passes through the plurality of third holes a light guide plate is disposed in the body relative to the reflector, and when the light guide plate is not placed in the body of the body, the first incident surface is For the light emitting surface; and 6 M413879 a second heat conducting layer attached to the outer surface of the long piece. wherein 'when the plurality of LEM pieces pass through the plurality of first holes and the plurality of second holes respectively And soldering to the inner surface of the circuit layer, at this time, the plurality of insulating sheets disposed on the inner sidewalls of the plurality of first holes prevent the solder from spreading outward along the inner sidewall of the first hole. wherein, when the plurality of LEDS When the piece emits light, the heat generated by it can pass through the inner surface of the circuit layer. Twenty iridium and outside the group carry a surface coating 〃 Bu insulating and thermally conductive layer by the thermally conductive layer is bi-directionally excluded. The fourth object of the present invention is to provide a LED backlight module having a folded circuit layer, and a receiving cover having a long portion, a short portion and a folded portion, which accommodates a plurality of LED elements and a light guide plate And a circuit layer is foldedly disposed on the folded portion of the accommodating cover to increase a circuit layout area of the circuit layer. The fifth object of the present invention is to provide a (4) backlight module having a folded circuit layer, which uses a receiving cover having a long portion, a short portion and a folded portion to accommodate a plurality of LED elements and a light plate, and a plurality of insulating sheets are respectively disposed in the plurality of first holes of the folded portion, such that when the plurality of LED elements respectively pass through the plurality of first holes and are soldered to the inner surface of the circuit layer The plurality of insulating sheets disposed on the inner sidewalls of the plurality of first holes prevent the solder from spreading outward along the inner sidewall of the first hole, thereby preventing the short circuit from occurring between the LED element and the long member. The sixth object of the present invention is to provide a folded circuit layer 7 M413879

The backlight unit of V uses a two-piece cover having a long part, a short part and a folded part to accommodate a plurality of LED elements and a light guide plate, and is disposed in the 6-well cover body-reflector , the machine part, when the light guide plate is placed inside the core cover body 'the tassel part can be completely attached to the guide plate to prevent light from the gap between the light guide plate and the accommodating cover body dew. Therefore, in order to achieve the fourth, fifth and sixth objects of the present invention, the creator of the present invention proposes a coffee backlight module having a folded circuit layer, which comprises: a short portion and a folded portion, which are accommodated The cover body has a long part, and the folding part is connected to the long part and the short part at the same time and has at least a accommodating space and a plurality of first holes, and the county postman is a younger brother? "Π and the long 邛, the new portion and the folded portion are formed; an insulating and thermally conductive layer is attached to the folded portion along the shape of the folded portion, and the insulating and thermally conductive layer is attached to the affixed portion In the space 2, wherein the insulating and thermally conductive layer has a plurality of second holes with respect to the plurality of first holes; the circuit layer is disposed on the insulating and thermally conductive layer with the inner surface thereof along the shape of the insulating and thermally conductive layer The first heat conducting layer is disposed on the outer surface of the circuit layer along the shape of the circuit layer; the plurality of insulating sheets are respectively disposed on the inner side wall of the plurality of first holes; 8 M413879 plurality of LED elements Passing through the plurality of first holes and the plurality of second holes respectively and disposed on an inner surface of the circuit layer; the δ further reflecting member is disposed in the receiving cover body and has a relative a plurality of third holes in the plurality of first holes - wherein when the reflecting member is placed in the receiving cover, a light emitting surface of the plurality of LED elements respectively passes through the plurality of third holes ; a light guide plate 'relative to reflection Placed in the accommodating cover body, and when the light guide plate is disposed on the accommodating cover body (4), a light incident surface thereof faces the light emitting surface; and a second heat conducting layer is attached to the long portion An outer surface; wherein, when the plurality of the plurality of LED elements respectively pass through the plurality of first holes and the plurality of second holes and are soldered to the inner surface of the circuit layer, at this time, the plurality of first- The plurality of insulating sheets on the inner side wall of the hole can prevent; the tin spreads outward along the inner side wall of the first hole; wherein, when the plurality of LED elements emit light, the heat generated by the inner layer can pass through the inside and outside of the circuit layer The surface is removed bidirectionally by the insulating and thermally conductive layer and the first thermally conductive layer. [Embodiment] In order to more clearly describe an LED backlight module having the most folded circuit layer proposed by the present invention, the following The preferred embodiment of the present invention is described in detail with reference to the drawings. The present invention has a plurality of sets of embodiments 'please refer to the second and third figures, 9 is a type of led backlight module with a circuit layer of the present invention. Explosion diagram and side view of the first embodiment I view. As shown in the second and third figures,

There is a folded circuit layer; lED _ first module 1 includes: a long piece 1 1 , a short piece 12 , an insulating heat conduction - circuit layer 14, a first guide b b, a plurality of LED elements # 17 The c 6 ... the member 17, a reflecting member 18, a light guiding plate 19, a second heat conducting layer 1E, and a bottom reflecting sheet 8. 4 The long piece 11 material f can be copper, Ming, electric record steel plate, and the impregnated steel plate; in the first example of the LEDf optical module with the folded circuit layer, the I piece 11 has a plurality of first- a hole 112 and a folding portion ln, the folding portion 111 further includes a -th accommodating space (1) 丨 and a second accommodating space 1112; wherein, the first accommodating space ηι and the second accommodating space m2 are The openings of the first accommodating space (1) are oriented toward the outer surface of the long piece 11 and the folded portion U1. The material of the short piece 12 which is the same as the long piece 11 may be copper, aluminum, electrogalvanized steel plate, and hot dip galvanized steel plate, and 'as shown in the third figure, the short piece 12 is embedded in the second accommodating space 1112 The method is combined with the long piece and is combined into a receiving cover to accommodate the plurality of LED elements 17, the reflecting member 18, and the light guiding plate 19. Referring to the second and third figures, the insulating and thermally conductive layer 13 is bent and attached to the outer surface of the folded portion along the shape of the folded portion 111, and simultaneously extends into the first receiving space ml. The surface is attached to the inner surface of the portion of the first accommodating space 1111. The circuit layer 14 is bent over the insulating heat conducting layer 13 along the shape of M413879 of the folded portion U1 for arranging the plurality of LED elements 17. Here, it must be particularly noted that the circuit layer 14 is The outer surface is attached to the insulating and thermally conductive layer i 3 . The first heat conducting layer 15 is slidably attached to the inner surface of the circuit layer 14 along the shape of the folded portion, and has a plurality of second holes with respect to the plurality of first holes 112.丨5丨, wherein the first heat conductive layer 丨5 may be made of copper, aluminum or graphite; and, since the copper has a high heat transfer coefficient, the first of the ED backlight module having the folded circuit layer In the embodiment, the first heat conducting layer 15 is made of copper. The plurality of LED elements 丨7 are respectively passed through the plurality of first holes 112 and the plurality of second holes 丨5丨 and disposed in the circuit. On the inner surface of layer 14, and, as shown in the third figure, when the plurality of LED elements 17 pass through the plurality of first holes U2 and the plurality of second holes, respectively, are not placed on the circuit layer 14. When the LED element i 7 is embedded in the first valley space 1111, it is possible to prevent the LED τ member 17 from being skewed by the impact of the light guide plate when the light guide plate is mounted. In addition, by the arrangement of the first hole 112, the second hole 151 and the first accommodating space 11u, the positioning of the element (17) can be assisted when the LED element 17 is soldered. "Hai reflection member 18 is disposed in the accommodating cover body and has a plurality of third holes 181 with respect to the plurality of first holes and holes 112; as shown in the second figure and the first figure, s reflection When the piece 18 is disposed in the accommodating cover, one of the plurality of LED elements 17 respectively passes through the plurality of 11th M413879 three holes 181. The light guide plate 19 is disposed in the accommodating cover with respect to the reflector member 8. When the light guide plate 19 is disposed in the accommodating cover, a light incident surface thereof faces the light emitting surface. The second heat conductive layer ι is attached to the outer surface of the long piece and has a heat-dissipating tassel 1E1, wherein the hood is composed of the long piece u and the short piece 12 When mounted to a main hub in the liquid crystal display, the thermally conductive tassel 1E1 can be attached to a bottom plate of the main frame to further conduct heat conducted to the elongated member 11 to the bottom plate to uniformly heat Distributed on the bottom plate. In addition, in the first embodiment of the LED backlight module 具有 having the folded circuit layer, the reflector member 8 is in the shape of a gate, and the light guide plate 19 enters the receiving portion by the opening formed by the gate shape. The cover body and the reflector member 8 are accommodated by the reflector member 18; and, since the reflector member 18 has a fringe portion 182, when the light guide plate 19 is disposed inside the reflector member 18 and the receiving cover member At this time, the tassel portion 182 may be completely attached to the light guide plate , to prevent light from leaking from the gap between the light guide plate 19 and the accommodating cover. Further, the bottom reflection sheet 1A is disposed in the accommodating cover body and located above the long piece to prevent light from leaking from the side surface of the light guide plate 丨9. Thus, the architecture of the LED backlight module having the folded circuit layer of the present invention has been completely disclosed by the above; and since the present creation has a plurality of sets of embodiments, Those skilled in the relevant art will readily appreciate the efficacy presented by each set of embodiments, which will be described immediately after the disclosure of the various sets of embodiments in this specification. Therefore, the above-mentioned embodiment of the LED backlight module having the folded circuit layer is completely disclosed and illustrated by the exploded view and the side view. The LED backlight module having the folded circuit layer is The first embodiment shows the following effects: 1. The first embodiment uses the accommodating cover body combined with the long piece 丨i and the short piece 12 to accommodate the plurality of LED elements 17 and the a light guide plate 19, and the circuit layer 14 is folded and disposed on the folded portion 111 of the long piece I, so that the circuit layer 14 can be folded and attached to the shape along the shape of the folded portion u 1 In a receiving space, the circuit layout area of the circuit layer 14 is increased; 2. In the first embodiment, the plurality of LED elements 17 are buried in the first receiving portion. Within the space 11U, the LED element 17 is deflected by the impact of the light guide plate when the light guide plate is mounted; 3. The plurality of first holes 112, the plurality of second holes 151 and the first volume are The setting of the space mi can also assist the LED element 17 when soldering the LED element 17. Positioning; 4. When the light guide plate 19 is disposed in the accommodating cover body, the tassel portion 182 of the reflecting member 18 disposed inside the accommodating cover body can be completely attached to the light guide plate 19, In order to prevent light from leaking from the gap between the light guide plate 19 and the accommodating cover; 5. When the plurality of LED elements 17 emit light, the heat generated by the light can pass through 13 M413879. The inner surface and the outer surface of the circuit layer 14 are mutually excluded by the insulating heat conducting layer 13 and the first heat conducting layer 15; and 6. the above point 4, and when by the long piece " When the accommodating cover body of the short combination 2 is mounted to a main frame in the liquid crystal display device, the second heat conductive layer 1 has the heat transfer tassel portion iei attached to the bottom plate of the main frame Upper to further conduct heat conducted to the elongated member U to the bottom plate to evenly distribute heat to the bottom plate. The main purpose of the present invention is to provide a circuit layer having a high circuit layout area in the accommodating cover of the backlight module. Therefore, the first embodiment of the LED backlight module having the folded circuit layer is used. The hood is composed of the long piece 11 and the short piece 12, and the long piece 11 has the folded portion (1); however, the LED backlight module with the folded circuit layer proposed in the present invention is proposed. 'The applicable hood, the long piece 11 and the short piece 12 can be implemented, and are not limited to the second and third figures. Therefore, in order to make the creation have a folded circuit layer led The backlight module can be presented in a multi-modal manner. The creator of the + tea also provides the first-practice palladium example of the LED backlight module with a folded circuit layer. See Figure 4 and Figure 5 for clarity. This is a side view of the second embodiment of the LED backlight module having a folded circuit layer. As shown in FIG. 4 and FIG. 5A, the second embodiment of the LED backlight module 1 having a folded thunder and a gossip layer includes: a long piece Ua, a knowing piece 12a, and a Insulation guide 14 M413879 thermal layer Ua, a circuit layer 14a, + heat conduction I l5a, a plurality of insulating sheets 16a, a plurality of LED elements 17a, a reflector I. A light guide plate 19a' - a heat conductive layer 1C, and a bottom reflection sheet 1Aa. Similar to the first embodiment, in the second embodiment of the LED backlight module 1 having the folded circuit layer, the long piece Ua and the short piece 12a can be made of copper, aluminum, electroplated steel plate, and hot etched steel plate. Formed thereon; wherein a long piece is provided with a plurality of first holes 1123, and a first accommodating space 113a is formed between the folding member Ilia and the long piece 1 la; The piece 12a is combined with the long piece na by an assembly member 1B to form a receiving cover for accommodating the plurality of LED elements 17a and the reflecting member 18a. The insulating and thermally conductive layer 13a is bent and attached to the first accommodating space 11 3a along the shape of the folding member ,u, and the insulating and thermally conductive layer i & has a plurality of first holes relative to the plurality of first holes U2a's plural second holes Η". The circuit layer 14a is bent over the insulating and thermally conductive layer 13a along the shape of the folding member 1113. As shown in FIG. 5A, the circuit layer i4a is disposed on the insulating and thermally conductive layer 13a. 14a is disposed in the first accommodating space 113a in a foldable manner. Thereafter, the first heat conductive layer 15a is attached to the outer surface of the circuit layer 14a in a folded shape along the shape of the folded member 1?1a. Continuing to refer to the fourth and fifth A drawings, the plurality of insulating sheets are respectively disposed on inner sidewalls of the plurality of first holes U2a; the plurality of 15 M413879 LED elements 17a respectively pass through the plurality of - Holes iQa and s Xuan a plurality of second holes 13 1 a and are disposed on the inner surface of the circuit panel 14a. The reflector 18a is disposed within the receiving cover and has a plurality of third holes 相对 with respect to the plurality of first holes U2a. And a fringe portion 182a, wherein when the reflecting member 18a is disposed inside the accommodating cover, a light emitting surface of the plurality of LED elements 17a passes through the plurality of third holes 181a, respectively. The illuminating guide 19a is disposed inside the accommodating cover with respect to the reflecting member (8), and a light incident surface is opposite to the light emitting surface when the light guiding plate 19a is disposed in the accommodating cover. In the second embodiment of the LED backlight module 1 having the folded circuit layer, the reflective member is presented in a gate shape, and the light guide plate 19a is defined by the first embodiment. The opening formed by the gate shape enters the accommodating cover body and the reflection member 18a, and is accommodated by the reflection member 18a; further, since the reflection member 18a has the tassel portion 182a, when the light guide plate 丨% is set to the reflection member When the 18a is placed inside the accommodating cover, the tassel portion 182& can be completely attached to the light guide plate 19a to prevent light from leaking from the gap between the light guide plate 19a and the accommodating cover. The heat conducting layer 1C is attached to the outer surface of the long piece 丨丨a and has a heat transfer fringe portion 1C1; wherein the valley cover body formed by combining the short piece 12a and the long piece 11a is When mounted to the main frame in the liquid crystal display device, the heat transfer tassel 1 C 1 can be attached to the bottom plate of the main frame to conduct the heat conducted by the heat conductive layer 1C to the bottom plate. The bottom reflector 1Aa is disposed in the housing and located on the elongated member to prevent light from leaking from the side surface of the light guide plate 19a. In addition, please refer to FIG. 5B, which is a second side view of a second embodiment of an LED backlight module having a folded circuit layer. As shown in Figure 5B, the two elastic guides are mediated, and the enamel 1D is relative to the accommodating cover.

Provided on the outer surface of the assembly member 18, wherein the surface of the elastic heat conductive medium (1) is provided with a thin metal layer having a high thermal conductivity; and 'by the thermal conductivity of the two elastic heat conductive materials f 1D, It can assist in eliminating heat that is conducted to the housing cover. In addition, it should be particularly noted that the two elastic heat transfer medium 1D is not limited to being disposed on the outer surface of the assembly ΐβ, and an elastic heat conductive medium 1D may be disposed on the outer surface of the long piece of the mountain. The effect of dissipating the heat dissipation of the cover body.

Thus, the architecture of the second embodiment of the LED backlight module having the folded circuit layer of the present invention has been completely disclosed by the above; and 'as shown in the fourth, fifth, and fifth panels. As shown, the second embodiment of the LED backlight module having the folded circuit layer exhibits the following effects: 1. The circuit layer 14a can be folded and attached to the shape of the folded member 11u in a folded manner. The first accommodating space 丨 13a is used to increase the circuit layout area of the circuit layer 14a. 2. The plurality of insulating sheets 16a prevent solder from spreading outward along the inner sidewall of the first hole 17 M413879 112a. Further, the short circuit phenomenon is prevented from occurring between the plurality of LED elements 17a and the folding member 111a. 3. The fringe portion 1823 of the reflecting member 18a can be completely attached to the light guide plate i9a to prevent light from being guided by the light guide plate. The gap between the 19a and the accommodating cover is *sfk* · β, 4. When the plurality of LED elements 17a emit light, the heat generated by the plurality of LED elements 17a can be

The inner surface and the outer surface of the circuit layer 14a are bidirectionally removed by the insulating and thermally conductive layer 13a and the thermally conductive layer 1c; and 5. the above-mentioned 43⁄4, and 'when the receiving cover is mounted to In the main frame of the liquid crystal display device, the heat-dissipating tassel portion 1C1 can be attached to the bottom plate of the main frame to further conduct heat conducted by the heat-conducting layer lc to the bottom plate, so that heat can be uniformly distributed to the bottom plate. Moreover, in addition to the first embodiment and the second embodiment, the creator of the present invention further provides the third embodiment of the LED backlight module having the folded or p circuit layer, please refer to the sixth figure and the first figure... ^ The brother's seven pictures are an explosion view and a side view of the second embodiment of the LED backlight with a folded circuit layer. As shown in the sixth and seventh figures, the third embodiment of the Led backlight module 1 having a folded circuit layer is 々', including a long piece lib, a short piece i2b, and one. The first heat conduction layer 13b, a mine, a female hemp, an eight circuit layer 14b, an insulating and thermally conductive layer i5b, a spacer 16b, a plurality of insulating κB, a piece 18b, a plurality of LED elements 17b, and a counter

The projecting member 19b, a light guide 1AU plate 1Ab, a second heat conducting layer 1Cb, and a bottom reflecting plate 1Bb. " 18 M413879 The long piece 11 b and the short piece i 2b material ΊΓ material is copper, Shao, electric mining plate, and hot-dip galvanized steel plate, in the first sinus brother - real example, long piece lib There is a long piece joint portion 111 b; the short piece i 2b is an ancient one, and has a short piece joint portion 121 b and a short piece setting portion 122b, wherein the gentleman is recombined by combining the short piece The portion 121b and the short portion setting portion 12 2 b can be 兮e Du, u J will be. The long piece lib is combined with the short piece 12b into a housing cover. The first heat-conducting layer 13b is folded to cover the short-piece placing portion mb; the circuit layer 14b is folded over the first conductive layer 13h·^ with its outer surface along the shape of the first heat-conducting layer Above the layer, the insulating inner layer 15b is folded and attached to the inner surface of the circuit layer along the shape of the circuit layer 14b, and the insulating heat conducting layer 15b has a plurality of first Hole i5ib. The spacer 16b is attached to the insulating heat conducting layer 丨5b and has a plurality of second holes 161b opposite to the plurality of first holes 151b; the plurality of insulating sheets 18b are respectively disposed on the plurality of second holes 161b The inner side wall. Continuing to refer to the sixth and seventh figures, the plurality of Led elements i 7b are respectively passed through the plurality of second holes 16 6b and the plurality of first holes 1 5 1 b and disposed on the circuit layer. On the inner surface of 丨4b. The reflecting member i 9b is disposed in the receiving cover body and has a plurality of third holes 191b and a first-class solid portion 192b opposite to the plurality of second holes 161b, wherein the reflecting member 19b is disposed in the capacity When disposed within the cover, a light emitting surface of the plurality of LED elements 17b passes through the plurality of third holes 191b, respectively. The light guide plate 1 Ab is disposed in the cover 19 M413879 with respect to the reflector 19 b, and when the light guide plate 1Ab is disposed in the accommodating cover, a light incident surface thereof is emitted for the light The surface and the outer fringe portion 192b may be completely attached to the light guide plate soup to prevent light from leaking from the gap between the light guide plate 1 Ab and the valley cover.

The second heat conducting layer icb is attached to the outer surface of the long piece i lb and has a heat-dissipating tassel 1Cb1, wherein the accommodating cover body assembled by the short piece 12b and the long piece of the claw is mounted to In the main frame of the liquid crystal display device, the heat transfer tassel 1Cb1 may be attached to the bottom plate of the main frame to further conduct heat conducted by the second heat conductive layer 1Cb to the bottom plate. The bottom reflection sheet IBb is disposed in the accommodating cover body and located on the long piece ub to prevent light from leaking from the side surface of the light guide plate 1 Ab. As shown in the sixth and seventh figures, the third embodiment of the LED backlight module i having the folded circuit layer exhibits the same functions as the first embodiment and the second embodiment. Therefore, it will not be repeated here. However, unlike the first embodiment and the second embodiment, in the third embodiment of the LED backlight module i having the folded circuit layer, a spacer 16b is placed in the housing cover. And a plurality of second holes 161b are formed in the spacer 16b to respectively insert the plurality of LED elements 17b into the plurality of second holes 1161b, so that when the light guide plate 丨Ab is When the accommodating cover body and the reflection sheet 19b are placed, the plurality of [ED elements 17b are prevented from being collided by the collision of the light guide plate 1Ab by the arrangement of the plurality of second holes 16 1 b; and When the plurality of lEE> elements 20 muS79 1 7b are welded, the plurality of second holes 191b 'the plurality of second holes 161b and the plurality of first holes 151b can be used to assist the (four) components to be determined. Referring to FIG. 8 , a second side view of the third embodiment of the LED backlight module having a folded circuit layer, as shown in FIG. 7B, for the LED back surface having the folded circuit layer. For the three embodiments of Qian Group, 岂/5 μ t , Han dynasty film 19b is not limited to bending Gate-shaped cover body like the state 'which may also be attached to sheet-like light guide plate on the lower surface. In addition, for the above-mentioned three-dimensional example of the LED back-money group i having a folded circuit layer, the valley cover body is composed of a long piece and a short piece, but the valley cover body is The implementation aspect should not be limited to this, and therefore, for this reason, the creator of the present invention further provides the fourth embodiment of the LED body light module having the folded circuit layer. Referring to the eighth and ninth drawings, an exploded view and a side view of a fourth embodiment of an LED backlight module having a folded circuit layer. As shown in the eighth and ninth embodiments, the fourth embodiment of the LED backlight module 1 having the folded circuit layer includes: a valley cover 11c, an insulating and thermally conductive layer 15c, a circuit layer 14c, and a circuit. The first heat conduction layer 13c, the plurality of insulation sheets 18c, the plurality of LED elements nc, the reflection member 19c, the light guide plate iAc, a second heat conduction layer 1Cc, and a bottom reflection sheet 1Bc. The material of the valley cover 11c may be copper, aluminum, electro-zinc steel plate, and hot-zinc steel plate. In the fourth embodiment, the accommodating cover 1k has a long portion 1Uc, a short portion 112c and a folded portion. 113c, wherein the folded portion n3c 21 M413879 is connected to the long portion 11c and the short portion 112c at the same time, and the folded portion 113c has an accommodating space 1132c and a plurality of first holes 1131c; further, the long portion lllc, the short portion 112c It is integrally formed with the folded portion ii3c. The insulating and thermally conductive layer 15c is attached to the folded portion 113c along the shape of the folded portion 13c, and has a plurality of second holes 丨5丨c with respect to the plurality of first holes 11 3 1 c At the same time, the insulating and thermally conductive layer i & is also attached to the valley space 1132c. The circuit layer i4c is provided on the insulating and thermally conductive layer 15c with its inner surface along the shape of the insulating and thermally conductive layer 15c. The first heat conduction layer 13c is provided on the outer surface of the circuit layer 14c along the shape of the circuit layer Mc. The plurality of insulating sheets 18c are respectively disposed on inner sidewalls of the plurality of first holes 1131c; the plurality of LED elements nc respectively pass through the plurality of first holes 11 3 1 c and the plurality of second The hole 丨5丨c is disposed on the inner surface of the circuit layer 14c. The reflecting member 19c is disposed in the receiving cover body 11c and has a plurality of third holes 丨9丨c and a first-class sulcus 192c relative to the plurality of first holes 丨丨3 1 c, wherein When the reflector member 9c is disposed in the accommodating cover 1 lc, a light emitting surface of the plurality of LED elements 17c passes through the plurality of third holes 191 respectively (the light guide plate 1Ac is opposite to the reflection) The member 19c is disposed within the accommodating cover 11c, and when the light guide plate 1Ac is placed in the accommodating cover body llc, a light incident surface thereof faces the light emitting surface; and the reflecting member 19c The tassel portion 192c can be completely attached to the 22 M413879 light guide plate 1Ac to prevent light from leaking from the gap between the light guide plate 1 ac and the accommodating cover Uc. The second heat conduction layer i Cc is attached to the length The outer surface of the portion c has a heat-dissipating tassel portion 1Ccl', wherein when the accommodating cover 1 is mounted to the main frame of the liquid crystal display device, the heat-dissipating tassel portion 1Ccl can be attached to the main frame On the bottom plate, the heat conducted by the second heat conducting layer 1Cc is further conducted to the bottom plate. The bottom reflection The lBc is disposed in the accommodating cover iic and located on the long portion 丨丨lc to prevent light from leaking from the side surface of the light guide plate 1 Ac. For the LED backlight module having the folded circuit layer, the fourth In the embodiment, it differs from the first embodiment, the second embodiment, and the third embodiment in that the accommodating cover 11 c is composed of the long portion 丨丨1 c, the short portion 11 2 c and the The folded portion 11 3c is formed integrally, rather than being composed of a long piece and a short piece; however, the effect of the fourth embodiment is the same as that of the first embodiment, the second embodiment and the third The embodiment, as shown in the eighth and ninth diagrams, has the following effects: I enable the circuit layer 14c to be folded and attached to the receiving portion along the shape of the folded portion 113c. The space 丨丨 32c is used to increase the circuit layout area of the circuit layer 14c. 2. The solder is prevented from spreading outward along the inner sidewall of the first hole U3ic by the plurality of insulating sheets 18c, thereby preventing the short circuit from occurring in the plural Between the LED elements 17c and the folded portion 113c; 23 4% of the reflectors tassel The sin can be completely attached to the light guide plate ^ to prevent light from leaking from the gap between the light guide plate 1Ac and the accommodating cover 11c; (when the plurality of LED elements 17c emit light, heat generated by the plurality of LED elements 17c can be passed through The circuit layer 14e is excluded from the second heat conducting layer 1Cc by the insulating guide (4); and 5. the fourth point 'and the main cover when the receiving cover is mounted to the liquid crystal display device In the frame, the heat-dissipating tassel can be attached to the bottom plate of the main frame to further conduct heat conducted by the second heat-conducting layer 1Cc to the bottom plate, so that heat can be uniformly distributed to the bottom plate. Referring to FIG. 10 again, a side view of a fifth embodiment of an LED backlight module having a folded circuit layer. As shown in FIG. 10, the fifth implementation of the LED backlight module 1 having a folded circuit layer The system includes: a receiving cover lid, a circuit layer I4d, an insulating and thermally conductive layer 15d, a first heat conducting layer 13d, a plurality of LED elements 17d, a reflecting member 19d, a light guiding plate iAd, and a second heat conducting layer. 1Cd, and a bottom reflection sheet 1Bd. The accommodating cover body has a long portion 1Ud and a short portion U2d, and the detaching portion llld is integrally formed with the short portion 112d, and the circuit layer 14d is disposed inside the accommodating cover lid. The insulating and thermally conductive layer 15d is attached to the inner surface of the circuit layer 14d along the shape of the circuit layer 14d, and has a plurality of first holes 151d. The first heat conducting layer 13d is disposed on the outer surface of the circuit layer 14d along the shape of the circuit layer Md. wherein the circuit layer Md, 24 M413879 is proud of, the insulating heat conducting layer Ud and the heat conducting layer 13d are bent into one Flexure. Continuing to refer to the tenth figure, the plurality of LEd elements 17d are respectively disposed through the plurality of first holes 151b to be disposed inside the surface of the circuit layer i4d. The reflecting member 19d is disposed in the accommodating cover 11d and has a plurality of second holes i91d opposite to the plurality of first holes 151d, wherein when the reflecting member 19d is disposed inside the accommodating cover 11d, One light emitting surface of the plurality of Led elements 17d passes through the plurality of second holes 191d, respectively. The light guide plate 1Ad is disposed within the accommodating cover 11d with respect to the reflecting member i9d, and when the light guiding plate 1Ad When it is disposed inside the accommodating cover Ud, its light incident surface is opposite to the light emitting surface. In addition, since the reflecting member 19d has the first-class sulcus 192d, when the light guiding plate 1Ad is disposed in the accommodating cover 11d, the tassel portion 92d can be completely attached to the light guide plate 1Ad, Light is prevented from leaking from the gap between the light guide plate 丨Ad and the accommodating cover 11d. φ the second heat conducting layer 1 Cd is attached to the outer surface of the long portion 11丨d, and has a heat-dissipating tassel portion iCdl; wherein the heat conducting hood 11d is mounted on a main frame, the heat conducting The tassel portion 1Cdl may be attached to the bottom plate of the main frame to further conduct heat conducted by the heat conductive layer 1C to the bottom plate. And in the fifth embodiment of the LED backlight module 1 having the folded circuit layer, when the plurality of LED elements 17d emit light, heat generated by the plurality of LED elements 17d can be conducted to the capacitor via the insulating and thermally conductive layer 15d. The cover 11d' is further removed via the thermally conductive layer 1C. Thus, the architecture of the fifth embodiment of the LED backlight module having a folded circuit layer of 25 M413879 has been disclosed, wherein, in other embodiments, in the fifth embodiment, The circuit layer 1 is bent a plurality of times to become a flexible body, and as shown in the tenth figure, the height of the circuit layer 14d to the LED element 17d is approximately equal to the width of the LED element i7d. The total thickness of the circuit layer 14 is approximately the thickness of the light guide plate 1 Ad. Referring to FIG. 11 again, a second view of the fifth embodiment of the LEd backlight unit having a folded circuit layer. As shown in FIG. 11 , a support plate can be added to the structure of the fifth embodiment of the LED backlight module having a folded circuit layer, wherein the support plate is used to assist the circuit layer 14d. The insulating heat conducting layer 15d and the heat conducting layer 13d are bent into the flexure. Referring to FIG. 12A, the support layer is used to bend the circuit layer, the insulating heat conducting layer and the heat conducting layer into a flexure. Actuation diagram, as shown in Figure 11A, does not want to insulate the circuit layer 14d The thermal layer 丨% and the heat conductive layer 13d are bent into a flexible body. First, the support plate i8d must be attached to the heat conductive layer 13d. Then, the circuit layer 14d, the insulating heat conductive layer I5d and the heat conductive layer 13d are terminated. Making a bending, and continuously bending the circuit layer 14d, the insulating heat conducting layer 15d and the one end of the heat conducting layer nd to adhere the insulating heat conducting layer 15d to the supporting plate 18d; then, insulating the circuit layer 4d, The other end of the heat conducting layer 15d and the heat conducting layer 13d are bent once, and the circuit layer 14d, the insulating heat conducting layer 15d and the other end of the heat conducting layer 13d are continuously and continuously bent, so that the insulating heat conducting layer 15d is attached. In the heat conduction 26 M413879 layer 13d, the step of bending the circuit layer I4d, the insulating heat conducting layer and the heat conducting layer 13d into a flexible body is completed. In addition, the circuit layer 14d can also be utilized by the two supporting plates 18d. The heat conducting layer 15d and the heat conducting layer 13d are bent into the flexure. Referring to FIG. 12B, a schematic diagram of the operation of bending the circuit layer, the insulating heat conducting layer and the heat conducting layer into a flexure using two supporting plates is used. As shown in Figure 12B, you want to use two branches. The board 18d bends the circuit layer I4d, the insulating and thermally conductive layer i5d and the heat conducting layer 13d into a flexure. First, the two supporting plates i 8d must be attached to the heat conducting layer 13d; then, the circuit layer 14d is The two ends of the insulating heat conducting layer 15d and the heat conducting layer 13d are bent inwardly so that the heat conducting layer ud covers the two supporting plates 18d; then, the two supporting plates 18d covered with the heat conducting layer 13d are bent at an angle, thus, That is, the circuit layer 14d, the insulating and thermally conductive layer 15d and the heat conducting layer 13d are bent into a flexible body. Continuing to refer to the eleventh and twelfth eightth views, and also refer to the thirteenth drawing. A perspective view of a flexible layer of a circuit layer, an insulating thermally conductive layer, and a thermally conductive layer. As shown in the thirteenth figure, when the circuit layer i4d, the insulating heat conduction layer 15d and the heat conductive layer 13d are bent into the flexure by the support plate 18d, the plurality of LED elements 17d are soldered. On the inner surface of the circuit layer, a circuit board 16d can be soldered to the inner surface of the circuit layer 14d at the same time, and the circuit board 16d can be bent-angled so that the circuit board (6) can be externally connected. Finally, please refer to the fourteenth figure, which is a side view of a sixth embodiment of the LED backlight module with a folded electric 27 M413879% road layer. As shown in FIG. 14, the sixth embodiment of the LED backlight module having a folded circuit layer includes a cover lle, a first heat conductive layer 13e, a circuit layer, and an insulating heat conductive layer 15e. a plurality of LED elements 17e, a reflecting member, a light guiding plate 1Ae, and a bottom reflecting sheet 1Be.

The cover lie has a long piece 11le and a short piece 112e integrally formed by bending. As shown in FIG. 14, one of the long pieces of the long piece fitting portion 111 is attached to one of the short piece fitting portions 1121e of the short piece 112e, and one of the long pieces 1Ue of the long piece mounting portion U12e is An accommodating space U3e is formed between the short-piece mounting portions 1122e of the short pieces Hu, wherein the s-shaped member mounting portion 1122e has a plurality of first holes 1123e. The first heat conducting layer is disposed in the accommodating space 113e in a folded form, and the circuit layer 14e is placed on the first heat conducting layer 13e along the shape of the first heat conducting layer, and As shown in FIG. 14, the circuit layer 14e is disposed on the inner surface of the circuit layer Me with the outer surface of the first heat conduction layer and the insulating heat conduction layer 15e along the shape of the circuit layer 14.e and has a plurality of a second hole; and the plurality of LED elements 17e pass through the plurality of first holes, and the holes J j 23e and the plurality of second holes/same are placed on the inner surface of the circuit layer 14e. The reflector 19e is disposed on the short mounting portion 22e and has a plurality of third holes 191 with respect to the plurality of LED elements 17e. When the reflecting member 19e is disposed on the short mounting portion m2e The light emitting surface of one of the plurality of LED elements 1 7e is exposed outside the plurality of second holes 191 e. In addition, the light guide plate j Ae is disposed on the short part mounting portion 1122e with respect to the reflection member 19e, wherein, in the sixth embodiment, the reflection member 19e also has the first-class solid portion 192e, in the same manner as the foregoing embodiment. When the light guide plate 1Ae is set in the cover! In the case of le, the tassel portion 192e may be completely attached to the light guide plate 1Ae to prevent light from leaking from the gap between the light guide plate iAe and the cover 11 e; at the same time, the tassel portion 1121e is disposed at the same time. The bottom reflection sheet 1Be prevents light from leaking from the side surface of the light guide plate 1Ae. In addition, it should be particularly noted that, in the sixth embodiment of the LED backlight module 1 having the folded circuit layer, as shown in FIG. 14, a heat-dissipating tassel portion 16e is formed in the cover body. a bending portion, wherein when the cover body 1 le is disposed on a main frame, the heat-dissipating tassel portion 16e can conform to a bottom plate of the main frame; thus, when the plurality of LED elements ik emit light, the generated The heat can be transmitted to the cover 11 e through the insulating and thermally conductive layer 15 e, and then the heat is transmitted to the frame of the main frame and the bottom plate by the cover iie and the heat-dissipating tassel 16e to achieve a good heat dissipation effect. Thus, the LED backlight module having the folded circuit layer of the present invention has been adopted by the first embodiment, the second embodiment, the third embodiment, the fourth embodiment, the fifth embodiment, and the sixth embodiment. The full disclosure; and its advantages and features are also illustrated one by one in the above. However, it should be emphasized that the above detailed description is directed to the specific description of the working example 29 M413879, but the embodiment is not intended to limit the scope of the patent of the present invention. Equivalent implementations or changes shall be included in the scope of the patent in this case. [Simple diagram of the diagram] The first diagram, the second diagram, the third diagram, the fourth diagram, the fifth diagram, the fifth, the fifth, the fifth, the sixth, the seventh, the seventh, the seventh, the eighth, and the eighth, which is a conventional LED backlight module. A perspective view of a first embodiment of a LED backlight module having a folded circuit layer; a side view of a first embodiment of an LED backlight module having a folded circuit layer; Explosion diagram of a second embodiment of an LED backlight module having a folded circuit layer; a side view of a second embodiment of an LED backlight module having a folded circuit layer; and an LED backlight module having a folded circuit layer A second side view of a second embodiment of the group; an exploded view of a third embodiment of an LED backlight module having a folded circuit layer; a second LED backlight module having a folded circuit layer Side view of an embodiment; a second side view of a third embodiment of an LED backlight module having a folded circuit layer; a creation of the present invention - a 30 M413879 LED backlight with a folded circuit layer; Explosion diagram of four embodiments; Nine Figure 11th Figure 11 Figure 12 is a side view of a fourth embodiment of an LED backlight module having a folded circuit layer; a fifth implementation of an LED backlight module having a folded circuit layer A side view of a fifth embodiment of an LED backlight module having a folded circuit layer; a board is used to bend a circuit layer, an insulating thermally conductive layer and a thermally conductive layer into a single side The schematic diagram of the operation of the curved body; the twelfth B-picture is a schematic diagram of the operation of bending the circuit layer, the insulating and heat-conducting layer and the heat-conducting layer into a flexible body by using two supporting plates; the twelfth drawing is a circuit layer, an insulating heat-conducting layer and a heat-conducting layer a perspective view of the flexure; and a fourteenth embodiment of the sixth embodiment of the LED backlight module having the folded circuit layer; [Major component symbol description] 1 LED backlight module having a folded circuit layer习 conventional LED backlight module 11, 11 a, 11 b, 111 e long piece 11', lie cover 1 lc, 1 Id accommodating cover 31 M413879 111 c, 111 d long part 111 ' 113c folding part 111a folding Item 1 lib 1111 ' 113a lllle 1112 1112e 112 , 112a ' 1123e , 112c ' 112d 112e ' 12 , 12a , 12b 1121e 1122e 1132c , 113e 125 long piece joint first accommodating space long piece fitting part second accommodating space long piece mounting part 1131c ' 151b ' 151d short part Short piece fitting portion short piece mounting portion accommodating space insulating heat conductive rubber short piece joint portion first hole short piece 121b 13, 13a, 15b, 15c, 15d, 15e 13', 14, 14a, 14b, 14c, 14d, 14e 13b, 13c' 13d, 13e, 15, 15a 131, 131a, 151, 151c, 161b 1E1, 1C1, lCbl, lCcl, lCdl, 16e 14', 17, 17a, 17b, 17c, 17d, 17e insulating thermally conductive layer circuit layer First heat conducting layer second hole heat conducting flow LED element 32 M413879 16a, 18b, 18c insulating sheet 16b spacers 18, 18a, 19b, 19c, 19d, 19e 181, 181a, 191b, 191c, 191d, 191e 182, 182a , 192b, 192c, 192d, 192e 19, 19a, 2', lAb, lAc, lAd, lAe 1A, lAa, lBb, lBc, lBd, IBe # IB assembly 1C, 13d thermal conduction layer lCb, lCc, lCd, IE W Specific width 18d support plate reflector third hole fringe light guide bottom reflector second Thermal layer 33

Claims (1)

The invention relates to a patent for a patent, and a led backlight module having a folded circuit layer, comprising: a long piece having a plurality of first holes and a folding portion, the folding portion comprising at least a first volume a space and a second accommodating space, wherein the first accommodating space and the second accommodating space are opposite to each other; and the opening of the first accommodating space faces the outer surface of the long piece and the folding portion; The short piece is combined with the long piece to form a accommodating cover body by embedding the second accommodating space; the insulating heat conductive layer is bent and attached to the outside of the folded portion along the shape of the folded portion The surface 'and simultaneously extends into the first accommodating space to be attached to the inner surface of the portion of the first accommodating space; - the circuit layer is bent and disposed on the insulating and thermally conductive layer along the shape of the folded portion 'The circuit layer is covered with an outer surface Z over the insulating and thermally conductive layer; - the first heat-conducting layer' is attached to the inner surface of the circuit layer in a folded shape along the shape of the folded portion and has a plurality of a plurality of second holes of the first hole; a plurality of LEDs And respectively disposed through the plurality of first holes and the plurality of second holes and disposed on an inner surface of the circuit layer; a reflecting member disposed in the receiving cover body and having a relative to 34 M413879 (σ〇^ a plurality of third holes of the plurality of first holes, wherein when the reflecting member is disposed within the receiving cover, the light emitting surface of the plurality of LED elements respectively passes through the plurality a third hole; the light guide plate is disposed inside the accommodating cover with respect to the reflector; and when the light guide plate is disposed in the accommodating cover, a light incident surface thereof faces the light emitting surface; a second heat conducting layer attached to the outer surface of the long piece; - the middle 4 of the plurality of led elements respectively passing through the plurality of first holes and the plurality of second holes and soldered to the inner surface of the circuit layer 'At this time, a plurality of insulating sheets disposed on the inner side walls of the plurality of first holes prevent the solder from spreading outward along the inner side walls of the first holes; Wherein, when a plurality of LEDs are illuminated, the heat generated by the plurality of LEDs can be removed bidirectionally via the inner and outer surfaces of the circuit layer and by the insulating and thermally conductive layers. 2. The coffee-backlit module having a folded circuit layer as described in the fourth aspect of the patent has a bottom reflective sheet disposed in the housing and located on the long member. The utility model is characterized in that the light is not exposed by the side surface of the light guide plate. 3. The coffee backlight module of the (four) stacked circuit layer as described in the scope of the patent application, wherein the reflector has a tassel portion. When the light guide plate is disposed in the accommodating cover body, the tassel portion can be completely attached to the 35 light guide plate to leak. The light is prevented from being separated by the gap between the light guide plate and the accommodating cover. ^申: The coffee cup with the folded circuit layer described in the first paragraph of the patent scope: the optical group 'where the second heat conduction layer further has a heat transfer tassel portion, and the X long piece is combined with the new piece The accommodating cover is mounted to a main frame. The heat-dissipating tassel can be attached to a bottom plate of the main frame to conduct heat conducted to the long piece to the bottom plate 5. The folding circuit layer of the coffee backlight module comprises: - the long piece is provided with a folding member having a plurality of first holes, and the folding member and the long member form at least a first receiving space; The piece 'is combined with the long piece to be a accommodating cover body; an insulating heat conducting layer' is attached to the 0 of the space of the 亥 第 顺 顺 according to the shape of the folding piece, and The insulating heat conducting layer has a plurality of second holes with respect to the plurality of first holes; - the circuit layer ' is bent over the insulating heat conducting layer along the shape of the folding member; - the first heat conducting layer Attached to the outer surface of the circuit layer in a folded shape along the shape of the folded member; The edge plates are respectively disposed on the inner side walls of the plurality of first holes; 36 Μ 13879 a plurality of LED elements respectively passing through the plurality of first holes and the plurality of second holes and disposed on the circuit layer On the inner surface; a reflective member disposed in the receiving cover and having a plurality of third holes relative to the plurality of first holes, wherein the plurality of the reflective members are disposed within the receiving cover One light-emitting surface of the led element passes through the plurality of third holes respectively; the light guide plate is disposed in the accommodating cover relative to the reflective member, and when the light guide plate is disposed in the accommodating cover body a light incident surface of the light emitting surface; and a second heat conducting layer attached to the outer surface of the elongated member; Providing the inner sidewalls of the plurality of first holes to prevent solder from being along the inner side of the first hole, wherein when the plurality of led first holes and the plurality of first inner surfaces, at this time, the plurality of insulating sheets are outward Diffusion; 70 pieces respectively pass through the plurality of holes and soldered to the circuit layer, and when the plurality of LED elements emit light, heat generated by the inner surface and the outer surface of the inner layer of the circuit layer may be The insulating and thermally conductive layer and the second thermally conductive layer are excluded. 6. The LED backlight module having a folded circuit layer as described in claim 5 is further provided with a bottom reflective sheet disposed in the housing and located on the long member. It is used to prevent light from being exposed by the side surface of the 37 M413879 of the light guide plate. For example, the coffee-sharing handle set having the folded circuit layer described in the above-mentioned application is further provided with at least an elastic heat-conductive medium disposed on the assembly with respect to the accommodating cover. The (4) backlight module having a folded circuit layer according to claim 7 of the patent application, wherein the Yanhai elastic heat transfer medium is cut into a plurality of sections, and a thin metal layer is laid on the surface thereof, the thin metal layer having High heat transfer coefficient. 9. The optical module having a folded circuit layer as described in claim 5 and wherein the s-reflector further has a tassel portion, and the light guide plate is disposed on the accommodating cover body (four) The domain material is completely attached to the light guide plate to prevent light from leaking from the gap between the light guide plate and the accommodating cover body. _ 1. The folding circuit layer as described in the fifth paragraph of the patent application (4) Le D: the optical module 'where the second heat conducting layer further has a heat-dissipating tassel portion, and the accommodating cover body formed by combining the short piece and the long piece is mounted on a main frame, the heat conduction The tassel portion may be attached to one of the bottom plates of the main frame to conduct the heat conducted by the second heat conducting layer to the bottom plate 0 1 1. An LED backlight module having a folded circuit layer The utility model comprises: a long piece having a long piece joint portion; a short piece having a short piece joint portion and a short piece setting portion, wherein the 38 M413879 l is assembled by combining the short piece joint portion and the short piece The long piece and the short piece can be combined into a receiving cover; the first heat conducting layer Laminating the short part setting portion; a circuit layer is folded over the heat conducting layer along an outer surface thereof; an insulating heat conducting layer is formed along the shape of the circuit layer Foldingly attached to an inner surface of the circuit layer, and the insulating heat conductive layer has a plurality of first holes; a spacer attached to the insulating heat conductive layer and having a plurality of first holes relative to the plurality of first holes a plurality of holes; a plurality of insulating sheets are respectively disposed on the inner side walls of the plurality of second holes; a plurality of LED elements respectively passing through the plurality of second holes and the plurality of first holes and disposed therein a reflective member disposed in the accommodating cover and having a plurality of third holes with respect to the plurality of second holes, wherein the reflecting member is disposed on the accommodating cover The light-emitting surface of the plurality of LED elements respectively passes through the plurality of third holes; the light guide plate is disposed in the accommodating cover relative to the reflector, and the light guide plate is disposed in the space When placed inside the cover, a light incident surface of the light emitting surface; and 39 M413879 a second heat conducting layer attached to the outer surface of the elongated member; wherein 'when the plurality of LED elements respectively pass through the plurality of second holes And the inner surface of the circuit layer is soldered to the inner surface of the circuit layer, wherein the plurality of insulating sheet walls are outwardly diffused; and the inner sidewalls of the plurality of second holes are disposed to prevent the solder from flowing along the inner side of the second hole Wherein, when the plurality of LED elements emit light, heat generated by the plurality of LED elements may be removed bidirectionally via the inner and outer surfaces of the circuit layer and by the insulating and thermally conductive layer and the first heat conducting layer. The LED aperture group having the folded circuit layer according to the item U has a bottom reflection sheet disposed in the housing and located on the long member. The bottom reflection sheet is for preventing light. The side surface of the light guide plate is exposed. 13. The backlight module of claim 4, wherein the reflective member further has a tassel portion, and the light guide plate is disposed in the occlusion housing. The tassel portion may be completely attached to the light guide plate to prevent light from leaking from the gap between the light guide plate and the accommodating cover. 14. The coffee backlight module having a folded circuit layer according to the invention of claim 5, wherein the second heat conductive layer further comprises a heat conduction tassel P field composed of a combination of 3 short pieces and the long piece. The accommodating cover is mounted on the main frame, and the heat transfer tassel can be attached to the bottom plate of the bottom plate 40 of the main frame to further transmit the heat conducted by the second heat conducting layer to the 15. The optical module having a folded circuit layer includes: ', the cover has a long portion, a short portion and a folded portion, wherein the folded portion is connected to the long portion at 3 o'clock. The portion has at least an accommodating space and a plurality of first holes, and the long portion, the short portion and the folded portion are integrally formed; and the 导热 edge heat conducting layer is attached to the folding along the shape of the folded portion. Above, and the insulating and thermally conductive layer is also bent and attached to the accommodating two, wherein the insulating and thermally conductive layer has a plurality of second holes with respect to the plurality of first holes; The inner surface is disposed on the insulating and thermally conductive layer along the shape of the insulating and thermally conductive layer a first heat conducting layer is disposed on the outer surface of the circuit layer along the shape of the circuit layer; a plurality of insulating sheets are respectively disposed on inner sidewalls of the plurality of first holes; a plurality of LED elements are Separatingly passing through the plurality of first holes and the plurality of second holes and disposed on an inner surface of the circuit layer; a reflector member is disposed in the receiving cover body and has a plurality of a plurality of third holes of a hole, wherein when the 41 reflection member is disposed within the accommodating cover, a light emitting surface of the plurality of LED elements respectively passes through the plurality of third holes; the light guide plate Is disposed in the accommodating cover relative to the reflector, and when the light guide plate is disposed in the accommodating cover, a light incident surface thereof faces the light emitting surface; and a second heat conducting layer ′ Attached to the outer surface of the long portion; wherein when the plurality of LED elements respectively pass through the plurality of first holes and the plurality of second holes and are soldered to the inner surface of the circuit layer, at this time, In the plurality of first holes The plurality of insulating sheets on the sidewalls prevent the solder from diffusing outward along the inner sidewall of the first hole; wherein 'when the plurality of LED elements emit light, the heat generated may pass through the inner and outer surfaces of the circuit layer and The insulating and thermally conductive layer and the first heat conducting layer are mutually removed. 16' The LED light-receiving module having a folded circuit layer as described in claim 15 has a bottom reflective sheet, which is disposed on The accommodating cover body is located on the long portion, and the bottom reflective sheet is for preventing light from being exposed by the side surface of the light guide plate. 17. The LED having the folded circuit layer according to claim 15 a backlight module, wherein the reflecting member further has a first-class suture portion, and when the light guiding plate is disposed in the receiving cover body, the tassel portion can be completely attached: ι is attached on the light guiding plate to prevent light from being The quotient of the light guide plate and the accommodating cover body. The gap is leaked. 18. The LED backlight module with a folded circuit layer according to claim 15, wherein the second heat conductive layer further has a heat conductive tassel portion, and the accommodating cover body is mounted on a main frame. The heat-dissipating tassel may be attached to a bottom plate of the main frame to further conduct heat conducted by the second heat-conducting layer to the bottom plate. 19. A LED backlight module having a folded circuit layer, comprising: a cover body having a long portion and a short portion, the long portion being integrally formed with the short portion; a circuit layer disposed on The insulating heat-conducting layer is attached to the inner surface of the circuit layer along the shape of the circuit layer and has a plurality of first holes; the first heat-conducting layer is disposed along the shape of the circuit layer On the outer surface of the circuit layer; a plurality of LED elements, a total of eight, a piece of the knife passes through the plurality of first holes and is disposed on the inner surface of the circuit layer; the reflecting member is disposed in the receiving cover The body has a plurality of first holes that are sucked relative to the plurality of first holes, wherein the plurality of LED elements emit light when the reflecting member is disposed within the accommodating cover The surface is respectively passed through the plurality of second holes; the light guide plate is disposed in the housing cover [[?0 ^ M413879 " with respect to the reflector, and when the light guide plate is disposed in the housing cover When a light incident surface is opposite to the light emitting surface; And a second heat conducting layer attached to the outer surface of the long portion; • a towel, the circuit layer, the heat insulating layer and the guiding (four) bending " into a flexure; wherein 'when the plural When the LED elements emit light, the heat generated by the LED elements can be conducted to the accommodating body via the insulating and thermally conductive layer, and is further excluded via the second heat conducting layer. 20. As claimed in claim 19 The LED back money group having a folded circuit layer further has a bottom reflection sheet disposed in the accommodating cover body and located on the long portion. The bottom reflection sheet is for preventing light from being on the side of the light guide plate. The LED backlight module having a folded circuit layer according to claim 19, wherein the reflector further has a tassel portion, and the light guide plate is disposed on the hood In the body, the tassel can be completely attached to the light guide plate to prevent light from leaking from the gap between the light guide plate and the accommodating cover. 22. As for the patented range of LED backlight modules, 19 of them Said having a folded circuit layer, the second heat conduction The layer further has a heat-dissipating ferrule. When the accommodating cover is mounted to a main frame, the heat-transfer tassel can be adhered to the bottom plate of the main frame by the heat-conducting layer, and the heat is further transmitted to The bottom plate. 44 M413879 — k /〇〇d 〜, 23. The LED backlight module with a folded circuit layer as described in claim 19, t includes at least a branch to assist the circuit layer The insulating heat conducting layer and the heat conducting layer are bent into the flexure. 24. The LED backlight module having a folded circuit layer according to claim 23, wherein 'by the at least one support plate When the circuit layer, the insulating heat conductive layer and the heat conductive layer 1 are folded into the elastic body, and the plurality of LED elements are soldered to the inner surface of the circuit layer, The circuit board can be soldered to the inner surface of the circuit layer at the same time, and the circuit board can be bent at an angle. 25. An optical module having a folded circuit layer, comprising: a cover having a long piece and a short piece integrally formed by bending; wherein the long piece is attached to the long piece (4) being attached to one of the short fitting portions of the short piece, and forming an accommodating space between the long piece mounting portion of the long piece and the short piece mounting portion of the short piece, wherein the short piece mounting portion Having a plurality of first holes; a heat conducting layer disposed in the accommodating space in a folded form; - a circuit layer disposed on the first heat conducting layer along the shape of the first heat conducting slip The circuit layer is disposed on the first heat conducting layer with the outer surface thereof; the inner surface of the insulating heat conductive layer is attached to the electric layer along the shape of the circuit layer and has a plurality of second holes; 45 M413879 The LED elements are respectively disposed through the plurality of first holes and the plurality of second holes and disposed on the inner surface of the circuit layer; the reflective member is disposed on the short part mounting portion and has a plurality of a plurality of third holes of the LED component, wherein, when the When the projecting member is disposed on the short component mounting portion, the light emitting surface of the plurality of LED components is respectively exposed outside the plurality of third holes; and a light guide plate is disposed on the short component with respect to the reflective member unit. 26. The LED backlight module having a folded circuit layer according to claim 25, further comprising a bottom reflective sheet disposed on the short fitting portion for preventing light from being on the side of the light guide plate Surface leaks. 27. The LED backlight module having a folded circuit layer as described in claim 25, wherein the reflective member further has a first-class suture portion, and the tassel portion is disposed when the light guide plate is disposed in the cover body. It can be completely attached to the light guide plate to prevent light from leaking from the gap between the light guide plate and the cover. 28. The LED backlight module having a folded circuit layer according to claim 25, further comprising a heat-transfer tassel formed at a bend of the cover, wherein 'when the cover is disposed on a main body In the frame, the thermally conductive tassel can conform to a bottom plate of the main frame. 46