TWM413087U - LED lighting - Google Patents

Description

V. New description: 【New technology field】 This creation involves a kind of light-emitting diode (LED) light source and its manufacturing method, especially related to the secret LED wire, which is suitable for LED The $ lamp provides high-intensity (four) effects and its manufacturing method is optimized to reduce costs. [Prior Art] In order to operate effectively, a conventional LED light source requires an effective heat sink to dissipate heat. Usually the 'heat dissipation mechanism or heat sink contains natural heat convection, adding a cooling fan unit, adding a heat pipe, providing a heat sink structure, and the like. The cooling fan unit is uncomplicated but has a low recording reliability. The fresh tube has a lower heat dissipation rate, while the heat-absorbing structure is limited by the surface area of its heat sink. All of these existing structures do not satisfactorily solve the heat dissipation problem. A conventional LED light source has a hermetic structure comprising a substrate spear-led element as a substrate, one side of which is bonded to the substrate and the other side is used for illumination. Further, the resin is phase-sealed to enclose the LED element such that the LED element is attached to the substrate. In recent years, the issue of LED heat dissipation has become an important issue in the development of Cong D technology. The material and wealth of the LED listening device are largely determined. 3 M413087 defines the life, function and cost of the LED light source. (iv) r- & Cost In addition, the conventional (10) light source ^ for the early = handle '(four) - the joint surface is not available on the material by the ship's, resulting in relatively low illumination intensity and efficiency. In addition, the light on the surface is converted by the substrate, so that it is converted into a set. On the sheet, 'reading for the twist provides a heading for a higher temperature working environment' and the public duty is The higher the temperature, the more the first-time effects will be discounted. Therefore, the L_scatter problem will form a vicious circle with an LED click and performance. [New content] The purpose of this creation is to provide an LED light source to greatly improve lighting efficiency, reduce design difficulty and reduce manufacturing costs. Another object of the present invention is to provide an LED component that can be illuminated by both sides to prevent heat from collecting on the bonding surface and substrate of the conventional LED light source. Another object of the present invention is to provide an LED element that is directly connected to the two phosphor elements in a two-way manner to form one or more channel ports to thereby achieve heat transfer through the channel port to direct the LED elements. Another object of the present invention is to provide a two-layer LED element that is directly connected to the two fluorescent elements in a two-way manner to form one or more channel openings to thereby achieve the heat of guiding the LED elements through the channel ports. transfer. 4 M413087 Another object of the present invention is to provide a three-layer LED element that is directly connected to the two phosphor elements in a sandwich manner to form one or more passage openings for thereby guiding the LED elements through the passage openings. heat transfer. Another object of the present invention is to provide an LED element that is sandwiched by two fluorescent elements and bonded to a position to form an LED receiving cavity having one or more ports, thereby filling A gas such as an inert gas can be used to fill the containment chamber to further enhance heat dissipation. Another object of the present invention is to provide an LED light source lamp comprising a body of 1%, the casing forming a cavity filled with an inert gas, the casing accommodating at least the LED component or The light test makes it possible to dissipate heat through the entire housing. Another object of the present invention is to provide an Lm) light source lamp comprising a housing forming a housing cavity filled with an inert gas, the housing accommodating at least the LED component or LED light source group, wherein each LED element or LED light source is connected to or connected to a head of the housing to enable the LED component or LED vehicle located in the housing cavity The light produced by the group is up to the entire luminous area of the housing. Therefore, the present invention provides a (four) light source lamp comprising a casing, the casing forming a casing cavity containing a filling gas and a light emitting surface, the LED light source lamp comprising: 5 M413087 - LED light source group, The LED light source group is housed in the housing cavity and supported on a head of the housing to provide illumination, wherein the 'LED light source group includes: at least one LED component, wherein each of the LED components includes a first a light emitting surface and a second light emitting surface to provide illumination by electroluminescence; the two fluorescent elements sandwich the LED element in a sandwich shape such that a light emitting surface is directly pressed against the fluorescent element to obtain Supporting and guiding heat transfer, and light generated by the LED element is respectively transmitted from the two light emitting surfaces to the two fluorescent elements; - an electronic component, two ends of the electronic component are electrically connected to the LED component respectively a corresponding end of the housing to connect to the power source through the housing; and a connecting component, the connecting component connecting the two fluorescent components to form an LED receiving cavity and fixing the two fluorescent devices a connection between optical components Connecting the distance so that the LED element is located between the two fluorescent elements and located in the LED valley, the inner cavity, the two ends of the electronic component extend outward to be connected to the housing Riding a head, a towel, the connecting member further forms a channel opening between the two fluorescent 7L members to connect the (10) element to the reading cavity , from the breaking of the filling gas as the medium / 1 guide heat transfer through the passage opening to leave the (10) element, reach the shell cavity, and further - the shell _ the entire part to effectively disperse 6 M413087 heat The present invention also provides an LED light source set, comprising: at least one LED component, wherein each of the LED components includes a first light emitting surface and a second light emitting surface to provide illumination by electroluminescence; the two fluorescent elements are sandwiched Clamping the LED element such that a light emitting surface is directly pressed against the fluorescent element to obtain support and guide heat transfer, and light generated by the LED element is respectively transmitted from the two light emitting surfaces The two fluorescent elements; an electronic component The two ends are respectively electrically connected to the corresponding ends of the LED elements to connect the head through the housing to a power source; the connecting element 'the connecting elements connect the two camping elements to form an LED Storing a cavity and fixing a connection distance between the two fluorescent elements such that the LED element is located between the two fluorescent elements and located in the LED receiving cavity, the two ends of the electronic component Extending to the outside of the accommodating cavity, wherein the connecting element comprises: - clamping the two ends of the two fluorescent trees respectively for the position it, such that the connecting distance between the two camping elements is greater than a thickness ' of the LED element' to provide a sympathetic hot channel between the light emitting surface and the corresponding phosphor element by a difference between the connection distance and the thickness of the LED element; and 7 The LED arms are respectively connected to the two sides of the LED element to support the LED component, so that the LED component is suspended between the two fluorescent components and located in the LED receiving cavity, thereby realizing Two sides of the LED element and the two fluorescent lights The component directs heat transfer away from the LED element. The present invention also provides a method for manufacturing a LED light source suitable for illumination, comprising the steps of: (a) horizontally overlapping a first current dispersion layer and a second illumination layer; (b) forming an LED layer unit, The LED layer unit has two light emitting surfaces 'by doping the LED layer unit to form a P-type doping unit on the current spreading layer and an N-type doping unit on the illumination layer, thereby Forming a PN junction between the two layers, the PN junction generating electroluminescence; (c) sandwiching the set of LED layers by sandwiching the two phosphor elements, thereby causing the LED The two light emitting surfaces of the layer unit are directly pressed against the two fluorescent elements to obtain support and guide heat transfer; (d) providing an electronic component connected to each ud layer unit to connect the LED layer unit to a power source (e) encapsulating the two fluorescent elements and a connecting element to form a light source group, thereby forming a -LED receiving cavity for accommodating one or more of the layer units, to a single access port, Μ4Ί3087 and formed in the receiving material - An external environment for guiding heat transfer away from the LED layer unit through the passage opening; (1) connecting an electronic component to a head of a housing to form an LED light source lamp, the head support of the housing The (10) light source group such that the LED light source group is housed in a housing filled with a filling gas, wherein the filling gas acts as a medium for heat transfer, thereby guiding heat transfer from the LED light source group The housing; and (g) providing a lighting structure comprising - one connector, each connector for connecting one of the LED light source groups to the head of the housing, The LED light source group is positioned at an optimized position of the housing such that the illumination generated by the LED light source group reaches the light emitting surface of the housing as a whole. In the step (a), optionally including a step of bonding a second substrate layer to the illumination layer; in the step (8), further comprising a step of repeating the steps to form a a group of LED layer units; further comprising a step in the step (e), after the step (e), repeating the steps to form a group of LED light sources; according to the above manufacturing method, the step (f) may be as follows Step instead: connecting a group of LED light sources to a head of a housing to form an LED light source lamp, wherein said electronic component of each of said LED light source groups is coupled to said head of said housing 9 M413087 body In order to support the LED light source group, the LED light source group is housed in a cavity filled with a filling gas, wherein the filling gas acts as a medium for heat transfer, thereby guiding heat transfer from the LED light source. The group reaches the housing; [Embodiment] As shown in FIGS. 1 to 3 and 16 and 17, it is according to the present creation

A preferred embodiment of a light emitting diode (LED) light source comprising one or more LED light source groups 1 适于 suitable for electrical connection to a power source, and a solid member 5. Each LED light source group 1〇〇 includes: at least one LED element 1〇, and a plurality of LEDs 1G have a first hair 11 and a second light emitting surface 12, and are adapted to be electrically connected to the power source; the first fluorescent tree The 20 and - second fluorescent elements 30 are respectively disposed on the first light-emitting surface 11 and the second light-emitting surface 12, wherein the fixing member 5 connects the two fluorescent elements 20, 30 to be in position. 1. 'Ground' As shown in Figs. 2 to 5, the light-emitting surfaces U, 12 of each of the LED light source groups 1 适于 are adapted to generate illumination by electroluminescence. LE] Between light elements _2G and 3G. Grounding, fluorescent element 1 light one =: == r_ through - electrical connection Two ends of two pairs of electric two pieces 81 are electrically connected to the LED element (4), respectively, to be electrically connected to the power source. The U pit position is formed between the two fluorescent pupils - LED ^ ^ between the inner surfaces of the hands 20, 30. The two-cavity 51 side-side element 1 is housed on the inner cavity 51 to be attached to the outer edge of the two fluorescent elements Μ, 30 to hold the squeaking elements 2G, 3G in place. When the two flashlights are outside the two light components 2〇, 3〇 are held in place by the fixing member 5, the interval between the I30s (that is, the width of the LED receiving cavity) is two: the outer capacity of the female is 51. Between the two ends, the two ends of the electronic component 81 extend outward to the accommodating cavity. The two waters are an edge-fixing member having a C-shaped cross section, so that the two waters iM are formed in a vertical portion between the two levels, wherein , on the fixture 5 . Excellent % Γ 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 接 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The intermediate level of the two flickers first 2fl, 3Q _ outer edge =: 5 extends into the LED accommodating cavity 51 to enter the width of the ED accommodating cavity 51, as shown in FIG. The channel member 5 further includes one or more 'between two fluorescent elements 2°, 3〇' to connect the LED element 1 to the outside of the LED housing cavity 51 to pass through the channel port 7〇. The guided heat transfer leaves the LED element 1〇. It is worth mentioning that the LED element 1 〇 provides two light-emitting surfaces u, 12, each of which is connected to one of the phosphor elements 20, 3 and provides one LED element with two light-emitting surfaces. Therefore, the lighting effect can be increased by at least 3〇%. In addition, the LED element 1 is not fixed to a substrate or a heat sink, and the substrate is usually an iron substrate, so that the LED element 1 provides two exposed ends instead of only one, thereby dissipating heat by convection and radiation. Therefore, it becomes possible to make the structure of the heat sink of the Lm) element 10 simple. In other words, the LED element 10 of the present invention provides illumination at a more acute angle than a conventional LED light source that is supported by a substrate or heat sink. The element 1 of the present invention can provide greater than that on each of the light emitting surfaces 11, 12. 180. Angle of illumination. Preferably, the first fluorescent element 20 is a fluorescent wafer, which may be a glass or crystal wafer or a transparent ceramic wafer, and the second fluorescent element 3 is a fluorescent gel, or vice versa. Alternatively, the first fluorescent element 2 〇 and the second fluorescent element 30 are both fluorescent wafers or fluorescent gels. That is, each of the first fluorescent element 20 and the second fluorescent element 30 is selected from one of a fluorescent wafer and a fluorescent colloid. In particular, the fluorescent wafer of one of the phosphor elements 20 (30) is discerned to form the base of the LED element 10 so that heat can also be transferred to dissipate heat away from the LED element 10. Since the thickness of the fluorescent wafer of the fluorescent element 20 (30) is remarkably smaller than that of the conventional LED light source, the efficiency of heat transfer is greatly improved. The fluorescent wafer can be made of a glass material or a crystal or a material in which 12 Μ 4 Ί 3087 is coated with phosphor powder. Preferably, the fluorescent wafer is made of an aluminum garnet doped rare earth metal. As shown in FIG. 2 and FIG. 3, the LED elements 10 are arranged in a sandwich manner between the two phosphors 70 pieces 2G, 3G, wherein the ® optical wafer can be used simultaneously for the first camp light τ 2 2 and the second Camp light component 3〇. In particular, the LED elements 10 are electrically connected in parallel or (four) and are sandwiched between the two light elements 20, 3G in the same horizontal line and at intervals, thereby forming between adjacent two LEDs. - The hot aisle 4 is for heat transfer. It is worth mentioning that the fluorescent wafer has a rigid body to form a rigid support for the LED ,1, avoiding the use of a conventional support substrate (usually an iron substrate) of the L:D source, thereby improving the illumination effect. And reduce the overall size. The thermal path 4〇 between the two adjacent LED elements provides an efficient and direct means of heat dissipation for heat transfer away from the LE:D element 1〇. In the absence of resin-based materials to package LED components and provide hot aisle conditions, effective heat dissipation can be achieved to ensure that the LED components operate under a controlled and reduced temperature condition to increase their lifetime. As shown in Figures 2, 3 and 4, two phosphor wafers are used for the first phosphor element 20 and the dichroic element 30, respectively, and the LED elements 10 are sandwiched in a position parallel to each other. In particular, each Lm) element 1 has a flip-chip structure having six light-emitting surfaces, and includes a plurality of layers that are sequentially overlapped and arranged, sequentially overlapping and arranging a rigid and transparent base layer as shown in FIG. 13, the light-emitting layer 14 and the current dispersion layer 15, wherein the fluorescent material 13 M413087 element 30 of one of the fluorescent elements is connected to the base layer 13, and the other fluorescent element 2 is connected to the current dispersion layer 15. Accordingly, the flip-chip structure of the LED element 10 has a simple structure and is sufficient for two light-emitting surfaces. Preferably, the base layer 13 is sapphire and is bonded to the phosphor element 20 (30) by bonding, preferably by molecular bonding. The use of molecular bonding does not require the transfer of heat from a conductive medium such as a conductive medium to be limited by its maximum heat transfer capability, whereby the molecular bond enables the heat transfer capability and efficiency of the LED element. It is worth mentioning that the base layer 13 can also be made of other materials as long as the base layer 13 can be securely bonded to the phosphor element 2, such as LiALC〇3. Alternatively, the base layer 13 may be removed, and the LED element 1 is bonded to one end of the fluorescent element 20 (30). For example, the LED element 1 is bonded to the end of the fluorescent element 20 (30) without any electrical components, so that the LED element 1 without any substrate layer 13 is directly bonded to the fluorescent element (30). , thereby greatly improving heat transfer away from the LED components. As shown in FIGS. 3 and 5, the LED element 1 is used to provide an illumination effect in which the 'two fluorescent elements 20, 30 sandwich the LED element 1' in a sandwich manner so that the LE:D element 10 is in the two fluorescent elements. The 2〇 and 3〇 are arranged in an orderly manner such that a heat channel 40 is formed between the two opposing faces of the two adjacent elements 1〇. The fixing member 5 is optionally a one-point component or a bonding component 5〇, which is disposed on the inner edge of the glazing elements 20, 30 and is enclosed between the fluorescent elements 2〇, 3〇 so as to surround the bonding component 5G. Connected to the periphery of the S-light elements 20, 30 to hold the LED elements 10 in place between the fluorescent elements 20, 30, 'a set of channel ports 7' are spaced along the bonding elements 50 to accommodate the LED receiving cavity Within 5 ι, heat is transferred away from the LED element 1 by heat through the 40 and the port port 7 〇. - The group support 60 is arranged in an orderly and symmetric manner between the two adjacent LED elements 10 in the hot channel 40 to maintain the relative position between each adjacent element 1' and maintain the two phosphor elements 20 The distance between the LED accommodating chambers 51 and 30 is 30. Preferably, an inert gas having high conductivity such as helium gas and hydrogen gas can be used to fill the space of the LED accommodating chamber 51 between the two phosphor elements 20, 30 to further enhance heat transfer, guiding heat transfer away from the LED element 1 〇 . It is worth mentioning that the LED element 1 is sandwiched by the two fluorescent elements 2〇, 3〇 in a sandwich manner, and is formed by the combined reading 5Q, and the channel port 70 leads to the hot channel 40 to effectively realize the heat dissipation function. . Preferably, the bonding element 50 is a silicone, which reflects light, and includes an electronic component 81. The motor dispersion layer a includes a p-type doping unit 1〇2, and the light-emitting layer 14 is included on the side close to the current dispersion layer 14. The N-cell unit is, for example, (10) the element 10 is connected in parallel or in series, and the LED element 1 is electrically connected to the electronic component 81 through a wire correction 80, which may be a metal wire 'copper wire or the like. Specifically, the connecting wire member 8 is connected to the p-type replacing unit 1〇2 and the N-type cleaning unit of the two adjacent (10) elements 10 such that each two LED elements 1〇 are electrically connected by the connecting wire member 8〇, and The LED element 1〇 located at the end is also connected to the electronic component 81. Alternatively, the fixture 5 of the LED light source includes a two-position element 90 disposed at its end to hold the two phosphor elements 20, 30 in place, as shown in FIG. The use of the location element 90 without the use of the bonding element 5〇 mentioned above may allow direct contact of the LED element 10 with the two phosphor elements 20, 30, further optimizing the heat dissipation function of the LED element 10. It is worth mentioning that, as a variant embodiment, the LED light source does not have a flip-chip structure, that is, has a standard LED light source structure, wherein the p-type doping unit 102 and the N-type doping unit 1〇1 are located at two of the LED elements 10. Corresponding face. As shown in FIG. 16, the LED light source group 1 includes: an LED element 1 〇, which includes two light emitting surfaces 11 and 12 to provide illumination by electroluminescence; and the two fluorescent elements 2, 30 are sandwiched. Led element 1〇, so that a light-emitting surface 丨丨 (12) faces a corresponding fluorescent element 2〇(3〇)′ such that light generated by the LED element 10 is transmitted from the two light-emitting surfaces To two fluorescent components, 3 〇. That is, the 'P-type doping unit 102 and the N-type doping unit 1'1 are respectively located on the two light-emitting surfaces I and 12 of the LED element 1''. Both ends of the electronic component 81 are electrically connected to the two corresponding ends of the LED component 1 to be connected to a power source. The fixing member 5 electrically connects the LED element 1 〇 and the two fluorescent π pieces 20, 30 to be in position, thereby forming a distance between the LED accommodating cavity 51 and the fixed two fluorescent elements 20, 30, so that the component 1 is squatted (10) The accommodating cavity 51 is suspended between the two fluorescent elements 2〇, 3〇, and both ends of the electronic component μ extend outward to the outside of the LED accommodating cavity 51. The fixing member 5 further includes two fluorescent 7L members 20 and 30. One or more channel ports 7 are interposed to allow the LED elements 10 to communicate with the external environment outside the LED valleys 51 to effect heat transfer away from the LED elements 10 through the channel ports. Preferably, the 'fixing member 5' includes two positional elements 90 disposed at the ends thereof to hold the two fluorescent elements 20, 3G in place so that the (10) tree is between the two fluorescent elements 20, 3G and passes through the two positions. () Wei Wei. Specifically, as shown in FIGS. 16 and 17, the fixing member 5 includes two positional members 90, and each of the positional members 90 is longitudinally provided with two sides facing the receiving groove and a pair of the room _92 disposed on both sides. Between the accommodating grooves 91, the fixing member 5 further comprises two horns 3 per LED g piece 93 having a first end adapted to be inserted into the intermediate receiving groove 91 of the corresponding positional element (10), and a second end _(10) element iq Side end. The crystal's two-position element 9〇 provides two sets of housings 91 92 on each position element (10). And preferably arranged in parallel with each other at intervals, wherein each of the members 90 of the member 90 is adapted to accommodate one end of the two fluorescent elements/, and the intermediate receiving groove 9 is appropriately sized. Which arm member 93 is accommodated. Correspondingly, the two fluorescent elements 2〇, 3〇 respectively read 90 scales (four) into two-positioned--the connection distance between the receiving cavity 51 and the fixed-two fluorescent elements 20, 3〇, such that the thickness is less than the connection distance. (10) The component 1 is disposed in the receiving cavity 51 and supported by the LED arm member 93 between the two camping light elements 20, 30, and further forms a heat between the two working elements 20, 30 and a member 1G. The channel. Thus through the hot channel sin and (d) the piece of material on both sides of the 10 (four) light element heat transfer. 17 is not shown when the LED light source group 1A includes a set of standard structure turns 10, the LED elements 1 are cut by a set of LED arm members 93 and connected by a set of connecting wire members 80. That is to say, each of the LED elements 10 is supported by the two arm members 93 at the two side ends, such that one LED element 1 is connected to the other LED element 1 〇 'the two LED elements 10 at the end of the LED light source group are respectively connected to the positional element 9 Hey. On the other hand, every two turns are connected by a connecting wire member 80. It is worth mentioning that an LED light source of the present invention provides an effective heat dissipation method for the LED element 1〇 or the flip-chip LED element 1〇 or the standard structure (non-flip-chip structure) LED element 1〇, and is suitable for different The structure and assembly for different applications, such as light source lights, emergency lights, downlights, car lights, street lighting, subway lighting, interior lighting, table/table lamps, hanging lights, candle lights, etc. When the LED light source of the present invention is applied to an LED light source, the LED light source group of the flip-chip structure and the LED light source group of the standard structure can be replaced with each other without departing from the spirit of the present invention. As shown in FIG. 6 , the LED light source of the present invention is applied to an LED light source lamp, which comprises a casing 110 ′ forming a cavity in the casing 11 , and a filling gas 112 in the casing U1 , wherein in the casing 110 One or more LED light source groups 1 are supported in the housing 111 to form an LED light source. Accordingly, each LED element 10 is adapted to generate light in the housing 111 and penetrate the housing 10. Further, the electronic component 81 is electrically connected between the LED component 1A and the light source lamp adapter 82 to supply power to the LED component 1A via the electronic component 81. Accordingly, heat dissipation is achieved by providing the passage port 70 to guide heat transfer away from the LED element 10 to the housing cavity 111 of the housing 110. As shown in Fig. 6, the LED elements 10 are arranged end to end to form an elongated structure in which the LED elements 10 are arranged in the same direction so that the LED elements ί illuminate on both sides. Alternatively, as shown in Fig. 6A, the LED elements W are arranged end-to-end to form an elongated structure in which the LED elements 1 are arranged in different directions so that the LED elements 1 发光 emit light in different directions. As shown in Fig. 6A, some of the LED elements 1 emit light toward the front-rear direction, and the LED elements 1 emit light toward the left-right direction. Therefore, the LED elements 1 发光 emit light in a selectable direction to provide 360-degree illumination to the LED light source set 100. Accordingly, the fill gas 112 can be an inert gas that can act as a medium for (10) reading 10 and housing 110 such that all of the surface area of the housing 11 can be used for heat dissipation. Preferably the 'filler gas is polydimethyl weiss (second oil). As a result, the surface area of 'secret (four) is greatly increased, so that the heat dissipation efficiency is improved. The filling gas 112 is an inert gas surrounding the LED element, which is sealed in the cavity lu of the casing 11G, and the LED tree 1G is filled with an inert gas. The inner cavity of the shell cavity is protected from oxidation, resulting in a longer life and higher reliability. Preferably, the LED light source set may further include a conduit 12, a light source lamp adapter 82 connecting the two camping lights 2, 30 and the housing 11G, as shown in Figs. 7 and 8. It is worth mentioning that the size and shape of the housing (10) can be selectively = into the configuration shown in Figures 6-11. The housing 110 may be an elongated structure as shown in Fig. 5 and no., an elliptical structure as shown in Fig. 7, a conventional bulb structure of Fig. 8 and Fig. 8, or a flask structure as shown in Fig. 9. As shown in Fig. 9, '10' is applied to a downlight, in particular, the downlight includes a two-layer body to form a first main body layer 13 as an outer layer and a second main body layer 14Q as an inner layer. And forming a two body layer (10), a layer cavity between the layers and a layer opening 15 that connects the layer cavity to the outside. Preferably, the light source of the present invention further includes a light reflecting element 16G extending from the side of the side of the two fluorescent elements 2 (3G) so as to be spaced apart along the LED The light source group is extended such that the light emitted by the LED read 1 射 is directed in one direction by the guidance of the light reflecting element 16 以 for providing a single-directional illumination effect. That is, by providing the light reflecting element 16Q, the light emitted from the LED light source is collected and reflected to a predetermined direction as shown in FIG. Preferably, the LED light source of the present invention further comprises a light-emitting structure 17 comprising one or more connectors 17A, wherein each connector 17 is connected to the LED light source group 1' One end is supported by the housing 1〇 of the light source lamp such that the LED light source group is located at an optimum position of the housing 1U of the housing 11〇. For example, as shown in FIG. 11, the light-emitting structure 17 for supporting the LED light source in the housing   and 100 includes a plurality of radially connected connectors ι 〇, each connected to the LED light source group. At one end, the connector 17 is concentrically extended outwardly from the housing 110 such that the LE:D elements 1 are arranged in an orderly manner in the center of the housing, providing illumination through the illumination surface 1102 of the housing 110. It is worth mentioning that the housing no can also be used as a heat dissipation medium. Specifically, as shown in FIG. 11, the LED light source group includes: an LED element sandwiching the LED element W with a U 13⁄4 optical element 20, 30 and a bonding element 50 for bonding (10) the element 1 to be placed in two Between the camping elements 20 ' 3G and between the two fluorescent lights 2 (), 3 () form a ‧ 通道 channel port 7 〇. Bonding element 50 includes - electronic components at its ends

The LED light source group includes: a set of parallel or series (10) elements 10 for illumination, two fluorescent elements 20, 30 sandwiched by a sandwich (4), and a - binding element 5G secret combination (10) element 1 () is placed between the two fluorescent elements 20, 30 and forms a circumstance port 7 在 between the two fluorescent elements 2 (), 3Q. The bonding element 5A includes an electronic component 81 at its end for electrically connecting the LED component 10 and the light source lamp adapter 82 of the housing 110 to be connected to a power source.

The 81' electronic component 81 is used to electrically connect (10) the component 10 and the light source lamp adapter 82 of the housing H0 to be connected to a power source. By way of example, the two fluorescent elements 2, Continental are two identical rectangular fluorescent wafers 2G, 3G to form two opposite connecting sides, on which the -th-end and -second ends of the electronic component 81 are located. Connect the component 1〇. As an example, referring to FIG. 13, the two fluorescent elements 30 are two identical circular fluorescent wafers 20, 3'' to form opposite connecting sides, and a first end and a second end of the electronic unit 81 are located. The LED element 10 is connected to one of the LED elements 1 位于 as shown in the figure, and the other LED elements 10 concentrically surround the centrally located LED element 1 以 so that the channel 40 leading to the channel opening 70 is along The edge of the led light source group is arranged in a light-emitting manner, which optimizes the heat dissipation effect. (10) Γ The LED light source group shown in Fig. 14 and Fig. 15 includes: an H ^ - position element 9G for placing (10) element 10 at two! light: between pieces 20, 30 ' and 1 sub-electronic money first = The two ends are connected to opposite sides of the component 1α, and the electronic components are located on opposite sides of the LED light source assembly, and are electrically connected by the thin component 10.

Connected to - power supply. It is worth mentioning that, in this embodiment, the component 1 (which does not need to have a flip-chip structure. Alternatively) is shown in Figure 18 as an embodiment of the housing 110, wherein the housing 110 is not suitable for For example, the casing m may have a segmented structure as shown in Fig. 18, a turbid structure as shown in Fig. 19, and a cup-like structure as shown in Fig. 2G.

Preferably, the LED light source lamp of the present invention further includes a heat guiding structure 18' on the outer surface of the casing 11 so that when a high-power (10) light source group is used, the heat dissipation can be further improved when the outer lighting is used. Surface area. For example, as shown in Fig. LED, the LED light source lamp includes: a casing 11 〇, the body ιι 形成 forms a light emitting surface on one side, and forms a non-hairline on the reverse side, (10) the light source group is used to provide illumination effects... The reflective element (10) is for transferring light from the LED light source group to the light emitting surface 1102 to provide an illumination effect through the light emitting surface, and a heat guiding structure 18 including a heat sink 181, a heat sink 181 The non-illuminating surface of the housing 11 呈 extends lightly to provide an additional 22 heat dissipation surface area. It is worth mentioning that the LED light source lamp of this creation can also be used as an LED backlight display for a computer or a television. As shown in FIG. 22, the led light source lamps are arranged to generate illumination through the reflective cup 190. The reflective cup 19 is connected to a reflecting plate 191 and a diffusing plate 192' so that the light is guided by the reflecting cup 19, the reflecting plate 191 and the diffusing plate 192. A light guide plate 193 is provided to provide a lighting effect. It is worth mentioning that compared to conventional lighting devices, the LED light source also releases heat when producing illumination. The heat generated increases the ambient temperature, which has an adverse effect on the efficiency of the light source. In the conventional technical towel, the illumination effect of the LED light source is generated by electroluminescence through electrons and electron holes, and thus is affected by the external energy supplied by the current on the p_N junction, and the illumination effect of the P_N junction needs to pass through the WD. The semiconductor material of the light source itself and the encapsulating material to reach the outside to provide a lighting effect. As a result, from the effects of energy input and energy input, light radiation output and light transmission efficiency, the percentage of energy converted to light is only about 30% to 40%, and the percentage converted to heat is about 70%. Correspondingly, thermal management has become an important factor in the improvement of traditional technologies. Compared with the prior art, the improvement of the present invention is to improve the lighting efficiency and reduce the generated heat, which effectively solves the inefficiency problem of the LED light source. The LED light source of the present invention effectively avoids the biasing use of the special heat absorption β of the LED light source in the prior art, provides illumination effect on the surface by utilizing the characteristics of electroluminescence, and optimizes the use of the illumination effect on all surfaces to make the illumination Efficacy is increased to 30% or higher. At the same time, the traditional heat sink acts as the main or only 23 channel's by providing an open area surrounding the LED elements for heat dissipation. This solution solves the bottle problem that hinders the heat dissipation of the conventional reader, and greatly improves the illumination efficiency and the dispersion rate. In addition, the improvement of heat dissipation efficiency provides a low ambient temperature to optimize the conditions for electrons and electron holes to provide efficient illumination through electro-optical light, resulting in high heat dissipation efficiency _ high illumination efficiency - two heat dissipation The loop of efficacy. In the test of the (10) light source of this creation, the percentage of electricity converted to light energy was 85% or higher. In addition, an additional filling gas is provided around the LED element 1〇 for guiding the heat dissipation to reduce the ambient temperature of the LED element, and the percentage of converting the electrical energy into light energy is increased to 9〇% or higher. The important effects of creation. Alternatively, as shown in Figs. 23 to 25, the LE:D light source includes a housing or a group of LED light sources 1 〇〇, and the led light source group 1 is accommodated and supported in the housing 110. The casing U 形成 forms a cavity lu L in the casing 11 于 to be filled with the filling oxygen enthalpy 2 . Each LED light source group includes a set of led elements 10, a set of connecting wires 80 electrically connected to the LED elements 1〇, two fluorescent elements 20, 30'-electronic elements 81 and - light reflections; The two fluorescent elements 20'30 are disposed on the two light emitting surfaces 11 and 12 of the LED element 1 to keep the LE:D element 10 in place, so that the LED element 丨〇 can be formed through the two light emitting surfaces. The two luminaires are 2 〇, 3 〇, and illumination is provided on the two illuminating surfaces u, 12 by electroluminescence at an angle greater than 180°. 24 Thunder: 81 is electrically connected to the LED element to electrically connect the LED element to /', and the LED element is connected by the connecting wire 8〇. The light reflecting element (10) is positioned along the side of the _ side of the two fluorosystems (4) (10) so that the smoke is intermittently extended along the LED so that the light emitted by the LED 通过 件 通过 passes through the reflective surface of the light reflecting element (10). ^ and shoot in - direction 'to provide a single-direction lighting effect. Also, by sinking the light-reflecting element (10), the light emitted by the LED light source is collected and reflected to a predetermined direction. — _ The cattle 10 are arranged to provide a uniform and ideal amount of luminescence. Accordingly, every two LED 7C members 1G are arranged in pairs 'where - one LED element 1G is - the first LED element 1GA ' has a inverted structure, and the other element is a second LED element (10)' which has a standard structure . For example, as shown in Figures 24 and 25, the L-assist elements 10 are arranged in two rows to provide uniform and ideal illumination. The two rows of LED elements 10 have a flip-chip structure and a repetitive structure of a standard structure to provide a uniform and ideal amount of illumination. /V again 110 also includes a shell coating to facilitate heat transfer. For example, > Figure 23 τ 'Shell 11Q inside the cabinet is high shell coating 11GW Worry &&&&& Hoi made of polydimethyl Wei burned material or other materials with similar heat transfer properties to make. 27A and FIG. 3B show another modified embodiment of the LED light source'. The LEDH further includes an electrically conductive layer 80A, and the electrically conductive layer 80A is overlaid onto the luminaires 20, 30, wherein the LED elements 10 and The electrically conductive layer 80A is electrically contacted [ such that the LED elements are electrically connected in parallel or in series and (10) the components are electrically connected to the electronic component 8 via the electrically conductive layer 80A. In other words, the above-mentioned connection conductor element (10) for electrically connecting the LED elements can be In this embodiment wire. In other words, the connecting element can be a connecting wire or a printed circuit board electrically connected to the LED element 1A. As shown in Fig. 27 to Fig. 29, the 'conducting layer is applied to each of the light-emitting elements 2, the fire, and the conductive layer _ is made of a transparent material to be suitable for light to pass through, thereby "turning light to generate light, It is able to penetrate the electrically conductive layer to reach the fluorescent elements 20,30. As shown in Fig. 29 and Fig. 30, (10) the opposite faces of the element 1 are electrically secured to the electrically conductive layer _ on the phosphor elements 20, 3, respectively. Grounding, p-type replacement unit Where the __doping unit 101 is located on the opposite side of the (10) element ι, = electrically stealing the conductivity layer of the fluorescent element (10), 3 。. According to the preferred embodiment of the present invention, the p-doping unit of the printed circuit layer 10 coated on the fluorescent element 2〇, 3〇 can be used as the doping unit. Correspondingly, the __ light source should be integrated with an -AC power supply, without the need for AC/DC converters or conversions. The fluorescent element 20, 3G has at least two (10) components ^ on the ground, and the components are connected to each other through the science object (four). In addition

When disposed at the side edge ends of the fluorescent elements 2G, 3G and electrically connected to the electrically conductive layer '(4) (10) to turn the first wheel (four), 30, the LED 26 70 is passed through the electrically conductive layer 80A and the electronic component 81 through the above manufacturing method. The woman is responsible for the efficiency, efficiency and heat dissipation. - It is worth mentioning that the 'conducting layer can be in the field of the fluorescent elements 20, 3, the 'Phod' unit _ the type doping unit 1 〇 1 is located on the same side of the LED element 1 ,, also the hetero unit _ Yufa first face „, 12==

(10) and the material (10) one of the tree wheel parts (four) is mixed early; the guide layer 8QA is electrically integrated. As shown in FIG. 29A, the 'conducting layer is a printed circuit layer, and is formed on the fluorescent tree 2G, which has a set of connection bases _ respectively printed on the f-light elements 2, 3G to separate the components (10). The p-type change cell is dying (4) the material is connected and the connection component view

Electrical connection. Correspondingly, the illumination tool is also printed on the fluorescent elements 2, 30 to electrically connect the elements 1 〇, and each (10) element 1G' has a P-type doping on the same light-emitting surface 11. The unit 102 and the N-type doping are electrically connected to the electrically conductive layer 8A. The LED element 1〇 of the LED light source group 1〇〇 can be mounted in the shattering body 110 to form an LED light source lamp structure, as shown in FIG. 7 - FIG. 1 , FIG. 18 , FIG. 2 and FIG. 23 - The 24 households are arranged end-to-end and have different orientations to form an elongate structure, as shown in Figure 6A, to provide full-angle illumination. The combination of different orientations of the LED elements of the Led source set can be seen as a variant embodiment that is apparent from the present writing. The present invention also provides a method of manufacturing the LED light source of the above preferred embodiment 27 M413087. As shown in FIG. 26, the method of manufacturing the LED element 10 includes the following steps. (1) The first current layering layer 15 and the second lighting layer 14 are overlapped, and preferably arranged in the horizontal direction. (2) forming the LED element 1 (), forming two light-emitting surfaces u, 12' on the LED element 1G. A p-type doping unit 102 is formed on the current-distributing layer 15 of the doped LED element 1 and a N is formed on the illumination layer 14. The type cell ι〇ι is formed such that a -PN junction is formed between the two layers 14'15 to produce electroluminescence. Preferably the method further comprises the step of bonding the third substrate layer 13 to the illumination layer 14. The manufacturing method of the LED light source group 1〇〇 includes the following steps. (a) arranging the two fluorescent elements 20, 30 and the at least one LED element 1 in a sandwich manner so that the two light-emitting surfaces u, 12 of the LED element 10 are pressed against the two fluorescent elements 20, 30 to directly support The list also guides the heat transfer. (b) The LE:D element 10 is electrically coupled to the electronic component 81 to electrically connect the Lm) component 10 to the power source. (c) forming the LED gull chamber 51 by accommodating the two fluorescent elements 2, 3, and a fixing member 5 to accommodate one or more of the LED elements 1 〇 so as to be outside the accommodating chamber 51 and the accommodating chamber 51 One or more ports 70 are formed between the external environments to effect heat transfer through the channel ports 7〇 away from the lED layer unit 10' to form an LED light source group 1A. It is worth mentioning that the two phosphor elements 2, 30 can be used to accommodate a group of LED elements 10. Correspondingly, the LED element 1 in step (a) is sandwiched between the two phosphor elements 20, 30 in the manner of a sandwich 28 M4.13087, so that the two light emitting surfaces 11, 12 of the LED element 10 are pressed against the two phosphors. The elements 20, 30 are directly supported and direct heat transfer. When a set of LED elements 10 is included, the LED elements are arranged in such a way that a thermal path 4 形成 is formed between two adjacent LED elements 10, and the hot aisle 40 leads to the port opening 70 to optimize the heat dissipation effect. When it comes to manufacturing a light source lamp, the method further includes the following steps. Lu (A) supports one or more LED light source groups 100 in the cavity 111 of the core 110. (B) electrically connecting the electronic component 81 to the light source lamp adapter 82 of the housing 11' so that the LED light source group is housed in the housing chamber ill, and the housing chamber Hi is filled with the filling gas 112 as a medium for heat transfer to guide LE: The heat generated by the D source group reaches the core 110' to form a led light source. When a set of LED light source groups 100 is included, a light effect junction structure 17 can also be provided to optimize the lighting effect. Correspondingly, the method comprises the following steps: (A.1) providing a light-emitting structure π, the light-effect structure comprising one or more connectors 170, each connector 170 for arranging an LED light source group 1 and a shell The light source lamp adapter 82 of the body 110 is connected such that the LED light source group 1 is located at a desired position of the cavity 112, so that the illumination generated by the LED light source group 1 can reach the light emitting surface 11〇2 of the housing 110 as a whole. . It is worthwhile to lift up, the fixture 5 can be a -binding forest 5Q or a two-position element 90 to hold the two fluorescent elements plus, 29 M413087 30 in place by molecular bonding or clamping. The LED component 10 can be two layers of LED components or three layers 10 to provide illumination on both sides. Alternatively, the light source of the present creation can be manufactured by the following method, as shown in Figs. 31 and 32. Each of the LED elements 10 is connected to the first fluorescent element 2A, and each (10) element 10 is mounted in an inverted manner as shown in FIG. Accordingly, the P-type impurity-changing unit 102 and the N-type doping unit 101 are located on the same side of the LED element 1A as the disk-light-emitting element 20, as shown in FIG. The connecting wire member 8 is pre-arranged on the first fluorescent member 20 to form a group of protruding points on the first glory element 2A and is matched with the LED element 10, so that (10) the element 1〇 and the first illuminating unit When the device is spliced at 20 o'clock, the LED tree 1G is electrically connected to the connecting wire member 80. It is worthwhile to mention that when the (four) element (four) is smuggled with the first fluorescent element 2, the electrically conductive layer 8GA can be a printed circuit layer to be formed in advance on the first illuminating element 20. Then, after the LED element 1 is spliced with the first fluorescent element, the second fluorescent element 30 can be overlaid on the (10) element 1 ,, so that the LED element 1 夹 is sandwiched in the fluorescent element 2〇 , 3〇^. It is worth mentioning that, by this method, the LED element 1 can be accurately positioned on the first luminaire element 20 and fixed between the fluorescent element and the 〇. FIG. 33 shows another modified embodiment of the phosphor element 30, the glory element 3 (M is a thin phosphor layer superimposed on each of the LED elements i 继, wherein the camping layer 30A performs the function of the above-described phosphor element 3 〇 Accordingly, since the p-type impurity-doping unit 102 and the N-type doping unit 1〇1 are located on the same plane of the element 1〇, the phosphor layer 30A is preferably formed on the other side of the element (10) in a coating manner. The countable GAs reduce the thickness of the phosphor elements 3〇 to substantially reduce the total thickness of the LED light source. In particular, each LED element is configured to have an illumination layer 14 and a current dispersion layer 15, wherein p-type The replacement unit 102 and the N-type connection unit 1〇1 are located on the current dispersion layer 15 and serve as a protruding connection site on the LED element 1。. As shown in FIG. 34, the LED element 1 is connected to the first glory element. 2〇, where 'P-type doping unit 102 and N-type doping unit 1〇1 are located on the same plane of (10) element 1〇' and do not face the first light-emitting element 2Q. Fluorescent thin layer writes instead of camping light A member 30 is coated on the LED element 1 以 to cover the p-type doping unit i 〇 2 and the N-type doping single 〇 1 , thus at the first The optical element 2 is covered (10) with the element 10. Accordingly, the 'connecting wire element 80 is ultrasonically welded to the first fluorescent element 20' to electrically splicing with the p-type doping unit 1〇2 and the N-type replacing unit. 'The connection site defect of the P-type doping unit 1〇2 and the N-type doping unit 1〇1 and the connecting wire element 8G are covered by the germanium layer. Fig. 35 shows another position of the LED element 1〇, where (10) element 1 is connected to the first phosphor layer 2G, and the p-type doping unit 1 () 2 and the N-type doping unit 101 are located on the same plane of the LED element 1 , and face the first fluorescent element 20. In other words, the P-type doping unit 1〇2^N-type doping unit ι〇ι is electrically connected to the wire element 8〇 by the soldering technique on the first-fluorescent element 2G. The crab light layer 30Α replaces the #-light element 3〇Α and coated on the LED element 1〇 to cover the LED element 10 on the M413087 first-fluorescent element 20. Alternatively, a few pieces of fluorescent light may be overlapped in which element-group discrete The camping light element 31A replaces the base layer 13 so that the discrete fluorescent elements 31A are superposed on the illumination layer 14, as shown in Fig. 100. "That is also the "bride" base layer 1 3 may be an integrated layer integrally bonded to the fluorescent tree 3G, which is integrated into the corresponding gemstone layer of the corresponding fluorescent element, a thin fluorescent layer drain, or a discrete fluorescent element 31A. It is worth mentioning that these embodiments and variant embodiments The LED light source lamp shown in Fig. HI and Xintu 18-23 can be used in the same light source device. In addition, the connecting wire 8〇 and the electrically conductive layer are alternatively p-doped with the LED element 10. The unit 1〇2 and the N-type impurity-changing unit ιοί are electrically connected. The p-type doping unit 102 and the N-type doping unit 〇1 may be formed on the same side of the LED element 10 or (4) in the LE]) The opposite face of the component 10 is electrically spliced to the connecting wire member 80 or the electrically conductive layer 8A. Accordingly, by the above manufacturing method, the manufacturing cost is lowered and the luminous efficacy and heat dissipation efficiency are greatly improved. In addition, the conventional light source has a relatively large amount of heat to the critical point. c, because the heat is held and sealed in the resin shell and can only be transferred through the sapphire substrate. Therefore, when the heat generated by the conventional MD light source causes the temperature to rise, the light intensity of the conventional LE:D light source is lowered. Compared with this creation, the LED light source of this creation only produces heat to about 40-50 〇C, because the fluorescent elements 2〇, 3〇 can effectively send out the heat, so that a traditional fan can be integrated into the led The light source is used to generate a gas flow, thereby enhancing the heat dissipation effect of the LED light source of the present invention 32 M4.13087. Once the ambient environment of the LED source is reduced, the light intensity of the lED source is increased, thereby minimizing the heat generated. In addition, the traditional bias believes that LEDs require a specific heat sink base as a support, and this creation overcomes the unresolved defects of this bias. In this creation, the heat sink is not used, but the light can be generated through the sides of the LED light source. This overcomes the limitation of the illumination angle of the conventional LED and provides the possibility of utilizing light energy from all illumination angles. 3〇% or more of the utilization of light energy. In other words, this creation virtually completely overcomes the thermal bottleneck of conventional cooling pedestals and at the same time achieves full illumination and heat dissipation from all angles', which greatly improves the efficiency of illumination and heat dissipation. In particular, 'this creation makes the LED π 10 work efficiently in a relatively low environment and greatly enhances its heat dissipation performance, which provides an optimized environment for electron holes to be provided by electroluminescence. Efficient bottle of fruit, resulting in a high heat dissipation rate together with the lighting effect - a good working cycle of high heat dissipation. The LED light source of this creation has a lion or more energy conversion rate in the electro-optic energy conversion test. It will be understood by those skilled in the art that the actual remuneration of the present invention shown in the above description and the drawings is only for scales* and is not related to the creation. It can be seen that the purpose of this creation has been completed and effectively achieved. The function and structural principle of the present invention have been shown and described in the embodiments, and the embodiments may be modified arbitrarily without departing from the principles. Therefore, the present invention includes all variants of the invention based on the spirit of the claims and the scope of the claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of an LED system according to the present invention. Fig. 2 is a plan view showing a modified embodiment of the (10) light source according to the above preferred embodiment of the present invention. i. A cross-sectional view along the line A-A of a variant embodiment of the LED light source of the above preferred embodiment of the present invention. Figure 4 is a cross-sectional view of a (10) element of the 光源led light source in accordance with the above-described preferred embodiment of the present invention. Fig. 5 is a partial enlarged view showing the structural relationship between the LED elements of the LED light source and the two fluorescent elements according to the above preferred embodiment of the present invention. Figure 6 is a side elevational view of another modified embodiment of the money in accordance with the above-described preferred embodiment of the present invention. 6A is a side view of another modified embodiment of the LED light source according to the above-described preferred embodiment of the present invention. FIG. 7 is a side view of another preferred embodiment of the LED light according to the present invention. . Figure 8 is a side elevational view of another variation of the preferred embodiment of the LED S source in accordance with the present teachings. Figure 9 is a side elevational view of another variant M4.13087 embodiment of the (10) & source according to the above-described preferred embodiment of the present invention. Figure 10 is a side elevational view of another modified embodiment of an LED light source in accordance with the above-described preferred embodiment of the present invention. Figure 11 is a side elevational view of another modified embodiment of an LED light source in accordance with the above-described preferred embodiment of the present invention. Figure 12 is a top plan view of another modified embodiment of an LED light source in accordance with the above-described preferred embodiment of the present invention. Figure 13 is a top plan view of another modified embodiment of an LED light source in accordance with the above-described preferred embodiment of the present invention. Figure 14 is a side elevational view of another modified embodiment of an LED light source in accordance with the above-described preferred embodiment of the present invention. Figure 15 is a top plan view of another modified embodiment of the LED light source of Figure 14 in accordance with the above-described preferred embodiment of the present invention. Figure 16 is a cross-sectional view showing another modified embodiment of the LED light source according to the above preferred embodiment of the present invention. Figure 17 is a cross-sectional view showing another modified embodiment of the LED light source according to the above preferred embodiment of the present invention. Figure 18 is a side elevational view of another embodiment of the LED light source in accordance with the above-described preferred embodiment of the present invention. Figure 19 is a side elevational view of another general embodiment of an LE:D light source in accordance with the above-described preferred embodiment of the present invention. 35 M413087 Figure 20 is a side elevational view of another modified embodiment of an LED light source in accordance with the above-described preferred embodiment of the present invention. Figure 21 is a partially enlarged view of another modified embodiment of the LED light source in accordance with the above-described preferred embodiment of the present invention. Figure 22 is a cross-sectional view showing another modified embodiment of the LED light source according to the above preferred embodiment of the present invention. Figure 23 is a partial enlarged view of another modified embodiment of the LEI) light source in accordance with the above-described preferred embodiment of the present invention. Fig. 24 is a plan view showing the LED light source group of the LED light source of Fig. 23 according to another modified embodiment of the above preferred embodiment of the present invention. Figure 25 is a cross-sectional view of the led light source group of the LED light source of another modified embodiment of the above preferred embodiment of Figure 24 taken along line A-A. Fig. 26 is a schematic view of the LE]) manufacturing method according to the above preferred embodiment of the present invention. Fig. 27 shows an LED light source of another modified embodiment of the above preferred embodiment of the present invention. A cross-sectional view of an LED light source according to the above-described other modified embodiment of the above preferred embodiment of the present invention. Figure 29 "'The LED element is not electrically connected to the conductive layer according to the above preferred embodiment of the present invention. t(4) is an exploded view of FIG. 29A, showing the 36 conductive layer according to the above preferred embodiment of the present invention. (4) The 1-way layer is formed on the $-light element. The page is not based on the p-type doping unit and the N-type doping unit of the above-described preferred embodiment of the present invention. Which of the above-described preferred embodiments is created in which the component is placed on the fluorescent component in an inverted manner. Figure 32 shows that the ship® is mounted on the fluorescent component in an inverted manner according to the selection of the button. Figure 33 is a side view showing the phosphor layer in the above preferred embodiment according to the present invention. Figure 34 is a side view showing a modification of the phosphor layer in the above preferred embodiment according to the present invention. Figure 35 is a side elevational view showing a second modified embodiment of the phosphor layer in the above preferred embodiment according to the present invention. Figure 36 is a cross-sectional view showing the phosphor layer in the above preferred embodiment according to the present invention. Third Deformation embodiment. [Description of main components] 100 LED light source group 10 LED element 11 first light emitting surface 12 second light emitting surface 13 base layer 14 light emitting layer 15 current dispersion layer 20 first fluorescent element 37 M413087 30 second firefly Light element 5 fixing member 70 passage port 81 electronic component 40 hot channel 51 LED housing cavity 80 connecting wire component

38

Claims (1)

M413087 * · VI. Patent Application Range: 1. An LED light source 'comprises one or more LED light source groups, wherein each of the LED light source groups comprises: at least one LED element, wherein the LED element has a first light emitting surface and a second light-emitting surface on the reverse side, wherein the LED element is adapted to provide illumination greater than 180° by electroluminescence on each of the first light-emitting surface and the second light-emitting surface; • two fluorescent elements, The two phosphor elements are respectively located on the first light emitting surface and the second light emitting surface of the LED element to keep the LED elements in place 'so that the illumination generated by the LEDs respectively starts from the light emitting surface Passing through the two fluorescent elements; and electronic components 'the electronic components are coupled to the coffee elements to electrically connect the LED elements to a power source. 2. The LED light source according to claim 1, wherein the (10) element is sandwiched by the two fluorescent elements to sandwich the LED element to enable the - the light-emitting surface and the second light-emitting surface are pressed directly onto the fluorescent element for support and guided away from the LED element, and the (10) element is held in the gap between the light-emitting elements - The LED is housed in the cavity. 3. The light source of (10) according to claim 2, characterized in that the LED TL member has one of a self-contact structure and a fresh structure. 4. The (10) light source of claim 3, wherein the UD element comprises a P-type doping on one of the first/light-emitting surface and the second light-emitting surface. A unit and an N-type doping unit are electrically connected to the electronic component. 5. The LED light source of claim 4, further comprising a connecting wire element extending from the electronic component to the LE1D component to be the LED component And electrically connected to the electronic component. 6. The LED light source of claim 4, further comprising an electrically conductive layer disposed on and extending over at least the fluorescent element to electrically charge the LED element and the electronic component connection. 7. The LED light source of claim 3, wherein the LED element comprises a P-type switching element and a N on the first light emitting surface and the second light emitting surface, respectively. A type change unit for electrically connecting to the electronic component. 8. The LED light source of claim 7, further comprising a connecting wire element extending from the electronic component to the LED component to convert the LED component and The electronic components are electrically connected. 9. The LED light source of claim 7, further comprising an electrically conductive layer, the electrically conductive layer overlapping one of the fluorescent elements to connect the LED element and the electronic component Electrical connection. 10. The LED light vibration according to claim 1, wherein the LED element has a current dispersion layer and a known and bright layer overlapping the current dispersion layer, A PN junction is formed between the current dispersion layer and the illumination layer, and electroluminescence is generated on the P_N junction to provide the illumination to the two phosphor elements through the two illumination surfaces. 11. The LED light source of claim 4, wherein the LED element has a current spreading layer and an illumination layer overlapping the current dispersion layer to be in the current dispersion layer and A P-N junction is formed between the illumination layers, and electroluminescence is generated on the PN junction to provide the illumination to the two phosphor elements through the two illumination surfaces. 12. The light source of (10) according to claim 7, wherein the LED τ a member has a current dispersion layer and an illumination layer overlapping the current dispersion layer to be in the current dispersion layer and A PN junction is formed between the illumination layers, and electroluminescence is generated on the P_N junction to provide the illumination to the two phosphor elements through the two illumination surfaces. The LED light source of claim 1, wherein the LED element further comprises a base layer under the illumination layer, wherein the base layer has a transparent and rigid structure And between the corresponding fluorescent element and the illumination layer of the LED element, wherein the base layer is connected to the corresponding fluorescent element by a bonding connection to make the LED The component is further secured to the corresponding camping element by the substrate layer. 14. The LED light source of claim 4, wherein the LED element further comprises a substrate layer under the illumination layer, wherein the substrate layer has a transparent and rigid structure. And between the corresponding fluorescent component and the illumination layer of the LED component, wherein the substrate layer is connected to the corresponding fluorescent component by a bonding connection to further pass the LED component The substrate layer is attached to the corresponding phosphor element. 15. The light source according to claim 12, wherein the LED element further comprises a substrate layer under the illumination layer, wherein the substrate layer has a transparent and rigid And between the corresponding fluorescent elements and the illumination layer of the LED element, wherein the substrate layer is coupled to the corresponding fluorescent element by a bonding connection to enable the The LED component is further secured to the corresponding phosphor component by the substrate layer. The light source of (10) according to claim 13, wherein the base layer is selected from the group consisting of a sapphire layer bonded to the corresponding glory element and an integrated layer integrated into the corresponding luminescent element. 17. The LED wire of claim 14, wherein the base layer is selected from the group consisting of a sapphire layer bonded to the corresponding camping element and an integrated layer integrated into the corresponding phosphor element. . The light source of claim 15, wherein the base layer is selected from the group consisting of a sapphire layer bonded to the corresponding Wei element and an integrated layer integrated into the corresponding fluorescent element. . LED 42 M413087. The LED* source of claim 1, wherein one of the fluorescent elements is a thin phosphor layer coated on the LED element. 20. The light source of claim i, wherein each of the LED light source groups further comprises a fixing member, the fixing member is attached to an edge of the fluorescent element to The distance between the fluorescent elements is fixed to fix the LED elements between the fluorescent elements. 21. The LE:D light source of claim 20, wherein the fixing member has a plurality of through ports that communicate the LED receiving cavity to the outside to The heat generated by the LED elements in the LED housing cavity is dissipated. 22. The LED light source of claim 21, wherein the fixing member is selected from an edge-fixing member that is spliced to both outer surfaces of the fluorescent member and is spliced to a bonding element of the inner surface of the fluorescent element. 23. The LED light source of claim 1, further comprising an LED light source lamp structure, the LED light source lamp structure comprising a housing, wherein the housing forms one of the housings a housing cavity, and having a fill gas in the housing, wherein the LED light source group is supported within the housing cavity to form an LED light source lamp. The LED light source of claim 23, wherein the LED light source lamp structure further comprises a light effect structure for supporting the LED light source group in the housing cavity, wherein the light effect structure Included in a set of connectors, 43 M413087 connectors extending lightly within the housing cavity to respectively splicing the (10) light source group ' to position the LED light source group within the housing cavity of the housing An ideal location. 25. The LED light source of claim 23, wherein the LED light source lamp structure further comprises a light reflecting element, the light reflecting element extending along the LED light source group at intervals The light reflecting element is provided to collect and reflect light of the LED light source group to a predetermined direction. 26. The LED light source of claim 23, wherein the LED light source lamp structure further comprises a heat guiding structure splicing to the outside of the housing to pass The surface of the housing enhances heat transfer, wherein the heat guiding structure includes a set of heat dissipating elements that extend radially outward from a non-illuminated surface of the housing such that the non-illuminated The surface provides additional heat dissipation. 44