M412817 '五、新型說明： 【新型所屬之技術領域】 本創作係有關-種點_，特別是指_種貼片用多孔點膠頭。 【先前技術】 工業上點雜的顧相當廣泛，諸如IC封裝、光電薇、液晶顯示器產 業之液晶面板框膠、LED廠LED封裝與LED轉、手機外殼封裝、筆記 •型電腦貼合、表面貼附技術（SMT)零件的使用或者印刷電路板組裝等。 #點賴程主要是屬於接合的後段製程，其功用為例如保護基板、微電路、 1C ’防止微塵、水氣、光線等物f進人，避免對產品產生損壞。 傳統的晶片是正方形設計，因此既有的點膠機之點膠頭1〇採單點膠針 12設計’如第丨騎示。在此架構下是足以適用於正方形晶片與基板的貼 合。但是’隨著現有的晶片形狀朝向長方形設計時，此種單點滕針之點朦 頭設計將不敷使用。舉例來說，使用此架構之點膝頭進行塗塗覆時用來 貼合之貼合料，例如銀謬，僅足缝覆部分長方形晶片表面導致晶片 ®與基板間存在許多空洞，使得接合狀態不佳》 有鑑於此，本創作遂針對上述習知技術之缺失，提出一種勒新的貼片 用點膠頭，以有效克服上述之該等問題。 【新型内容】 本創作之主要目的在提供一種貼片用點膠頭，其雙點膠針的設計使用 於長方形晶片時’能择保貼合膝料於長方形晶片表面上的覆蓋率達到百分 之百’減少銀膠空洞，使長方形晶片與基板達到穩固的接合。 為達上述之目的，本創作提出一種貼片用點膠頭，其主要包含有一本 3 M4丄此17 趙與一設於本體底端之點膠組件。 點勝組件包含有-間隔塊與兩__隔塊間__膠針。 兹為使貴審查委員對本創作之結構特徵及所達成之功效更有進一步 之瞭解與麟，謹佐啸奴實施_魏合詳細之賴，說明如後： 【實施方式】 μ併參閱第2圖、第3圖與第4圖，其係各為本創作之貼片用點膠 頭之立體圖、第2圖之ΑΑ’線段剖視圖與點膠組件的仰視圖。如圖所示，- 本創作之貼片用點膠頭20主要包含有—本體22與一設置於本體22下方的 點膠組件24。 點膠組件24包含有-間隔塊3〇，以及兩點膠針32、％，其係以間隔 塊30間隔開。 上述之間隔塊30與點膠針32、％之材質可以為鎢鋼，且間隔塊默 長度Υ為0.5毫米（mm)，寬度〇為4密耳（mil),b厚度為㈣耳點膠 針32、34之長度X為h5毫米（職），寬度…密耳，厚度_密耳。 請參閱第5圖，其係使用本創作之貼片用點膠頭進行基板與長方形曰曰曰籲 片貼合料賴。此處制_合祕可以是選用銀膠々圖所示利用· 本創作之貼片用點膠頭2〇於基板38進行點穋時，因為本創作是採雙點朦 針32、34的設計’因此點膝針32、34沾膠後，沾點於基板38上時:形成 兩個銀膠黏著區40。隨後，當長方形晶片42貼合於基板38上時銀膠黏 著區4〇將於長方形晶片&底表面上形成良好的覆蓋率，減少銀膠空洞， 因此能確保長方形晶片42與基板38穩固的接合。 … 綜上所述，本創作提出-種勒新的貼片用點膠頭，其特徵在於具有雙 4 M412817 點膠針，鑑此使用於長方形晶片時可確保貼合滕料於長方形晶片表面上的 覆蓋率達到百分之百，減少銀膠空洞，使長方形晶片與基板達到穩固的接 合。 唯以上所述者，僅為本創作之較佳實施例而已，並非用來限定本創作 實施之。故即凡依本創作申請細所述之特徵及精神所為之均等變化 或修飾’均應包括於本創作之申請專利範圍内。 【圖式簡單說明】 •第1圖是習知之貼片用點膠頭的示意圖。M412817 'V. New description: 【New technical field of the art】 This creation is related to the kind of point _, especially the porous spot for the patch. [Prior Art] The industry has a wide range of considerations, such as IC packaging, photovoltaic, liquid crystal display panel LCD panel sealant, LED factory LED package and LED turn, mobile phone case package, note-type computer fit, surface mount Use of technology (SMT) parts or printed circuit board assembly. #点赖程 is mainly the post-joining process of the joint. Its function is to protect the substrate, microcircuit, 1C' to prevent dust, moisture, light, etc. from entering the person to avoid damage to the product. The traditional wafer is a square design, so the dispensing head of the existing dispenser 1 is a single-point plastic needle 12 design. Under this architecture is sufficient for a square wafer to bond to the substrate. However, as the existing wafer shape is oriented toward a rectangular shape, the design of the single-pointed pin is not sufficient. For example, when using the structure of the knee to coat the adhesive material for coating, such as silver enamel, only the surface of the rectangular wafer is covered by the foot, resulting in a lot of voids between the wafer® and the substrate, so that the joint state is not In view of this, the author proposes a new dispensing head for the patch to effectively overcome the above problems in view of the above-mentioned shortcomings of the prior art. [New content] The main purpose of this creation is to provide a dispensing head for the patch. When the double-pointing needle is designed for use in a rectangular wafer, the coverage of the knee-shaped wafer on the surface of the rectangular wafer can be guaranteed to be 100%. Reduce the void of silver glue to achieve a firm bond between the rectangular wafer and the substrate. In order to achieve the above purpose, the present invention proposes a dispensing head for a patch, which mainly comprises a 3 M4 17 17 ZH and a dispensing assembly disposed at the bottom end of the body. The point win component includes a - spacer block and two __ spacers between the __ plastic needles. In order to make your reviewer have a better understanding of the structural features and the effects achieved by this reviewer, I would like to discuss the implementation of Wei Wei's detailed description of Wei He, as follows: [Implementation] μ and refer to Figure 2 Fig. 3 and Fig. 4 are respectively a perspective view of the dispensing head for the patch of the creation, a cross-sectional view of the line section of Fig. 2, and a bottom view of the dispensing assembly. As shown in the figure, the dispensing head 20 for the patch of the present invention mainly comprises a body 22 and a dispensing assembly 24 disposed under the body 22. Dispensing assembly 24 includes a spacer block 3, and two dispensing needles 32, % spaced apart by spacers 30. The spacer block 30 and the dispensing needle 32, % of the material may be tungsten steel, and the spacer block has a length Υ of 0.5 mm (mm), a width 〇 of 4 mils, and a thickness of (4) a needle dispensing needle. The length of 32, 34 is h5 mm (job), width... mil, thickness _ mil. Please refer to Figure 5, which uses a dispensing head for the substrate to make a substrate and a rectangular sheet. Here, the _ secret can be selected from the use of the silver plastic · · 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为 因为'When the knee needles 32, 34 are glued, when they are spotted on the substrate 38, two silver adhesive regions 40 are formed. Subsequently, when the rectangular wafer 42 is attached to the substrate 38, the silver adhesive region 4 形成 will form a good coverage on the rectangular wafer & the bottom surface, thereby reducing the void of the silver paste, thereby ensuring the stability of the rectangular wafer 42 and the substrate 38. Engage. In summary, this author proposes a new type of dispensing head for patch, which is characterized by a double 4 M412817 dispensing needle, which is used to ensure the fit of the rectangular wafer on the surface of the rectangular wafer. The coverage is 100%, and the void of silver glue is reduced, so that the rectangular wafer and the substrate can be firmly joined. The above descriptions are merely preferred embodiments of the present invention and are not intended to limit the implementation of the present invention. Therefore, any changes or modifications to the characteristics and spirits described in this application should be included in the scope of the patent application for this creation. [Simple description of the drawings] • Fig. 1 is a schematic view of a conventional dispensing head for a patch.
I 第2圖為本創作之貼片用點膠頭之立體圖。 第3圖為第2圖之AA’線段剖視圖。 第4圖為本創作之貼片用點膠頭之點膠組件的仰視圖。 第5圖為使用本創作之貼片用點膠頭進行基板與長方形晶片貼合的示意圖。 【主要元件符號說明】 .10點膠頭 ,12單點膠針 20點膠頭 22本體 24點膠組件 30間隔塊 32點膠針 34點膠針 38基板 5 M412817 40銀勝黏者區 42長方形晶片 X 長度 Y 長度 a 寬度 b 厚度 c 寬度 6I Fig. 2 is a perspective view of the dispensing head for the patch of the creation. Fig. 3 is a cross-sectional view taken along line AA' of Fig. 2. Fig. 4 is a bottom view of the dispensing assembly of the dispensing head for the patch of the present invention. Fig. 5 is a schematic view showing the bonding of the substrate to the rectangular wafer using the dispensing head of the patch of the present invention. [Main component symbol description] .10 point plastic head, 12 single point plastic needle 20 point plastic head 22 body 24 point glue assembly 30 spacer block 32 point plastic needle 34 dispensing needle 38 substrate 5 M412817 40 silver wins sticky area 42 rectangle Wafer X Length Y Length a Width b Thickness c Width 6