M408131 /αί¥ 五、新型說明： __ 【新型所屬之技術領域】 本創作係有關一種封裝技術領域，尤指一種組裝精簡及高 防濕效果之LED封裝結構。 【先前技術】 按，TW-M375288專利所揭之LED封裝結構，主要係於 基板施以SMT技術達到固晶目的，再利用螢光粉、矽膠或環 氧樹脂等混合物，搭配自動點膠機將混合物塗佈於led晶粒 表面，藉此達到晶粒之固定及晶粒激發白光目的。但利用點膠 方式激發白光技術手段，容易因晶粒導電後屋生之熱能，造成 螢光粉、矽膠等老化而形成光衰效應。 又TW-M377703專利’係利用具預設高度之框架之基板 底面固晶後，復於框架頂面固設一玻璃，玻璃相異内部空間端 表面，再施以絲網印刷手段塗覆一螢光層，藉此，將螢光層與 LED晶粒分離，以克服上述螢光粉與晶粒高溫接觸產生之光 衰效應。 該TW-M3777〇3專利技術固然可克服螢光粉與晶粒接觸 所生之老化、光衰技術課題，但激發UV LED晶粒產生白光之 榮光私除耐熱性差夕卜，吸濕情況下則易生水解之激光效果變 弱缺失’且螢光粉與晶粒距離越遠’亮度則呈正比衰減，故該 專利技術就流明度方面卻不如TW_M375288所揭LED封裝釺 構； 一 3 再者，誠如上述螢光粉亦有怕水問題，然而TW-M377703 專利之螢光層卻塗覆於玻璃外表面，以致LED照明裝置長時 P4及收環n度後，則會降低晶粒之激光效果。 承上述所，TW-M377703專利將螢光層塗覆於玻璃外表 面，不僅存在賴後之激光效果降低問題，其侧絲網印刷塗 覆於玻璃外表φ，齡造成LED難結齡麟於複雜化， 實不利於LED縣之觀、快速目標，故在產能方面無法療 至完美。 八 【新型内容】 本創作主要係提供一種可克服晶片熱影響及水氣影響之 發光二極體封裝結構。 本創作另一目的係提供一種基於克服螢光粉熱影響情況 下，亦能獲得高光亮發光效果之發光二極體封裝結構。 為達到上述預期目的，本創作之發光二極體封裝結構，主 要包括： 一基板，表面朝上延伸出一牆面，該牆面内則圍構出一空 間； 複數個發光二極體晶片，係固設於該基板牆面圍構之空間 内，且與該基板呈電性連結；以及一螢光透光板，係由可透光 之材料混合螢光粉壓製而成，該螢光透光板並具有一内表面及 一外表面，至少一表面則形成有一增亮部，且該螢光透光板係 固設於牆面之頂面，藉此將該空間圍構出一真空封閉空間，藉 M408131 100年1月31日修正替換頁 由如述結構完成之發光二極體封裝結構，^述既 結構功效。 為使一般人仕能更深入瞭解本創作之核心技術及本創作 其他技術功效所在，茲輔以相關圖式及三個較佳結構實施例予 以闡述，請參照之。 【實施方式】 本創作係有關一種發光二極體封裝結構，請配合參照圖 1、2所示之最佳實施例，其中該發光二極體封裝結構包含： 一基板10，該基板10較佳者可選擇銅合金或陶瓷……等 尚導熱效能基板，該具高導熱效能之基材10，其表面周緣垂 直朝上延伸出一預設高度之牆面12，該牆面12與基板表面則 圍構出上方開放之空間； 複數個發光二極體晶片20 (本實施例係以藍光發光二極 體晶片為主），係透過導線22與上述基板10牆面内之空間表 面電性連結，其中較佳之發光二極體之固晶手段，亦可採用 SMT (Surface Mount Technology 表面黏著技術）方式； 一螢光透光板30,係由可透光材料混合螢光粉壓製而成， 目的係提供藍光發光二極體晶片激發出白光之用◊其中該可透 光材料可以是具防水效果之壓克力或兼具防水及高透光效能 之玻璃，或者是兼具高透光效果之等效材。而該螢光透光板 30具有一内表面及一外表面，至少一表面則形成有一增亮部 32，增党部32之設置除圖式之内表面模式外，亦可獨立設置 5 於外表面’甚至更佳者為内、外表面皆設置增亮部32則係 指-圓弧狀、銳、鈍角或垂直角之鑛齒狀花紋或者幾何形狀之 凹、凸微結構紋路，甚至亦可使賊膜方式形成增亮鑛膜。 其中若内、外表面皆設置增亮部者，内、外表面之辦 可以是相互交錯設置或相對重疊設置模式。上述混合營光粉壓 合製成之螢光透光板，係於真空作業環境下固設於基板牆面 12開放之頂面處，藉此將牆面之開放空間騎出完全密封之 一真空封閉空間14。該螢光透光板3〇固設於牆面之手段，若 為高透光之玻璃螢光透光板30，則於真空作業環境下，以接 著劑（uv膠）塗覆於牆面頂面，令置放之螢光透光板3〇於 真空封裝環境下自鱗乾。反之若祕克力螢光透光板，除了 使用接著齡©外’亦得於真空作業魏下配合輔助機具施以 高週波手段相互固接。 上述結構完成之發光二極體封裝結構，藉由螢光粉與可透 光板材料混合壓製完成一螢光透光板具備之優勢包含： 第.激光用之螢光粉與發光二極體晶片分離，則可防止 晶片通電產生之熱能影響LED之激光效果。 第二：承上，本創作之螢光粉與發光二極體晶片分離，雖 可防止晶片之熱能對螢光粉之影響’卻也因螢光粉與晶片之距 離變大而形成大量光損，故本創作特別將基板、牆面與螢光透 光板圍構出一真空封閉空間，則有彌補距離差產生之一半光 損’同時再配合螢光透光板表面之增亮部設計，藉此令發光二 M408131 loo年1月31日修正替換頁 極體之光源具有聚光之效果’以彌補距離差損，令- 本創作元成之發光二極體封裝結構能保持既有點膠封裝之高 光亮功能，此點更是先前技藝TW-M37703專利所不及之處。 第三：又相較於先前技藝TW_M3777〇3專利，本創作之 螢光粉係混合塑膠或玻璃材料壓合製成，則可藉由玻璃可透光 板之保護，防止外部環境之水氣與螢光粉接觸，令螢光粉與發 光二極體晶片採分離設計之防熱光衰優點外，更兼具防止水解 等激光效果變差情況發生之優點。 第四：承上所述，螢光粉係與玻璃（或塑膠壓克力）材料 相互混拌下予以壓製成一螢光透光板，相較於 專利技術而言’本創作於玻璃（或壓克力）壓製完成同時，亦 代表著螢光層與可透光板相互結合，完全無需tw_M3777〇3 專利尚需於玻璃製成後，再施以絲網印刷加工步驟，將榮光粉 塗覆於玻璃透光板外表面，本創作更兼具封裝作業快速優點。 再配合參照圖3所示’係本創作發光二極體封裝結構之第 二實施例，其主要架構與上述實施例相同，相同結構元件符 號、名稱延用之同時不再贅述，本實施例僅就差異之螢光透光 板予以說明： 本實施例之螢光透光板30’，提供發光二極體晶片激發白 光之技術手段，係透過一可透光板34包覆一螢光片36，使該 螢光片36受可透光板完全包覆下，可防止螢光片受外部水氣 影響。且該實施例之螢光透光板30,同樣具有一内表面及一外 7 100年1月31日修正替換頁 表面，圖式所揭之内表面則形成有一增亮部32,， 設於外表面或内、外表面皆設置增亮部，增亮部亦如上述實施 例，可為圓弧狀、鋸齒狀或任意幾何形狀之凹、凸紋路，該螢 光透光板30’則設於牆面之頂面，藉此將該基板與牆面之空間 圍構出一真空封閉空間14者。 最后再請配合參照圖4所示，係本創作第三實施例，該實 把例與上述二實施例差異亦在於螢光透光板之不同該第三實 施例之螢光透光板30” ’係由一具内表面及一外表面之可透光 、 板34，以及一设置於可透光板内表面之螢光片％”所構成， 並於該可透光板34”外表面形成有一圓弧狀或鋸齒狀或任意幾 何形狀之凹、凸花紋增亮部32”，該螢光透光板3〇”亦固設於 牆面之頂面’藉此將該基板與牆面之空間圍構出一真空封閉空 間14者。 諸如上述本創作之第二實施例，將螢光片夾合於可透光板 之間亦具備防止外部環境水氣接觸之影響，而第三實施例形態 將螢光片置於可透光板内表面，令該螢光片位於真空封裝空間 14内，亦可防止外部環境水氣接觸螢光片，以保持螢光片之 使用壽命。 由上可知，本創作不僅結構新穎實用，更具有顯著進步之 功效’符合專利法相關規定’爰依法提起專利申請，鏗請鈞 局早曰核予專利，實感德便。 M408131M408131 /αί¥ V. New description: __ [New technical field] This creation is about a kind of packaging technology, especially an LED package structure with compact assembly and high moisture resistance. [Prior Art] According to the LED package structure disclosed in TW-M375288, the main purpose is to apply SMT technology to the substrate to achieve the purpose of solid crystal, and then use a mixture of phosphor powder, silicone rubber or epoxy resin, and the automatic dispenser will be used. The mixture is coated on the surface of the led die, thereby achieving the purpose of fixing the crystal grains and exciting the white light by the crystal grains. However, the use of dispensing to stimulate the white light technology is easy to cause the light decay effect due to the aging of the phosphor powder and the tannin gel due to the heat of the grain after the grain is electrically conductive. The TW-M377703 patent is based on the bottom surface of the substrate with a frame of preset height, and then a glass is fixed on the top surface of the frame, and the end surface of the glass is different from the internal space, and then a screen printing method is applied to coat a firefly. The light layer, whereby the phosphor layer is separated from the LED crystal grains to overcome the light decay effect produced by the above-mentioned high-temperature contact between the phosphor powder and the crystal grains. The patented TW-M3777〇3 technology can overcome the aging and light-fading technology problems caused by the contact between the phosphor powder and the crystal grains, but the glory of the UV LED crystal grains is generated by the glory of the white light, and the heat resistance is poor. The laser effect of the probiotic hydrolysis becomes weak and missing' and the farther the distance between the phosphor powder and the crystal grain is, the brightness is proportional to the attenuation. Therefore, the patented technology is not as good as the LED package structure disclosed by TW_M375288; As the above-mentioned phosphor powder is also afraid of water, the TW-M377703 patented phosphor layer is applied to the outer surface of the glass, so that the long-term P4 of the LED lighting device and the n-degree of the ring will reduce the laser of the crystal. effect. According to the above, the TW-M377703 patent applies the fluorescent layer to the outer surface of the glass, which not only has the problem of lowering the laser effect, but also the side screen printing is applied to the appearance of the glass φ, and the age of the LED is difficult to be complicated. It is not conducive to the LED county view, fast target, so it can not be perfected in terms of production capacity. VIII [New content] This creation mainly provides a light-emitting diode package structure that can overcome the thermal influence of the wafer and the influence of moisture. Another object of the present invention is to provide a light-emitting diode package structure which can also obtain a high-brightness light-emitting effect based on the influence of the thermal effect of the fluorescent powder. In order to achieve the above-mentioned intended purpose, the LED package structure of the present invention mainly comprises: a substrate having a surface extending upward from a wall, wherein the wall encloses a space; a plurality of light-emitting diode chips, The system is fixed in the space surrounding the wall of the substrate and electrically connected to the substrate; and a fluorescent transparent plate is formed by mixing fluorescing powder with a light-transmitting material, and the fluorescent light is transparent. The light plate has an inner surface and an outer surface, at least one surface is formed with a brightening portion, and the fluorescent transparent plate is fixed on the top surface of the wall surface, thereby enclosing the space to a vacuum Space, by M408131 January 31, 100 revised replacement page by the structure of the light-emitting diode package structure, the structure of the structure. In order to give the general person a deeper understanding of the core technology of this creation and the other technical effects of this creation, please refer to the related drawings and three preferred structural examples for explanation. Please refer to it. [Embodiment] The present invention relates to a light-emitting diode package structure. Referring to the preferred embodiment shown in FIGS. 1 and 2, the LED package structure includes: a substrate 10, and the substrate 10 is preferably A copper alloy or a ceramic material, such as a thermal conductivity substrate, may be selected, and the substrate 10 having high thermal conductivity has a surface 12 extending perpendicularly upward from a surface of the substrate 12, and the surface of the substrate 12 and the surface of the substrate A plurality of light-emitting diode chips 20 (mainly a blue light-emitting diode chip in this embodiment) are electrically connected to the space surface in the wall surface of the substrate 10 through the wires 22, Among them, the preferred solid crystal diode is also a SMT (Surface Mount Technology) method; a fluorescent transparent plate 30 is made of a luminescent material mixed with fluorescent powder. Providing a blue light emitting diode chip for exciting white light, wherein the light transmissive material may be a waterproof acrylic or a waterproof and high light transmissive glass, or a high light transmission effect Effectiveness. The fluorescent light-transmitting plate 30 has an inner surface and an outer surface, and at least one surface is formed with a brightening portion 32. The addition of the party portion 32 can be independently set in addition to the inner surface mode of the drawing. The surface of the surface is even better. The brightening portion 32 is provided for both the inner and outer surfaces, which means the arc-shaped, sharp, obtuse or vertical angle of the ore-like pattern or the concave or convex microstructure of the geometric shape, or even The thief film is formed into a brightening film. Where the inner and outer surfaces are provided with brightening portions, the inner and outer surfaces may be arranged in a staggered or relatively overlapping setting mode. The fluorescent light-transmitting plate made by mixing the above-mentioned mixed camping powder is fixed in the open top surface of the substrate wall 12 in a vacuum working environment, thereby riding the open space of the wall surface to completely seal one vacuum Closed space 14. The fluorescent transparent plate 3 is fixed on the wall surface, and if it is a high light transmissive glass fluorescent transparent plate 30, it is coated on the top of the wall with an adhesive (uv glue) in a vacuum working environment. The surface of the fluorescent light-transmitting plate 3 is placed in a vacuum packaging environment and self-dried. On the other hand, if the Mikon fluorescent light-transmissive plate is used in addition to the use of the next age, it is also necessary to apply a high-frequency means to the vacuum machine to cooperate with the auxiliary machine. The light-emitting diode package structure completed by the above structure is obtained by mixing and mixing the phosphor powder and the light-transmitting plate material to obtain a fluorescent light-transmitting plate, and the advantages thereof include: the laser powder and the light-emitting diode chip Separation prevents the thermal energy generated by the energization of the wafer from affecting the laser effect of the LED. Second: In fact, the phosphor powder of the present invention is separated from the light-emitting diode wafer, although the thermal energy of the wafer can be prevented from affecting the phosphor powder, but the distance between the phosphor powder and the wafer is increased to form a large amount of light loss. Therefore, the creation of the substrate, the wall surface and the fluorescent light-transmitting plate enclose a vacuum enclosed space, and the brightness-increasing part of the surface of the fluorescent light-transmitting plate is compensated for by the distance difference. In this way, the light source of the M408131 loo is corrected on January 31, and the light source of the replacement page body has the effect of collecting light to compensate for the distance difference, so that the light-emitting diode package structure of the original element can be kept in a somewhat plastic package. The high-brightness function is beyond the reach of the previous TW-M37703 patent. Third: Compared with the previous TW_M3777〇3 patent, the fluorescent powder mixed plastic or glass material of this creation can be pressed by the glass transparent board to prevent the moisture of the external environment. The contact of the phosphor powder has the advantages of preventing the heat and light decay of the phosphor powder and the light-emitting diode wafer, and also has the advantages of preventing the deterioration of the laser effect such as hydrolysis. Fourth: According to the above, the phosphor powder and the glass (or plastic acrylic) materials are mixed with each other to be pressed into a fluorescent transparent plate. Compared with the patented technology, the present invention is created in glass (or pressure). At the same time, it also represents the combination of the fluorescent layer and the permeable plate. It does not need tw_M3777〇3. The patent still needs to be made of glass, and then applied to the screen printing process to apply glory powder. The outer surface of the glass translucent plate, this creation has the advantage of quick packaging operation. Referring to FIG. 3, the second embodiment of the present invention is the same as that of the above embodiment, and the same structural elements and symbols are not used for further description. This embodiment only The difference between the fluorescent light-transmitting plate is as follows: The fluorescent light-transmitting plate 30' of the embodiment provides a technical means for exciting the white light of the light-emitting diode chip, and coating a fluorescent plate 36 through a light-transmitting plate 34. The fluorescent sheet 36 is completely covered by the light-transmitting sheet to prevent the fluorescent sheet from being affected by external moisture. The fluorescent light-transmitting plate 30 of the embodiment also has an inner surface and an outer surface of the modified replacement page on January 31, 100, and the inner surface of the figure is formed with a brightening portion 32. The outer surface or the inner and outer surfaces are provided with a brightening portion, and the brightening portion is also a concave or convex line with an arc shape, a zigzag shape or an arbitrary geometric shape as in the above embodiment, and the fluorescent transparent plate 30' is provided. On the top surface of the wall surface, the space between the substrate and the wall is surrounded by a vacuum enclosure 14 . Finally, please refer to FIG. 4, which is a third embodiment of the present invention. The difference between the actual embodiment and the second embodiment is that the fluorescent transparent plate is different from the fluorescent transparent plate 30 of the third embodiment. ' is composed of a light permeable sheet having an inner surface and an outer surface, a plate 34, and a phosphor sheet disposed on the inner surface of the light permeable panel, and is formed on the outer surface of the light permeable panel 34" a concave or convex pattern brightening portion 32" having an arc shape or a zigzag shape or an arbitrary geometric shape, the fluorescent light transmitting plate 3"" is also fixed on the top surface of the wall surface" thereby the substrate and the wall surface The space encloses a vacuum enclosure 14. For example, in the second embodiment of the present invention, the sandwiching of the phosphor between the light-transmitting plates is also provided to prevent the external environment from moisture and gas contact, and the third embodiment The fluorometer is placed on the inner surface of the permeable plate so that the illuminating sheet is located in the vacuum packaging space 14, and the external environment moisture is prevented from contacting the luminescent sheet to maintain the service life of the luminescent sheet. This creation is not only novel and practical, but also has significant advancement effect. Eliphaz the relevant provisions' Yuan patent applications filed in accordance with law, please hang Jun Bureau earlier said core to patent, then the real sense of ethics. M408131
【圖式簡單說明】 圖1為本創作較佳實施例之外觀示意圖。 圖2係圖1之剖面示意圖。 圖3係本創作第二實施例之剖面示意圖。 圖4係本創作第三實施例之剖面示意圖。 【主要元件符號說明】 10 ： 基板 30、30’、30” ：螢光透光板 12 ： 牆面 32、32’、32” ：增亮部 14 : 真空封閉空間 34、34” ：可透光板 20 ： 發光二極體晶片 36、36” ：螢光片 22 ： 導線BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing the appearance of a preferred embodiment of the present invention. Figure 2 is a schematic cross-sectional view of Figure 1. Figure 3 is a schematic cross-sectional view showing a second embodiment of the present invention. Figure 4 is a schematic cross-sectional view showing a third embodiment of the present creation. [Main component symbol description] 10 : Substrate 30, 30', 30": Fluorescent translucent plate 12: Wall surface 32, 32', 32": Brightening portion 14: Vacuum closed space 34, 34": Light transmissive Plate 20: Light Emitting Diode Wafers 36, 36": Fluorescent Sheet 22: Conductor