M406752 五、新型說明： 【新型所屬之技術領域】 本新型是有關於一種背光模組的光源裝置以及該光源 裝置的LED封裝結構，特別是指一種背光模組的光源裝置 的散熱結構。 【先前技術】 參閱圖1，為習知的背光模組的發光模組9，其包含一 導熱架91、一電路板92、一發光二極體93以及一導熱材 料94。導熱架91可供放置導光板95以及反射片96等光學 組件，發光二極體93銲設固定在電路板92並且設置在導 熱架91上’且導熱材料94是設置在電路板92與導熱架91 之間’一反射罩97是鎖固在導熱架9丨並且未與發光二極 體93接觸。 習知的這種發光模組9中，由於發光二極體93只有塑 膠材質的座體931 —側藉由引腳932銲接在電路板92並透 過導熱材料94與導熱架91接觸，因此，發光二極體％運 作所產生的熱能，大部分也只能經由電路板92傳導至導熱 材料94以及導熱架94散出，這樣的散熱機制仍有可改善 的空間。 【新型内容】 因此本新型之目的，即在提供一種增加熱傳導路徑 而可提升散熱效果的背光模組的光源裝置以及該光源裝置 的LED封裝結構。 於疋，本新型背光模組的光源裝置包含一背架單元、 4 M406752 與第- LED封裝結構。該背架單元包括-基板以及—殼部 ’該殼部設置於該基板並且具有_間隔於該基板的第一板 4 ”亥第LED封|結構設置於該基板與該第—板部之間 並且包括一封裝體、_墓蝻鈕留_ 導線糸早το以及一發光晶粒，該封 裝體具有一出光面以及-如β ，工 及一相反側面，該出光面形成有一凹 穴’該導線架單元具有一第一牮 弟架體，5玄第一架體受該封裝 體包覆而外露於該封装贈的兮楚^ 町哀體的忒專側面以分別與該基板形成M406752 V. New Description: [New Technical Field] The present invention relates to a light source device for a backlight module and an LED package structure of the light source device, and more particularly to a heat dissipation structure of a light source device of a backlight module. [Previous Art] Referring to Figure 1, a lighting module 9 of a conventional backlight module includes a heat conducting frame 91, a circuit board 92, a light emitting diode 93, and a heat conducting material 94. The heat conducting frame 91 can be used for placing optical components such as the light guide plate 95 and the reflective sheet 96. The light emitting diode 93 is soldered and fixed on the circuit board 92 and disposed on the heat conducting frame 91. The heat conducting material 94 is disposed on the circuit board 92 and the heat conducting frame. A reflector 117 is locked between the heat conducting frame 9 and not in contact with the light emitting diode 93. In the conventional light-emitting module 9, the light-emitting diode 93 has only the plastic body 931—the side is soldered to the circuit board 92 by the lead 932 and is in contact with the heat-conducting frame 91 through the heat-conductive material 94. Most of the heat generated by the operation of the diodes can only be conducted through the circuit board 92 to the heat conductive material 94 and the heat conducting frame 94, and such a heat dissipation mechanism still has room for improvement. [New content] Therefore, the object of the present invention is to provide a light source device of a backlight module which can increase the heat conduction path and which can improve the heat dissipation effect, and an LED package structure of the light source device. Yu Yu, the light source device of the novel backlight module comprises a back frame unit, 4 M406752 and a first LED package structure. The back frame unit includes a substrate and a case portion. The case portion is disposed on the substrate and has a first plate 4 spaced apart from the substrate. The LED package is disposed between the substrate and the first plate portion. And comprising a package, a tomb button, a wire 糸, and a light-emitting die, the package having a light-emitting surface and - such as β, and an opposite side, the light-emitting surface is formed with a recess The frame unit has a first frame body, and the first frame body of the 5th frame is covered by the package body and is exposed on the side surface of the package provided by the package to form a separate surface with the substrate.
一第一熱傳導路徑和盘号坌一 上、.. 子一这第板部形成一第二熱傳導路徑 ’邊發光晶粒固設於該第一架*§Α ;〜| t # 、硪弟系體而位於該封裝體的凹穴内a first heat conduction path and a disk number, the first plate portion forms a second heat conduction path, and the light emitting die is fixed to the first frame; Body in the pocket of the package
不祈至 LtDDon't pray to LtD
封裝結構—設置於—基板以及與該基板 相間隔之-第^板部之間，LED封裝結構包含—封裝體 、-導線架單元以及-發光晶粒。該封裝體具有一出光面 以及二相反側面，胃出光面形成有—凹穴。料線架單元 具有一第一架體’胃第-架體受該封裝體包覆而外露於該 封裝體的該等側面以分別與該背架單元基板形成一第—熱 傳導路徑和與該㈣單元第―板部形成—第二熱傳導路; 。該發光晶粒固設於該第一架體而位於該封裝體的凹穴内 本新型之功效在於，藉由led封裝結構的導線架單元 的結構改良，使得當LED封裝結構設置在背架單元時，能 產生多條熱料路徑，以提料發光晶粒的散熱效果。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 5 1406752 以下配合參考圖式之四個較佳實施例的詳細說明中’將可 清楚的呈現。 在本新型被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖2,本新型背光模組的光源裝置100的第一較佳 實施例包含一背架單元1、一電路板單元2、第一、第二 LED封裝結構3 ' 3，以及二導熱墊4。 參閱圖3、圖4,背架單元丨可為金屬材質並且包括一 基板11以及一設置在基板U的殼部12,基板11可供放置 如導光板、擴散片等光學元件，殼部12設置在基板u並且 具有一第一板部121、一第二板部122以及一第三板部123 ，第二板部122概呈矩形框狀並且具有二第一框邊124以 及連接兩第框邊124兩端而相平行的二第二框邊125，第 板。P 121與第二板部123分別位在兩第二框邊125與同 -第-框4 124連接處’第一板部121與第三板部123均 概呈三角型板狀而具有一斜邊板緣126、127，第一板部 ⑶與第三板部123的斜邊板緣126、127分別與其所㈣ 第一框邊m及第二框邊125夹45度角，且第一板部121 ^二板部123每一者的斜邊板緣126、127與基板n配合 二出1口 m (圖3只示出第一板部121與基板 ^的開口 128)。第一 LED封裝結構3與第二LED封裝姓 二置在並基板11上分別位於笫-板部121與第三二 邊板缘126 ’且W者第一板部121與第三板部123的斜 邊板緣126、127斜向設置’使得第，封裝結構： 6 M406752 :㈣封震結構3,的出光方向是分別相對於第二框邊125 里45度角的朝向基板^的中央區域 191 ώ? ^ 一事實上，第一板部 ⑵與第二板部123的斜邊板緣126、m在與第 125夾3〇度至9〇度的範圍内都是可允許的。因此，在盆他 實施例中，當第-板部121與第三板部123的斜邊板緣、126 127均與第二框邊125失90度角時，則等同第一板部 121與第三板部123的斜邊板緣126、127都是平行第一框The package structure is disposed between the substrate and the board portion spaced apart from the substrate, and the LED package structure includes a package body, a lead frame unit, and a light emitting die. The package has a light-emitting surface and two opposite sides, and the stomach light-emitting surface is formed with a recess. The wire rack unit has a first frame body. The stomach body frame is covered by the package body and exposed on the sides of the package body to form a first heat conduction path with the back frame unit substrate and the (four) The first-plate portion of the unit is formed - the second heat conduction path; The light-emitting die is fixed in the first frame body and located in the cavity of the package body. The novel effect of the present invention is that the structure of the lead frame unit of the LED package structure is improved, so that when the LED package structure is disposed on the back frame unit It can generate multiple hot material paths to improve the heat dissipation effect of the illuminating crystal grains. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the accompanying drawings. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 2, a first preferred embodiment of the light source device 100 of the backlight module of the present invention comprises a back frame unit 1, a circuit board unit 2, first and second LED package structures 3'3, and two thermal pads 4. . Referring to FIG. 3 and FIG. 4, the back frame unit 丨 can be made of a metal material and includes a substrate 11 and a shell portion 12 disposed on the substrate U. The substrate 11 can be used to place optical components such as a light guide plate and a diffusion sheet, and the shell portion 12 is disposed. On the substrate u and having a first plate portion 121, a second plate portion 122 and a third plate portion 123, the second plate portion 122 has a rectangular frame shape and has two first frame edges 124 and two frame sides. 124 two second frame edges 125, which are parallel to each other, the first plate. The first plate portion 121 and the third plate portion 123 are both triangular-shaped and have a slant The side plate edges 126, 127, the first plate portion (3) and the beveled edge 126, 127 of the third plate portion 123 are respectively at a 45 degree angle with the (four) first frame edge m and the second frame edge 125, and the first plate The beveled edge 126, 127 of each of the portions 121 and the two plate portions 123 is fitted with the substrate n by two openings m (FIG. 3 shows only the first plate portion 121 and the opening 128 of the substrate). The first LED package structure 3 and the second LED package are respectively disposed on the parallel substrate 11 at the 笫-plate portion 121 and the third two-sided rim 126 ′, and the first plate portion 121 and the third plate portion 123 are respectively The beveled edge 126, 127 is disposed obliquely so that the first package structure: 6 M406752: (4) the shock-absorbing structure 3, the light-emitting direction is a central region 191 facing the substrate ^ with respect to the second frame edge 125 at a 45-degree angle.一? ^ In fact, the beveled edge 126, m of the first plate portion (2) and the second plate portion 123 are allowed to be within a range of from 0 to 9 degrees. Therefore, in the embodiment of the pot, when the beveled edge of the first plate portion 121 and the third plate portion 123 and the 126 127 are both at an angle of 90 degrees from the second frame edge 125, the first plate portion 121 is equivalent to The beveled edge 126, 127 of the third plate portion 123 is parallel to the first frame
邊以’其實際態樣可能是如同以往背光模組的背架是可供 長條狀的LED光源（即多個LED封裝結構連接排列於基板 上而背對第-框邊m向基板n發光）容置於内的態樣， 亦即，殼部是沿著基板的板緣形成的長條溝槽狀，且第一 板部與第三板部會相連接為單—板部，而該單—板部的板 緣會平行於第-框邊。在此情況下，料有㈣LED封裝 結構放置在殼部的單一板部和基板間’而不限制於僅兩個 LED封裝結構。The actual situation may be that the back frame of the backlight module is like a long LED light source (that is, a plurality of LED package structures are connected and arranged on the substrate, and the back-to-frame edge m is illuminated toward the substrate n. The inside is disposed, that is, the shell portion is formed in a long groove shape along the edge of the substrate, and the first plate portion and the third plate portion are connected to each other as a single-plate portion, and the The edge of the single-plate portion will be parallel to the first-frame edge. In this case, the (four) LED package structure is placed between the single plate portion and the substrate of the case portion' without being limited to only two LED package structures.
電路板單元2設置在背架單元丨的基板u並且兩端分 別延伸入基板11與第—板部121之間以及基板u與第三板 部123之間。 參閱圖4、圖5A、圖5B，本實拖例中，第一 LED封裝 I。構3與第二LED封裝結構3 ’兩者大致相同，以下僅以第 LED封裝結構3說明，第一 LED封裝結構3包括一封裝 體31、一導線架單元32、複數發光晶粒33、一透光膠34 。封裝體31呈塊狀並且具有一出光面311以及連接出光面 3 11並且往下延伸的兩相反側面3丨2，出光面31丨形成有一 7 M406752 凹穴313，凹穴313較佳可呈倒錐狀。導線架單元32包括 複數彼此交錯排列設置的第一架體321以及第二架體322, 每一第一架體321介於兩第二架體322之間，每一第一架 體321概呈倒U型而具有一頂板323、由頂板323往下延伸 並且相間隔的一第一側板324與一第二側板325，以及一由 第一側板324延伸出而間隔於頂板323下方的底板326。每 一第二架體322概呈L型並且具有一頂板327以及一連接 頂板327的第三側板328，在本實施例中，部分第二架體 322的第三側板328是相對於頂板327往上延伸，部分第二 架體322的第三側板328則是相對於頂板327往下延伸， 或者，第二架體322也可以更具有由第三侧板328往外延 伸出並且間隔於頂板327下方的底板329。 導線架單元32受包覆在封裝體31内而使得第一架體 321的頂板323朝向封裝體31的凹穴313，第一架體321 的第-側板324與第二側板325分別外露出封裝體31的兩 側面312 ’每-第二架體322的第三側板328也外露出封裝 體31的其中一側面312 ’第一架體321的底板似與第二 架體322的底板329也外露於封裝體31相反於出光面η! 的一側表面3 14。 發光晶粒33固設在該等第一架體321的頂板323而位 在封裝體31的…13 0，發光晶粒B的光線是通過封 裂體31的凹穴313 *由出光面311射出。透光膠34則是填 充在封裝體31的凹穴313内以密封凹穴313。 參閱圖6，第- LED封裝結構3是以其外露於封裳體 8 M406752 單π 1的第二板部〗2之間設置其他導熱材料分別與背架單 凡1的第二板部12以及第一、第二架體321、322的底板 26 329直接接觸，形成一第三熱傳導路徑”，更加提升 對第一 LED封裝結構3的散熱效果。 導”，、塾4除了作為第一、第二[ED封裝結構3、3， 一者架單元1之間的熱傳導媒介以外，由於其通常為矽膠 (silicon rubber)製成而具有彈性的材質，故也可補足第一、 第二LED封裝結構3、3,與背架單元1的第—板部i2i、第 三板部123之間的組裝誤差，並且避免組裝時對第一、第 二LED封裝結構3、3,造成破壞。 參閱圖7、圓8，為本新型背光模組的光源裝置的 第—較佳實施例。與第一較佳實施例不同的地方在於殼部5 的結構’在第二較佳實施例中，有兩個殼部”圖7只顯示 一個）分別對應第- LED封裝結構3與第二LED封裝結構 (如圖2的第二LED封裝結構3，），而第- LED封裝結構 3與第二LED封裝結構同樣可例如透過錫膏銲設 路板單元2。 € …第一 LED封裝結構3的殼部5為例， 倒U型而包括一笛^ 括第一板部51以及二由第一板部5丨 下延伸的側板部52，且 裝結構3的出光面3ηπ第板°P51具有-與第- LED封 出先面311同侧的板緣511，當殼部5結 一 封裝結構3時，導熱塾4被夹置在第一架體321 = ^ 一^板325所外露的該封裝體的其中-側面312與第 板^ 51之間，使得導熱势4同時與第-架體321的第二 11 M406752 側板325以及殼部5的第—板部51接觸，兩側板部η則 分別靠置在第- LED封裝結構3的封裝體31的另兩相反侧 ’殼部5的g]定方式可以是電路板單元2設有二插槽η分 別供每一殼部5的兩側板部52插入固定，但其固定方式並 不以此為限’且藉由殼部5的側板部52插入電路板單元2 的插槽21内並且將第一 LED封裝結構3以及導熱墊4定位 於殼部5與電路板單元2之間，也具有增加第一 led封裝 結構3的；t位精準度的效果。且當殼部5結合在第—㈣ 封裝結構3並且將導熱塾4夾置於其間時，第—板部η的 板緣511以及導熱塾4以不超出第一 LED封裝結構3的出 光面3 11或與第-LED封裝結構3的出光面3 η對齊為較 佳’避免第-板部51或導熱墊4阻擋到第—LED封裝結 3的出光。 由於殼部5的第一板部51是與導熱墊4直接接觸，而 導熱塾4又是與第一 LED封裝結構3的該等第一架體切 的第一側板325接觸’因此當發光晶粒Μ的熱能由該等 第架體321 @第二側板325經由導熱墊4傳導至殼部5 的第一板部51時’熱能除了藉由第-板部51直接散出以 第板。卩51的另一部分熱能也可以往兩側板部52傳 並由兩側板部52直接散出或與再經由其他導熱介質散 出，因而增加散熱路徑。 參閱圖9、® 10，為本新型背光模,组的光源裝置1〇3 :，較佳實施例’與第一較佳實施例不同的地方在於背 J單凡的’、。構’在第二較佳實施例中背光模組的光源裝 12 M406752 置103的背架單元14為板片進行衝壓時，除了沖出基板 141的區域以外，更沖出與基板ι41連接的二凸片i46，並 且將兩凸片146往上兩次彎折使其部分間隔於基板M1上 方而界定出間隔於基板141的第一板部142與第二板部143 ，因而形成殼部140，第一、第二LED封裝結構3、3，同樣 設置在基板141與第一板部142之間以及基板14丨與第二 板部143之間並且例如透過錫膏銲設固定在電路板單元2， 且以第- LED封裝結構3該處為例，第—板部M2與第一 LED封裝結構3之間同樣可設置導熱塾4，並且使導敎塾4 同時與第-板部142以及第—咖封裝結们接觸或者 ’導熱墊4與第一板部142之間，也有可能還有其他元件 ，而第-板部"2配合第一 LED封裝結構3以及第二板部 143配合第二LED封裝結構3，的設置方向則與第—較佳實 施例相同’且第—板部142的斜向板緣144與第二板部⑷ 的斜向板緣145均呈45度角設置，但第一板部M2的斜向 =緣m與第二㈣143的斜向板緣145的斜向角度範圍 也可與第-較佳實施例相同。在其他實施例中 而(!用如同以往背光模組的背架是可供長條狀 樣。“(即包含了多個LED封裝結構)容置於内的態 相同的’第-板部142與導熱墊 封裝結構3的出光面川或與第-LED封裝=第3—的= 面311對齊為鲂4 苒3的出光 - LED^ =避免第—板部142或導熱塾4阻擒到第 裝、43的出光。此外’在前述的其他實施例中 13 M406752 ，背架單元14的殼部也可以是沿基板的一側板緣額外延伸 出長條狀部分並彎折形成一長條溝槽狀的態樣，也就是兩 凸片146延長相連接成一長條並進行兩次彎折而構成殼部 〇 參閱圖11'圖12,為本新型背光模組的光源裝置的第 四較佳實施例’②光源裝置i Q4包含—背架單元6、一 ’于裝、、。構7 電路板單元81以及一導熱墊82。背架單元 L括基板61以及一 §免置在基板61的殼部62，實際上 泣’殼部62概呈L型板狀而具有—間隔於基板61的第一板 621以及n基板61的-側外緣連接基板η與第一 板部621的連接板部622，且第—板部621具有—板緣⑵ ’第-板部621的板緣623與基板61之間同樣配合界定出 一開口 620。 一咖封裝結構7包括-封裝體7〇、受封裝體70包覆纪 :第-架體71以及位於第一架體7丨兩側的二第二架體 以及至J 一设置在第一架體71的發光晶纟^。第—架體 71概呈矩形並且具有外露出封裝體％兩相反側面他的一 第一板緣711與一篦-舡祕7τ ^ 電路η/、 封裝結構7係銲固在 與基…間，且此時電：:8::於苐-一 上而LED „ ,構7 # + ^ 位於連接板部⑶ 縣、，.。構7的出光面7〇1與電路板單元 ::平行’且當LED封裂結構7設置在殼部以内 一 4 621的板緣623以不超出led封袭結構7的 -1或對齊㈣封裝結構7的出光面701為較佳:= 14 M406752 一板部621的板緣623阻擋到LED封裝結構7的出光。 導熱墊82 δ又置在第一架體71外露出封裝體的第一 板緣711以及基板61之間並且同時與第一架體621的第一 板緣711以及基板61接觸而形成—由第一架體62丨的第一 板緣711經導熱塾82 ?其:te ααλ* . ’ 主基板61的第一熱傳導路徑P1，而 第-架體7!外露出封裝體7G的第二板緣712朝向背架單 元6的第-板部621並且與背架單元6的第一板部621接 觸而形成第二熱傳導路徑P2。The circuit board unit 2 is disposed on the substrate u of the back frame unit 并且 and extends between the substrate 11 and the first plate portion 121 and between the substrate u and the third plate portion 123, respectively. Referring to FIG. 4, FIG. 5A and FIG. 5B, in the present example, the first LED package I is used. The first LED package structure 3 includes a package body 31, a lead frame unit 32, a plurality of light-emitting dies 33, and a second LED package structure 3, which are substantially the same. Light-transmitting glue 34. The package body 31 has a block shape and has a light-emitting surface 311 and two opposite side surfaces 3丨2 connected to the light-emitting surface 31 and extending downward. The light-emitting surface 31 is formed with a 7 M406752 recess 313, and the recess 313 is preferably inverted. Cone. The lead frame unit 32 includes a plurality of first frames 321 and a second frame 322 which are arranged in a staggered manner. Each of the first frames 321 is interposed between the two second frames 322, and each of the first frames 321 is The inverted U-shape has a top plate 323, a first side plate 324 and a second side plate 325 extending downward from the top plate 323, and a bottom plate 326 extending from the first side plate 324 and spaced below the top plate 323. Each of the second frames 322 is generally L-shaped and has a top plate 327 and a third side plate 328 connecting the top plate 327. In this embodiment, the third side plate 328 of the second frame body 322 is opposite to the top plate 327. The third side plate 328 of the second frame body 322 extends downwardly relative to the top plate 327. Alternatively, the second frame body 322 may further extend outwardly from the third side plate 328 and be spaced below the top plate 327. The bottom plate 329. The lead frame unit 32 is wrapped in the package body 31 such that the top plate 323 of the first frame body 321 faces the recess 313 of the package body 31, and the first side plate 324 and the second side plate 325 of the first frame body 321 are respectively exposed to the package. The two side faces 312' of the body 31 also expose a third side plate 328 of the second frame 322 to expose one of the side faces 312 of the package body 31. The bottom plate of the first frame body 321 is similar to the bottom plate 329 of the second frame body 322. The package body 31 is opposite to the one side surface 3 14 of the light exit surface η!. The light-emitting crystal grains 33 are fixed on the top plate 323 of the first frame body 321 and are located in the package body 31 of the package body 31. The light of the light-emitting crystal grain B is emitted through the light-emitting surface 311 through the cavity 313 of the sealing body 31. . The light transmissive glue 34 is filled in the recess 313 of the package body 31 to seal the recess 313. Referring to FIG. 6, the first LED package structure 3 is provided with a second plate portion 12 which is provided with another heat conductive material and a single frame 1 between the second plate portions 2 of the single body π 1 exposed to the body 8 M406752 and The bottom plate 26 329 of the first and second frames 321 and 322 are in direct contact with each other to form a third heat conduction path, thereby further improving the heat dissipation effect on the first LED package structure 3. In addition, as the first, the fourth 2 [ED package structure 3, 3, in addition to the heat conduction medium between the frame unit 1, since it is usually made of silicone rubber and has an elastic material, it can complement the first and second LED package structures. 3, 3, assembly error with the first plate portion i2i and the third plate portion 123 of the back frame unit 1, and to avoid damage to the first and second LED package structures 3, 3 during assembly. Referring to FIG. 7 and circle 8, a preferred embodiment of the light source device of the backlight module of the present invention is shown. The difference from the first preferred embodiment lies in the structure of the shell portion 5. In the second preferred embodiment, there are two shell portions. FIG. 7 shows only one) corresponding to the first LED package structure 3 and the second LED, respectively. The package structure (such as the second LED package structure 3 of FIG. 2), and the first LED package structure 3 and the second LED package structure can also be soldered to the road board unit 2, for example, through solder paste. The shell portion 5 is exemplified by an inverted U-shape including a first plate portion 51 and two side plate portions 52 extending downward from the first plate portion 5, and the light-emitting surface 3nπ of the mounting structure 3 has a plate PP51 - a board edge 511 on the same side as the first LED sealing the first surface 311. When the shell portion 5 is connected to the package structure 3, the heat conducting crucible 4 is sandwiched by the first frame body 321 = ^ Between the side surface 312 and the first plate 511, the heat conduction potential 4 is simultaneously in contact with the second 11 M406752 side plate 325 of the first frame body 321 and the first plate portion 51 of the shell portion 5, and the side plate portions η are respectively The other two opposite sides of the package body 31 of the first LED package structure 3 may be the circuit board unit 2 provided with two slots η The side plate portions 52 of each of the shell portions 5 are inserted and fixed, but the fixing manner is not limited thereto, and the side plate portion 52 of the shell portion 5 is inserted into the slot 21 of the circuit board unit 2 and the first LED is The package structure 3 and the thermal pad 4 are positioned between the shell portion 5 and the circuit board unit 2, and have the effect of increasing the accuracy of the first LED package structure 3; and when the shell portion 5 is combined with the first (four) package structure 3, when the thermal conductive crucible 4 is interposed therebetween, the edge 511 of the first plate portion η and the thermal conductive crucible 4 do not exceed the light emitting surface 31 of the first LED package structure 3 or the light emitting surface of the first LED package structure 3 3 η alignment is preferred to prevent the first plate portion 51 or the thermal pad 4 from blocking the light output from the first LED package 3. Since the first plate portion 51 of the case portion 5 is in direct contact with the thermal pad 4, the thermal conductivity 塾 4 Further, the first side plate 325 of the first LED package structure 3 is in contact with the first side plate 325. Therefore, the thermal energy of the illuminating chip Μ is conducted by the first frame body 321 @ the second side plate 325 via the thermal pad 4 to In the first plate portion 51 of the shell portion 5, the thermal energy is discharged directly from the first plate portion 51 by the first plate portion 51. Another portion of the heat energy of the crucible 51 It can also be transmitted to the side plate portions 52 and directly discharged by the two side plate portions 52 or discharged through other heat conduction medium, thereby increasing the heat dissipation path. Referring to FIG. 9 and FIG. 10, the backlight device of the present invention, the light source device of the group 1 〇3: The preferred embodiment of the present invention differs from the first preferred embodiment in that the backlight of the backlight module is disposed on the back of the light source assembly 12 M406752 in the second preferred embodiment. When the frame unit 14 is stamped, in addition to the area punched out of the substrate 141, the two tabs i46 connected to the substrate ι 41 are punched out, and the two tabs 146 are bent twice to be partially spaced apart from the substrate. Above the M1, the first plate portion 142 and the second plate portion 143 are defined to be spaced apart from the substrate 141, thereby forming the shell portion 140. The first and second LED package structures 3, 3 are also disposed on the substrate 141 and the first plate portion. Between the 142 and between the substrate 14 丨 and the second plate portion 143 and fixed to the circuit board unit 2 by, for example, solder paste bonding, and taking the first LED package structure 3 as an example, the first plate portion M2 and the first portion The thermal conductive crucible 4 can also be disposed between the LED package structures 3, and the guides 4 are simultaneously - the board portion 142 and the first coffee package contact or the 'thermal pad 4 and the first plate portion 142, there may be other components, and the first plate portion " 2 with the first LED package structure 3 and The second plate portion 143 is matched with the second LED package structure 3, and the arrangement direction is the same as that of the first preferred embodiment', and the oblique plate edge 144 of the first plate portion 142 and the oblique plate edge 145 of the second plate portion (4) are both It is disposed at an angle of 45 degrees, but the oblique angle range of the oblique direction edge m of the first plate portion M2 and the oblique plate edge 145 of the second (four) 143 can also be the same as that of the first preferred embodiment. In other embodiments, the back frame of the backlight module is available in the form of a long strip. "(ie, a plurality of LED package structures are included) are accommodated in the same state as the first plate portion 142. The light exiting the light-emitting surface of the thermal pad package structure 3 or the light-emitting surface of the first LED package = the third-side = 311 is 鲂4 苒3 - LED^ = avoiding the first plate portion 142 or the thermal conductive layer 4 blocking In the other embodiments described above, 13 M406752, the shell portion of the back frame unit 14 may also have an extra strip extending along a side edge of the substrate and bent to form a long groove. The shape of the shape, that is, the two tabs 146 are connected to form a long strip and are bent twice to form a shell portion. Referring to FIG. 11 ' FIG. 12 , a fourth preferred embodiment of the light source device of the novel backlight module is shown. The '2 light source device i Q4 includes a back frame unit 6, a 'package, a 7-circuit board unit 81, and a thermal pad 82. The back frame unit L includes a substrate 61 and a casing that is free from the substrate 61. The portion 62, actually, the crust portion 62 is substantially L-shaped and has - spaced apart from the first plate 621 of the substrate 61 and the n substrate 61 - The outer edge connects the substrate η to the connecting plate portion 622 of the first plate portion 621, and the first plate portion 621 has a plate edge (2). The edge 623 of the first plate portion 621 and the substrate 61 cooperate to define an opening 620. The package structure 7 includes a package body 7〇, a package body 70, a first frame body 71, and two second frame bodies on both sides of the first frame body 7丨 and a first one disposed at the first frame. The illuminating crystal of the frame body 71. The first frame body 71 is substantially rectangular and has a first edge 711 and a 板-舡 7 7τ ^ circuit η / , package structure 7 Soldering and fixing between the base and the electricity, and at this time, electricity::8:: on the 苐-one and the LED „, the structure 7 # + ^ is located in the connecting plate (3) county, the structure of the 7 light-emitting surface 7〇1 And the circuit board unit:: parallel' and when the LED sealing structure 7 is disposed within the shell portion, the edge 623 of the 4 621 is not to exceed the -1 of the LED encapsulation structure 7 or the light-emitting surface 701 of the alignment (four) package structure 7 is佳:= 14 M406752 The edge 623 of the plate portion 621 blocks the light from the LED package structure 7. The thermal pad 82 is further disposed on the first frame 71 to expose the first edge 711 of the package and the substrate 6 Between 1 and at the same time being formed in contact with the first rim 711 of the first frame 621 and the substrate 61 - the first rim 711 of the first frame 62 经 passes through the thermal conductive ridge 82. Its: te ααλ* . The first heat conduction path P1 of the substrate 61, and the second plate edge 712 of the first frame body 7 of the package body 7G is exposed toward the first plate portion 621 of the back frame unit 6 and the first plate portion 621 of the back frame unit 6 The second heat conduction path P2 is formed in contact.
因此’在第四較佳實施例中’ LED封裝結構7除了第 -架體7!的第二板緣712與第一板部621直接接觸而形成 的第二熱傳導路徑P2散熱以外，更可藉由第-架體71的 第一板緣711透過導熱墊82與基板61接觸而形成的第一熱 傳導路#P1散熱，因而增加LED封裝結構7的散熱路徑。Therefore, in the fourth preferred embodiment, the LED package structure 7 can be borrowed in addition to the heat dissipation of the second heat conduction path P2 formed by the second board edge 712 of the first frame body 611 in direct contact with the first plate portion 621. The first heat conduction path #P1 formed by the first plate edge 711 of the first frame 71 passing through the thermal pad 82 in contact with the substrate 61 dissipates heat, thereby increasing the heat dissipation path of the LED package structure 7.
综上所述，本新型藉由第一、第二LED封農結構3、 3’、7的導線架單元32的結構改良配合導㈣4、82，使得 當第一、第二LED封裝結構3、3，、7 -時，能產生多條熱傳導路徑，以提升== 73的散熱效果，故確實能達成本新型之目的。 ▲惟以上所述者，僅為本新型之較佳實施例❿已當不 能以此限定本新型實施之範圍，即大凡依本新型申請:利 範圍及新型說明内容所作之簡單的等效變化與修部，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖I是一種習知的背光模組的發光模組的剖視圖； 15 卿6752 圖2是本新型背光模組的光源裝置的第〜較佳實施例 #部分元件分解圖； 圖3是該第一較佳實施例的局部放大圖； .圖4是該第-較佳實施例的一 LED封裝結構的分解圖 的立體圖 圓5A是該第一較佳實施例的LED封裝結構 圖5B是該第一較佳實施例的LED封裳結構的另一角 度的立體圖； 剖視Γ是該第—較佳實施例在第—LED料結構位置的 圖7是本新型背光模組的光源裝置的第二較佳實施例 的局部分解圖； 圖8是該第二較佳實施例的刮視圖； 圖9是本新型背光模組的光源裝置的該第三較佳實施 例的部分元件分解圖； 圖1 〇是該第三較佳實施例的剖視圖； 圖11是本新型背光模組的光源裝置的第吨 的〆LED封裝結構的立體圖；以及 實 圖12是該第四較佳實施例的局部剖視圖。 16 M406752 【主要元件符號說明】 【先前技術】 126 、 127· •斜邊板緣 9 ....... …·背光模組的發光模組 128…… •開口 91…… …·導熱架 14........ •背架單元 92…… …電路板 140…… •殼部 93…… …發光二極體 141…… •基板 931 ···. …·座體 142…… •第一板部 932 ···· …引腳 143…… 第·—板ctP 94…… •…導熱材料 144…… •斜向板緣 95…… •…導光板 145…… •斜向板緣 96…… …·反射片 146…… •凸片 97…… …反射罩 15........ •框架元件 【實施例】 2 ......... •電路板單元 100… …背光模組的光源裝置 3 ......... •第一 LED封裝結構 103 .... …·背光模組的光源裝置 35 ........ •第二LED封裝結構 104… …·背光模組的光源裝置 31........ •封裝體 1 ....... …背架單元 311…… •出光面 11…… …基板 312…… •側面 12…… •…殼部 313…… •凹穴 121 ··· •…第一板部 314…… •表面 122 ·.·. •…第二板部 32........ •導線架單元 123 ··· …第三板部 321…… •第一架體 124 ··· —第 框邊 322…… •第二架體 125… •…第二框邊 323…… •頂板 17 Έ406752 324 ··.. …第一側板 622 ···· …連接板部 325 ···· …第二側板 623 ·.·. 板緣 326 ···· …底板 7 ....... ••••LED封裝結構 327 ···. …頂板 70…… •…封裝體 328 ···· …第三側板 701 ··· •…出光面 329 ···· …底板 702… …·側面 33…… …·發光晶粒 71…… •…第一架體 34…… …透光膠 711… •…第一板緣 4 ....... •…導熱墊 712… •…第二板緣 5 ....... •…殼部 72…… …·第二架體 51…… •…第一板部 73••… •…發光晶粒 511… •…板緣 81 ••… …·電路板單元 52•…· •…側板部 82···.· …·導熱墊 6…… •…背架單元 P1••… •…第一熱傳導路徑 61 ·..·· ----基板 P2•.… •…第二熱傳導路徑 62···.. …·殼部 P3··... •…第三熱傳導路徑 620… …·開口 621… •…第一板部 18In summary, the present invention is improved by the structure of the lead frame unit 32 of the first and second LED enclosure structures 3, 3', and 7 (4) 4, 82, so that when the first and second LED package structures 3, 3, 7 -, can generate multiple heat conduction paths to improve the heat dissipation effect of == 73, so it can achieve the purpose of this new type. ▲ However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change of the novel application and the new description content is The repair department is still covered by this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a conventional light-emitting module of a backlight module; 15 qing 6752 FIG. 2 is an exploded view of a portion of a preferred embodiment of a light source device of the backlight module of the present invention; 3 is a partially enlarged view of the first preferred embodiment; FIG. 4 is an exploded perspective view of an LED package structure of the first preferred embodiment. FIG. 5 is an LED package structure of the first preferred embodiment. 5B is another perspective view of the LED sealing structure of the first preferred embodiment; the cross-sectional view is the first preferred embodiment in the position of the first LED material structure, FIG. 7 is the backlight module of the present invention. A partially exploded view of a second preferred embodiment of the light source device; FIG. 8 is a plan view of the second preferred embodiment; FIG. 9 is a partial view of the third preferred embodiment of the light source device of the backlight module of the present invention 1 is a cross-sectional view of the third preferred embodiment; FIG. 11 is a perspective view of a ton of the 〆LED package structure of the light source device of the backlight module of the present invention; and FIG. 12 is the fourth preferred embodiment A partial cross-sectional view of an example. 16 M406752 [Description of main component symbols] [Prior Art] 126, 127· • Beveled edge 9..................Lighting module 128 of backlight module... • Opening 91...... ...·Heat conduction frame 14........ • Back frame unit 92 ... ... circuit board 140 ... • Shell portion 93 ... ... light emitting diode 141 ... • Substrate 931 · · · · ... · Block 142 ... • First plate portion 932 ····· Pin 143... Page-plate ctP 94... •... Thermally conductive material 144... • Oblique plate edge 95... •... Light guide plate 145... • Oblique plate Edge 96 ... ... reflective sheet 146 ... • tab 97 ... ... reflector 15 ..... ... frame element [Embodiment] 2 ......... • Board unit 100...light source device 3 of backlight module ..... ... first LED package structure 103 ..... light source device 35 of backlight module ........ LED package structure 104... Light source device of backlight module 31........ • Package 1 ......... Back frame unit 311... • Light exit surface 11 ... ... substrate 312... ... • Side 12... •... Shell 313... • Concave Hole 121 ····...first plate portion 314... • surface 122 ·.........second plate portion 32........ • lead frame unit 123 ···...third plate portion 321 ...... • First frame 124 ··· — Frame side 322... • Second frame 125... •...Second frame 323... • Top plate 17 Έ406752 324 ··.....First side plate 622 ·· ··...Connecting plate part 325 ····...Second side plate 623 ·.·. Plate edge 326 ····...Backplane 7............••••LED package structure 327 ···. Top plate 70...•...Package 328 ····...Third side plate 701 ····...Light-emitting surface 329 ····...Backplane 702...·Side 33... ...·Light-emitting dies 71... •... The first frame 34...the light-transmissive glue 711...•...the first plate edge 4............•...the thermal pad 712...the second plate edge 5............ Part 72...the second frame 51...•...the first plate portion 73••...•...the light-emitting die 511...•...the plate edge 81 ••...the circuit board unit 52•...·...the side panel Department 82···.·...·thermal pad 6... •...back frame P1••... •...first heat conduction path 61 ·..·· ----substrate P2•.... •...second heat conduction path 62···.....·shell part P3··... •... Three heat conduction paths 620 ... ... openings 621 ... • ... first plate portion 18