TWM405575U - Modular testing device - Google Patents

Description

M405575 V. New description: [New technical field] This creation is about a signal testing device, especially a modular test device that can distinguish high-order signals from general signals. [Prior Art] Today in the field of Print Circuit Board (PCB),

The technology of design and production continues to advance, enabling the industry to compete to develop PCBs with the smallest size, lowest cost and most integrated functions. However, as shown in the first figure, when a conventional printed circuit board is required to have multiple functions at the same time, a general design method is to centrally arrange components having the same function and classify signals to form a plurality of different functions. Block, in other words, as far as possible, the high-order, layer 10' (such as: high-frequency, high-speed, RF, analog to digital, etc.) line design and the general signal circuit layer 1丨, sub-regional or layered independent design arrangement ^Principle' means that the signal processing method is sub-regional or layered processing, and other Ls are arranged according to the production ability and cost. But the PCB design method of purchasing ^ ultimately the various signal circuits are still designed on the same piece / B, and the design of the printed circuit board of the mixed signal circuit is quite complicated, the layout, wiring and power and ground processing of the burning: will directly affect Electric power: Γ performance. In addition, the signal layering process needs to consider the package 2, the arrangement, the trace side of each trace layer "~ 曰 口 mouth, impedance matching, shielding, even electromagnetic: medium: Lili can be divided into physical partition and electrical Partition, , knife "considering component layout, orientation and electrical and electrical partitioning need to consider the power distribution = question signal and grounding and other partitioning issues. Line, light-structure and 3/15, this, when the design of the integrated circuit is more and more, if you take the conventional P c Β Ί, and the denser the arrangement is in a PCft l, A 々 When the various signal circuits are tightly designed and wired, the space of the _ degree is increased to a small extent, which causes the length of the material of the coffee to be made and the efficiency is not good. Correction, because Wei County ^ therefore economic plans are taken in a customized way, to: 屮: - a PCB set to use 'limbs should pay attention to the body Wei, if the test occurs abnormally, _ re-made: two =:=When the damage is confirmed: The two creators feel that the above-mentioned defects can be improved, but they are deeply researched:=;:=, finally proposed a reasonable design and effective improvement [new content] ^ The main purpose of this creation, It is to provide a testable test that can make a high-order signal and a general signal. The modular test device is designed and manufactured to reduce at least two printed circuit boards (PCBs), and the high-order signal circuits are independently fabricated into a single module board. The general signal circuit is designed on the original motherboard. Therefore, the fault can be quickly eliminated when the fault occurs. Only the faulty PC is redesigned, which greatly reduces the production time and cost. Another object of the present invention is to provide a scalable test device with an extended function, which can be applied to an integrated circuit (1C) for testing various signals. 4/15 M405575 Test device purpose, this creation provides a modular testable & bracket-motherboard, the motherboard includes at least _ two - application circuit layer; at least - module board, the module yoke :: a high-order signal circuit layer; and the second, ''4-face electrical connection to the motherboard and _, _ I connection interface creation has the following beneficial effects: the physical test device' High-order signals and general signals

The second and the module board 'helps the pcb circuit to make the space of the hard disk', thus reducing the difficulty of the coffee and shortening the design time and improving the work efficiency. The modular test device can be: == establish a standardized modular circuit design, and t = i can have any signal test requirements or test machine changes, the motherboard can be redesigned and The combination of the modular boards, the time and cost of not redesigning, can also eliminate the difference in #唬缒 表现 performance. High-level letter

The modular test device has a signal connection method that uses a plug-in or a house-mounted fixed-correction type to prevent the board from being touched. The modular test device requires a repair or a reduction in the scope of the inspection to shorten the operation time or only need to redesign the replacement for one of the \CBs. In order to enable us to further understand the features and technical content of this creation, please read the following about this creation _ _ _ _, however, _ drawings are for reference and explanation only, and are not intended to limit the creation. 5/15 iVHU5575 [Embodiment] Please refer to the second A to the fourth B. The present invention provides a 4-modular test device 2, which includes a mother board 2G, at least a module board 21, and an electrical connection. The interface between the motherboard 2G and the module board 21 is at least connected to the interface 22. As shown in the second figure, the motherboard 2G and the module board 21 are both printed circuit boards (Pdm Chxuit B(10)d, PCB), wherein the motherboard 2() includes at least one signal circuit layer and at least - Application circuit layer, while the mold taste 21 包括 includes - a high-order signal circuit layer, wherein the high-order signal circuit layer is not limited here. In this specific real 阙 ' high-order Qian Wei layer shot for high-frequency circuit layer, high-speed electric switch , shooting (four) road layer, analog Wei signal circuit layer or less than two or more components. The modular test device 2 of the present invention designs high-order signals and general signals in different pcBs by using a high-order signal and a general signal as a physical distinction and a signal classification concept (ie, the motherboard 20 and the module). On the board 21), in the specific embodiment, the high-order signal circuit layer is disposed on the remaining board 21, and the general signal circuit layer is disposed on the motherboard 20. The other signal circuits are designed according to the manufacturing capability and the cost. Arrangement. This kind of wealth is private but has a division of pCB circuit design and effectively increases the space of the circuit layout. Therefore, the difficulty of pcB production is relatively reduced: the design time is reduced and the work efficiency is improved. If the pCB needs to be repaired or μ is generated again, 'The repair m can be shortened to shorten the operation time or only need to be redesigned and replaced for its t PCB', so the relative cost is relatively low, and there are 5 need, only need to set the module board with high-order signal circuit layer On the 21st, the special material that can improve the efficiency of (5) is improved, so the production can be greatly reduced. In addition, in the modular test device 2 of the present invention, the mother board 2 〇 and the mold 'and the i-connection mode of the board 21 are plugged or pressed, and the connection manner can be avoided directly on the motherboard 20 The welding or desoldering action, 6/15 M405575, therefore does not damage the various components on the motherboard 2〇 or other motherboard 2〇. & month refers to the first A picture, which is the first embodiment of the creation, the motherboard 20 and the module board 21 are both a rigid carrier board, and the module board 21 is mainly used for carrying high-order signal circuit design. The connection interface 22 is used to electrically connect the motherboard 2 and the module board 21 to transmit signals to each other. The electrical connection between the motherboard 2 and the module board 21 is a plug-in method. In other words, the module board 21 is electrically connected to the motherboard 2 by being plugged into the connection interface 22. As shown in FIG. 2A, the module board 21 is a rigid board 21a, and the connection interface 22 is a socket unit 22a (Socket). The socket unit 22a includes a socket 221 and a plurality of sockets. The signal pins 222 of the board 2, the signal pins 222 electrically connect and fix the socket 221 to the motherboard 2, whereby the module board 21 is inserted into the socket unit 22a and the motherboard 2 〇 Signal transmission. Please refer to FIG. 2B, which is the second embodiment of the present invention. The structure of the motherboard 2 and the electrical connection between the motherboard 2 and the module board 21 are the same as those of the first embodiment. The difference between an embodiment is that the module board 2 is a flexible soft and hard composite board/soft board 21b, wherein the soft and hard composite board/soft board 21b can be a copper foil board, but not limited thereto. The flexible board connector unit 22b's flexible board connector unit 22b includes a plurality of 223s and a plurality of signal pins 224 extending through the motherboard 2, and the rectangular connector is disposed on the motherboard 20. The module board soft board connector unit 22b performs signal transmission with the motherboard 20. It is worth mentioning that the modular board 21 of the test can be modularized with a hard board 21a, a flexible soft and hard composite board/soft board or other carrier board; a 'soft and hard composite board' The advantage of the soft board 21b and the general hard board is that the soft and hard composite board/soft board 21b can be selectively ribbed 7/15 M405575 and electrically connected to the connection interface 22, thereby making the module board 21 and the mother board plus signal transmission 'so when the product to be tested has volume and institutional limitations (such as mobile phones, monitors, e-books or notebook computers), the module board 21 can use soft and hard composite boards / soft boards 2lb to meet the test requirements of various electronic products. The connection interface 22 (the socket unit 22a and the flexible board connector unit 22b) used in the first embodiment and the second embodiment described above is designed as a common specification. Therefore, (4) the field is easy to obtain, cost-effective and easy to manufacture. Please refer to the third figure and the fourth (four), which is the third embodiment of the creation, the structure of the mother board 20 is the same as that of the first embodiment, and the structure of the module board 21 is the hard board 21a (third A picture) Or the combination of the soft and hard composite board/soft board training (third B diagram) 'the connection interface 22 is an electrical connection unit 22c. The structure of the electrical connection unit 22c is not limited thereto. In this embodiment, the electrical connection is made. The unit 22c can be a conductive sheet. The conductive sheet is a metal connection point disposed on the motherboard 2 (the electrical connection manner of the pac^ mother board and the module board 21 is a pressing method, in other words, by pressing The device 23 presses the module board 21 downwardly to the connection interface 22, so that the module board 21 is in contact with the connection interface 22, and the force is applied to the connection interface 22, so that the module board 2 is electrically connected. The single 7L 22c is pressed and electrically connected to the mother board 2〇. It is desirable to have a cushioning material (not shown) between the module and the module board, and the structure of the cushioning material can be - kraft layer, graphite Paper layer or rubber, but not limited to this 'the cushioning material can make the force of the forceps 23 to be evenly dispersed throughout the module board 21 and On the mother board 20, the whole module board 21 and the mother board 2 are tightly pressed together to make the signal transmission efficiency better. Please refer to the fourth A picture and the fourth B picture, which is the fourth implementation of the creation 8/ 15 M405575 Example 'The structure of the mother board 20 is the same as that of the first embodiment, and the module board 2' is constructed as a hard board 21a (fourth A ® ) or a soft and hard composite board / soft board 2 lb (fourth b diagram) The connection interface 22 is an elastic conductive unit 22d. The structure of the elastic conductive unit 22d is not limited thereto. In the specific embodiment, the elastic conductive unit 22d can be a pressure-sensitive conductive rubber.

Rubber, PCR) or - conductive elastomer. The phantom electrical connection between the motherboard 2 and the module board is a pressing method, in other words, by an elastic conductive unit.

The mother board 2Q and the module board 21 are electrically connected to each other to transmit signals by elastically pressing between the motherboard 20 and the module board 21. The biggest advantage of the flexible conductive unit DC is that it only needs to be connected to the neighboring lock county (not shown) to make the mother board 2G and the module board 21 vertically connected in series. In other words, the only example is the mother. The electrical connection of the board 2G and the module board 2] is a pressing method, but there is no need to provide a pressing tool 23 (such as the third A ® and the third B) to press the module board 2i and the motherboard 20 In the specific embodiment, the function of the aging is achieved by the elastic conductive unit being finely pressed between the motherboard 2 () and the module board 2_1. In addition, due to the elastic conductive sheet

=22d itself has elasticity' so that the elastic conductive unit can serve as a slower lining for pressing, and no additional consumables, so it has the advantage of simplifying the manufacturing process, low cost, and being more environmentally friendly. The value of the elastic conductive unit 22d is a pressurized conductive fine i: (PCR) ' * in the PCR system is - will be broken glass silver, silver, ton silver, graphite money recorded, recorded silver The low-density silver, the high-density silver, and the electric particles are evenly distributed in the transfer rubber, so that the force T is the touch to achieve good performance. In addition, f _, money, and high conductivity, % magnetic phase valley mask and environmental sealing ability, and vertical conduction 9 / 15 surface 5575 lateral non-conduction characteristics. Furthermore, PCR has superior and stable conduction performance (approaching zero impedance), and because of its softness of rubber material and shock absorption. In summary, PCR overcomes the shortcomings of the previous conductive foam and is easy to contaminate the dust on the surface, and the PCR design concept is based on light, thin and small applications, so PCR can be used in this creation to modularize On the test device 2, the applicability is further displayed.

Referring to FIG. 5 to FIG. 6 , the module board 2 is further provided with a multi-signal 1C component 212, an electronic component (not shown), an application circuit layer 2U, a circuit phase trace/lead layer 2 3 or Slot (not shown), so that the module board 21 has signal predation, and matching control, the electronic components can be resistors, inductors, capacitors or relays, but not limited thereto. . As shown in FIG. 6 , the module board 21 is further provided with at least the extended connection interface 24 to extend the module core 21 , and the frame connection interface 24 has the same structure as the connection interface 22 , but is not limited thereto. In the specific embodiment, the upper surface and the lower surface of the module board 21 are divided into at least one county connection interface 24, and the expansion connection interface on the upper surface of the mold board 21 is extended with the lower surface of the other module board 21. Interface 24 is electrically connected, and the mold plate 2

The interface 24 is electrically connected to the connection interface 22 of the motherboard 2G, and the signal is fed back to the motherboard 20 and the module boards 21 . In addition, the motherboard 20 and the module board 21, the layer, the power layer, the circuit layer, the application circuit layer 2u, the n-line layer 213, or at least two or more groups of boards, - spring / lead multiple electrons Component (not shown) or ic component 212 • Upper layer 2 can be provided with electronic components and circuit layers + which have the usual knowledge in the domain (4) and the same as the motherboard 2 and the module board 21; _. s belongs to the original bamboo 10/15 M405575 this! The #犹装置2 has the following advantages: 1' =憎Tactile device 2, which distinguishes high-order money from general letter f and _ into mother board 2G and module board 2 〗, to help the PCB private road "again. The tool j_ of f· effectively increases the space of the circuit layout, so the difficulty of making PCBs relative to IV is low, and the design time is shortened* to improve the efficiency of the layout. 2. ^ „Grouping job device 2' It can establish a standardized module circuit design according to the meaning of various signal communication, and make a signal test or test machine change requirement for the Shishi test object. The board 20 can be redesigned and used in combination with the module board 21, which not only hurts the time and cost of the high-end design, but also the difference in the performance of the high-order signal by the designer. The device 2, the signal connection method is to insert or pull the coffee to correct the material, Wei Qian can do the tan or desoldering on the mother board 2 (), will not hurt the mother board 20. 4. ^ Creation The device can be pooled, and when it needs to be damaged or damaged, it can reduce the scope of inspection. When it is used, it is only for redesigning and replacing two of the PCBs, so the relative cost is relatively low. This creation can be modularized by the device 2, which only needs to increase the high-order signal efficiency on the high-number electro-static handle plate 20, which can greatly reduce the production cost.

6. The test device 2 can be modularized. The motherboard 2 and the module door can be connected between the motherboard 2 and the module board 21 by connecting the interface 22 and the expansion interface 24. The function of transfer, matching control and expansion between the group board 21 and the other module board 21. σ I The above is only the preferred embodiment of the present invention, and is not intended to create the scope of patent protection. Therefore, the equivalent change of the 11/15 M405575 in this manual and the drawings is used. To Chen Ming. The same applies to the protection of the rights of this creation [simplified description of the drawings] The first picture is a schematic diagram of the combination of the conventional printed circuit board; the second picture A is the first embodiment of the device that can be modularized A schematic diagram of the combination of the two embodiments of the second B ® forest creation modularization device; the first A diagram and the second B diagram are the third embodiment of the test device capable of modularizing Combination diagram; the fourth diagram A and the fourth diagram B are schematic diagrams of the fourth embodiment of the creation of the modular device; the fifth diagram is a schematic diagram of the creation of the modularized tonnage device; The six figures are schematic diagrams of the expanded combination of the test devices that can be modularized. [Main component symbol description] [Practical] 】 'Printed circuit board】 〇 'High-order signal layer H' General signal layer [This creation] 2 Modular test device 20 Mother board 21 module board 12/15 M405575 21a Hard board 21b soft and hard composite board/soft board 211 Application circuit layer 212 1C element 213 Circuit board trace/lead layer 22 connection interface

22a socket unit 221 socket 222 signal pin 22b soft board connector unit 223 connector 224 signal pin 22c electrical connection unit 22d elastic conductive unit 23 pressing tool 24 expansion connection interface

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Claims (1)

雠 5575 6. Patent application scope: 1. A modular test device, including the package. The motherboard includes at least a general signal layer and at least - application = less - module board, the module board at least Included as a high-level signal circuit layer; with a = connection interface, the connection interface is electrically connected to the motherboard and the module 2. As claimed in the application of the full-time (4) 1 item, the modular interface is a Socket unit, two /, medium ο is set on the signal pin of the motherboard, material ^ ^, early 7 " has multiple wear.谓 % _ _ _ electrically connected to the motherboard 3. As in the scope of the patent application, the connection interface is a soft board connection crying device, wherein the ν ^ is connected to the early 70, the soft board is connected to the crying cover The right side = the signal pin disposed on the motherboard, the connection is electrically connected to the bank; the modular test device described in the item, wherein the connection " face is an electrical Connect the unit motherboard or the conductive strip on the module board. Press m again and place it in the "5" = the modular test device described in item 4 of the patent scope. The conductive sheet is a metal connection point. The apparatus is the same as the apparatus of the invention. The i-th connection interface of the patent application is an elastic conduction degradable test device, wherein the elastic conductive unit is elastically pressed according to the test plate. The modular test device, wherein the v-electricity is an additive conductive rubber or a conductive elastic rubber. 14/15 8. If the application scope is i-th, the module board is further set to at least - (4) H-grouped m, wherein the connection to the module board and the other expansion interface is electrically. 9. The patent can be used to test the modular test device described in item j. The motherboard and the (4) are -_ circuit boards.可 The modular test device described in item 1, wherein the trace to the layer, the circuit layer, the application circuit layer, the circuit board layer, and the power layer 1 channel; the module; This includes the grounding 'Hongg circuit board trace/lead layer or at least two or more components. 11. If you apply for a test device that specializes in 11 $ 1 rhyme, the A cough mother board and the module board are respectively set with one electronic component or IC component, ^ it: some 70 pieces have multiple electric The signal pin is connected to the motherboard and the module board. 12. The modular test device according to claim 1, wherein the replacement plate is a high-frequency circuit layer, a high-speed circuit layer, a radio frequency circuit layer, and a Yuet number of the signal circuit layer. Circuit layer or at least two of them. 13. 13. The modular test device as described in the patent application (4), and the middle wheel set is Wei, flexible soft and hard composite plate or soft. board.乂 & For example, a modular test device as claimed in claim 13 wherein the flexible flexible composite panel or the flexible panel is selectively flexed and electrically connected to the connection interface. 15/15