TWM405575U - Modular testing device - Google Patents

Modular testing device Download PDF

Info

Publication number
TWM405575U
TWM405575U TW99219053U TW99219053U TWM405575U TW M405575 U TWM405575 U TW M405575U TW 99219053 U TW99219053 U TW 99219053U TW 99219053 U TW99219053 U TW 99219053U TW M405575 U TWM405575 U TW M405575U
Authority
TW
Taiwan
Prior art keywords
board
motherboard
test device
layer
module
Prior art date
Application number
TW99219053U
Other languages
Chinese (zh)
Inventor
wen-cong Li
jia-en Zhang
xin-yao Li
Original Assignee
Chunghwa Prec Test Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chunghwa Prec Test Tech Co Ltd filed Critical Chunghwa Prec Test Tech Co Ltd
Priority to TW99219053U priority Critical patent/TWM405575U/en
Publication of TWM405575U publication Critical patent/TWM405575U/en

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

M405575 五、新型說明: 【新型所屬之技術領域】 本創作有關於一種信號測試裝置,尤指一種可將高階 信號與一般信號做實體區分之可模組化之測試裝置。 【先前技術】 現今於印刷電路板(Print Circuit Board, PCB)的領域,由M405575 V. New description: [New technical field] This creation is about a signal testing device, especially a modular test device that can distinguish high-order signals from general signals. [Prior Art] Today in the field of Print Circuit Board (PCB),

於設計製作的技術不斷進步,使產業界競相研發具有最小 尺寸、最小成本而整合最多的功能之PCB。然而,如第一 圖所示,當習知印刷電路板丨,上需同時具有多個功能時, 一般的設計方式是將功能相同的元件集中佈置,且將信號 分類而形成多個不同的功能區塊,換言之,盡可能將高階 ,號層10’(如:高頻、高速、射頻、類比轉數位等)的線路設 计與一般信號電路層1丨,採取分區域或分層獨立設計安排 ^原則’即信號的處理方式為分區域或分層處理,其他的 L就則依據製作能力及成本高低做祕設計之安排。但购 ^的PCB設計方式’最终各種信號電路仍設計在同—片 /B上,而混合信號電路印刷電路板的設計相當複雜,焚 :的佈局、佈線以及電源和地_處理將直接影響到電 電:Γ性能。另外,信號分層處理時需考慮包 二,安排、各走線層的走線方“ 〜曰虎口口貝、阻抗匹配、屏蔽作用、甚至電磁 :中:理里時可分為物理分區和電氣分區, 、 刀“考慮零組件佈局、朝向和電 而電氣分區則需考慮電源分配 =問喊 信號以及接地等的分區問題。触線、輕-構和 3/15 ,此,當積體電路的設物聊 末越问,若採取習知的P c Β Ί,且始度越 密地安排在一片PCft l 、A々式將各類信號電路都緊 設計佈線時的_度增加空間狹小使 導致咖的料製作賴拉長度進而 效益不佳。糾,由於魏縣^因此經濟 計案皆採取客製化的方式進行,以;屮:-個PCB設 稷使用’肢應錢觀體魏 再 ,若測試發生異常時, ,_重新製作:二=:=認損壞時 究並:二本創作人有感上述缺失之可改善,乃特潛心研 :=;:=,終於提出一種設計合理且有效改善 【新型内容】 ^本創作之主要目的,在於提供一種可將高階信號與一 般信號做實魏分的可模纟德之測試|置。該可模組化之 測試裝置係採賴財式設計及製作而分減至少兩片測 4用印刷電路板(print Circuit B〇ard,PCB),將高階信號電路 獨立製作成一片模組板,而一般信號電路則設計在原有的 母板上’因此故障發生時可快速排除’僅就故障之PC只重 新設計’大幅減少製作時間及成本。 本創作之另一目的,在於提供一種具有擴充功能之可 杈組化之測試裝置,可應用於測試各種信號的積體電路 (Integrated Circuit, 1C)。 4/15 M405575 試裝置目的,本創作提供—種可模組化之測 Τ &括-母板,該母板至少包括_個 二―應用電路層;至少-模組板,該模組軛:: —個高階信號電路層;以及少 二而、'’ 4 面係電性連接於該母板與_、_之I接 連接介 本創作具有以下有益的效果: 實體之測試裝置’其將高階信號與一般信號做The technology of design and production continues to advance, enabling the industry to compete to develop PCBs with the smallest size, lowest cost and most integrated functions. However, as shown in the first figure, when a conventional printed circuit board is required to have multiple functions at the same time, a general design method is to centrally arrange components having the same function and classify signals to form a plurality of different functions. Block, in other words, as far as possible, the high-order, layer 10' (such as: high-frequency, high-speed, RF, analog to digital, etc.) line design and the general signal circuit layer 1丨, sub-regional or layered independent design arrangement ^Principle' means that the signal processing method is sub-regional or layered processing, and other Ls are arranged according to the production ability and cost. But the PCB design method of purchasing ^ ultimately the various signal circuits are still designed on the same piece / B, and the design of the printed circuit board of the mixed signal circuit is quite complicated, the layout, wiring and power and ground processing of the burning: will directly affect Electric power: Γ performance. In addition, the signal layering process needs to consider the package 2, the arrangement, the trace side of each trace layer "~ 曰 口 mouth, impedance matching, shielding, even electromagnetic: medium: Lili can be divided into physical partition and electrical Partition, , knife "considering component layout, orientation and electrical and electrical partitioning need to consider the power distribution = question signal and grounding and other partitioning issues. Line, light-structure and 3/15, this, when the design of the integrated circuit is more and more, if you take the conventional P c Β Ί, and the denser the arrangement is in a PCft l, A 々 When the various signal circuits are tightly designed and wired, the space of the _ degree is increased to a small extent, which causes the length of the material of the coffee to be made and the efficiency is not good. Correction, because Wei County ^ therefore economic plans are taken in a customized way, to: 屮: - a PCB set to use 'limbs should pay attention to the body Wei, if the test occurs abnormally, _ re-made: two =:=When the damage is confirmed: The two creators feel that the above-mentioned defects can be improved, but they are deeply researched:=;:=, finally proposed a reasonable design and effective improvement [new content] ^ The main purpose of this creation, It is to provide a testable test that can make a high-order signal and a general signal. The modular test device is designed and manufactured to reduce at least two printed circuit boards (PCBs), and the high-order signal circuits are independently fabricated into a single module board. The general signal circuit is designed on the original motherboard. Therefore, the fault can be quickly eliminated when the fault occurs. Only the faulty PC is redesigned, which greatly reduces the production time and cost. Another object of the present invention is to provide a scalable test device with an extended function, which can be applied to an integrated circuit (1C) for testing various signals. 4/15 M405575 Test device purpose, this creation provides a modular testable & bracket-motherboard, the motherboard includes at least _ two - application circuit layer; at least - module board, the module yoke :: a high-order signal circuit layer; and the second, ''4-face electrical connection to the motherboard and _, _ I connection interface creation has the following beneficial effects: the physical test device' High-order signals and general signals

計的二及該模組板’有助於pcb電路設 f作:難ΐ ί 排的空間’因此相對降低咖 "^難度、縮短設計時間而提升工作效率。 該可模組化之測試裝置,其可依: ==建立標準化的模組電路設計,並製t = i 有任一項信號測試需求或測試機台變更時,該母板 可重新設計而與該模組板結合使用,不 重新設計的時間及成本,亦可免除# 唬缒 號表現的差異。 打嫌抑^者職高階信The second and the module board 'helps the pcb circuit to make the space of the hard disk', thus reducing the difficulty of the coffee and shortening the design time and improving the work efficiency. The modular test device can be: == establish a standardized modular circuit design, and t = i can have any signal test requirements or test machine changes, the motherboard can be redesigned and The combination of the modular boards, the time and cost of not redesigning, can also eliminate the difference in #唬缒 表现 performance. High-level letter

該可模組化之測試褒置,其信號連接方式係採用插接 或屋制固定糾式’可魏直接錢母板上料接或 的動作,不會傷及該母板。 該模組化之測試裝置,其需要查修或發生 將查修範圍縮小縮短作業時間或僅需針對其中一片\CB重 新設計更換’故相對々匕費的成本較低。 為使能更進-步瞭解本創作的特徵及技術内容,請來 閱以下有關本創作_細朗_圖,然而_圖式僅提 供參考與說明用,並非用來對本創作加以限制者。 5/15 iVHU5575 【實施方式】 請參閱第二A圖至第四B圖,本創作提供一種4模組 化之測試裝置2,其包括—母板2G、至少—模組板21及電 性連接於母板2G與模組板21之_至少―連接介面22。 如第二圖所示,母板2G與模組板21均為—_用的印刷 電路板(Pdm Chxuit B⑽d, PCB),其中母板2()至少包枯〆 個-般信號電路層及至少-應用電路層,而模味21矣少 包括-個高階信號電路層,其中高階信號電路層不在此做 限制’於本具體實闕巾’高階錢魏層射為高頻電 路層、高速電關、射㈣路層、類比魏位信號電路層 或^少兩種以上之組成者。本創作可模組化之測試裝置2 係藉由將高階信號與一般信號做實體區分、信號分级之概 念’而將高階信號與-般信號分別設計在不同之pcB(即母 板20及模組板21)上,於本具體實施例中,高階信號電路 層係设置於餘板21上,而-般信號電路層係設置母板20 上,其他信號電路相依據製作能力及成本高低做線路設 計之安排。此種設財私但有騎pCB電路設計的分工 且有效增加線路佈排的空間,因此相對降低pcB製作的難 度:縮紐设計時間而提升工作效率,若pCB需要查修或發 生μ又時’可將查修m缩小縮短作業時間或僅需針對其 t PCB重新設計更換’故相對花費的成本較低,且有 5又计需,時只需於設置有高階信號電路層之模組板21上使 用可使㈤社^;效率提升之特殊材料,故可大幅降低製作 ^本。此外,本創作可模組化之測試裝置2中,母板2〇及 模’且板21的i性連接方式係為插接方式或壓制方式,此種 連接方式可避免直接在母板20上進行焊接或解焊的動作, 6/15 M405575 因此不會傷及母板2〇或其他母板2〇上的各類元件。 &月參閱第一 A圖,其為本創作之第一實施例,母板20 與模組板21皆係為一硬質載板,模組板21係主要用來承 載高階信號電路設計之用,而連接介面22係用以將母板2〇 及模組板21電性連接使兩者之間彼此信號傳遞。母板2〇 及模組板21的電性連接方式係為插接方式,換言之,模組 板21藉由插接於連接介面22而電性連接於母板2〇。如第 二A圖所示,模組板21係為一硬板21a,而連接介面22 係為一承接插座單元22a (Socket座),承接插座單元22a包 括一插座221及多個穿設於母板2〇之信號接腳222,該些 信號接腳222使插座221電性連接並固定於母板2〇上,藉 此,模組板21經由插接於承接插座單元22a而與母板2〇 進行信號傳遞。 請參閱第二B圖,其為本創作之第二實施例,母板2〇 的結構及母板2與模組板21的電性連接方式皆與第一實施 例相同,本實施例與第一實施例不同的地方在於,模組板 2^係為一可撓折之軟硬複合板/軟板21b,其中軟硬複合板/ 軟板21b可為銅箔基板,但不在此限,連接 軟板連接器單元22b’軟板連接器單元22b包括—^器 223及多個穿設於母板2〇之信號接腳224, 朗吏連接器则定於母板20上。模組板 軟板連接器單元22b而與母板20進行信號傳遞。 值得-提的是,本創作可模組化之測試裳置2的模組 板21可選用硬板21a、可撓折之軟硬複合板/軟板或其 他載板;射’軟硬複合板/軟板21b與—般硬板叫相較 最大的優點在於,軟硬複合板/軟板21b係可選擇性地棱折 7/15 M405575 而電性連接於連接介面22,進而使模組板21與母板加進 行信號傳遞’因此當待測產品具有體積及機構上的限制時( 如手機、顯示器、電子書或筆記型電腦),模組板21即可使 用軟硬複合板/軟板2lb,以滿足各類電子產品之測試需求 0 上述第一實施例及第二實施例中所使用之連接介面 22(承接插座單元22a、軟板連接器單元22b),因其接頭設 計為公用規格,故具㈣場取得容易、節省成本及製作方 便之優點。 請參閱第三八圖及第王㈣,其為本創作之第三實施 例,母板20的結構與第一實施例相同,模組板21之結構 則係為硬板21a(第三A圖)或軟硬複合板/軟板训(第三B 圖)’連接介面22係為一電性連接單元22c,電性連接單元 22c之結構不在此限制,於本具體實施例中,電性連接單元 22c係可為-導電片’該導電片為設置於母板2〇上之金屬 連接點(pac^母板及模組板21的電性連接方式係為壓 制方式’換言之’藉由-壓制制具23將模組板21朝連接 介面22时向下壓而使得模組板21與連接介面22接觸, 對連接介面22產生-撥壓的力量,進而使模組板2ι因與 電性連接單7L 22c壓合而電性導通於母板2〇。愿制制具Μ 與模組板之間更可設置有一緩衝材(未圖示),該緩衝材 之結構可為-牛皮紙層、石墨紙層或橡雜,但不在此限 ’該緩衝材可使闕制具23施加_力能平均分散於整個 模組板21及母板20上,使整片模組板21與母板2 整地緊密壓合,使信號傳遞效率更佳。 請參閱第四A圖及第四B圖,其為本創作之第四實施 8/15 M405575 例’母板20的結構與第一實施例相同,模組板2】之結構 則係為硬板21a(第四A ®)或軟硬複合板/軟板2lb(第四b 圖)’連接介面22係為一彈性導電單元22d,彈性導電單元 22d之結構不在此做限制,於本具體實施例中,彈性導電單 元22d係可為-力口壓導電橡膠The modular test device has a signal connection method that uses a plug-in or a house-mounted fixed-correction type to prevent the board from being touched. The modular test device requires a repair or a reduction in the scope of the inspection to shorten the operation time or only need to redesign the replacement for one of the \CBs. In order to enable us to further understand the features and technical content of this creation, please read the following about this creation _ _ _ _, however, _ drawings are for reference and explanation only, and are not intended to limit the creation. 5/15 iVHU5575 [Embodiment] Please refer to the second A to the fourth B. The present invention provides a 4-modular test device 2, which includes a mother board 2G, at least a module board 21, and an electrical connection. The interface between the motherboard 2G and the module board 21 is at least connected to the interface 22. As shown in the second figure, the motherboard 2G and the module board 21 are both printed circuit boards (Pdm Chxuit B(10)d, PCB), wherein the motherboard 2() includes at least one signal circuit layer and at least - Application circuit layer, while the mold taste 21 包括 includes - a high-order signal circuit layer, wherein the high-order signal circuit layer is not limited here. In this specific real 阙 ' high-order Qian Wei layer shot for high-frequency circuit layer, high-speed electric switch , shooting (four) road layer, analog Wei signal circuit layer or less than two or more components. The modular test device 2 of the present invention designs high-order signals and general signals in different pcBs by using a high-order signal and a general signal as a physical distinction and a signal classification concept (ie, the motherboard 20 and the module). On the board 21), in the specific embodiment, the high-order signal circuit layer is disposed on the remaining board 21, and the general signal circuit layer is disposed on the motherboard 20. The other signal circuits are designed according to the manufacturing capability and the cost. Arrangement. This kind of wealth is private but has a division of pCB circuit design and effectively increases the space of the circuit layout. Therefore, the difficulty of pcB production is relatively reduced: the design time is reduced and the work efficiency is improved. If the pCB needs to be repaired or μ is generated again, 'The repair m can be shortened to shorten the operation time or only need to be redesigned and replaced for its t PCB', so the relative cost is relatively low, and there are 5 need, only need to set the module board with high-order signal circuit layer On the 21st, the special material that can improve the efficiency of (5) is improved, so the production can be greatly reduced. In addition, in the modular test device 2 of the present invention, the mother board 2 〇 and the mold 'and the i-connection mode of the board 21 are plugged or pressed, and the connection manner can be avoided directly on the motherboard 20 The welding or desoldering action, 6/15 M405575, therefore does not damage the various components on the motherboard 2〇 or other motherboard 2〇. & month refers to the first A picture, which is the first embodiment of the creation, the motherboard 20 and the module board 21 are both a rigid carrier board, and the module board 21 is mainly used for carrying high-order signal circuit design. The connection interface 22 is used to electrically connect the motherboard 2 and the module board 21 to transmit signals to each other. The electrical connection between the motherboard 2 and the module board 21 is a plug-in method. In other words, the module board 21 is electrically connected to the motherboard 2 by being plugged into the connection interface 22. As shown in FIG. 2A, the module board 21 is a rigid board 21a, and the connection interface 22 is a socket unit 22a (Socket). The socket unit 22a includes a socket 221 and a plurality of sockets. The signal pins 222 of the board 2, the signal pins 222 electrically connect and fix the socket 221 to the motherboard 2, whereby the module board 21 is inserted into the socket unit 22a and the motherboard 2 〇 Signal transmission. Please refer to FIG. 2B, which is the second embodiment of the present invention. The structure of the motherboard 2 and the electrical connection between the motherboard 2 and the module board 21 are the same as those of the first embodiment. The difference between an embodiment is that the module board 2 is a flexible soft and hard composite board/soft board 21b, wherein the soft and hard composite board/soft board 21b can be a copper foil board, but not limited thereto. The flexible board connector unit 22b's flexible board connector unit 22b includes a plurality of 223s and a plurality of signal pins 224 extending through the motherboard 2, and the rectangular connector is disposed on the motherboard 20. The module board soft board connector unit 22b performs signal transmission with the motherboard 20. It is worth mentioning that the modular board 21 of the test can be modularized with a hard board 21a, a flexible soft and hard composite board/soft board or other carrier board; a 'soft and hard composite board' The advantage of the soft board 21b and the general hard board is that the soft and hard composite board/soft board 21b can be selectively ribbed 7/15 M405575 and electrically connected to the connection interface 22, thereby making the module board 21 and the mother board plus signal transmission 'so when the product to be tested has volume and institutional limitations (such as mobile phones, monitors, e-books or notebook computers), the module board 21 can use soft and hard composite boards / soft boards 2lb to meet the test requirements of various electronic products. The connection interface 22 (the socket unit 22a and the flexible board connector unit 22b) used in the first embodiment and the second embodiment described above is designed as a common specification. Therefore, (4) the field is easy to obtain, cost-effective and easy to manufacture. Please refer to the third figure and the fourth (four), which is the third embodiment of the creation, the structure of the mother board 20 is the same as that of the first embodiment, and the structure of the module board 21 is the hard board 21a (third A picture) Or the combination of the soft and hard composite board/soft board training (third B diagram) 'the connection interface 22 is an electrical connection unit 22c. The structure of the electrical connection unit 22c is not limited thereto. In this embodiment, the electrical connection is made. The unit 22c can be a conductive sheet. The conductive sheet is a metal connection point disposed on the motherboard 2 (the electrical connection manner of the pac^ mother board and the module board 21 is a pressing method, in other words, by pressing The device 23 presses the module board 21 downwardly to the connection interface 22, so that the module board 21 is in contact with the connection interface 22, and the force is applied to the connection interface 22, so that the module board 2 is electrically connected. The single 7L 22c is pressed and electrically connected to the mother board 2〇. It is desirable to have a cushioning material (not shown) between the module and the module board, and the structure of the cushioning material can be - kraft layer, graphite Paper layer or rubber, but not limited to this 'the cushioning material can make the force of the forceps 23 to be evenly dispersed throughout the module board 21 and On the mother board 20, the whole module board 21 and the mother board 2 are tightly pressed together to make the signal transmission efficiency better. Please refer to the fourth A picture and the fourth B picture, which is the fourth implementation of the creation 8/ 15 M405575 Example 'The structure of the mother board 20 is the same as that of the first embodiment, and the module board 2' is constructed as a hard board 21a (fourth A ® ) or a soft and hard composite board / soft board 2 lb (fourth b diagram) The connection interface 22 is an elastic conductive unit 22d. The structure of the elastic conductive unit 22d is not limited thereto. In the specific embodiment, the elastic conductive unit 22d can be a pressure-sensitive conductive rubber.

Rubber,PCR)或-導電彈性膠。母板2〇及模組板幻的電 性連接方式係為壓制方式,換言之,藉由彈性導電單元咖Rubber, PCR) or - conductive elastomer. The phantom electrical connection between the motherboard 2 and the module board is a pressing method, in other words, by an elastic conductive unit.

彈性地壓接於母板20及模組板21之間,使母板2Q及模組 板21彼此電性連接而進行信號傳遞。彈性導電單元DC之 最大優點在於,其僅需經由接觸加上週邊鎖縣(未圖示) 固=即可使母板2G及模組板21垂直串接導通,換言之, 本只知例中母板2G及模組板2]的電性連接方式雖為壓制 方式’但卻不需設置一壓制制具23(如第三A ®及第三B 圖)使模組板2i及母板20壓合而電性連接;即於本具體實 知例中’係藉由彈性導電單元细輕壓於母板2()及模組板 2_1之間即可達齡麟遞的功能。另外,由於彈性導電單The mother board 2Q and the module board 21 are electrically connected to each other to transmit signals by elastically pressing between the motherboard 20 and the module board 21. The biggest advantage of the flexible conductive unit DC is that it only needs to be connected to the neighboring lock county (not shown) to make the mother board 2G and the module board 21 vertically connected in series. In other words, the only example is the mother. The electrical connection of the board 2G and the module board 2] is a pressing method, but there is no need to provide a pressing tool 23 (such as the third A ® and the third B) to press the module board 2i and the motherboard 20 In the specific embodiment, the function of the aging is achieved by the elastic conductive unit being finely pressed between the motherboard 2 () and the module board 2_1. In addition, due to the elastic conductive sheet

=22d本身具有彈性’因此彈性導電單元娜可充當壓制 時所需的緩麟,不f額外的耗材,故具有製作過程簡化 IV低成本,且更加環保的優點。 值仔—提的疋,上述之彈性導電單元22d為加壓導電 細i:(PCR) ’ *於PCR係為—將破璃纖賴銀、減銀、 吨銀、石墨錢錄、錄鑛銀、低密度銀、高密度銀、 電顆粒’均勻分佈在轉膠中,因此 力即T使觸而達到良 性能。另外 f _、财之錢,又具有高導電性 义、%磁相谷遮罩和環境密封能力,及具有垂直導通 9/15 麵5575 橫向不導通的特性。再者,PCR具有優越而穩定的導通效 能(趨近於零阻抗),更因為它本身含橡膠材質的柔軟性,兼 具有避震的功能。綜上所述,PCR克服以前導電泡棉厚重 且易沾染灰塵於表面的缺點,且PCR的設計理念是以輕、 薄、小的應用為主,故將PCR使用於本創作可模組化之測 試裝置2上,更顯示其適用性。=22d itself has elasticity' so that the elastic conductive unit can serve as a slower lining for pressing, and no additional consumables, so it has the advantage of simplifying the manufacturing process, low cost, and being more environmentally friendly. The value of the elastic conductive unit 22d is a pressurized conductive fine i: (PCR) ' * in the PCR system is - will be broken glass silver, silver, ton silver, graphite money recorded, recorded silver The low-density silver, the high-density silver, and the electric particles are evenly distributed in the transfer rubber, so that the force T is the touch to achieve good performance. In addition, f _, money, and high conductivity, % magnetic phase valley mask and environmental sealing ability, and vertical conduction 9 / 15 surface 5575 lateral non-conduction characteristics. Furthermore, PCR has superior and stable conduction performance (approaching zero impedance), and because of its softness of rubber material and shock absorption. In summary, PCR overcomes the shortcomings of the previous conductive foam and is easy to contaminate the dust on the surface, and the PCR design concept is based on light, thin and small applications, so PCR can be used in this creation to modularize On the test device 2, the applicability is further displayed.

請參閱第五圖至第六圖所示,模組板2丨更設置有多信 1C元件212、電子元件(未圖示)、應用電路層2U、電路相 走線/引線層2】3或插槽(未圖示),使模組板21具有信號谓 遞、、匹配控制的魏’其巾該些電子元件係可為電阻件、 電感件、電容件或繼電器,但不以此為限。如第六圖所示 ’模組板21更設置有至少—擴充連接介面24而使模組核 21具有擴充的魏,其巾敎連接介面24與連接介面22 結構相同,但不以此為限;財具體實施例中,模組板21 上表面及下表面分職有至少—個縣連接介面24,模% 板21上表面之擴充連接介面係與另一模組板21下表面 之擴充連接介面24電性連接,而模級板2Referring to FIG. 5 to FIG. 6 , the module board 2 is further provided with a multi-signal 1C component 212, an electronic component (not shown), an application circuit layer 2U, a circuit phase trace/lead layer 2 3 or Slot (not shown), so that the module board 21 has signal predation, and matching control, the electronic components can be resistors, inductors, capacitors or relays, but not limited thereto. . As shown in FIG. 6 , the module board 21 is further provided with at least the extended connection interface 24 to extend the module core 21 , and the frame connection interface 24 has the same structure as the connection interface 22 , but is not limited thereto. In the specific embodiment, the upper surface and the lower surface of the module board 21 are divided into at least one county connection interface 24, and the expansion connection interface on the upper surface of the mold board 21 is extended with the lower surface of the other module board 21. Interface 24 is electrically connected, and the mold plate 2

,接介面24則係與母板2G之連接介面22電性連接,= 取終:母板20及該些模組板21的信號回饋給。曰 除此之外,母板20與模組板21更 ,層、電源層、電路層、應用電路層2u、n 線層213或至少兩種以上之組 板走、-泉/引 多個電子元件(未圖示)或ic元件212 •上2〇更可設置有 域中具有通常知識者㈣依科同計於本領 2〇及模組板21上的電子元件及電路層+;相 之範_。 s屬於本創竹 10/15 M405575 本!彳作可模la化之#猶裝置2具有以下優點: 1‘ =憎可触化之職裝置2,其將高階錢與一般信 f做^體區分而_成母板2G及模組板2〗,有助於PCB 私路《又。f·的刀工j_有效增加線路佈排的空間,因此相對 IV低PCB製作的難度、縮短設計時間*提升卫作效率。 2. ^„組化之職裝置2 ’其可依據各項信號通訊 疋之疋義,建立標準化的模組電路設計,並製作成 士田待測物有任一項信號測試或測試機台變更需求 板20可重新設計而與模組板21、结合使用,不但 痛去高階錢端$新設計的時間及成本,亦 設計者對該高階信號表現的差異。 〃母個 3. 本創作可额化之賴裝置2,其信號連接方式係採用 插拔或壓咖糾料,可魏錢在母板2()上做谭 接或解焊的動作,不會傷及母板20。 4. ^創作可池化之職裝置2,其需要絲或發生損毀 時’可將查修範圍縮,丨、雜作#時_僅f針對其中二 片PCB重新設計更換,故相對花費的成本較低。 5. 本創作可模組化之職裝置2,只需於高_號電靜 之柄組板20上使料使高階信號效率提升 二 ,可大幅降低製作成本。 、殊材枓The interface 24 is electrically connected to the connection interface 22 of the motherboard 2G, and the signal is fed back to the motherboard 20 and the module boards 21 . In addition, the motherboard 20 and the module board 21, the layer, the power layer, the circuit layer, the application circuit layer 2u, the n-line layer 213, or at least two or more groups of boards, - spring / lead multiple electrons Component (not shown) or ic component 212 • Upper layer 2 can be provided with electronic components and circuit layers + which have the usual knowledge in the domain (4) and the same as the motherboard 2 and the module board 21; _. s belongs to the original bamboo 10/15 M405575 this! The #犹装置2 has the following advantages: 1' =憎Tactile device 2, which distinguishes high-order money from general letter f and _ into mother board 2G and module board 2 〗, to help the PCB private road "again. The tool j_ of f· effectively increases the space of the circuit layout, so the difficulty of making PCBs relative to IV is low, and the design time is shortened* to improve the efficiency of the layout. 2. ^ „Grouping job device 2' It can establish a standardized module circuit design according to the meaning of various signal communication, and make a signal test or test machine change requirement for the Shishi test object. The board 20 can be redesigned and used in combination with the module board 21, which not only hurts the time and cost of the high-end design, but also the difference in the performance of the high-order signal by the designer. The device 2, the signal connection method is to insert or pull the coffee to correct the material, Wei Qian can do the tan or desoldering on the mother board 2 (), will not hurt the mother board 20. 4. ^ Creation The device can be pooled, and when it needs to be damaged or damaged, it can reduce the scope of inspection. When it is used, it is only for redesigning and replacing two of the PCBs, so the relative cost is relatively low. This creation can be modularized by the device 2, which only needs to increase the high-order signal efficiency on the high-number electro-static handle plate 20, which can greatly reduce the production cost.

6·本^作可模組化之測試裝置2 ’其母板2〇及模組板门 可藉由連接介面22及擴充連接介面24,而使母板2〇與 模組板21間、模組板21與另—模組板21間 _ 傳遞、匹配控制及擴充之功能。 σ I 惟以上所述僅為本創作之較佳實施例,非意欲偈 創作的專利保護範圍,故舉凡運用本創作說明書及圖式内 11/15 M405575 容所為的等效變化, 圍内,合予陳明。 均同理皆包切本創作的權利保護範 【圖式簡單說明】 第一圖為習知印刷電路板的組合示意圖; 第二A圖為本創作可模組化之_裝置的第—實施例之组 合示意圖; 第二B ®林創作可模組化之_裝置的$二實施例之組 合示意圖; 第一A圖及第二B圖為本創作可模組化之測試裝置的第三 實施例組合示意圖; 第四A圖及細B圖為本創作可模組化之職裝置的第四 實施例組合示意圖; 第五圖為本創作可模組化之吨裝置賴組板放大示意圖 ;以及 第六圖為本猶可模組化之測試裝置的擴充組合示意圖。 【主要元件符號說明】 【習知】 】’印刷電路板 】〇’高階信號層 H’ 一般信號層 【本創作】 2 可模組化之測試裝置 20母板 21模組板 12/15 M405575 21a硬板 21b軟硬複合板/軟板 211 應用電路層 212 1C元件 213 電路板走線/引線層 22 連接介面6. The test device 2 can be modularized. The motherboard 2 and the module door can be connected between the motherboard 2 and the module board 21 by connecting the interface 22 and the expansion interface 24. The function of transfer, matching control and expansion between the group board 21 and the other module board 21. σ I The above is only the preferred embodiment of the present invention, and is not intended to create the scope of patent protection. Therefore, the equivalent change of the 11/15 M405575 in this manual and the drawings is used. To Chen Ming. The same applies to the protection of the rights of this creation [simplified description of the drawings] The first picture is a schematic diagram of the combination of the conventional printed circuit board; the second picture A is the first embodiment of the device that can be modularized A schematic diagram of the combination of the two embodiments of the second B ® forest creation modularization device; the first A diagram and the second B diagram are the third embodiment of the test device capable of modularizing Combination diagram; the fourth diagram A and the fourth diagram B are schematic diagrams of the fourth embodiment of the creation of the modular device; the fifth diagram is a schematic diagram of the creation of the modularized tonnage device; The six figures are schematic diagrams of the expanded combination of the test devices that can be modularized. [Main component symbol description] [Practical] 】 'Printed circuit board】 〇 'High-order signal layer H' General signal layer [This creation] 2 Modular test device 20 Mother board 21 module board 12/15 M405575 21a Hard board 21b soft and hard composite board/soft board 211 Application circuit layer 212 1C element 213 Circuit board trace/lead layer 22 connection interface

22a承接插座單元 221 插座 222信號接腳 22b軟板連接器單元 223 連接器 224信號接腳 22c 電性連接單元 22d 彈性導電單元 23壓制制具 24擴充連接介面22a socket unit 221 socket 222 signal pin 22b soft board connector unit 223 connector 224 signal pin 22c electrical connection unit 22d elastic conductive unit 23 pressing tool 24 expansion connection interface

13/1513/15

Claims (1)

讎5575 六、申請專利範圍: 1· 一種可模組化之測試裝置,包托. 該母板至少包括—個—般信號魏層及至少—應用 =少-模組板,該模組板至少包括—個高階信號電路層;以 =連接介面,該連接介面係電性連接於該母板與該模組 2. 如申請專職㈣1項所述之可模組化之職 連接介面係為一承接插座單元, 二/、中ο 設於該母板之信號接腳,料^^,早7"具有多個穿 。 謂机%賴_電性連接於該母板 3. 如申請專利範圍第丨項 連接介面係為-軟板連接哭 Κ裝置,其中該 ν ^ 是接态早70,該軟板連接哭罩开呈右各 =設於該母板之信號接腳,該些魏接_電性連接於該 圍Ϊ;項所述之可模組化之測試裝置,其中該 連接"面係為一電性連接單元 母板或該模組板上之導電片。 按m又置於》亥 5·=請專利範圍第4項所述之可模組化之測試裝置,立中該 導電片係為金屬連接點。 裝置其系 6.如申請專利範圍第i 連接介面係為-彈性導可減化之測試裝置’其中該 接於該母板與該===,該彈性導電單元係彈性地壓 彈所述之可模組化之測試裝置,其中該 v電早係為加屋導電橡膠或導電彈性膠。 14/15 8. 如申請專利範圍第i 、 模組板更設置至少—㈣H換組化之m置,其中該 連接於該模組板與另該擴充連接介面係電性 9. 如申.月專利犯圍第j項所述之可模組化之測試裝置,苴中該 母板與該㈣為—_電路板。 〃 關第1項所述之可模組化之測試裝置,其中該 走線至層少闕、電路層、應用電路層、電路板 層、電源層1路^;成者;該模組板更包括接地 ' 弘g电路板走線/引線層或至少兩種以上之 組成者。 11,如申請專鄕11 $ 1韻述之可齡化之測試裝置,A中咳 母板與該模組板更分別設置❹個電子元件或IC元件,^ it:些70件具有多個電性連接於該母板與該模組板之信號 接腳。 12.,申請專利範圍第1項所述之可模組化之測試裝置,其中該 換组板之為階信號電路層料高頻電路層、高速電路層、 射頻電路層、嶽轉數純號電路層或至少兩種以上之^ 者0 13.如申請專利範㈣丨項所述之可模組化之測試裝置,並中^ 輪組板係為魏、可撓狀軟硬複合板或軟板。 乂 &如申請專職圍第13項所述之可模組化之測試裝置,其中 邊可撓折之軟硬複合板或該軟板係選擇性地撓折而電性 接於該連接介面。 15/15雠 5575 6. Patent application scope: 1. A modular test device, including the package. The motherboard includes at least a general signal layer and at least - application = less - module board, the module board at least Included as a high-level signal circuit layer; with a = connection interface, the connection interface is electrically connected to the motherboard and the module 2. As claimed in the application of the full-time (4) 1 item, the modular interface is a Socket unit, two /, medium ο is set on the signal pin of the motherboard, material ^ ^, early 7 " has multiple wear.谓 % _ _ _ electrically connected to the motherboard 3. As in the scope of the patent application, the connection interface is a soft board connection crying device, wherein the ν ^ is connected to the early 70, the soft board is connected to the crying cover The right side = the signal pin disposed on the motherboard, the connection is electrically connected to the bank; the modular test device described in the item, wherein the connection " face is an electrical Connect the unit motherboard or the conductive strip on the module board. Press m again and place it in the "5" = the modular test device described in item 4 of the patent scope. The conductive sheet is a metal connection point. The apparatus is the same as the apparatus of the invention. The i-th connection interface of the patent application is an elastic conduction degradable test device, wherein the elastic conductive unit is elastically pressed according to the test plate. The modular test device, wherein the v-electricity is an additive conductive rubber or a conductive elastic rubber. 14/15 8. If the application scope is i-th, the module board is further set to at least - (4) H-grouped m, wherein the connection to the module board and the other expansion interface is electrically. 9. The patent can be used to test the modular test device described in item j. The motherboard and the (4) are -_ circuit boards.可 The modular test device described in item 1, wherein the trace to the layer, the circuit layer, the application circuit layer, the circuit board layer, and the power layer 1 channel; the module; This includes the grounding 'Hongg circuit board trace/lead layer or at least two or more components. 11. If you apply for a test device that specializes in 11 $ 1 rhyme, the A cough mother board and the module board are respectively set with one electronic component or IC component, ^ it: some 70 pieces have multiple electric The signal pin is connected to the motherboard and the module board. 12. The modular test device according to claim 1, wherein the replacement plate is a high-frequency circuit layer, a high-speed circuit layer, a radio frequency circuit layer, and a Yuet number of the signal circuit layer. Circuit layer or at least two of them. 13. 13. The modular test device as described in the patent application (4), and the middle wheel set is Wei, flexible soft and hard composite plate or soft. board.乂 & For example, a modular test device as claimed in claim 13 wherein the flexible flexible composite panel or the flexible panel is selectively flexed and electrically connected to the connection interface. 15/15
TW99219053U 2010-10-01 2010-10-01 Modular testing device TWM405575U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99219053U TWM405575U (en) 2010-10-01 2010-10-01 Modular testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99219053U TWM405575U (en) 2010-10-01 2010-10-01 Modular testing device

Publications (1)

Publication Number Publication Date
TWM405575U true TWM405575U (en) 2011-06-11

Family

ID=45079396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99219053U TWM405575U (en) 2010-10-01 2010-10-01 Modular testing device

Country Status (1)

Country Link
TW (1) TWM405575U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113064050A (en) * 2021-03-18 2021-07-02 展讯通信(上海)有限公司 Detection device and detection equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113064050A (en) * 2021-03-18 2021-07-02 展讯通信(上海)有限公司 Detection device and detection equipment

Similar Documents

Publication Publication Date Title
US7916494B1 (en) Printed circuit board
US8263877B2 (en) Printed circuit board
CN101374390B (en) Aeroscopic plate for filling circuit board conducting resin and method for filling conducting resin
US20100012363A1 (en) Printed circuit board and layout method thereof
CN103108487B (en) Couple circuit board and the coupling method thereof of USB 3.0 socket connector and cable
CN104134907B (en) Phone jack component and electronic equipment
US20130059475A1 (en) USB Connector
CN102668071A (en) Semiconductor apparatus
TWM405575U (en) Modular testing device
CN103079341B (en) The structure of the anti-solder shorts of pcb board and there is the pcb board of this structure
Eroglu RF Circuit Design Techniques for MF-UHF Applications
CN202050592U (en) Antenna feeder pad and printed circuit board with same
CN201937145U (en) Data connecting line
CN201910971U (en) Bonding pad structure of circuit board
CN104852172B (en) A kind of electronic equipment and circuit board connection method
CN104661426A (en) Circuit board adopting steel sheet tin filling grounding
CN206879231U (en) The position limiting structure and mobile terminal of a kind of flexible connector
CN105161926B (en) Pin arranges and electronic assembly
CN206010249U (en) A kind of pcb board weld jig
TWI330768B (en) Management system for feeders
CN205942568U (en) Novel hard disk back plate
CN216057643U (en) PCIe card
CN204090272U (en) A kind of high heat radiation pcb board
CN213425247U (en) MXM module bus circuit
JP6369314B2 (en) Transmission line

Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model