TWM404493U - LED forming device - Google Patents

LED forming device Download PDF

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Publication number
TWM404493U
TWM404493U TW99213430U TW99213430U TWM404493U TW M404493 U TWM404493 U TW M404493U TW 99213430 U TW99213430 U TW 99213430U TW 99213430 U TW99213430 U TW 99213430U TW M404493 U TWM404493 U TW M404493U
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TW
Taiwan
Prior art keywords
light
emitting diode
package substrate
substrate
optical
Prior art date
Application number
TW99213430U
Other languages
Chinese (zh)
Inventor
Chih-Ming Chen
Cheng-Chin Chen
Ching-Chi Cheng
Ching-Fu Tsou
Teng-Hsien Lai
Cheng-Han Huang
Chun-Ming Chang
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Silicon Base Dev Inc
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Priority to TW99213430U priority Critical patent/TWM404493U/en
Publication of TWM404493U publication Critical patent/TWM404493U/en

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  • Led Device Packages (AREA)

Abstract

This model utility relates to an LED forming device. The LED forming device comprises: a package surmount for providing a carrier space; at least one LED element, placed on the package surmount and located in the carrier space, for emitting a light; and an optical colloid structure, corresponding to the LED element and placed on the surmount, for changing the angle and direction of the light in order to generate various illumination effects.

Description

M404493 五、新型說明: 【新型所屬之技術領域】 本新型係為-種發光二極體構成裝置,尤指一種利用將光 學膠體結構填人或設置在具有承載空間的基板上,而能 夠提升整體裝置之發光效能、均光特性與照明範圍的發光二= 體構成裝置。M404493 V. New description: [New technical field] The new type is a kind of light-emitting diode forming device, especially one that can fill the optical colloid structure or be placed on a substrate with a bearing space, and can improve the whole The illuminating performance, the uniform light characteristic and the illumination range of the device are two illuminating devices.

【先前技術】 發光二極體(Light Emiting Doide,簡稱為lEd)係為目 前技術常見的一種以半導體材料所製成的固態發光元件,具有 體積小、發熱度低、高照明性能、耗電量小、適合量產與壽命 長等性能,因此已普遍應用在各種照明裝置以及發光器材上。 目前技術對於發光二極體(LED)的研發係已發展出具有多重 色光的成果,包括較早期的紅光、綠光、黃光,以及近年來有 所突破發展的藍光和白光等,使得結合了紅、綠、藍三原色技 術便可達到全彩發光之效果;同時目前發光二極體([ED)的 發光技術在亮度上也有所提升,且除了可見光之外,不可見光 的部份(例如紅外線)也有所發展,使得發光二極體元件之應 用已日趨多it並存在著相當大的生產市場與開發空間。 而就目别發光二極體(LED)元件之應用來說,因為其體 積小之特性’所以能夠設計以錢的陣列式之配置而應用在需 要產生發光的裝置上’例如交通號结或大型電子看板等,而可 3 M404493 產生特^之随或文字;另外,以背光源發光之設計方式 作多種應S ’例如手機或個人餘麟(PDA)之螢;'、、此 設備儀表板和各種電子裝置之指示燈等。*目前對於汽車=、 ,燈、照明燈與各種指示燈的設置也有逐漸採用發光= (led)元件之趨勢。 位粗 。由於照明裝置對於人們的生活來說是_種最不可或缺 產品’且發光二極體(LED)的技術與裝置應用在目前係且 相當大的市場與開發空間,是以,除了基本所需的光源昭明功 ,外’其裝置之功能還要能更進—步滿足與配合相關 求’以使其於照縣置之應用上能更具多雜。例如利二 發先一極體的封裝_樣式加以設計,從而職能在發光之4 能、照明聚光之朗分布或翻強度上更加提升,並還可ς ί=ϊ射出形式上加以變化’從而能產生射出角度與方向變 化的特殊效果。而如何提出此—適t之裝置,便為本样展之 【新型内容】 —種可提升發光效能及改變光線射出形 ί右極11構成裝置。包含將光學膠體結構填入或設置在 ;=膠:結構中。透過此-設置,將J 度壯效ΐ 效能與照明_,域生均光特性的亮 本新型係為一種發光二極體構成裳置,包含有:-封裝基 4 M404493 基板係為銘金屬或鋼 10是以哪-種材質^ t材。而無讀使用的該封裝基板 供高導熱性之散熱,為皆可提 之構 特性效果來加以製成。舉例二而2為域不同的光學 錐形、正立方形 ° q承載工間11係可呈現為 此-構成形狀的對應說明二==形。而對於 親樣式作說明,·也就是該 工間之下相對的外 於其外形之構成則和對 111係為一立體空間,而對 式有關。 x ’褒基板10所進行的餘刻或製備方 以此實施例之苐—圖進 該承載空間之構成 β月,此圖之不意係為剖面,但 圖所在的剖面角度所示、,:二維空間下整體的形狀有關。如該 地呈現為斜面;;封义基板10於其内部側壁係相對 為方形或矩形時,該承7載空;的:視方向來看’若側壁相連而 連而為_形或圓形時,呈現為錐形;而若側壁相 形或半圓錐形。或者,於I他之實Γ間11便呈現為半橢圓錐 不為斜面,使得該承载空間,料中’其内部側壁亦可 承上所述,該發光二極體構現為正立方形或立方矩形。 結構;而在本新型之設吁中成/置1還包含有—光學膠體 之材料特性或所構成的外編^是/]用該光學勝體結構】3 與方向上產生射出變化的照::果來==光線在角度 Μ不社此%例令,該光學谬 6 M404493 體結構13係對應該發光二極體元件12而設置於該封裝基板 10上,5羊細來說,如第一圖所示,該光學穋體結構Η係呈現 為具有一均勻厚度之平面層面,而對應地位於該封裝基板1〇 和該承載空間U之上方;也就是該光學膠體結構13係以其周 圍的部份面積黏合而設置於其封裝基板10的上層表面上,並 相對地懸於該承載空間11以及該發光二極體元件12的上方。 此外 A /U于吵肢V’口傅1 J I pg评你J供秀相關材料,且[Prior Art] Light Emiting Doide (lEd) is a solid-state light-emitting element made of semiconductor materials, which is common in the prior art, and has a small volume, low heat generation, high illumination performance, and power consumption. Small, suitable for mass production and long life, it has been widely used in various lighting devices and luminaires. The current technology for the development of light-emitting diodes (LEDs) has developed multiple color light results, including the earlier red, green, yellow, and recent breakthroughs in blue and white light, making the combination The red, green, and blue primary color technologies can achieve the effect of full-color illumination; at the same time, the current LED ([ED) illumination technology has also improved in brightness, and in addition to visible light, invisible parts (for example Infrared has also been developed, making the application of LED components more and more and there is a considerable production market and development space. As far as the application of the light-emitting diode (LED) component is concerned, because of its small size, it can be designed in a cost-based array configuration on a device that needs to generate light, such as a traffic knot or a large Electronic signage, etc., and 3 M404493 can produce special characters or texts; in addition, a variety of backlights should be used in the design of backlights, such as mobile phones or personal Yulin (PDA); ',, this device dashboard and Indicators for various electronic devices, etc. * At present, there is a tendency to gradually adopt the illuminating = (led) component for the setting of the car =, the lamp, the illuminating lamp and various indicator lights. Bit is thick. Since the lighting device is the most indispensable product for people's lives, and the technology and device of the light-emitting diode (LED) are applied in the current system and a considerable market and development space, in addition to the basic needs. The light source of Zhaoming Gong, the external 'the function of its device can be more advanced - step to meet and cooperate with the relevant 'to make it more complex in the application of the county. For example, the package style of the second-pole first-pole is designed so that the function can be improved in the luminescence, the illuminating distribution or the grading intensity, and can also be changed in the form of ϊ 从而 ϊ 从而It can produce special effects of shooting angle and direction change. And how to propose this - suitable device, it will be the basis of this [new content] - a kind of device that can improve the luminous performance and change the light emission shape. Including filling or setting the optical colloid structure in the ; = glue: structure. Through this setting, the J-effect is ΐ 效能 效能 效能 效能 , , , , , , 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域What kind of material is steel? The package substrate, which is not used for reading, is provided for heat dissipation with high thermal conductivity, and can be produced by a combination of properties. For example, two and two different optical cones and erect squares of the domain can be presented as the corresponding description of the shape of the shape == shape. For the pro-style description, that is, the relative external structure of the work room and the structure of the 111 are a three-dimensional space, and the relationship is related. The remainder or the preparation made by the x '褒 substrate 10 is the structure of the bearing space in the embodiment of the present invention. The figure is not a cross-section, but the cross-sectional angle of the figure is shown, The overall shape is related to the dimensional space. If the inner surface of the sealing substrate 10 is relatively square or rectangular, the bearing 7 is empty; when viewed from the direction of view, if the side walls are connected and connected as a _ shape or a circle , appears as a cone; and if the sidewall is shaped or semi-conical. Or, in the case of I, the semi-elliptical cone is not beveled, so that the bearing space, the inner side wall of the material can also bear the above, the light-emitting diode is constructed as an ortho-square or Cubic rectangle. Structure; and in the present invention, the inclusion/setting 1 also includes - the material properties of the optical colloid or the external composition of the composition is /] using the optical winning structure] 3 and the direction of the emission changes:: If the light is at an angle, the optical 谬6 M404493 body structure 13 is disposed on the package substrate 10 corresponding to the light-emitting diode element 12, as shown in the first section. As shown in the figure, the optical raft structure is formed as a plane layer having a uniform thickness, and correspondingly located above the package substrate 1 〇 and the bearing space U; that is, the optical colloid structure 13 is surrounded by A portion of the area is bonded to the upper surface of the package substrate 10 and relatively suspended above the carrying space 11 and the LED component 12. In addition, A /U is in the paranoid V' mouth Fu 1 J I pg to comment on your J-related materials, and

填入的步驟或程序係可在該光學膠體結構13之整體於其封裝 基板10上设置之前完成。而在此實施例中,於該光學膠體結 構13之内部係填充複數個微顆粒(如圖式中之多個小圓點所 不)’而該等微顆粒係可為石英粉或螢光粉。藉由此一填充之 設計,當下方的該發光二極體元件12發光時,所產生的光線 便會先經由和穿過該等微顆粒,進*才會再向外射^。而將填 充微顆粒之材料以諸如石英粉或螢光粉來設置時,光線便可於 照射其上時在肖度與方向上產生射出變化的照明效果,從而能 提升對外部的照明範圍。或者,藉由其材料本身的特性,材料 在接又到光線照射後的反射能因而增加整體的照明亮度,且利 用填充材料的平均分布之設計’從城產生均祕性:亮度分 布效果’進而提升整體裝置的發光效能。 =本新型所提出之發光二極體構成裝置的概念,還可根據 弟-貫施例所揭示的設計加以變b現以U施例進 新型之實施說明。請參閱第二圖,係為本新型所提出的一 二極體構絲置2之剖㈣意圖。如圖所*,在此實施例X中, =於其對應之雌基板2〇、承物心和發光二極體元件^ 專的設置方式或材料使用,係可和上述第—實施例相同。其差 7 M404493 別在於此例中之發光二極體構成裝置2所包含的一光學膠 結構23的設置。 ^ 承上所述,如第二圖所示,在此實施例中之該光學膠體妹 構23除仍以其周圍的部份面積黏合而設置於其封裝基板2〇的 上層表面上外,係還對應該發光二極體元件22而填充於該承 載空間21中。換句話說,在該承載空間21之内部設置完該發 光二極體元件22後,其餘空間便提供該光學膠體結構23作^ . 份的對應填入,從而能將該發光二極體元件22加以包覆。另 鲁一方面,該光學膠體結構23還包含有複數個微結構230 ;如 第二圖所示,所示之該等微結構230係對應位於整體裝置之中 央,或是對應該承載空間21及其發光二極體元件22之所在 處。在此實施例中,若以三維空間之下相對的外觀樣式作說 明,該等微結構230之设置係呈現為陣列形式,也就是除了第 二圖所在的剖面位置外’其他對應位置之剖面也設有類似的微 結構,從而構成一整層的陣列形式。 . 承上所述,於δ亥光i膠體結構23内部的填充設計係亦可 鲁和上述第一實施例相同,也就是可為石英粉或螢光粉之複數個 微顆粒;但相對地於此例中’所述之微顆粒係能於該承載空間 21内作平均分布。另外’在所述之該等微結構230之設計上, 於此實施例中,係將每一個微結構作向上凸出之半球形呈現的 外觀設計。而針對此凸出部位之設計,係可用熱塑性或熱固 性之材料來構成該等微結構230 ;且由於微結構230需呈現出 精緻的陣列形式樣式’因而能採以精密切削加工、體積膨脹 法、熱熔式、表面張力或熱擠壓法等方式來對所述之熱塑性或 熱固性材料加以製造,並再以翻模製程加以完成。 8 M404493 疋以,此第二實施例和弟—實施例相較,除了可同樣刺用 所述之微顆粒而在角度與方向上產生光線射出變化的照明效 果外,還能藉由於承載空間21内的填充方式而可更增加整體 裝置的發光效能。此外,由於該等微結構230的陣列^式以及 向上凸出之特徵,光線行經其曲率有所變化的結構表面上時同 樣也會造成射出的變化效果,並還能利用其整個層面的陣列平 '均配置,而可更加提升對外部的照明範圍和均光的亮度分布效 果。雖'然,在本實施例中係以向上凸出之半球形作^微結構 230的只施5兒明,但於其他貫施方式中亦可加以變化;例如可 將其设計為向上凸出之半橢球形,或可為三面體、四面體或是 多面體錐形之樣式,並皆可因其微結構表面的曲率變化之多樣 性而能對光線在角度與方向上產生射出變化的照明效果。 再者’本新型之概念還能以上述兩實施例之設計加以組合 變化。舉例來說,係可根據第一實施例之架構而將對應之光學 膠體結構於該承載空間中作填充;或者,可根據第一實施例之 鲁架構而將第二實施例的向上凸出之半球形的複數個微結構設 置在其光學膠體結構中,而此處之光學膠體結構的整個層面, 係仍相對地懸於其承載空間以及對應之發光二極體以牛的上 方0 綜上所述’本新型所提出之發光二極體構成裝置,除了能 0供基本的光源朗魏外’藉由光學雜結構於其封裝架構 ^的樣式設計’使得在發光之效能、照明聚光之範圍分布或照 上都能有效地提升,並且在光線的射出形式上也能產生 =^度與方⑽特轉化。是以,透過本新型之設計,將可 正體裝韻發光二贿元件之發纽能與腳範圍,並產 9 M404493 生均光特性的亮度增加效果,從而 要目的。 任何熟悉本技術領域的人員,可在運用與 之前提下,㈣本新型所揭示的概念和實施例變 申請專利範圍所界定的本新型的保護 ♦不月“離 熟習此技藝之人士任施匠思而為諸般修飾,:=型二 專利範圍所欲保護者。 白不脫如附申請The step or procedure of filling can be completed before the optical colloidal structure 13 is integrally disposed on its package substrate 10. In this embodiment, the interior of the optical colloid structure 13 is filled with a plurality of micro-particles (not shown in the plurality of small dots in the figure) and the micro-particles may be quartz powder or phosphor powder. . With this filling design, when the lower LED element 12 emits light, the generated light will first pass through and through the micro-particles, and then will be emitted again. When the material filled with the microparticles is set such as quartz powder or phosphor powder, the light can be irradiated with illumination in the direction and direction of the illumination, thereby improving the illumination range to the outside. Or, by virtue of the characteristics of the material itself, the reflection energy of the material after the irradiation of the light increases the overall illumination brightness, and the design of the average distribution of the filling material is used to generate uniformity from the city: brightness distribution effect Improve the luminous performance of the overall device. The concept of the light-emitting diode-constituting device proposed by the present invention can also be modified according to the design disclosed by the second embodiment. Please refer to the second figure, which is the cross-section (4) of a diode set 2 proposed in the present invention. As shown in the figure, in this embodiment X, the arrangement of the corresponding female substrate 2, the receiving core and the light-emitting diode element or the material can be used in the same manner as the above-described first embodiment. The difference is 7 M404493, which is the arrangement of an optical adhesive structure 23 included in the light-emitting diode forming device 2 in this example. ^ As shown in the second figure, in the embodiment, the optical colloid 23 is disposed on the upper surface of the package substrate 2, except that the surrounding area is bonded. The light-emitting diode element 22 is also filled in the bearing space 21. In other words, after the light-emitting diode element 22 is disposed inside the load-bearing space 21, the remaining space provides a corresponding filling of the optical colloid structure 23, so that the light-emitting diode element 22 can be Wrap it. In another aspect, the optical colloid structure 23 further includes a plurality of microstructures 230; as shown in the second figure, the microstructures 230 are correspondingly located in the center of the overall device, or corresponding to the bearing space 21 and Where the light-emitting diode element 22 is located. In this embodiment, if the relative appearance patterns under the three-dimensional space are used for description, the arrangement of the microstructures 230 is in the form of an array, that is, the profiles of the other corresponding positions except the section position where the second figure is located. A similar microstructure is provided to form an array of entire layers. As described above, the filling design inside the δ 光 i i colloid structure 23 can also be the same as the first embodiment described above, that is, a plurality of micro-particles which may be quartz powder or phosphor powder; In this case, the microparticles described can be evenly distributed within the load-bearing space 21. In addition, in the design of the microstructures 230, in this embodiment, each of the microstructures is designed to have an upwardly convex hemispherical appearance. For the design of the protruding portion, the microstructures 230 may be formed by thermoplastic or thermosetting materials; and since the microstructures 230 are required to exhibit a fine array pattern, the precision cutting, volume expansion, and the like may be employed. The thermoplastic or thermosetting material is manufactured by means of hot melt, surface tension or hot extrusion, and is then completed by a molding process. 8 M404493 In addition to the second embodiment and the younger embodiment, in addition to the same effect of puncturing the microparticles to produce a light-emitting change in angle and direction, the load space 21 can also be utilized. The internal filling mode can further increase the luminous efficacy of the overall device. In addition, due to the array pattern and the upward bulging characteristics of the microstructures 230, the ray passing through the surface of the structure whose curvature has changed also causes the effect of the emission change, and can also utilize the array of the entire layer. 'Equipped with each other, it can enhance the illumination range of the outside and the brightness distribution of the uniform light. Although, in the present embodiment, only the five hemispheres 230 are formed by the upwardly convex hemispheres, but they may be changed in other modes; for example, they may be designed to be convex upwards. a semi-ellipsoidal shape, or a trihedral, tetrahedral or polyhedral cone, and can produce illumination changes in the angle and direction of the light due to the diversity of the curvature of the microstructured surface. effect. Furthermore, the concept of the present invention can be combined and changed in the design of the above two embodiments. For example, the corresponding optical colloid structure may be filled in the bearing space according to the architecture of the first embodiment; or, the upward convexity of the second embodiment may be according to the Lu architecture of the first embodiment. The hemispherical plurality of microstructures are disposed in the optical colloidal structure, and the entire layer of the optical colloidal structure here is still relatively suspended in its bearing space and the corresponding light emitting diode is above the cow. The present invention proposes a light-emitting diode forming device, in addition to being able to provide a basic light source, Langwei, and the design of the optical hybrid structure in its package structure. The distribution or the illumination can be effectively improved, and the ^^ degree and the square (10) special transformation can also be generated in the form of the light emission. Therefore, through the design of the novel, the brightness and the range of the foot can be adjusted, and the brightness of the 9 M404493 homogenous light characteristic is increased, thereby achieving the purpose. Any person skilled in the art can apply and have previously mentioned, (4) the concept disclosed by the present invention and the protection of the present invention defined by the scope of the patent application ♦ not "a person who is familiar with this skill" Thinking for all kinds of modifications, : = type 2 patent scope to protect the person.

【圖式簡單說明】 本案得藉由下列圖式及說明,俾得 :-圖’係為本新型所提出的發光 ::了解: 意圖。 僻肷衣置1之剖面不[Simple description of the diagram] This case can be obtained by the following diagrams and descriptions: - Figure ' is the light emitted by the new type :: Understanding: Intent. The profile of the secluded clothing is not

能成功地_本案發展之主 ^圖’係為本新型所提出的發光二極體構絲置2之剖面示 【主要元件符號說明】 本案圖式中所包含之各元件列示如下. 發光二極體構成裝置丨、2 封裝基板10、20 承載空間11、21 發光一極體元件12、22 光學膠體結構13、23Can successfully _ the main development of the case ^ map ' is the outline of the proposed light-emitting diode wire set 2 [main symbol description] The elements included in the diagram of the case are listed below. Pole body forming device 丨, 2 package substrate 10, 20 carrying space 11, 21 illuminating one body element 12, 22 optical colloidal structure 13, 23

Claims (1)

微結構230 100年01月14日修正替換頁 六、申請專利範圍: 1.一種發光二極體構成裝置,包含有: 一封裝基板’其内部具有一承載空間; 至少一發光二極體元件,設置於該封裝基板上並位於該承 載空間中,用以發光而加以射出光線;以及 一光學膠體結構,對應該發光二極體元件而設置於該封裝 基板上,用以對所述之光線在角度與方向上產生射出變化J 明效果。 熱 2’如申凊專利範圍第1項所述之發光二極體構成裝置,其中該 封裝基板係為一矽基板,而該矽基板係為(100)晶格方向、(110") 晶格方向或(111)晶格方向之矽基材,用以提供高導熱性之散 3·如申請專利範圍第1項所述之發光二極體構成裝置,其中該 封裝基板係為一陶瓷基板,而該陶瓷基板係為氮化鋁或氧化S 之材料’用以提供高導熱性之散熱。 4. 如申請專利範圍第1項所述之發光二極體構成裝置,其中該 封裝基板係為一金屬基板’而該金屬基板係為鋁金屬或銅金屬 之塊材’用以提供高導熱性之散熱。 5. 如^請專利範圍第1項所述之發光二極體構成裝置,其中該 承載空間係呈現為錐形、正立方形、立方矩形、半橢圓錐形: 斗·圓錐形。 6. 如申請專利範圍第1項所述之發光二極體構成裝置,其中該 M404493 而對應位 光學膠體結構係呈現為具有一均勻厚度之平面層面, 於該封裝基板和該承載空間之上方。 7.如申請專利範㈣丨_述之發光二極體構錢置, 該光學膠體結構_填充複數個微雌,而料微雜係= 提升照明範圍或發光效能之石英粉或螢光粉。 、’’、、可 8·如申請專利範圍第丨項所述之發光二極體構絲置,立中今Microstructure 230 Modified on January 14, 100. Replacement Page 6. Patent Application Range: 1. A light-emitting diode forming device comprising: a package substrate having a bearing space therein; at least one light-emitting diode component, And disposed on the package substrate and disposed in the bearing space for emitting light to emit light; and an optical colloid structure disposed on the package substrate corresponding to the light emitting diode component for The effect of the emission change is produced in the angle and direction. The illuminating diode assembly device according to claim 1, wherein the package substrate is a ruthenium substrate, and the ruthenium substrate is a (100) lattice direction, (110") lattice Or a light-emitting diode structure device according to the first aspect of the invention, wherein the package substrate is a ceramic substrate, The ceramic substrate is made of aluminum nitride or oxidized S material to provide high thermal conductivity. 4. The light-emitting diode-constituting device according to claim 1, wherein the package substrate is a metal substrate 'the metal substrate is a block of aluminum metal or copper metal' to provide high thermal conductivity. Cooling. 5. The light-emitting diode-constituting device of claim 1, wherein the bearing space is tapered, square, cubic, and semi-elliptical: bucket/conical. 6. The illuminating diode constituting device of claim 1, wherein the M404493 and the corresponding optical colloidal structure are formed as a planar layer having a uniform thickness above the package substrate and the carrying space. 7. If the application of the patent (4) 丨 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ , ’’, 可8·, as in the application of the patent scope, the illuminating diode structure, Li Zhongjin 光學膠體結構包含有複數個微結構,而該等微結構晉: 現為陳列彬忐。 & “王 9‘如申請專利範圍第8項所述之發光二極體構成|置,其中每 -微結構係、呈現為向上凸出之半球形、半橢球形或多面體錐 形’用輯所述之光線在㈣與方向上產⑽㈣㈣照明效 瓜如申請專利範圍第8項所述之發光二極體構絲置,其中 該等微結構係為熱塑性或熱固性之材料。 ^ 11.如申請專利範圍第8項所述之發光二極體構成裝置,发中 鲁該等微結構所呈現之陣列形式係能以精密切削加工、體積膨服 .法、熱炫式、表面張力或熱擠厪法加以製造,再以翻模製程加 以完成。 12·如申請專職㈣1項所述之發光二極職成裝置,1中 該光學膠體結構於該封裝基板上之設置,係對應該發光二極體 元件而填充於該承載空間中。 七、圖式: 12The optical colloidal structure contains a plurality of microstructures, and the microstructures are now: & "王9" as in the application of the scope of the light-emitting diode according to item 8 of the arrangement, wherein each-micro-structure, appearing as a convex upward hemisphere, semi-ellipsoidal or polyhedral cone The light is produced in (4) and direction (10) (4) (4) illumination effect, such as the light-emitting diode structure described in claim 8 wherein the microstructures are thermoplastic or thermosetting materials. The illuminating diode forming device according to Item 8 of the patent scope, the array form of the micro-structures of the lacquering system can be processed by precision cutting, volume expansion, heat squeezing, surface tension or hot extrusion. The method is manufactured and then completed by a mold-turning process. 12. If the application of the full-time (4) item 1 of the light-emitting diode assembly device, the optical colloid structure on the package substrate is set to correspond to the light-emitting diode The component is filled in the carrying space. 7. Pattern: 12
TW99213430U 2010-07-14 2010-07-14 LED forming device TWM404493U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI457663B (en) * 2012-05-16 2014-10-21 友達光電股份有限公司 Backlight module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI457663B (en) * 2012-05-16 2014-10-21 友達光電股份有限公司 Backlight module

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