M400658 I 五、新型說明： 【新型所屬之技術領域】' 本揭露係關於一種半導體元件之高速測試裝置及其探 針載台，特別係關於一種配置高速致動器及接觸感測器之 高速測試裝置及其探針載台，該高速致動器被建構以向下 移動該探針而接觸一待測元件或向上移動該探針而離開該 待測元件，該接觸感測器被建構以感測該探針及該待測元 件之接觸狀態。 【先前技術】 般而5，aa圓上的積體電路元件必須先行測試其電 氣特性，#以判定積體電路元件是否良好。良好的積體電 路將被選出以進行後續之封裝製程，而不良品將被捨棄以 避免增加額外的封裝成本。完成封裝之積體電路元件必須 再進订另一次電性測試以篩選出封裝不良品，進而提升最 終成品良率》測試時間及成本主要取決於元件載台之移動 速度，亦即，較高移動速度降低測試時間及成本。 圖1及圖2例示一習知之測試系統3〇〇，其使用探針3〇2 接觸位於元件載台304上之晶圓31〇,其中該晶圓3ι〇具有待 測凡件312、314、316。該元件載台304(例如晶圓承座）可在 X、Υ及ζ等三個軸向移動。在測試過程中，元件載台先 橫向移動以使待測元件314對準探針3〇2，再將晶圓31〇上移 以使探針302接觸待測元件3 14而形成電氣通路，俾便進行 待測元件3 1 4之電氣測試；一旦電氣測試完成，元件載台別* 4 M400658 先將晶圓3H)下移以使探針搬離開待測元3i4後橫移該晶 圓3H)以使待測元件316對準探針3()2，再將晶圓31〇上移以 使探針302接觸待測元件316而形成電氣通路，俾便重覆進 行電氣測試。 此一設計已廣泛地應用於現今之電子元件測試系統中 ，例如US 2〇08/0100312揭示一種測試系統其使用圖 圖2所示之設計在mz等三個軸向上移動待測元件。然 而此°又°十無法應用於尚速測試系統中，因為典型之元M400658 I V. New Description: [New Technology Field] The present disclosure relates to a high-speed test device for a semiconductor device and a probe carrier thereof, and particularly to a high-speed test for configuring a high-speed actuator and a contact sensor. a device and a probe stage thereof, the high speed actuator being configured to move the probe downwardly to contact an element to be tested or to move the probe upward to leave the element to be tested, the contact sensor being constructed to sense The contact state of the probe and the device to be tested is measured. [Prior Art] As a general example, the integrated circuit component on the aa circle must first test its electrical characteristics, # to determine whether the integrated circuit component is good. A good integrated circuit will be selected for subsequent packaging processes, and defective products will be discarded to avoid additional packaging costs. The integrated circuit component of the package must be ordered for another electrical test to screen out the defective package, thereby improving the final product yield. The test time and cost mainly depend on the moving speed of the component stage, that is, the higher movement. Speed reduces test time and cost. 1 and 2 illustrate a conventional test system 3〇〇 that contacts a wafer 31〇 on a component stage 304 using a probe 3〇2, wherein the wafer 3ι has a workpiece 312, 314 to be tested, 316. The component stage 304 (e.g., wafer holder) is movable in three axial directions, X, Υ, and ζ. During the test, the component stage is moved laterally to align the device under test 314 with the probe 3〇2, and then the wafer 31 is moved up to bring the probe 302 into contact with the device under test 3 14 to form an electrical path. The electrical test of the component to be tested 3 1 4 is performed; once the electrical test is completed, the component carrier table 4 4 M400658 is first moved down the wafer 3H) to move the probe away from the device to be tested 3i4 and then traverse the wafer 3H) In order to align the device under test 316 with the probe 3 () 2, and then move the wafer 31 up to bring the probe 302 into contact with the device under test 316 to form an electrical path, the electrical test is repeated. This design has been widely used in today's electronic component testing systems. For example, US 2 〇 08/0100312 discloses a test system that uses the design shown in Figure 2 to move the component under test in three axial directions, such as mz. However, this ° ° ° can not be applied to the speed test system, because the typical yuan
件載台之重量相斜鲂大，JL 里祁耵权九再上下移動之頻率因而限制於6 次/秒。 【新型内容】 本揭露提供—種配置高速致動器及接觸感測器之高速 測試裝置及其探針載台，該高速致動器被建構以向下移動 該探針而接觸-待測元件或向上移動該探針而離開該待測The weight of the stage is relatively large, and the frequency of the movement of the JL is up to 6 times/second. [New Content] The present disclosure provides a high-speed test device for configuring a high-speed actuator and a contact sensor, and a probe stage thereof, the high-speed actuator being configured to move the probe downward to contact the component to be tested Or move the probe up and leave the test
兀件’該接觸感測器被建構以感測該探針及該待測元件之 接觸狀態。 本揭露之探針載台之一實施例，包含一基座 臂’拖接於該基座’該置放臂包含—固持部，被建構以承 载至少-探針；以及一致動器’設置於該基座上，該致動 器被建構以根據-電氣訊號藉由該置放臂向下移動該探針 而接觸-待測元件或向上移動該探針而離開該待測元件。 本揭露之測試裝置之一實施例，包含_殼體，被建構 5 广界疋-測試室’·_元件載，台，設置於該殼體内且被建構 Z承載至少一待測元件；以及至少一探針載台，設置於該 又體内。在本揭露之一實施例中，該探針載台包含一基座 ，—置放臂，枢接於該基座，該置放臂包含一固持部，被 建構以承載至少一探針；以及一致動器，設置於該基座上 該致動器被建構以根冑一電氣訊號藉由該置放臂向下移 動該板針而接觸該待測元件或向上移動該探針而離開該待 測元件。 驾知之7L件載台重量相對較大，其上下移動之頻率因 制於6 -人/移，無法應用於高速測試系統中。相對地， =揭露使用高速致動器上下移動重量較小之探針而實現該 探針與該待測元件之電氣接觸，並非上下移動重量相對較 大之70件載台。因此’本揭露之技術可以高於6次/秒之頻 率上下移動該探針。 上文已相當廣泛地概述本揭露之技術特徵及優點，俾 使下文之本揭露詳細描述得以獲得較佳瞭解。構成本揭露 之申凊專利範圍標的之其它技術特徵及優點將描述於下文 。本揭露所屬技術領域中具有通常知識者應瞭解，可相當 容易地利用下文揭示之概念與特定實施例可作為修改或設 計其它結構或製程而實現與本揭露相同之目的。本揭露= 屬技術領域中具有通常知識者亦應瞭解，這類等效建構無 法脫離後附之中請專利範圍所界定之本揭露的精神和範圍 M400658The contact sensor is configured to sense the contact state of the probe and the device under test. An embodiment of the probe carrier of the present disclosure includes a base arm 'drafted to the base'. The placement arm includes a retaining portion configured to carry at least a probe; and an actuator is disposed on the On the base, the actuator is configured to contact the element to be tested by moving the probe downward by the placement arm by the placement arm or moving the probe upward to move away from the element to be tested. An embodiment of the testing device of the present disclosure comprises a housing, a 5th-conductor-test chamber, and a component, which is disposed in the housing and configured to carry at least one component to be tested; At least one probe stage is disposed in the body. In an embodiment of the present disclosure, the probe stage includes a base, and a placement arm pivotally connected to the base, the placement arm includes a holding portion configured to carry at least one probe; An actuator disposed on the base to configure an actuator to contact the device under test by moving the plate needle downward by the placement arm or to move the probe upward to leave the probe Measuring component. The 7L piece of the table is relatively heavy, and the frequency of its up and down movement is not applicable to the high-speed test system due to the 6-person/shift. In contrast, it is disclosed that the high-speed actuator is used to move the probe with a small weight up and down to achieve electrical contact between the probe and the device under test, and not to move up and down the 70-piece stage with relatively large weight. Therefore, the technique of the present disclosure can move the probe up and down at a frequency higher than 6 times/second. The technical features and advantages of the present disclosure have been broadly described above, and the detailed description of the present disclosure will be better understood. Other technical features and advantages of the subject matter of the claims of the present disclosure will be described below. It will be appreciated by those of ordinary skill in the art that the present invention may be practiced otherwise. This disclosure is also within the ordinary skill of the art. It should also be understood that such equivalent construction cannot be removed from the spirit and scope of this disclosure as defined by the scope of the patent application.
【實施方式】[Embodiment]
圖3至圖6例示本揭露一實施例之測試裝置1 〇〇。該測試 裝置100包含一殼體40、至少一探針載台50以及一元件載台 70。在本揭露之一實施例中，該殼體包含一本體、設 置於該本體42上之一平台44、以及設置於該平台44之一上 盖46 ’形成一測試室102 ’且該探針載台5〇及該元件載台7〇 係設置於該殼體40之測試室1 〇2。在本揭露之一實施例中， 該探針載台50係設置於該平台44上且被建構以承載至少一 探針58,該元件載台7〇係被建構以承載一半導體待測元件 62。在本揭露之一實施例中，該元件載台70包含一可動基 座72及設置於該可動基座72内之一溫度控制器74，其可為 加熱器或冷卻器，用以控制該元件载台7〇之溫度。3 to 6 illustrate a test apparatus 1 according to an embodiment of the present disclosure. The test apparatus 100 includes a housing 40, at least one probe stage 50, and a component stage 70. In one embodiment of the present disclosure, the housing includes a body, a platform 44 disposed on the body 42 , and a cover 46 ′ disposed on one of the platforms 44 to form a test chamber 102 ′ and the probe carries The stage 5 and the component stage 7 are disposed in the test chamber 1 〇 2 of the casing 40. In one embodiment of the present disclosure, the probe stage 50 is disposed on the platform 44 and configured to carry at least one probe 58 that is configured to carry a semiconductor device under test 62. . In an embodiment of the present disclosure, the component stage 70 includes a movable base 72 and a temperature controller 74 disposed in the movable base 72, which may be a heater or a cooler for controlling the component. The temperature of the stage 7〇.
參考圖4 ’在本揭露之一實施例中，該探針載台50包含 基座52枢接於該基座52之一置放臂90、以及設置於該 基座52上之-致動器8()。在本揭露之—實施例中，該基座 52包含一樞軸54，該置放臂9〇包含-固持部92,被建構以 承載該探針58。在本揭露之—實施例中，該致動器％被建 構以根據-電氣訊號藉由該置放臂9Q向下移動該探針Μ而 “待湏J 7L件62或向上移動該探針58而離開該待測元件 •俾，以呵於6次/秒之頻率上下移動該探針Μ。在本揭 :::實施例中’該致動器9〇係一壓電致動器，其根據一 電壓sfl號而向上赤a ^ 移動。在本揭露之一實施例中，該 7 M400658 致動器9〇係一音圈致動^ (例如，使用一般之小尺寸制。八 )’其根據一電流訊號而向上或向下移動。 參考圖5’在本揭露之_實施例中，該探針載台5〇包含 接觸感測g 88，其被建構以感測該探針58及該待測元件 62之接觸狀禮。在本揭露之—實施例中，該接觸感測器以 包含設置於該致動器80上之—第一端點84以及設置於該置 放煮90上之一第二端點86，且該第一端點％面向該第二端 點86。在本揭露之一實施例中，&加預定電流至該致動器 80可導致該第一端點84向上移動而接觸該第二端點％，進 而向上移動該置放臂9〇使得該探針82離開該待測元件Μ ; 施加預定逆向電流至該致動器8〇可導致該第一端點料向下 移動，使得該探針58接觸該待測元件62，且該第一端點離 開該第二端點86。換言之，該接觸感測器88被建構以在該 探針58離開該待測元件62時，該第一端點84接觸該第二端 點86 ;該接觸感測器88被建構以在該探針58接觸該待測元 件62時，該第一端點84離開該第二端點％。 在本揭露之一實施例中，該探針載台5〇另包含一發光 凡件94及一電源供應器96，該發光元件94係電氣連接於該 接觸感測器88，該電源供應器96係電氣串聯於該發光元件 94及該接觸感測器88。當該致動器8〇向上移動該第—端點 84以接觸該第二端點86並將該探針58及該待測元件62予以 分離時，該第一端點84與該第二端點86形成一電氣迴路， 使得該發光元件94發光；當該致動器80向下移動以使該探 8 針58接觸該待測元件62並將 ，肝系弟一端點84及該第二端點86 予以分離時，該電氣迴路關閉，使得該發光元件％停止發 光。換言之，該發光元件94可作為該探針58之接觸指示器 〇 參考圖6，在本揭露之—眘 霄細例中，該接觸感測器88 電氣連接於-測試機78，其可經由該第一端點^與該第二 端點86之分離，知悉該探針58接觸該待測元扣，如此該 _ Κ $78 f藉由電氣通路（未顯示於圖中）經由該探針58 傳送測試訊號至該待測元件62並荒集該待測元件62之響應 訊號。在本揭露之-實施例中’該測試機78係電氣連接於 一訊號產生器82 ’其被建構以產生該電氣訊號；當該待測 元件62之電氣測試完成時，該測試機78即可傳送一指令給 該訊唬產生器82以產生一上移訊號給該致動器8〇，使得該 第一端點84接觸並向上移動該第二端點％，並進一步向上 移動該探針58而使得該探針58自該待測元件62上分離。在 馨 本揭露之一實施例中，該測試機78係電氣連接於該元件載 台70，其可經由該第一端點84與該第二端點％之接觸知 悉該探針58與該待測元件62之分離後，即可傳送一指令給 該元件載台70以進行橫向移動，使得該探針58對準另一待 測元件’俾便進行電氣測試。 在本揭露之一實施例中，該探針載台50另包含一負載 98 ’設置於該置放臂9〇上且被建構以經由該探針58實質上 施加一固定力於該待測元件62。當該致動器8〇向下移動該 9 M400658 第一端點84，該探針58接觸該待測元件62且該第一端點84 與該第二端點86分離，該負載98成為該探針58施力於該待 測元件62之唯一影響因素；換言之，如果該負載％之重量 固疋，則該探針5 8施加一固定力於該待測元件62。在本揭 露之一實施例中，該置放臂90可配置各種不同重量的負載 ’俾便該探針58得以施加不同的固定力於該待測元件62。 圖7至圖1 1例示本揭露另一實施例之測試裝置丨〇〇，。該 測試裝置1〇〇,包含一殼體4〇、至少一探針載台5〇,以及一元 件載台70。在本揭露之一實施例中，該殼體4〇包含一本體 42、δ又置於該本體42上之一平台44、以及設置於該平台44 之一上蓋46，形成一測試室1〇2，且該探針載台5〇,及該元件 載台70係設置於該殼體4〇之測試室丨〇2。在本揭露之一實施 例中，該探針載台50'係設置於該平台44上且被建構以承載 至少一測試卡1 〇，該元件載台7 〇係被建構以承載一半導體 存測元件62。在本揭露之一實施例中，該元件載台7〇包含 一可動基座72及設置於該可動基座72内之一溫度控制器74 ’其可為加熱器或冷卻器，用以控制該元件載台7〇之溫度 。在本揭露之一實施例中，該測試卡丨〇包含一基板（例如電 路板）12、設置在該電路板12上之一支撑物14、固定在該支 撑物14上之複數根探針16 ’其中該探針丨6係以環氧樹脂i 8 固定於該支撑物14上，如圖8所示。 參考圖9’在本揭露之一實施例中，該探針載台5〇·包含 一基座52、樞接於該基座52之一置放臂90,、以及設置於該 10 M400658 基座52上之一致動器80。在本揭露之—實施例中該基座 52包含一樞軸54，該置放臂9〇,包含—固持部％，被建構以 承載該測試卡10。在本揭露之一實施例中，該致動器9〇，被 建構以根據一電氣訊號藉由該置放臂9〇,向下移動使得該探 針16接觸該待測元件62或向上移動使得該探針丨6離開該待 測το件62，俾便以高於6次/秒之頻率上下移動該探針16。 在本揭露之一實施例中，該致動器9〇，係一壓電致動器其 根據一電壓訊號而向上或向下移動。在本揭露之一實施例 中，該致動器90·係一音圈致動器（例如，使用一般之小尺 寸喇叭），其根據一電流訊號而向上或向下移動。 參考圖10，在本揭露之一實施例中，該探針載台5〇，包 含一接觸感測器88，其被建構以感測該探針丨6及該待測元 件62之接觸狀態。在本揭露之一實施例中，該接觸感測器 88包含設置於該致動器8〇上之一第一端點討以及設置於該 置放臂90’上之一第二端點86，且該第一端點料面向該第二 端點86。在本揭露之一實施例中，施加預定電流至該致動 器80可導致該第一端點84向上移動而接觸該第二端點％， 進而向上移動該置放臂9〇·使得該探針82離開該待測元件62 ;施加預定逆向電流至該致動器8〇可導致該第一端點料向 下移動，使得該探針16接觸該待測元件62，且該第一端點 84離開該第二端點86。換言之，該接觸感測器88係被建構 以在該探針16離開該待測元件62時，該第一端點84接觸該 第二端點86 ;該接觸感測器88亦被建構以在該探針〖6接觸 M400658 該待測元件62時’該第一端點84離開該第二端點86。 在本揭露之一實施例中，該探針載台50·另包含一發光 元件94及一電源供應器96，該發光元件94係電氣連接於該 接觸感測器88，該電源供應器96係電氣串聯於該發光元件 94及該接觸感測器88。當該致動器8〇向上移動該第一端點 84以接觸該第二端點86並將該探針16及該待測元件62予以 分離時’該第一端點84與該第二端點86形成一電氣迴路， 使得該發光元件94發光；當該致動器80向下移動以使該探 針16接觸該待測元件62並將該第一端點84及該第二端點％ 予以分離時，該電氣迴路關閉，使得該發光元件94停止發 光。換言之’該發光元件94可作為該探針16之接觸指示器 〇 參考圖11，在本揭露之一實施例中，該接觸感測器88 電氣連接於一測試機78，該測試機78可藉由該第一端點84 與該第二端點86之分離，得知該探針16接觸該待測元件62 而形成電氣通路，如此該測試機78可藉由電氣通路（未顯示 於圖中）經由該探針16傳送測試訊號至該待測元件62並蒐 集該待測元件62之響應訊號。在本揭露之—實施例中，該 測试機78係電氣連接於一訊號產生器82，其被建構以產生 該電氣訊號；當該待測元件62之電氣測試完成時，該測試 機傳$才曰令給該訊號產生器82以產生一上移訊號給該 致動器80，冑得該第一端點料接觸並向上移動該第二端點 86，並進—步向上移動該探針16使得該探針16自該待測元 12 M400658 件62上分離。在本揭露之一實施例中，該測試機78係電氣 連接於該元件載台70，該測試機78可藉由該第—端點84與 該第二端點86之接觸，知悉該探針16與該待測元件62之分 離後，即可傳送一指令給該元件載台7〇以進行橫向移動， 使知遠楝針1 6對準另一待測元件，俾便進行電氣測試。 在本揭露之一實施例中，該探針載台5〇，另包含一負載 98，設置於該置放臂9〇，上且被建構以經由該探針16實質上 • 施加一固定力於該待測元件62。當該致動器80向下移動該 第一端點84 ’該探針16接觸該待測元件62且該第一端點84 與該第二端點86分離，該負載98成為該探針16施力於該待 测το件62之唯一影響因素；換言之，如果該負載％之重量 固定，則該探針1 6施加一固定力於該待測元件62。在本揭 露之一實施例中，該置放臂9〇,可配置各種不同重量的負載 ，俾便該探針16得以施加不同的固定力於該待測元件62。 驾知之tl件載台重量相對較大，其上下移動之頻率因 • 而限制於6次/秒，無法應用於高速測試系統中。相對地， 本揭露使用高速致動器上下移動重量較小之探針而實現該 探針與該待測元件之電氣接觸，並非上下移動重量相對較 =之元件载台。因此，本揭露之技術可以高於6次/秒之頻 率上下移動該探針，甚至可以高於數千次/秒之頻率上下移 動該探針，以滿足高速測試需求。 本揭露之技術内容及技術特點已揭示如上，然而本揭 路所屬技術領域中具有通常知識者應瞭解，在不背離後附 13 M400658 之教 申μ專利祀圍所界定之本揭露精神和範圍内，本揭露 二及揭示可作種種之替換及修飾。例如，上文揭示:許多 製程可以不同之方法實施或以其它製程予以取代，或者: 用上述二種方式之組合。Referring to FIG. 4, in one embodiment of the present disclosure, the probe stage 50 includes a base 52 pivotally connected to one of the base 52, and an actuator disposed on the base 52. 8(). In the disclosed embodiment, the base 52 includes a pivot 54 that includes a retaining portion 92 that is configured to carry the probe 58. In the disclosed embodiment, the actuator % is configured to "move the J 7L member 62 or move the probe 58 upwards according to the - electrical signal by moving the probe arm 9 by the placement arm 9Q. And leaving the device to be tested, 俾, moving the probe 上下 up and down at a frequency of 6 times/second. In the present invention: in the embodiment, the actuator 9 is a piezoelectric actuator, Moving upwards a ^ according to a voltage sfl number. In one embodiment of the present disclosure, the 7 M400658 actuator 9 is a voice coil actuating ^ (for example, using a general small size system. Eight) Moving up or down according to a current signal. Referring to FIG. 5', in the embodiment of the present disclosure, the probe stage 5A includes a contact sensing g 88 that is configured to sense the probe 58 and the In the embodiment of the present disclosure, the contact sensor includes a first end point 84 disposed on the actuator 80 and disposed on the placement cook 90 a second endpoint 86, and the first endpoint % faces the second endpoint 86. In one embodiment of the disclosure, & adding a predetermined current to the actuator 80 Causing the first end point 84 to move upward to contact the second end point %, thereby moving the placement arm 9 upward so that the probe 82 leaves the device under test Μ; applying a predetermined reverse current to the actuator 8〇 The first end material can be moved downward such that the probe 58 contacts the device under test 62 and the first end point exits the second end point 86. In other words, the contact sensor 88 is constructed to When the probe 58 leaves the device under test 62, the first end point 84 contacts the second end point 86; the contact sensor 88 is configured to be when the probe 58 contacts the device under test 62. An endpoint 84 leaves the second endpoint %. In one embodiment of the disclosure, the probe carrier 5 further includes a light emitting device 94 and a power supply 96, the light emitting component 94 being electrically connected The contact sensor 88 is electrically connected in series to the light emitting element 94 and the contact sensor 88. When the actuator 8 〇 moves the first end point 84 to contact the second end point When the probe 58 and the device under test 62 are separated, the first terminal 84 and the second terminal 86 form an electrical The light emitting element 94 is illuminated; when the actuator 80 is moved downward to cause the probe 8 to contact the device under test 62 and the liver terminal 84 and the second terminal 86 are separated The electrical circuit is turned off, so that the light-emitting element% stops emitting light. In other words, the light-emitting element 94 can serve as a contact indicator for the probe 58. Referring to FIG. 6, in the present disclosure, the contact sensing is performed. The device 88 is electrically connected to the test machine 78, and the first end point is separated from the second end point 86, and the probe 58 is notified to contact the element to be tested, so that the _ Κ $78 f is electrically A path (not shown) transmits a test signal to the device under test 62 via the probe 58 and discards the response signal of the device under test 62. In the disclosed embodiment, the tester 78 is electrically connected to a signal generator 82' which is constructed to generate the electrical signal; when the electrical test of the component to be tested 62 is completed, the tester 78 can An instruction is sent to the signal generator 82 to generate an up-shift signal to the actuator 8 such that the first end point 84 contacts and moves the second end point % upward and further moves the probe 58 upward. The probe 58 is separated from the device under test 62. In an embodiment of the present disclosure, the test machine 78 is electrically connected to the component stage 70, and the contact between the first end point 84 and the second end point is known to the probe 58 and the After the separation of the measuring element 62, an instruction can be sent to the component stage 70 for lateral movement so that the probe 58 is aligned with the other component to be tested for electrical testing. In one embodiment of the present disclosure, the probe stage 50 further includes a load 98 ′ disposed on the placement arm 9 且 and configured to substantially apply a fixing force to the device under test via the probe 58 . 62. When the actuator 8 〇 moves the 9 M400658 first end point 84, the probe 58 contacts the device under test 62 and the first end point 84 is separated from the second end point 86, the load 98 becomes the The probe 58 applies the only influencing factor of the component to be tested 62; in other words, if the weight of the load is fixed, the probe 58 applies a fixing force to the component 62 to be tested. In one embodiment of the present disclosure, the placement arm 90 can be configured with a variety of different weight loads. The probe 58 can apply a different fixing force to the member under test 62. 7 to 11 illustrate a test apparatus according to another embodiment of the present disclosure. The test apparatus 1A includes a housing 4〇, at least one probe stage 5〇, and a component stage 70. In one embodiment of the present disclosure, the housing 4 includes a body 42 and a platform 44 disposed on the body 42 and an upper cover 46 disposed on the platform 44 to form a test chamber 1〇2. And the probe stage 5〇, and the component stage 70 is disposed in the test chamber 丨〇2 of the housing 4〇. In one embodiment of the present disclosure, the probe stage 50' is disposed on the platform 44 and is configured to carry at least one test card 1 〇 that is constructed to carry a semiconductor memory test. Element 62. In an embodiment of the present disclosure, the component stage 7 includes a movable base 72 and a temperature controller 74 ′ disposed in the movable base 72. The heater can be a heater or a cooler to control the The temperature of the component stage 7〇. In one embodiment of the present disclosure, the test cartridge includes a substrate (eg, a circuit board) 12, a support 14 disposed on the circuit board 12, and a plurality of probes 16 secured to the support 14. 'The probe 6 is fixed to the support 14 with an epoxy resin i 8 as shown in FIG. Referring to FIG. 9 ′, in an embodiment of the present disclosure, the probe stage 5 includes a base 52 , a pivoting arm 90 disposed on the base 52 , and a base disposed on the 10 M400658 base. The actuator 80 on 52. In the disclosed embodiment, the base 52 includes a pivot 54 that includes a retaining portion % that is configured to carry the test card 10. In an embodiment of the present disclosure, the actuator 9 is configured to be moved downward by the placement arm 9A according to an electrical signal such that the probe 16 contacts the element to be tested 62 or moves upward. The probe 丨 6 leaves the τ member 62 to be tested, and the cymbal moves the probe 16 up and down at a frequency higher than 6 times/second. In one embodiment of the present disclosure, the actuator 9 is a piezoelectric actuator that moves up or down according to a voltage signal. In one embodiment of the present disclosure, the actuator 90 is a voice coil actuator (e.g., using a generally small size speaker) that moves up or down in response to a current signal. Referring to Figure 10, in one embodiment of the present disclosure, the probe stage 5A includes a contact sensor 88 that is configured to sense the contact state of the probe cassette 6 and the element under test 62. In one embodiment of the present disclosure, the contact sensor 88 includes a first end point disposed on the actuator 8 and a second end 86 disposed on the placement arm 90'. And the first endpoint material faces the second endpoint 86. In an embodiment of the present disclosure, applying a predetermined current to the actuator 80 may cause the first end point 84 to move upward to contact the second end point %, thereby moving the placement arm 9 〇· The needle 82 leaves the device under test 62; applying a predetermined reverse current to the actuator 8 turns the first end material to move downward, so that the probe 16 contacts the device under test 62, and the first end point 84 leaves the second endpoint 86. In other words, the contact sensor 88 is configured to contact the second end point 86 when the probe 16 leaves the device under test 62; the contact sensor 88 is also constructed to When the probe [6 contacts the M400658 the element to be tested 62] the first end point 84 leaves the second end point 86. In one embodiment of the present disclosure, the probe stage 50 further includes a light emitting element 94 and a power supply 96. The light emitting element 94 is electrically connected to the contact sensor 88. The power supply 96 is connected. Electrically connected in series to the light emitting element 94 and the contact sensor 88. 'The first end point 84 and the second end when the actuator 8 〇 moves the first end point 84 upward to contact the second end point 86 and separate the probe 16 and the device under test 62 Point 86 forms an electrical loop such that the illuminating element 94 illuminates; when the actuator 80 moves downwardly to cause the probe 16 to contact the element under test 62 and the first end point 84 and the second end point % When separated, the electrical circuit is turned off, causing the light-emitting element 94 to stop emitting light. In other words, the light-emitting element 94 can serve as a contact indicator for the probe 16. Referring to FIG. 11, in one embodiment of the present disclosure, the contact sensor 88 is electrically coupled to a tester 78, which can be borrowed. The first end point 84 is separated from the second end point 86, and the probe 16 is contacted with the device under test 62 to form an electrical path. Thus, the test machine 78 can be electrically connected (not shown in the figure). The test signal is transmitted to the device under test 62 via the probe 16 and the response signal of the device under test 62 is collected. In the disclosed embodiment, the test machine 78 is electrically connected to a signal generator 82, which is constructed to generate the electrical signal; when the electrical test of the device under test 62 is completed, the test machine transmits The signal generator 82 is caused to generate an up-shift signal to the actuator 80, so that the first end material contacts and moves the second end point 86 upward, and moves the probe 16 upwards. The probe 16 is separated from the element to be tested 12 M400658 62. In one embodiment of the present disclosure, the test machine 78 is electrically connected to the component stage 70, and the test machine 78 can know the probe by contacting the first end point 84 with the second end point 86. After separation from the device under test 62, a command can be sent to the component stage 7 to perform lateral movement, and the remote probe 16 is aligned with the other component to be tested for electrical testing. In one embodiment of the present disclosure, the probe stage 5〇 further includes a load 98 disposed on the placement arm 9〇 and configured to substantially apply a fixing force via the probe 16 The element to be tested 62. When the actuator 80 moves the first end point 84' to the probe element 62 and the first end point 84 is separated from the second end point 86, the load 98 becomes the probe 16 The only influencing factor of the force to be tested is the influencing factor; in other words, if the weight of the load % is fixed, the probe 16 applies a fixing force to the element to be tested 62. In one embodiment of the present disclosure, the placement arm 9A can be configured with loads of various weights so that the probe 16 can apply different fixing forces to the member to be tested 62. The weight of the tl piece is relatively large, and the frequency of the up and down movement is limited to 6 times/second, which cannot be applied to the high-speed test system. In contrast, the present disclosure uses a high speed actuator to move the probe with less weight up and down to achieve electrical contact between the probe and the component under test, rather than moving the component carrier with a relatively heavy weight up and down. Therefore, the technique of the present disclosure can move the probe up and down at a frequency higher than 6 times/second, and can even move the probe up and down at a frequency higher than several thousand times/second to meet high-speed test requirements. The technical content and technical features of the present disclosure have been disclosed above, but those having ordinary knowledge in the technical field of the present disclosure should understand that it is within the spirit and scope of the disclosure defined by the teaching patent of 13 M400658. This disclosure 2 discloses that various alternatives and modifications can be made. For example, the above discloses that many processes can be implemented in different ways or in other processes, or: a combination of the two.
此外，本案之權利範圍並不侷限於上文揭示之特定實 施例的製程、機台、製造、物質之成份、裝置'方法或步 驟。本揭露所屬技術領域中具有通常知識者應瞭解，基於 本揭露教示及揭示製程、機台、製造、物質之成份、裝置 、方法或步驟，無論現在已存在或日後開發者，其與本案 實施例揭示者係以實質相同的方式執行實f相同的功能， 而達到貫質相同的結果，亦可使用於本揭露。因此，以下 之申咕專利範圍係用以涵蓋用以此類製程、機台、製造、 物質之成份、裝置、方法或步驟。 【圖式簡單說明】 φ 藉由參照前述說明及下列圖式，本揭露之技術特徵及 優點得以獲得完全瞭解。 圖1及圖2例示一習知之測試系統； 圖3至圖6例示本揭露一實施例之測試裝置；以及 圖7至圖11例示本揭露另一實施例之測試裝置。 【主要元件符號說明】 10 測試卡 14 M400658 基板 支撑物 探針 環氧樹脂 殼體 本體 平台 上蓋 探針載台 探針載台 基座 柩轴 探針 待測元件 元件載台 可動基座 溫度控制器 測試機 致動器 訊號產生器 第一端點 15 M400658 第二端點 接觸感測器 置放臂 置放臂 固持部 固持部 發光元件 電源供應器 負載 測試裝置 測試裝置 測試室 測試系統 探針 元件載台 晶Η 待測元件 待測元件 待測元件Moreover, the scope of the present invention is not limited to the process, the machine, the manufacture, the composition of the substance, the device's method or the steps of the specific embodiments disclosed above. It should be understood by those of ordinary skill in the art that, based on the teachings of the present disclosure, the process, the machine, the manufacture, the composition of the material, the device, the method, or the steps, whether present or future developers, The revealer performs the same function of the real f in substantially the same manner, and achieves the same result of the same quality, and can also be used in the present disclosure. Therefore, the scope of the claims below is intended to cover such processes, machines, manufactures, components, devices, methods or steps. BRIEF DESCRIPTION OF THE DRAWINGS The technical features and advantages of the present disclosure are fully understood by reference to the foregoing description and the accompanying drawings. 1 and 2 illustrate a conventional test system; FIGS. 3 to 6 illustrate a test apparatus according to an embodiment of the present disclosure; and FIGS. 7 to 11 illustrate a test apparatus according to another embodiment of the present disclosure. [Main component symbol description] 10 Test card 14 M400658 Substrate support probe Epoxy resin case body Platform cover Probe stage Probe stage base 柩 Axis probe Test component component Stage movable base temperature controller Test Machine Actuator Signal Generator First End Point 15 M400658 Second End Point Contact Sensor Placement Arm Placement Arm Holder Holder Light Emitting Element Power Supply Load Test Device Test Set Test Room Test System Probe Element Load Taiwan wafer 待 component to be tested component to be tested