M394555 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種複合型背膠式透明導電結構，旨在提 供一種可應用於觸控面板之背膠式透明導電結構。 【先前技術】 按，近年來’感觸式之人機介面，如：觸控面板（T〇uch Panel)，已被廣泛地應用至各式各樣之電子產品中，如：全 球定位系統（GPS)、個人數位助理（PDA)、行動電話（cellular phone)及掌上型電腦（Hand-held PC)等，以取代傳統之輸入 裝置（如：鍵盤及滑鼠等），此一設計上之大幅改變，不僅提 昇了該等電子裝置之人機介面親和性，更因省略了傳統輸入 裝置’而騰出更多空間，供安裝大型顯示面板，方便使用者 瀏覽資料- 傳統上，觸控面板的構造主要包含二片面狀的導電層U 以分開一定間隙而對向配置，如第一圓所示，而在下方之導 電膜11以一透明的膠合層16(光學膠），設置於一具有堅硬 質料的透明塑料基板13的一表面，在對向配置的二面之間備 有多數凸點狀隔件14,而在導電膜11的設置區域内留出間 隔，以及在該區域之環周邊部塗佈黏膠，據以將二者密射黏 接在一起而形成一觸控感應組件，再於上方之導電膜11上方 貼設一裝飾面板15,然後再貼覆於一顯示幕（圖未示）上使用。 惟誠如前述，習知之裝飾面板15及觸控感應組件等元 件都是先各自生產完成後再以一透明的膠合層16將二者4 3 M394555 置貼合成一體，其具有下列缺失： 卜該習有組合構造係先將導電膜u、透明塑料基板13、 裝飾面板15以及膠合層16各自生產完成後，再由下游廠商 自行加工貼合，該貼合程序可如第二圖（A)、（B)所示，係將 該膝合層16 —側所預設之離型層ι61剝離，貼合於該導電膜 11上’再將該膝合層16另側所預設之離型層161剝離，而 貼合於該襞飾面板15，此組裝操作程序稍嫌繁複。 2、 該膝合層16製程係為無基材塗佈製程，其製程難度 較高’且光學膠價格高昂、貼合時很容易產出不良品，造成 材料浪費以及使生產成本倍增。 3、 該導電膜11之結構如圖所示，依序設有上層保護層 111、硬化塗層112、透明基材113、透明導電層114以及下 層保護層115 ’其中該透明基材113之厚度就高達188/z m， 使得其整體厚度較厚，組合後的板體厚度倍增，既不符輕薄 特性的需求，且將減損觸控面板的光學特性，降低了觸控靈 敏度。 【新型内容】 有鑑於此，本創作之主要目的提供一種可應用於觸控面 板之背膠式透明導電結構。 為達上揭目的，本創作之背膠式透明導電結構依序設有 一透明導電層、一透明基材、一膠合層以及一離型層，該背 膠式透明導電結構可將該離型層剝離，而直接藉由該膠^層 黏貼固定於一板材（可以為裝飾面板或支撐基材）上該背膠 式透明導電結構可大幅降低觸控的入力克數，並大幅提高觸 M394555 控靈敏度，且可減少一道貼膜作業，達到節省工序、降低不 ，良率等功效。 【實施方式】 本創作之特點，可參閱本案圖式及實施例之詳細說明而 獲得清楚地瞭解。 本創作「複合型背膠式透明導電結構」，如第三圖之第 • 一實施例所示，該複合型背膠式透明導電結構2，係至少包 •含有： 一透明基材21，其設有相對之第一表面211及第二表面 212，該透明基材21可以為？£1'(聚對苯二曱酸乙二酯）、？(：（聚 碳酸酯）或PEN(聚萘二甲酸乙二酯）之透明塑膠材材質，而該 透明基材21之厚度係介於12~188/zm ; 一透明導電層25，該透明導電層25係設於該透明基材 之第一表面211 ; 一膠合層22，該膠合層22可以為各種不同折射率之光 ，學膠，該膠合層22係設於該透明基材之第二表面212;以及 至少一離型層23，該離形層23係設於該膠合層22之表 面。 如圖所示之第一實施例中，該背膠式透明導電結構2依 序設有一透明導電層25、透明基材21、一膠合層21以及一 離型層23，該背膠式透明導電結構可進一步設有保護層24， 如第四圖之第二實施例所示，該保護層24係設於該透明導電 層25表面。 本創作之背膠式透明導電結構2應用於觸控面板中時， 5 M394555 可將該離型層23剝離，如第五圚（A)所示，而直接藉由該膠 合層21黏貼固定於一板材（可以為裝飾面板31)上；或者， 如第五圖（B)所示，可直接黏貼於支撐基材32【可以 材質或pc(聚碳酸酯）材質之板材】上。 w 亦可如第六圓所示，係為應用於觸控面板之另一實施 例，該觸控面板依序設有支撐基材32、膠合層22、透明基材 21、透明導電層25、多數凸點狀隔件26、透明導電層&、 透明基材21、勝合層21以及裝飾面板31，其中，該裝飾面 板31下方進一步設有裝飾外框27,該裝飾外框27係僅設置 於該裝飾面板31框邊位置處，其具有一高度差，而該膠合層 21之設置可消除該高度差。 值得一提的是，本創作係具有下列優點： 1、 本創作之背膠式透明導電結構節省了原本光學膠的一 層離型層，以及導電膜之上層保護廣及硬化塗層之結構，且 該透明基材之厚度可降於12〜188从〇1，不僅可節省材料成本， 且整體厚度較薄，滿足輕薄短小特性的需求，亦可大幅降低 觸控的入力克數，並大幅提高觸控靈敏度。 2、 本創作係於該透明基材上進行塗膠而形成膠合層，以 改善習有無基材塗佈形成膠合層之製程。 3、 直接將透明基材以及透明導電層與膠合層預先結合成 單一整艘的背膠式透明導電結構，減少下游廠商一道貼膜作 業，而可直接使用於板材上，達到節省工序、降低不良率及 製造成本等功效。 4、 本創作之谬合層可消除該裝飾外框所產生之高度差， 使4附之其他結構（例如透明基材及透明導電層）係可完整地 M394555 彼覆於上 , 綜上所述，本創作提供一較佳可〜、 導電結構’爰依法提呈新型專利之申複合型背膠式透明 及技術特點已揭示如上，然而熟悉本‘抽：創作之技術内容 於本創作之揭示而作各種不背離 夜術之人士仍可能基 H本創作之倾範圍應於=精神之替換及修 【圖式簡單說明】 帛-圖係為-般觸控面板之結構示意圖。 =二圖（Α)、⑻係為習有觸控面板組裝之 結構Si係為本創作中背膠式透明導電結構第 一實施例之 舞結構Si係為本創作中背膠式透明導電結構第二實施例之 圖。第五圖（A)、（Β)係為本創作中觸控面板組裝之結構示意 圖。第六圖係為本創作中應用於觸控面板之另一結構示意 7 M394555 【主要元件符號說明】 導電膜11 上層保護層111 硬化塗層112 透明基材113 透明導電層114 下層保護層115 透明塑料基板13 隔件14 裝飾面板15 膠合層16 離型層161 背膠式透明導電結構2 透明基材21 膠合層22 離型層23 保護層24 透明導電層25 凸點狀隔件26 裝飾外框27 裝飾面板31 支撐基材32M394555 V. New Description: [New Technology Field] This is a composite back-type transparent conductive structure designed to provide a back-coated transparent conductive structure that can be applied to touch panels. [Prior Art] According to recent years, 'touch-sensitive human-machine interface, such as: touch panel (T〇uch Panel), has been widely used in a variety of electronic products, such as: Global Positioning System (GPS) ), personal digital assistants (PDAs), cellular phones, and handheld computers (Hand-held PCs) to replace traditional input devices (such as keyboards and mice), this design has changed dramatically. It not only enhances the human-machine interface affinity of these electronic devices, but also frees up more space for omitting the traditional input device to install a large display panel for users to browse data - traditionally, the construction of the touch panel The conductive layer U mainly includes two planar conductive layers disposed opposite to each other with a certain gap, as shown by the first circle, and the conductive film 11 underneath is provided with a transparent adhesive layer 16 (optical glue), which is disposed on a hard material. One surface of the transparent plastic substrate 13 is provided with a plurality of bump-like spacers 14 between the opposite sides of the opposite arrangement, leaving a space in the arrangement area of the conductive film 11, and coating the peripheral portion of the ring in the area Cloth adhesive, A touch sensing component is formed by adhering the two together, and a decorative panel 15 is attached over the upper conductive film 11, and then attached to a display screen (not shown) for use. However, as mentioned above, the conventional decorative panel 15 and the touch sensing component are all integrated and then combined with a transparent glue layer 16 to form the 4 3 M394555, which has the following drawbacks: The conventional composite structure firstly produces the conductive film u, the transparent plastic substrate 13, the decorative panel 15 and the glue layer 16 respectively, and then the downstream manufacturer processes and fits itself. The bonding procedure can be as shown in the second figure (A). (B), the release layer ι61 preset on the side of the knee joint layer 16 is peeled off and attached to the conductive film 11 and the release layer is preset on the other side of the knee joint layer 16. The 161 is peeled off and attached to the enamel panel 15, and the assembly operation procedure is somewhat complicated. 2. The kneading layer 16 process is a substrate-free coating process, which is difficult to process. The optical adhesive is expensive, and it is easy to produce defective products when it is attached, resulting in material waste and double production costs. 3. The structure of the conductive film 11 is as shown in the figure, and is provided with an upper protective layer 111, a hardened coating 112, a transparent substrate 113, a transparent conductive layer 114, and a lower protective layer 115', wherein the thickness of the transparent substrate 113 is sequentially provided. As high as 188/zm, the overall thickness is thicker, and the combined thickness of the plate is doubled, which does not meet the requirements of thin and light characteristics, and will detract from the optical characteristics of the touch panel and reduce the touch sensitivity. [New content] In view of this, the main purpose of this creation is to provide a back-coated transparent conductive structure that can be applied to a touch panel. In order to achieve the above, the adhesive back-type transparent conductive structure of the present invention is sequentially provided with a transparent conductive layer, a transparent substrate, a glue layer and a release layer, and the back-type transparent conductive structure can be used for the release layer. Stripping, and directly bonding the adhesive layer to a plate (which can be a decorative panel or a supporting substrate), the adhesive-type transparent conductive structure can greatly reduce the input force of the touch, and greatly improve the sensitivity of the touch M394555 And can reduce a film operation, to save the process, reduce the rate, yield and other effects. [Embodiment] The features of the present invention can be clearly understood by referring to the detailed description of the drawings and the embodiments. The present invention is a composite back-type transparent conductive structure, as shown in the first embodiment of the third embodiment, the composite back-type transparent conductive structure 2, at least comprising: a transparent substrate 21, The first surface 211 and the second surface 212 are opposite to each other. The transparent substrate 21 can be? £1' (polyethylene terephthalate), ? (: (polycarbonate) or PEN (polyethylene naphthalate) transparent plastic material, and the thickness of the transparent substrate 21 is between 12 and 188 / zm; a transparent conductive layer 25, the transparent conductive The layer 25 is disposed on the first surface 211 of the transparent substrate; a glue layer 22, the glue layer 22 can be light of various refractive indexes, and the glue layer 22 is disposed on the second of the transparent substrate. a surface 212; and at least one release layer 23, the release layer 23 is disposed on the surface of the glue layer 22. In the first embodiment, the back-type transparent conductive structure 2 is sequentially provided with a transparent The conductive layer 25, the transparent substrate 21, a glue layer 21 and a release layer 23, the back-type transparent conductive structure may further be provided with a protective layer 24, as shown in the second embodiment of the fourth figure, the protective layer 24 is disposed on the surface of the transparent conductive layer 25. When the adhesive back transparent conductive structure 2 of the present invention is applied to a touch panel, 5 M394555 can peel off the release layer 23, as shown in the fifth layer (A). And directly adhered to a plate (which may be the decorative panel 31) by the glue layer 21; or, as in the fifth (B), it can be directly adhered to the support substrate 32 [can be made of material or pc (polycarbonate) material.] w can also be applied to the touch panel as shown in the sixth circle. In an embodiment, the touch panel is sequentially provided with a support substrate 32, a glue layer 22, a transparent substrate 21, a transparent conductive layer 25, a plurality of bump-like spacers 26, a transparent conductive layer &, a transparent substrate 21, and a win. a decorative layer 31 and a decorative panel 31, wherein the decorative panel 31 is further provided with a decorative outer frame 27, which is disposed only at a frame edge position of the decorative panel 31, and has a height difference, and the bonding The setting of the layer 21 can eliminate the height difference. It is worth mentioning that the creation has the following advantages: 1. The adhesive-backed transparent conductive structure of the present invention saves a layer of the original optical adhesive and the upper layer of the conductive film. The structure of the protective coating and the hardened coating can be reduced, and the thickness of the transparent substrate can be reduced from 12 to 188, which not only saves material cost, but also has a thin overall thickness, meets the requirements of light and thin characteristics, and can greatly reduce the touch. Control the number of grams, and greatly increase Touch sensitivity. 2. This creation is based on the transparent substrate to form a glue layer to improve the process of forming a glue layer without substrate coating. 3. Directly bonding the transparent substrate and the transparent conductive layer. The layer is pre-combined into a single full-back adhesive-type transparent conductive structure, which reduces the downstream film processing operation of the downstream manufacturer, and can be directly used on the board to save the process, reduce the defect rate and the manufacturing cost, etc. 4. The combination of the creation The layer can eliminate the height difference caused by the decorative frame, so that other structures attached to the cover 4 (for example, the transparent substrate and the transparent conductive layer) can be completely covered by the M394555. In summary, the present invention provides a better one. Can be ~, conductive structure '爰 提 提 提 提 提 提 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合It is still possible that the scope of the creation of the base H should be based on the replacement of the spirit and the repair [simplification of the drawing]. The 帛-picture is a schematic diagram of the structure of the general touch panel. = 二图(Α), (8) is a structure with a touch panel assembly. The Si system is the dance structure of the first embodiment of the adhesive-type transparent conductive structure. The Si system is the adhesive transparent conductive structure in the creation. Figure of a second embodiment. The fifth figure (A) and (Β) are schematic diagrams of the structure of the touch panel assembly in the creation. The sixth figure is another structure diagram applied to the touch panel in this creation. 7 M394555 [Main component symbol description] Conductive film 11 Upper protective layer 111 Hardened coating 112 Transparent substrate 113 Transparent conductive layer 114 Lower protective layer 115 Transparent Plastic substrate 13 spacer 14 decorative panel 15 glue layer 16 release layer 161 back-coated transparent conductive structure 2 transparent substrate 21 glue layer 22 release layer 23 protective layer 24 transparent conductive layer 25 bump-shaped spacer 26 decorative frame 27 decorative panel 31 supporting substrate 32