M394424 五、新型說明： 【新型所屬之技術領域】 一種光源模組散熱裝置，其可供組設於一光源模組 上，本創作尤指一種利用致冷液進行散熱，可有效降低 光源模組發光時所產生的熱，以維持發光模組整體發光 效率的光源模組散熱裝置》 【先前技術】M394424 V. New description: [New technical field] A light source module heat dissipation device, which can be set on a light source module, especially in the case of using a refrigerant liquid for heat dissipation, which can effectively reduce the light source module Light source generated by illuminating, to maintain the overall luminous efficiency of the illuminating module, the light source module heat sink device [Prior Art]
般所稱的光源模組，其係在導通電流之後，即可 使電路板表面所佈設的數個發光源（如發光二極體等） 發光，而光源模組在發光時會產生熱，且產生的熱必須 被快速排除及發散，否則會影響到光源模組整體的發光 效率；請參目「第1圖」，目中所示係為一習知的發光模 組，如圖中所示的發光模組1〇，其係由一電路板1〇1及 散熱部102係為具有散 一散熱部102組構而成，其中 熱效果的材質所製成，例如金屬板、銘板等且電路板 101與散熱部102之間係塗佈有一層散熱膏1〇3，其塗佈 方式為全平面塗佈’以使電路板101與散熱部102之間 能夠完全互相貼合 利用散熱膏103的高導熱作用，使 電路板ιοί表面電性佈設的各發光二極體1〇4在發光時 所產生的熱，能經由電路板1〇卜散熱膏m傳導至散熱 σ Χ使熱可由散熱部102發散，唯，光源模組10 的發級率日趨進步，其運作時產生的熱，也隨著發光 效率提升而增加，且光源模組發光時產生的熱，也會隨 3 M394424 著環境等其他因素造成變化’若模組產生的熱過高，且 無法及時排除，會進一步影響到光源模組本身的發光效 率’例如可能造成光衰減、晶片失效等狀況，因此，如 何更有效的幫助光源模組排除發光時所產生的熱，為待 需解決的問題。 【新型内容】 有鑑於上述的問題，本創作者係以多年來從事相關The light source module is generally called after the conduction current, so that several light sources (such as light-emitting diodes) disposed on the surface of the circuit board can emit light, and the light source module generates heat when emitting light, and The generated heat must be quickly eliminated and diverged, otherwise it will affect the overall luminous efficiency of the light source module; please refer to "Figure 1", which is a conventional lighting module, as shown in the figure. The light-emitting module 1〇 is formed by a circuit board 1〇1 and a heat-dissipating part 102 having a heat dissipation part 102, wherein the heat-effect material is made of, for example, a metal plate, a nameplate, etc. A heat dissipating paste 1〇3 is applied between the board 101 and the heat dissipating portion 102, and the coating method is a full-surface coating 'so that the circuit board 101 and the heat dissipating portion 102 can be completely adhered to each other by using the thermal grease 103. The high thermal conductivity enables the heat generated by each of the light-emitting diodes 1〇4 electrically disposed on the surface of the circuit board to be conducted through the circuit board 1 to the heat dissipation σ, so that the heat can be dissipated by the heat dissipation portion 102. Divergence, only the rate of the light source module 10 is increasing, The heat generated during the process also increases with the increase of the luminous efficiency, and the heat generated when the light source module emits light will also change with other factors such as the environment of the M M394424. If the heat generated by the module is too high, it cannot be timely. Exclusion will further affect the luminous efficiency of the light source module itself. For example, it may cause light attenuation, wafer failure, etc. Therefore, how to effectively help the light source module to eliminate the heat generated when the light is emitted is a problem to be solved. [New content] In view of the above problems, the creator has been engaged in related years.
行業及相關產品設計的經驗，針對光源模組的結構及散 熱方式進行相關的分析及研究，緣此，本創作主要的目 的在於提供一種具有良好散熱效果的光源模組散熱裝 置。Based on the experience of industry and related product design, the related analysis and research on the structure and heat dissipation mode of the light source module. Therefore, the main purpose of this creation is to provide a heat dissipation device for the light source module with good heat dissipation effect.
為達上述目的，本創作之光源模組散熱裝置，主要 係可供組設於一光源模組的散熱部，例如光源模組的散 熱部，所述的光源模組散熱裝置，係成型有一集熱面， 且集熱面與-儲液槽相連結，集熱面可供一光源模組之 散熱部直接接觸’藉以吸收光源模組發光時產生的熱， 並進「步將熱傳導至儲液槽内，#由冷卻液來進行散 熱，以增加光源模組的散熱效率。 型右2作係可進—步於集熱面的下方，連接或直接成 效率，^柱’藉由導_進行熱傳導作用，提升散熱 …足較大發光功率需求的光源模组。 列說審查委員能清楚了解本創作之内容，僅以下 說月搭配圖示，敬請參閲。 4 M394424 【實施方式】 6月參閱「第2圖」，圖中所示係為本創作之立體外觀 圖，如圖所示的光源模組散熱裝置2〇，其主要係由一集 熱面201及一儲液槽2〇2所組構而成，其中，集熱面2〇1 係可直接成型、或獨立成型後，組設於儲液槽2〇2，儲液 槽202内部，係成型有一容置空間（本圖中尚未繪示）， 可供以儲存致冷液。 承上，請搭配參照「第3圖」，圖中所示係為本創作 之構件示意圖（一），如圖所示，儲液槽202内部係成型 有一容置空間2021，供以承裝適量的致冷液2〇3 ;請接 續參閱「第4圖」，圖中所示係為本創作之實施示意圖， 如圖所示，如圖中所示的一光源模組3〇，其主要係由一 電路板301及一散熱部302所組成，其中，電路板3〇1 上係電性佈設有數個發光二極體30n，而散熱部3〇2係 組設於電路板301的下方，供以散熱用，當電路板3〇1 受到一電源導.通後，電路板301上的各發光二極體3〇11 係會產生發光源，而發光二極體3011產生的熱，係會經 由電路板301傳導至散熱部302,藉由散熱部3〇2進行散 熱；承上所述，本創作為提升光源模組3〇的散熱效率， 係進一步將光源模組散熱裝置20，組設於光源模組3〇的 散熱部302下方，藉此，各發光二極體3〇11發光時產生 的熱’會經由電路板301傳導至散熱部302，如圖中所示 的箭頭A所示，熱逐漸傳導至儲液槽2〇2上方的集熱面 5 2(H ’再如圖中所示的箭頭B，沿著儲液槽2〇2的本體， 傳導至致冷液203，以進行快速的散熱，其確實可有效降 低光源模組30運作時產生的熱’以維持光源模組3〇的 發光效率；如本圖所示，散熱部3〇2的下平面係可進一 步句勻塗佈有一層散熱膏303 ’而光源模組散熱裝置2〇 係利用散熱膏303完整的貼合於散熱部3〇2的下平面， 以提升其熱傳導效率。 凊參閱「第5圖」，圖中所示係為本創作之另一實施 例（一），如圖中所示’本創作所稱的光源模組散熱裝置 20，其集熱面201的下方，係進一步成型或組設有一導 熱柱204，其係由高導熱係數的材質所製成，例如銅金 屬、鋁金屬等，或亦可為一導熱係數良好的熱導管；再 請參照本圖，搭配導熱柱204實施的集熱面2〇1，可依實 際產品需求，設計成不同款型，例如，於集熱面2〇1的 平面、或導熱柱204的外觀上，成型有一組設部2〇11， 此組設部2011可例如為一卡接機構、螺合機構等型式； 又，儲液槽202供集熱面201組設的相對位置，則成型 有一相對組設部2022,此相對組設部2022係與内部的容 置空間2021呈連通狀，並可進一步供集熱面2〇1的組設 部2011完成相對組合，使導熱柱2〇丨的一端，在常態下 位處於儲液槽202的容置空間2021之中；而上述構件完 成組設之態樣，即如「第6圖」所示，圖中所示係為實 施例（一）之組合完成示意圖，如圖，導熱柱2〇4與儲 液槽202完成組設後，其一端係埋入於儲液槽2〇2内部， M394424 並浸泡於致冷液203之中，而集熱面201係外露於儲液 槽202 ;請接續參閱「第7圖」’圖中所示係為實施例（j ) 之實施示意圖，如圖中所示的儲液槽2〇2,其内部的容置 空間2021，係盛裝具有散熱效果的致冷液2〇3，例如油 類液體、冷卻液等；再請參照本圖，圖中所示的導熱柱 204，在常態下係浸入於致冷液2〇3中；如圖中所示的光 源模組30,其發光二極體3011產生的熱，係會經由電路 板301傳導至散熱部302,藉由散熱部3〇2進行散熱；承 上所述，本創作係以集熱面201，組設於散熱部3〇2底面， 藉此，各發光二極體3011發光時產生的熱，會經由電路 板301傳導至散熱部302,如圖中所示的箭頭A ,熱逐漸 傳導至儲液槽202上方的集熱面201，再如圖中所示的箭 頭B，傳導至導熱柱204，由於導熱柱204在常態下係浸 於致冷液203中，故導熱柱204所吸收的熱，可藉由致 冷液203達到快速降溫；綜上所述，本創作與發光模組 凡成組設後，係可將光源模組3〇發光時所產生的熱， 進步的藉由導熱柱204將熱導入儲液槽202的致冷液 203中，並利用致冷液203進行散熱，禮實可有效降低光 源模組運作時產生的熱，以維持光源模組的發光效率。 請參閱「第8圖」，圓中所示係為本創作之另一實 施例（二）’請搭配參照「第7圖」，承上所述，因本創 作所稱的儲液槽202内係盛裝有致冷液203,為此，本創 作可進一步於組設部2〇u與相對組設部2〇22之間，增 6又—油封環205 ’藉此，當導熱柱2〇1完成組設時，油封 7 環205可有效阻絕致冷液2〇3外洩β 請參閱「第9圖」，圖中所示係為本創作之另一實 施例（三）’如圖中所示的一光源模組散熱裝置4〇，其儲 液槽401的外部周圍，係分別成型有數片散熱鰭片4011， 而當儲液槽401吸取光源模組發光產生的熱時，其儲液 槽401整體溫度會逐漸上升，此時，儲液槽4〇1外部成 形的數片散熱鰭片4011，係可將儲液槽401的所吸收的 熱進一步的發散，藉以協助儲液槽4〇1本體進行降溫。 如上所述，本創作主要係組設於一光源模組後，可 與光源模組的散熱部呈緊密貼合，使光源模組發光時產 生的熱’經由集熱面傳導至儲液槽的致冷液之中，並藉 由儲液槽内的致冷液進行快速降溫，供以增加光源模組 的散熱效率’以維持光源模組的發光效率，又，本創作 更進一步於集熱面下方，成型或組設有一導熱柱，藉由， 提升其整體的熱傳導效率；據此，本創作其據以實施後， 確實可達到提供一種可有效排除光源模組發光時所產生 的熱的光源模組散熱裝置。 唯，以上所述者，僅為本創作之較佳之實施例而 已，並非用以限定本創作實施之範圍；任何熟習此技藝 者，在不脫離本創作之精神與範圍下所作之均等變化與 修飾’皆應涵蓋於本創作之專利範圍内。 综上所述，本創作之功效，係具有新型之「產業可 利用性」、「新穎性」與「進步性」等專利要件；申請人 羞依專利法之規定，向鈞局提起新型專利之申請。 M394424 气 第 1圖， 第 2圖， 第 3圖， 第 4圖， 第 5圖， - 第 6圖， 第 7圖， • 第 8圖， 第 9圖， 【圖式簡單說明】 為一習知的發光模組。 為本創作之立體外觀圖。 為本創作之構件示意圖（一）。 為本創作之實施示意圖。 為本創作之另一實施例（一）。 為實施例（一）之組合完成示意圖。 為實施例（一）之實施示意圖。 為本創作之另一實施例（二）。 為本創作之另一實施例（三）。 【主要元件符號說明】 10 發光模組 101 電路板 102 散熱部 103 散熱膏 104 發光二極體 20 發光模組散熱裝置 201 集熱面 202 儲液槽 2011 組設部 2021 容置空間 203 致冷液 2022 相對組設部 204 導熱柱 205 油封環 30 光源模組 9 M394424 301 電路板 302 散熱部 3011 發光二極體 303 散熱膏 40 光源模組 401 儲液槽 4011 散熱鰭片In order to achieve the above object, the heat sink of the light source module of the present invention is mainly provided for a heat dissipating portion of a light source module, such as a heat dissipating portion of the light source module, and the heat dissipating device of the light source module is formed with a set. The hot surface, and the heat collecting surface is connected with the liquid storage tank, and the heat collecting surface can be directly contacted by the heat radiating portion of the light source module to absorb the heat generated when the light source module emits light, and the heat is transferred to the liquid storage tank. Inside, #cooling is used to dissipate heat to increase the heat dissipation efficiency of the light source module. The right 2 system can be advanced - below the heat collecting surface, connected or directly into efficiency, and the column 'heat conduction by conduction _ Function, improve heat dissipation... Light source module with large luminous power requirements. The review committee can clearly understand the content of this creation, please refer to the following monthly matching icon, please refer to it. 4 M394424 [Implementation] See in June "Fig. 2", which is a three-dimensional appearance of the creation, as shown in the figure, the heat dissipation device of the light source module is mainly composed of a heat collecting surface 201 and a liquid storage tank 2〇2. Organized, in which the collector surface is 2〇1 Molded directly or after forming an independent group 2〇2 reservoir disposed inside the reservoir tank 202, is shaped as an accommodating space (not shown in this FIG.), Is available to store the liquid refrigerant. Please refer to "3rd figure" for reference. The figure shows the schematic diagram of the component (1). As shown in the figure, the inside of the liquid storage tank 202 is formed with an accommodating space 2021 for the proper amount. The cooling liquid is 2〇3; please refer to the “4th drawing”. The figure shows the implementation of the creation. As shown in the figure, a light source module 3〇, as shown in the figure, is mainly The circuit board 301 and a heat dissipating portion 302 are disposed on the circuit board 3〇1, and the plurality of light emitting diodes 30n are electrically disposed, and the heat dissipating portion 3〇2 is disposed under the circuit board 301 for For heat dissipation, when the circuit board 3〇1 is guided by a power source, each of the light-emitting diodes 3〇11 on the circuit board 301 generates a light source, and the heat generated by the light-emitting diode 3011 passes through The circuit board 301 is conducted to the heat dissipating portion 302, and is dissipated by the heat dissipating portion 3〇2. According to the above description, in order to improve the heat dissipating efficiency of the light source module 3, the light source module heat dissipating device 20 is further assembled. Below the heat dissipating portion 302 of the light source module 3〇, the heat generated when each of the light emitting diodes 3〇11 emits light Conducted to the heat dissipating portion 302 via the circuit board 301, as indicated by the arrow A shown in the figure, the heat is gradually transmitted to the heat collecting surface 52 above the liquid storage tank 2〇2 (H' and then the arrow B shown in the figure , along the body of the liquid storage tank 2〇2, is transmitted to the refrigerant liquid 203 for rapid heat dissipation, which can effectively reduce the heat generated during operation of the light source module 30 to maintain the luminous efficiency of the light source module 3〇 As shown in the figure, the lower surface of the heat dissipating portion 3〇2 can be further coated with a layer of thermal grease 303 ′, and the light source module heat dissipating device 2 is completely attached to the heat dissipating portion 3 by using the thermal grease 303. The lower plane of 2 is used to improve the heat transfer efficiency. 凊 Refer to “figure 5”, which is another embodiment (1) of the creation, as shown in the figure. The heat dissipating device 20 is further formed or assembled with a heat conducting column 204 under the heat collecting surface 201, which is made of a material with high thermal conductivity, such as copper metal, aluminum metal, etc., or may also be a thermal conductivity coefficient. Good heat pipe; please refer to this figure again, the heat collecting surface 2 with the heat conducting column 204 1, can be designed into different models according to the actual product requirements, for example, on the plane of the heat collecting surface 2〇1, or the appearance of the heat conducting column 204, a set of components 2〇11 is formed, and the grouping unit 2011 can be, for example, The clamping unit 202 is provided with a relative position of the heat collecting surface 201, and a relative assembly portion 2022 is formed. The relative assembly portion 2022 is internally and accommodating. The space 2021 is connected to each other, and can be further combined with the assembly portion 2011 of the heat collecting surface 2〇1 so that one end of the heat conducting column 2〇丨 is in the accommodating space 2021 of the liquid storage tank 202 in the normal lower position; The above-mentioned components complete the assembled state, that is, as shown in "Fig. 6", the figure is a schematic diagram of the combination of the embodiment (1), as shown in the figure, the heat conducting column 2〇4 and the liquid storage tank 202 are completed. After being assembled, one end is buried in the liquid storage tank 2〇2, M394424 is immersed in the refrigerant liquid 203, and the heat collecting surface 201 is exposed in the liquid storage tank 202; please refer to "Fig. 7" 'The figure is a schematic diagram of the implementation of the embodiment (j), the liquid storage tank 2〇2 shown in the figure, the inside thereof The accommodating space 2021 is for containing a cooling liquid 2〇3 having a heat dissipation effect, such as an oil liquid, a cooling liquid, etc.; referring to this figure, the heat conducting column 204 shown in the figure is immersed in the cooling under normal conditions. In the liquid crystal module 30, the heat generated by the light-emitting diode 3011 is transmitted to the heat-dissipating portion 302 via the circuit board 301, and is radiated by the heat-dissipating portion 3〇2; As described above, the present invention is formed on the bottom surface of the heat dissipating portion 3〇2 by the heat collecting surface 201, whereby heat generated when each of the light emitting diodes 3011 emits light is conducted to the heat radiating portion 302 via the circuit board 301, such as The arrow A shown in the figure, the heat is gradually transmitted to the heat collecting surface 201 above the liquid storage tank 202, and then transmitted to the heat conducting column 204 by the arrow B shown in the figure, because the heat conducting column 204 is immersed in the normal state. In the cold liquid 203, the heat absorbed by the heat transfer column 204 can be quickly cooled by the refrigerant liquid 203; in summary, after the creation and the light-emitting module are assembled, the light source module can be turned on. The heat generated during the luminescence is advanced by the heat transfer column 204 to introduce heat into the refrigerant 203 of the liquid storage tank 202, and utilize 203 cold liquid for cooling, can effectively reduce the ceremony solid heat generated during operation of the light source modules to maintain the light emission efficiency of the light source module. Please refer to "Figure 8". The circle shown in the figure is another embodiment of the creation (2) 'Please refer to the figure 7 in conjunction with the above, as described in the reservoir 202 as referred to in this creation. The refrigerant liquid 203 is contained therein. For this reason, the creation can be further between the assembly portion 2〇u and the opposite assembly portion 2〇22, and the oil seal ring 205′ is added to the heat seal column 2〇1. When assembled, the oil seal 7 ring 205 can effectively block the leakage of the refrigerant 2〇3. Please refer to “Fig. 9”, which is another embodiment of the creation (3) as shown in the figure. A light source module heat dissipating device 4〇, a plurality of heat dissipating fins 4011 are formed around the outer portion of the liquid storage tank 401, and when the liquid storage tank 401 absorbs heat generated by the light source module, the liquid storage tank 401 The overall temperature will gradually increase. At this time, the plurality of heat dissipation fins 4011 formed outside the liquid storage tank 4〇1 can further diverge the absorbed heat of the liquid storage tank 401, thereby assisting the liquid storage tank 4〇1 body. Cool down. As described above, the present invention is mainly disposed in a light source module, and can be closely adhered to the heat dissipating portion of the light source module, so that the heat generated when the light source module emits light is transmitted to the liquid storage tank through the heat collecting surface. In the refrigerant liquid, the cooling liquid in the liquid storage tank is used for rapid cooling to increase the heat dissipation efficiency of the light source module to maintain the luminous efficiency of the light source module, and the creation further extends to the heat collecting surface. Below, a heat-conducting column is formed or assembled to enhance the overall heat transfer efficiency; accordingly, according to the implementation of the present invention, it is indeed possible to provide a light source which can effectively eliminate the heat generated when the light source module emits light. Module heat sink. The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; any person skilled in the art can make equal changes and modifications without departing from the spirit and scope of the present invention. 'All should be covered by the scope of this creation patent. In summary, the effectiveness of this creation is based on new types of “industry availability,” “novelty,” and “progressiveness”; the applicant is ashamed of the patent law and filed a new patent with the bureau. Application. M394424 Gas 1st, 2nd, 3rd, 4th, 5th, - 6th, 7th, 8th, 9th, [Simplified illustration] Light module. A three-dimensional appearance of the creation. A schematic diagram of the components of this creation (1). A schematic diagram of the implementation of this creation. This is another embodiment of the creation (1). A schematic diagram is completed for the combination of the embodiments (I). A schematic diagram of the implementation of the embodiment (I). Another embodiment (2) of this creation. Another embodiment (3) of this creation. [Main component symbol description] 10 Light-emitting module 101 Circuit board 102 Heat-dissipating part 103 Thermal grease 104 Light-emitting diode 20 Light-emitting module heat sink 201 Heat collecting surface 202 Liquid storage tank 2011 Assembly part 2021 accommodating space 203 Cooling liquid 2022 Relative assembly part 204 Thermal conduction column 205 Oil seal ring 30 Light source module 9 M394424 301 Circuit board 302 Heat sink 3011 Light-emitting diode 303 Thermal paste 40 Light source module 401 Reservoir 4011 Heat sink fin