五、新型說明： 【新型所屬之技術領域】 本創作係有關一種熱輻射散熱薄膜結構，尤其是具有以熱輻射方式 進行高效率散熱的薄膜。 【先前技術】 不論是機構元件或電氣裝置，過高的使用溫度常常會造成功 能變差或甚至失效，此外還會縮短使用壽限’因此需要不同的散 熱裝置或機制，以避免操作溫度高於臨界值。 以内燃機的引擎為例，汽油或柴油在引擎内經高壓壓縮並點 燃後產生爆炸而輸出動力，藉以推動齒輪組或傳賴構而使車輛 移動。由於引擎内部的操作溫度極高，如果沒有適當的散熱機制， 會使引擎過熱而無法持續運轉，甚至發生引擎爆炸的危險，因此， 引擎的外4會做成具有多個散熱_片，利用力^大散熱表面積以提 高散熱效率，或連接高熱傳導的散熱墊，先以熱傳導方式將熱傳 播至散熱墊，再由散熱塾進行散熱。 上述熱傳導的加強散熱方式有廣泛的應用於環保節能的發光 極體(LED)產業’因為LED的發光效率及使用壽限皆受LEd本 身的操作溫度而影響。理論上，只要LED不超過溫度上限，可增 加LED的導通電流，脚可增加LED力亮度。因此只要能降低 ，溫度，便可提高LED的亮度，啸高LED的亮度係意味著 單位面積的發光亮增加，使得發光效率提升，降低材料成本。尤 -是近年來同辨LED的應關來越加普遍，使得LED的散熱問 題也愈加顯著。 然而’上述習用技術的熱傳導機制之缺點在於，熱量是由高 溫朝向低溫傳播，且與面積成正比，因此需大幅增加散熱裝置: 表面積’造册料成本增加，並使終端產品祕笨重而不方便使 用。以LED舰為例，價格可約為一般燈泡的數十倍以上，因此 失去一般人使用的誘因。此外，當2W的LED溫度達到i35t：時， 可藉所連結之散熱裝置而降低溫度至約125<5(：或115。〇，但是對 led而言還是太高。因此，需要_種不需增加散錄置之體積而 以熱輕射散鋪以增加發賊之散熱效率賴购散熱薄膜結 構’以解決上述習用技術的問題。 【新型内容】 本創作之主要目的在提供一種熱輻射散熱薄膜結構，包括基 板及熱輻射散_膜，触職_膜伽彡成於基板上，基板具 電氣絕雜，a級及鋪概__轉麟叙間的差額 比不大於0.1%。 熱輻射散麟财第-面鮮二面，第-面具有表面顯微結 構’第二面雜基板接觸。趣射散__藉触射方式在朝 向第二面的方向上進行熱傳播，因此，位於基板之外的外部物件 的溫度可不小於熱輻射散熱薄膜的溫度。 熱輕射散熱薄膜包括金屬非金屬組合物，且金屬非金屬组合 物進一步包括金屬組合物及非金屬組合物。金屬組合物係包括 銀、銅、錫、銘、鈦、鐵及銻的至少其中之一，或包括銀、銅、 錫、銘、鈦、鐵及録的至少其中之—的合金，或包括銀、銅'錫' 紹、鈦、鐵及_至少其中之—的氧化物或鹵化物。非金屬組合 物係包括至少硼、碳的其中之一的氧化物或氮化物或無機酸機化 物。 本創作之另—目的在提供—種細射散闕膜結構之其製作 方法，包括選取材料並進行混合以形成混合組合物，接著對混合 MJ93799 組合物進行加壓處理形成加壓混合組合物，再對基板進行加熱’ 然後將加壓混合組合物塗佈至已加熱的基板的表面上，使加壓混 合組合物經晶體成長過程而形成熱輻射散熱薄膜，最後經冷卻， 進而形成包括熱輻射散熱薄膜及基板的熱輻射散熱薄膜結構。 【實施方式】 以下配合圖式及元件符號對本創作之實施方式做更詳細的說 明，俾使熟習該項技藝者在研讀本說明書後能據以實施。V. New description: [New technical field] This creation is about a heat radiation heat dissipation film structure, especially a film with high efficiency heat dissipation by heat radiation. [Prior Art] Excessive operating temperatures, whether they are mechanical components or electrical devices, often cause poor function or even failure, and also shorten the service life. Therefore, different heat sinks or mechanisms are required to avoid operating temperatures higher than Threshold value. Taking the engine of an internal combustion engine as an example, gasoline or diesel is compressed in the engine and ignited to generate an explosion to output power, thereby pushing the gear set or passing the structure to move the vehicle. Due to the extremely high operating temperature inside the engine, if there is no proper heat dissipation mechanism, the engine will overheat and cannot continue to operate, and even the danger of engine explosion will occur. Therefore, the outer 4 of the engine will be made to have multiple heat dissipation sheets. ^ Large heat dissipation surface area to improve heat dissipation efficiency, or connect a high heat conduction cooling pad, first heat transfer to the heat dissipation pad by heat conduction, and then dissipate heat by heat dissipation. The above-mentioned heat conduction enhanced heat dissipation method is widely used in the environmentally-friendly and energy-saving light-emitting body (LED) industry. Because the luminous efficiency and service life of LEDs are affected by the operation temperature of LEd itself. In theory, as long as the LED does not exceed the upper temperature limit, the conduction current of the LED can be increased, and the foot can increase the brightness of the LED. Therefore, as long as the temperature can be lowered, the brightness of the LED can be increased, and the brightness of the LED is high, which means that the luminous intensity per unit area is increased, so that the luminous efficiency is improved and the material cost is lowered. In particular, in recent years, the identification of LEDs has become more common, making LED heat dissipation more prominent. However, the shortcoming of the above-mentioned conventional heat transfer mechanism is that heat is transmitted from high temperature to low temperature and is proportional to the area, so it is necessary to greatly increase the heat sink: the surface area increases the cost of the book, and makes the terminal product bulky and inconvenient. use. Take the LED ship as an example, the price can be more than tens of times that of a general light bulb, so the incentive for the use of ordinary people is lost. In addition, when the temperature of the LED of 2W reaches i35t:, the temperature can be lowered to about 125 < 5 (: or 115. 〇 by the connected heat sink, but it is still too high for the LED. Therefore, it is not necessary Increasing the volume of the scatter volume and spreading it with heat and light to increase the heat dissipation efficiency of the thief depends on the heat dissipation film structure to solve the above-mentioned problems of the conventional technology. [New content] The main purpose of the creation is to provide a heat radiation film. The structure, including the substrate and the heat radiation scatter film, the contact _ film 彡 彡 on the substrate, the substrate is electrically impregnated, the difference between the a-level and the __ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Lincai-the first two sides, the first side has a surface microstructure 'the second side of the hetero-substrate contact. The interesting scatter__ by means of the radiation method in the direction of the second side of the heat propagation, therefore, located on the substrate The temperature of the external object outside may be not less than the temperature of the heat radiation heat dissipation film. The heat light radiation heat dissipation film includes a metal nonmetal composition, and the metal nonmetal composition further includes a metal composition and a nonmetal composition. The metal composition includesAt least one of copper, tin, indium, titanium, iron and tantalum, or an alloy comprising at least one of silver, copper, tin, inscription, titanium, iron and recorded, or including silver, copper 'tin' An oxide or a halide of at least one of titanium, iron, and at least one of the non-metal compositions comprising at least one of boron, carbon, or a nitride or inorganic acid organic compound. Providing a method for making a fine-sprayed ruthenium film structure, comprising selecting materials and mixing to form a mixed composition, and then subjecting the mixed MJ93799 composition to a pressure treatment to form a pressurized mixed composition, and then heating the substrate' Applying the pressure mixing composition to the surface of the heated substrate, forming a heat radiation heat-dissipating film through the crystal growth process, and finally cooling, thereby forming heat radiation including the heat radiation heat-dissipating film and the substrate Heat Dissipating Film Structure [Embodiment] The following is a more detailed description of the implementation of this creation with the drawings and component symbols, so that those skilled in the art after studying this specification According to implement.
參閱第一圖，本創作熱輻射散熱薄膜結構的示意圖。如第一 圖所示，本創作的熱輻射散熱薄膜結構10包括基板2〇及熱輻射 散熱薄膜30 ’其中基板20具電氣絕緣性，且具有第一熱膨脹係數， 而熱輻射散熱薄膜30係形成於基板2〇上，並具有第二熱膨脹係 數’尤其是基板2〇 #第-熱膨脹係數與熱輕射散熱薄膜3〇的第 二熱膨脹係數之間的差額比不大於〇1〇/。。 熱輻射散熱薄膜30具有第一面31與第二面32，而第一面31 係為第二面32的相對面，其中第—面31朝上，如第—圖所示， 而第二面32係與基板2〇接觸。Referring to the first figure, a schematic diagram of the structure of the heat radiation film is proposed. As shown in the first figure, the heat radiation heat dissipation film structure 10 of the present invention comprises a substrate 2 and a heat radiation heat dissipation film 30' wherein the substrate 20 is electrically insulating and has a first thermal expansion coefficient, and the heat radiation heat dissipation film 30 is formed. On the substrate 2〇, and having a second coefficient of thermal expansion, in particular, the difference between the substrate 2〇# first thermal expansion coefficient and the second thermal expansion coefficient of the thermal light-radiating heat-dissipating film 3〇 is not more than 〇1〇/. . The heat radiation heat dissipation film 30 has a first surface 31 and a second surface 32, and the first surface 31 is an opposite surface of the second surface 32, wherein the first surface 31 faces upward, as shown in the first figure, and the second surface The 32 series is in contact with the substrate 2A.
% 熱輻射散熱_ 3〇包括金屬非金屬組合物，其巾該金屬非金 屬組合物包括金雜合物及非金屬組合物。金細合物可包括 銀'銅、錫，'鈦、鐵及録的至少其中之―，或可包括銀、銅、 錫”、鐵及錄的至少其中之—的合金，或可包括銀、銅、 錫、銘、欽、鐵及録的至少其中之-的氧化物«化物。非金屬 ;合物輸娜,版—嫩輸錄或無機酸 機化合物。例如，金屬非金屬組合物可驗職化物及碳酸鹽。 第-面3丨具有表面顯微結構，例如，包括2奈米至1微米之 S㈣結晶體，而以具有球體結構或多面體結構的結晶體為較 5 M393799 佳。 〃上述的本創作熱輻射散熱薄膜結構1〇可以熱輕射方式在朝 向第二面32的方向上進行鋪播，亦㈣熱輻錄熱_結構^ 本身的熱量以熱輻射方式向基板外傳播，藉以達到加強散熱的目 的。% Thermal Radiation _ 3〇 includes a metal non-metallic composition, the metal non-metal composition including the gold hybrid and the non-metal composition. The gold composition may include at least one of silver 'copper, tin, 'titanium, iron, and at least, or may include at least one of silver, copper, tin, iron, and at least one of those recorded, or may include silver, Copper, tin, Ming, Chin, iron, and at least one of the oxides of the compound. Non-metal; compound to Na, version - tender or inorganic acid compound. For example, metal non-metal composition can be tested The first surface has a surface microstructure, for example, including S (four) crystals of 2 nm to 1 μm, and crystals having a spherical structure or a polyhedral structure are better than 5 M393799. The heat-radiating heat-dissipating film structure can be spread in a direction toward the second surface 32 by heat and light radiation, and (4) heat radiation _ structure ^ itself heat is radiated to the outside of the substrate by heat radiation, thereby achieving reinforcement The purpose of heat dissipation.
晶 一般而言’本創作熱輻射散_赌構1G中熱触散敎薄膜 的熱輻射機制係與熱輻射散熱薄膜3〇的厚度有關，同時依據所 構成之材料組成的不同而變化。據信，熱輻射散熱_ 3〇的结曰e 體可產生強烈的振盪，可落在熱輻射的頻寬内，比如紅外光，尤曰 其是遠紅外光範I請參閱第二圖，本創作熱輻射散熱薄膜的孰 輪射光譜示意圖。如第二騎示，純射散_膜在等效黑體溫 ^為55〇C時，主要的光譜落在波長4um至16um之間，當然二 思的疋’第二®的光譜只是本創作難射散麟膜的實例並藉以 清楚說明創作的_而已，並義以限定本_的範圍。Crystal In general, the thermal radiation mechanism of the thermal contact film is related to the thickness of the heat radiation film 3 ,, and varies depending on the composition of the material to be formed. It is believed that the thermal radiation _ 3 〇 曰 曰 e body can produce strong oscillations, can fall within the bandwidth of thermal radiation, such as infrared light, especially the far infrared light I see the second picture, this creation Schematic diagram of the enthalpy of the thermal radiation film. As the second ride shows, the pure emission _ film at the equivalent black body temperature ^ 55 〇 C, the main spectrum falls between the wavelengths of 4um to 16um, of course, the second 的 'second ® spectrum is only difficult to create this An example of a smear film is used to clarify the _ of the creation, and to limit the scope of the _.
由於本創作熱輻射散_膜結構的最主要散熱機制，熱輕射 傳播’是不需要任何介質當作媒介物，與—般熱傳導或熱對流受 限於媒介物接觸面積的傳播对完全不同，目此，本創作熱輕射 散熱薄膜結構的散熱效率遠高於傳統的散熱裝置。 例如’备發熱源(圖中未顯示)位於第—圖令的熱輻射散熱薄膜 30上％ φ於發熱源係以熱傳導方式將熱傳遞至熱#射散熱薄膜 及v、下方的基板20，使得穩定狀態下的發熱源、熱輻射散熱薄 膜3〇及基板20可保持在一高溫，或由上而下形成溫度梯度，亦 即發熱源的溫度大於熱輻射散熱細3G的溫度，而熱輻射散熱薄 膜3〇的ant度大於基板2〇的溫度。假設第—物件位於熱輻射散熱 薄膜30上方的某-位置，而第二物件位於基板2()下方的某一位 置’且第-物件至熱輻射散熱細3G的蹄等於第二物件至基板 6 M393799 20的距離，此時’可量_第二物件的 又门於苐一物件的溫度 且第-物件私皿度也高於發熱源的溫度。依據物理學的敎傳原 理，熱量無法藉她料或熱職㈣低溫㈣溫_，因此， 本創作触射散熱_結構駐要熱傳播方式不賴傳導或續 一，摘作的_在於提供以熱輻射為主要熱傳播方式的 熱輻射散熱賴，可顧於任何發熱源，並對發鱗進行高效率Due to the most important heat dissipation mechanism of the heat radiation scatter film structure, the thermal light radiation propagation does not require any medium as a medium, and the heat transfer or heat convection is completely different from the propagation of the contact area of the medium. Therefore, the heat dissipation efficiency of the heat-spraying heat-dissipating film structure of the present invention is much higher than that of the conventional heat sink. For example, a heat source (not shown) is located on the heat radiation heat dissipating film 30 of the first embodiment. The heat source transmits heat to the heat radiation film and the lower substrate 20 in a heat conduction manner. The heat source in the steady state, the heat radiation heat dissipation film 3 and the substrate 20 can be maintained at a high temperature, or a temperature gradient is formed from top to bottom, that is, the temperature of the heat source is greater than the temperature of the heat radiation heat sink 3G, and the heat radiation heats up. The ant of the film 3〇 is greater than the temperature of the substrate 2〇. It is assumed that the first object is located at a certain position above the heat radiation heat dissipation film 30, and the second object is located at a position below the substrate 2 () and the hoof of the first object to the heat radiation heat dissipation thin 3G is equal to the second object to the substrate 6 The distance of M393799 20, at this time 'quantity _ the second object's door is at the temperature of the object and the first object is also higher than the temperature of the heat source. According to the rumor principle of physics, heat can not be borrowed from her materials or hot jobs (4) low temperature (four) temperature _, therefore, the creation of the heat radiation _ structure station heat transmission mode is not good or continuous, the _ is to provide heat Radiation is the main heat transfer method of heat radiation, which can take care of any heat source and high efficiency of scales.
本創作的另—特點在於鋪射散熱薄膜的熱輛射具方向性， 亦即熱輻射係朝向基板的方向進行。 以上所述者僅為用以解釋本創作之較佳實施例，並非企圖據以 本創作做任何形式上之關，是以，凡有在相同之創作精神下所作有 關本創作之任何修飾或變更，冑減包括在本_意、_護之範嘴。 【圖式簡單說明】 第一圖為本創作熱輻射散熱薄膜結構的示意圖。Another feature of the present invention is the directionality of the heat-emitting device that spreads the heat-dissipating film, that is, the direction in which the heat radiation is directed toward the substrate. The above description is only for explaining the preferred embodiment of the creation, and is not intended to be in any form related to the creation of the creation, so that any modification or change related to the creation in the same creative spirit is made. , the reduction is included in the mouth of this _ meaning, _ guardian. [Simple description of the diagram] The first figure is a schematic diagram of the structure of the heat radiation film.
而是熱輻射 因此 的散熱 第二圖為本創作熱輻射散熱薄膜的熱輻射光譜示意圖。 【主要元件符號說明】 10熱輻射散熱薄膜結構 20基板 30熱輻射散熱薄膜 31第一面 32第二面 R熱輻射 7It is the heat radiation and therefore the heat dissipation. The second figure is a schematic diagram of the thermal radiation spectrum of the heat radiation film. [Main component symbol description] 10 heat radiation heat dissipation film structure 20 substrate 30 heat radiation heat dissipation film 31 first side 32 second side R heat radiation 7