五、新型說明： 【新型所屬之技術領域】 本創作是有關於一種基板結構，且特別是有關於一種 具'有較佳可靠度的基板結構。 【先前技術】 —般的液晶面板（liquid crystal panel)主要是由兩片 基板以及一配置於二基板之間的液晶層所構成。不論是主 動矩陣式液晶顯示器或者是被動矩陣式液晶顯示器，兩片 基板上都必須具有配向膜（alignment layer )。配向膜的主 要功能在於對液晶分子進行配向，以使液晶分子在兩片基 板之間呈現扭轉的現象。一般而言，配向膜可用印刷方式 或其他方式形成，其中以印刷方式形成配向膜的製程主要 包括配向膜印刷以及配向處理兩部份。在配向膜印刷的步 驟中’通常是藉由印刷設備將聚醯亞胺（p〇lyimide)製作 於基板上’而在配向處理的步驟中是以定向摩擦（mbbing) 的方式進行配向處理。 於配向膜印刷後，通常會將印刷後的基板送入配向膜 檢測機中，利用灰階晝面來檢測配向膜是否有精確地印刷 =基板的預定印刷區内。然而，由於中小尺寸的面板開發， ^位面積_面板數量大增，因此檢測人員需耗費較多的 時間來進行檢測且會降低檢測精準度。此外，由於配向膜 檢測機只能麟配向膜衫完全覆蓋預定印砸，、但無法 判斷配向膜是否偏印至基板上的預定框轉與印刷於預定 M392975 框膠區中的料亞胺量’如此—來，則會影響後續基板透 過框膠進行組裝時的組裴良率。 【新型内容】 本創作提供一種基板結構，用以改善習知之缺陷，以 提高可靠度。 本創作提供一種基板結構，其包括一基板以及一膜 層。基板具有至少一圖案標記、至少一圖案區以及一環繞 圖案區的週邊區。圖案標記配置於週邊區。膜層配置於基 板上，且膜層具有至少一開口、至少一有效圖案以及至少 一環繞有效圖案配置的虛置圖案。膜層的開口暴露出基板 的圖案標記。膜層的有效圖案位於基板的圖案區且與圖案 區重疊。膜層的虛置圖案位於基板的週邊區且與週邊區部 分重疊。 在本創作之一實施例中，上述之基板的圖案標記的至 少一邊緣與圖案區的至少一側緣實質上切齊。 在本創作之一實施例中，上述之臈層的有效圖案的面 積大於基板的圖案區的面積，且有效圖案完全覆蓋圖案區。 在本創作之一實施例中’上述之膜層的有效圖案的邊 緣與虛置圖案的邊緣實質上切齊。 在本創作之一實施例中，上述之基板包括一主動元件 陣列基板（Active device array substrate )或一彩色濾光基 板（ColorFilter Substrate)。 在本創作之一實施例中，上述之膜層包括一配向膜。 實_中’上述之基板的圖案標記包括V. New description: [New technical field] The present invention relates to a substrate structure, and in particular to a substrate structure having a better reliability. [Prior Art] A general liquid crystal panel is mainly composed of two substrates and a liquid crystal layer disposed between the two substrates. Whether it is an active matrix liquid crystal display or a passive matrix liquid crystal display, an alignment layer must be provided on both substrates. The main function of the alignment film is to align the liquid crystal molecules so that the liquid crystal molecules are twisted between the two substrates. In general, the alignment film can be formed by printing or other means, wherein the process of forming the alignment film by printing mainly includes alignment film printing and alignment processing. In the step of alignment film printing, "ply-imimide is usually formed on a substrate by a printing apparatus", and in the step of the alignment treatment, alignment treatment is performed in a direction of mbbing. After the alignment film is printed, the printed substrate is usually fed into the alignment film inspection machine, and the gray-scale surface is used to detect whether the alignment film is accurately printed = the predetermined printing area of the substrate. However, due to the development of small and medium-sized panels, the number of the panel area is greatly increased, so the inspectors need to spend more time to perform the inspection and reduce the detection accuracy. In addition, since the alignment film inspection machine can only completely cover the predetermined print with the film, it is impossible to judge whether the alignment film is offset to the predetermined frame on the substrate and the amount of imine printed in the predetermined M392975 frame seal area. In this way, it will affect the stacking yield of the subsequent substrate through the assembly of the sealant. [New Content] This creation provides a substrate structure to improve the known defects to improve reliability. The present invention provides a substrate structure comprising a substrate and a film layer. The substrate has at least one pattern mark, at least one pattern area, and a peripheral area surrounding the pattern area. The pattern mark is disposed in the peripheral area. The film layer is disposed on the substrate, and the film layer has at least one opening, at least one effective pattern, and at least one dummy pattern disposed around the effective pattern. The opening of the film exposes the pattern marks of the substrate. The effective pattern of the film layer is located in the pattern area of the substrate and overlaps the pattern area. The dummy pattern of the film layer is located in the peripheral region of the substrate and overlaps the peripheral portion. In one embodiment of the present invention, at least one edge of the pattern mark of the substrate is substantially aligned with at least one edge of the pattern area. In one embodiment of the present invention, the area of the effective pattern of the germanium layer is larger than the area of the pattern area of the substrate, and the effective pattern completely covers the pattern area. In one embodiment of the present invention, the edge of the active pattern of the film layer described above is substantially aligned with the edge of the dummy pattern. In an embodiment of the present invention, the substrate comprises an active device array substrate or a color filter substrate. In an embodiment of the present invention, the film layer comprises an alignment film. The pattern mark of the above substrate is included
在本創作之—______ 一 S 數予、文字、符號、圖案或其組合 括二作之圓―形實施::形=層的開，狀包 層。種基板結構，其包括—基板以及—膜 基板具有至少—圖案標記、至少—圖無以及—扣 =區的週邊區。圖案標記配置於週邊區。膜層配置於= —戸:且膜層具有至少—開口、至少.一有效圖案以及至.少 展、、有效圖案配置的虚置圖案。膜層的開口未暴露出基 板=圖案標記。膜層的有效圖案位於基板的圖案區且與圖 案區至少部分重疊。膜層的虛置圖案位於基板的週邊區且 與週邊區部分重疊。 在本創作之一實施例中，上述之基板的圖案標記的至 少一邊緣與圖案區的至少一側緣實質上切齊。 在本創作之一實施例中，上述之膜層的有效圖案的面 積大於基板的圖案區的面積。 在本創作之一實施例中’上述之基板包括一主動元件 陣列基板（Active device array substrate)或一彩色濾光基 板（Color Filter Substrate) 〇 在本創作之一實施例中，上述之膜層包括一配向膜。 在本創作之一實施例中，上述之基板的圖案標記包括 數字、文字、符號、圖案或其組合。 在本創作之一實施例中，上述之膜層的開口的形狀包 括矩形、方形、圓形、橢圓形或其組合。 M392975 a基於上述，由於本創作之基板結構是透過膜層的開口 是否暴露基板的圖案標記來判定膜層是否偏離預定位二口 因此檢測人員可經由簡單的目視方式來快速判斷是 整塗佈裝置部分構件的相對位置，可藉此提高後續制= 效率與準確率。如此—來，本創作之基板結構可伟 的可靠度。 一男平又佳 為讓本創作之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 、 【實施方式】 圖1為本創作之一實施例之一種基板結構的局部俯視 示意圖。請先參考圖1，在本實施例中，基板結構1〇〇a包 括一基板110a以及一膜層i20a。 詳細來說，基板ll〇a具有至少一圖案標記U2a (圖 1中僅示意地繪示一個）、至少一圖案區114a (圖1中僅 示意地繪示一個）以及一環繞圖案區114a的週邊區n6a。 特別是’本實施例之圖案標記112a配置於週邊區U6a， 且圖案標記112a的至少一邊緣與圖案區n4a的至少一側 緣實質上切齊。 在本實施例中’基板ll〇a例如是一主動元件陣列基 板（Active device array substrate )或一彩色濾光基板（Color Filter Substrate)。圖案標記U2a例如是數字、文字、符 號、圖案或其組合。此處之圖案標記112a是以一直線圖案 為例說明’但本技術領域具通常知識者也能夠可想而知將 M392975 上述之圖案標記112&的形態以—其他形態代替使用。 基板結構l〇0a的膜層120a配置於基板u〇a上且膜 層12〇a具有至少一開口 122a (圖1中僅示意地繪示一、 個）、至少一有效圖案12乜（圖i中僅示意地繪示一個） 以及至少—環繞有效圖案124a配置的虛置圖案126a(圖1 中僅不意地繪示三個），其中有效圖案124a的邊緣與虛置 圖案126a的邊緣實質上切齊。特別是，膜層12〇&的開口 122&對應暴露出基板110a的圖案標訖112a，且膜層i2〇a 的有效圖案124a位於基板ll〇a的圖案區U4a且與圖案區 114a重疊，而膜層12〇a的虛置圖案12如位於基板ii〇a 的週邊區116a且與周邊區116a部分重疊。 在本貫施例中，膜層12〇a例如是一配向膜，其是由 聚醯亞胺（P〇lyimide)固化所構成。膜層12〇a之有效圖 案124a的面積大於基板11〇&之圖案區U4a的面積，且有 效圖案124a完全覆蓋圖案區114a。此外，開口 i22a的形 狀例如是矩形、方形、圓形、橢圓形或其組合。此處之開 口 122a的形狀是以矩形為例說明，但本技術領域具通常知 識者也能夠可想而知將上述之開口 122a的形態以一其他 形態代替使用。 以下將介紹本實施例之基板結構l00a的製作方法， 但本創作之製作方式並不限於以下所說明的實施例。 圖2A至圖2D是依照本創作之實施例所繪示之基板 結構的製作流程圖。首先，請先參考圖2A與圖2B，提供 一母板110於一塗佈裝置1〇的一承載器2〇上，其中母板 7 M392975 上已具有多個基板ll〇a，而每一基板110a上已具有至 )圖案標記112a (圖2B中僅示意地缯示一個）、至少 —圖案區114a (圖2B中僅示意地繪示一個）以及一環繞 圖案區114a的週邊區116a。在本實施例中，塗佈裝置10 疋由承載器20、一第一轉印輪30、一承靠第一轉印輪3〇 的第—轉印輪40、一位於第一轉印輪3〇上方的塗佈溶液 供應器50以及一覆蓋於第二轉印輪4〇上的轉印板6〇所構 成。 當進行塗佈作業時，塗佈溶液供應器50會供應一液 體L ’例如是一聚醯亞胺（p〇iyimide, ρι)溶液，於第一轉 印輪30上，且第一轉印輪30會透過旋轉與配合其上之一 上刮刀32與一下刮刀34而將液體[均勻地轉移至第二轉 印輪40上。此時，包覆於第二轉印輪4〇上的轉印板6〇 會接受來自第一轉印輪30上的液體l，並透過第二轉印輪 40的轉動而將轉印板60上的液體l轉印至母板no上。 一般來說，基板ll〇a之圖案區114&所需印製的圖案 是由轉印板60來決定。因此，可透過凸版型態或凹版型態 的轉映板60將所需之圖案轉印至基板u〇a的圖案區 114a。 詳細來說，請同時參考圖2A與圖2C，本實施例之轉 印板60例如是以一凸版形態來轉印圖案，其中轉印板6〇 上具有一至少一開口圖塊62、至少一有效圖塊64以及至 少一環繞有政圖塊64配置的虛置圖塊66。值得一提的是， 轉印板60上的虛置圖塊66可提供轉印板6〇於印刷時具有 較為平均的印刷張力，可增加轉印板60的使用壽命。 於印刷過程時’較佳地’轉印板60上的有效圖塊64 會印刷於基板ll〇a的圖案區U4a，且轉印板6〇上的虛置 圖塊66會印刷於基板11〇a的周邊區，而轉印板6〇上的開 口圖塊62會對應基板i10a的圖案標記U2a。 於印刷後，請參考圖2D，基板ll〇a上會形成一膜層 120a’其中此膜層12〇a為液體l固化後所形成。詳細來說， $於基板ll〇a上之膜層12.0a具有暴露出基板u〇a之圖案 標記112a的一開口 122a，一位於基板ii〇a的圖案區114a 且與圖案區114a重疊的有效圖案124以及一位於基板 ll〇a的週邊區U6a且與周邊區116a部份重疊的虛置圖案 126a。至此，已完成基板結構1〇〇a的製作。 當基板結構100a之膜層120a的開口 122a精確地暴露 出基板110a的圖案標記112a時，檢測人員可由此快速得 知轉印的過程中精確度無離異。 當然，於印刷過程中，亦可能會產生印刷偏移的現 象。舉例來說，請參考圖2E，基板結構100b之膜層120b 的開口 122b並未暴露出基板110b的圖案標記U2t)，此處 之圖案標s己112b落於開口 122b的上方。檢測人員由此現 象可得知膜層120b的有效圖案124b離基板110b的圖案區 114b過遠’即表示膜層i2〇b已覆蓋超過基板ll〇b上之預 定框膠區（未繪示）之中心線（未繪示）的位置。因此， 檢測人員可調整下一塊基板（未繪示）或第二轉印輪4〇 相對於下一塊基板的位置’來提高下一塊基板的印刷精確 M392975 度。 再者’凊參考圖2F ’基板結構100c之膜層120c的開 口 122〇並未暴露出基板110c的圖案標記ii2c，此處之圖 f標記U2C落於開口 122c的下方。檢測人員由此現象可 付知膜層12〇c的有效圖案124c離基板n〇c的圖案區u牝 過近’即表錢續减絲^時，成品將核光之疑慮。 因此’檢測人員可調整下一塊基板（未繪示）或第二轉印 輪4〇相對於下—塊基板的位置，來提高下-塊基板的印刷 精確度。 β综上所述，由於本創作之基板結構是透過膜層的開口 是否暴露基板的圖案標記來欺膜層是否偏離預定位置， 因此檢測人員可經㈣單的目視方式來快速觸是否需調 整塗佈襄置部分構件_對位置，可藉此提高後續製程的 確率。如此—來，本創作之基板結構可具有較佳 的可Λ度。 雖然本創作已以實施例揭露如上，然其並非用以限定 任何所屬技術領域中具有通f知識者，在不脫離 =作之精神和範圍内，當可作⑽之更動與潤飾，故本 ]作之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 示意Ξ ί為本辦之—實施例之—縣板結_局部俯視 圖2Α至圖2D是依照本創作之實施例所 、、、。構的製作流程圖。 a不之基扳 M392975 圖2E為本創作之另一實施例之一種基板結構的局部 俯視不意圖。 圖2F為本創作之又一實施例之一種基板結構的局部 俯視示意圖。 【主要元件符號說明】 10 :塗佈裝置 20 :承載器 30 :第一轉印輪 32 :上刮刀 34 :下刮刀 40 :第二轉印輪 50 :塗佈溶液供應器 60 :轉印板 62 :開口圖塊 64 :有效圖塊 66 :虛置圖塊 100a、100b、100c :基板結構 110 :母板 110a、110b、110c :基板 112a、112b、112c :圖案標記 114a、114b、114c :圖案區 116a、116b、116c :週邊區 120a、120b、120c :膜層 122a、122b、122c :開口 124a、124b、124c :有效圖案 126a、126b、126c :虛置圖案 L :液體In this creation—the ______-S number, the text, the symbol, the pattern, or a combination thereof, consists of a circle-shaped implementation:: shape = layer opening, shape cladding. A substrate structure comprising a substrate and a film substrate having at least a pattern mark, at least a picture, and a peripheral region of the buckle region. The pattern mark is disposed in the peripheral area. The film layer is disposed at = - 戸: and the film layer has at least - an opening, at least an effective pattern, and a dummy pattern to a lesser, effective pattern configuration. The opening of the film layer did not expose the substrate = pattern mark. The effective pattern of the film layer is located in the pattern area of the substrate and at least partially overlaps the pattern area. The dummy pattern of the film layer is located in the peripheral region of the substrate and partially overlaps the peripheral region. In one embodiment of the present invention, at least one edge of the pattern mark of the substrate is substantially aligned with at least one edge of the pattern area. In one embodiment of the present invention, the area of the effective pattern of the film layer is larger than the area of the pattern area of the substrate. In one embodiment of the present invention, the substrate includes an active device array substrate or a color filter substrate. In one embodiment of the present invention, the film layer includes An alignment film. In one embodiment of the present invention, the pattern marks of the substrate described above include numbers, characters, symbols, patterns, or a combination thereof. In an embodiment of the present invention, the shape of the opening of the film layer described above includes a rectangle, a square, a circle, an ellipse or a combination thereof. M392975a is based on the above, since the substrate structure of the present invention determines whether the film layer deviates from the predetermined position by whether the opening of the film layer exposes the pattern mark of the substrate, so that the detecting person can quickly judge the coating device by a simple visual method. The relative position of some components can be used to improve follow-up = efficiency and accuracy. In this way, the substrate structure of this creation can be highly reliable. The above features and advantages of the present invention will become more apparent and easy to understand. The following detailed description is given in conjunction with the accompanying drawings. [Embodiment] FIG. 1 is a partial plan view showing a structure of a substrate according to an embodiment of the present invention. Referring first to FIG. 1, in the embodiment, the substrate structure 1A includes a substrate 110a and a film layer i20a. In detail, the substrate 11a has at least one pattern mark U2a (only one is schematically shown in FIG. 1), at least one pattern area 114a (only one is schematically shown in FIG. 1), and a periphery of a surrounding pattern area 114a. District n6a. In particular, the pattern mark 112a of the present embodiment is disposed in the peripheral area U6a, and at least one edge of the pattern mark 112a is substantially aligned with at least one side edge of the pattern area n4a. In the present embodiment, the substrate 11a is, for example, an active device array substrate or a color filter substrate. The pattern mark U2a is, for example, a number, a letter, a symbol, a pattern, or a combination thereof. Here, the pattern mark 112a is described by taking a straight line pattern as an example. However, those skilled in the art can also imagine that the pattern of the above-mentioned pattern mark 112 & M392975 can be used instead of other forms. The film layer 120a of the substrate structure 10a is disposed on the substrate u〇a and the film layer 12a has at least one opening 122a (only one is schematically shown in FIG. 1), at least one effective pattern 12乜 (Fig. i Only one) and at least the dummy pattern 126a disposed around the effective pattern 124a (only three are unintentionally shown in FIG. 1) are illustrated, wherein the edge of the effective pattern 124a is substantially cut from the edge of the dummy pattern 126a. Qi. In particular, the opening 122& of the film layer 12& corresponds to the pattern mark 112a of the substrate 110a, and the effective pattern 124a of the film layer i2a is located in the pattern area U4a of the substrate 11a and overlaps the pattern area 114a. The dummy pattern 12 of the film layer 12a is located, for example, on the peripheral region 116a of the substrate ii 〇a and partially overlaps the peripheral region 116a. In the present embodiment, the film layer 12a is, for example, an alignment film which is formed by curing of P〇lyimide. The area of the effective pattern 124a of the film layer 12a is larger than the area of the pattern area U4a of the substrate 11& and the effective pattern 124a completely covers the pattern area 114a. Further, the shape of the opening i22a is, for example, a rectangle, a square, a circle, an ellipse or a combination thereof. Here, the shape of the opening 122a is exemplified by a rectangular shape, but it is also conceivable for those skilled in the art to use the above-described shape of the opening 122a in a different form. The method of fabricating the substrate structure 100a of the present embodiment will be described below, but the manner of fabrication of the present invention is not limited to the embodiments described below. 2A-2D are flow diagrams showing the fabrication of a substrate structure in accordance with an embodiment of the present invention. First, referring to FIG. 2A and FIG. 2B, a motherboard 110 is provided on a carrier 2 of a coating device 1 , wherein the motherboard 7 M392975 has a plurality of substrates 11 〇 a, and each substrate 110a has a pattern mark 112a (only one is schematically shown in Fig. 2B), at least - a pattern area 114a (only one is schematically shown in Fig. 2B) and a peripheral area 116a surrounding the pattern area 114a. In the present embodiment, the coating device 10 is provided by the carrier 20, a first transfer wheel 30, a first transfer wheel 40 that bears against the first transfer wheel 3, and a first transfer wheel 3. The coating solution supply 50 above the crucible and a transfer sheet 6〇 covering the second transfer wheel 4〇 are formed. When the coating operation is performed, the coating solution supply unit 50 supplies a liquid L' such as a solution of a polyimine (p〇iyimide, ρι) on the first transfer wheel 30, and the first transfer wheel 30 will uniformly transfer the liquid to the second transfer wheel 40 by rotating and mating one of the upper blade 32 and the lower blade 34. At this time, the transfer sheet 6 包覆 coated on the second transfer wheel 4 〇 receives the liquid 1 from the first transfer wheel 30 and transmits the transfer plate 60 through the rotation of the second transfer wheel 40. The liquid l on the upper side is transferred to the mother board no. In general, the pattern area 114& of the substrate 11a is required to be printed by the transfer sheet 60. Therefore, the desired pattern can be transferred to the pattern area 114a of the substrate u〇a through the relief plate 60 of the relief type or the intaglio type. In detail, please refer to FIG. 2A and FIG. 2C at the same time, the transfer plate 60 of this embodiment transfers the pattern, for example, in a relief form, wherein the transfer plate 6 has an at least one opening block 62, at least one. The valid tile 64 and at least one dummy tile 66 are arranged around the political block 64. It is worth mentioning that the dummy block 66 on the transfer plate 60 can provide the transfer plate 6 with a relatively uniform printing tension when printing, which can increase the service life of the transfer plate 60. During the printing process, 'effectively' the effective tile 64 on the transfer plate 60 is printed on the pattern area U4a of the substrate 11a, and the dummy block 66 on the transfer plate 6 is printed on the substrate 11〇. The peripheral area of a, and the opening block 62 on the transfer sheet 6〇 corresponds to the pattern mark U2a of the substrate i10a. After printing, referring to Fig. 2D, a film layer 120a' is formed on the substrate 11a, wherein the film layer 12a is formed after the liquid 1 is solidified. In detail, the film layer 12.0a on the substrate 11a has an opening 122a exposing the pattern mark 112a of the substrate u〇a, an effective pattern overlap with the pattern area 114a of the substrate ii〇a and overlapping with the pattern area 114a. The pattern 124 and a dummy pattern 126a which is located in the peripheral region U6a of the substrate 11a and partially overlaps the peripheral region 116a. So far, the fabrication of the substrate structure 1A has been completed. When the opening 122a of the film layer 120a of the substrate structure 100a accurately exposes the pattern mark 112a of the substrate 110a, the examiner can thereby quickly know that the accuracy of the transfer process is not divisible. Of course, printing offsets may also occur during the printing process. For example, referring to FIG. 2E, the opening 122b of the film layer 120b of the substrate structure 100b does not expose the pattern mark U2t) of the substrate 110b, where the pattern mark 112b falls above the opening 122b. The detecting personnel can know that the effective pattern 124b of the film layer 120b is too far from the pattern area 114b of the substrate 110b, which means that the film layer i2〇b has covered the predetermined sealant area on the substrate 11b (not shown). The location of the centerline (not shown). Therefore, the inspector can adjust the position of the next substrate (not shown) or the second transfer wheel 4〇 relative to the next substrate to improve the printing accuracy of the next substrate by M392975 degrees. Further, the opening 122 of the film layer 120c of the substrate structure 100c is not exposed to the pattern mark ii2c of the substrate 110c, and the mark U2C of the figure f is dropped below the opening 122c. The detector can know that the effective pattern 124c of the film layer 12〇c is too close to the pattern area u牝 of the substrate n〇c, that is, when the meter continues to reduce the wire, the finished product will be suspected of nuclear light. Therefore, the inspector can adjust the position of the next substrate (not shown) or the second transfer wheel 4 to the lower substrate to improve the printing accuracy of the lower substrate. As described above, since the substrate structure of the present invention is such that the film layer is exposed to the pattern mark of the substrate to discard whether the layer is deviated from the predetermined position, the inspector can quickly touch the (4) single visual mode to adjust whether or not to adjust the coating. The cloth sets part of the component _ to the position, thereby improving the accuracy of the subsequent process. As such, the substrate structure of the present invention can have better flexibility. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the knowledge of those skilled in the art, and it is possible to make changes and refinements in (10) without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2A to 2D are diagrams in accordance with an embodiment of the present invention. Construction process flow chart. A is not a base plate. M392975 FIG. 2E is a partial plan view of a substrate structure of another embodiment of the present invention. 2F is a partial top plan view of a substrate structure in accordance with still another embodiment of the present invention. [Main component symbol description] 10: Coating device 20: Carrier 30: First transfer roller 32: Upper blade 34: Lower blade 40: Second transfer roller 50: Coating solution supplier 60: Transfer plate 62 Opening block 64: effective block 66: dummy blocks 100a, 100b, 100c: substrate structure 110: mother boards 110a, 110b, 110c: substrates 112a, 112b, 112c: pattern marks 114a, 114b, 114c: pattern area 116a, 116b, 116c: peripheral regions 120a, 120b, 120c: film layers 122a, 122b, 122c: openings 124a, 124b, 124c: effective patterns 126a, 126b, 126c: dummy pattern L: liquid