TWM392314U - LED lamp and heat dissipation device with winding heat pipe thereof - Google Patents

Description

M392314 V. New description: [New technical field] [0001] This creation relates to a lighting device, especially a light-emitting diode lamp and a heat sink with a coiled heat pipe. [Prior Art] [0002] Lighting devices are indispensable important scientific and technological tools for the development of human civilization. People can still recognize the environment and orientation in the absence of light or dark environment. Tungsten lamps are a type of lighting device with tungsten. As a light source, the wire is very simple in structure. The tungsten lamp is transmitted to make the tungsten wire glow and emit light. However, the tungsten wire is easily burned and the service life of the tungsten lamp is too short. [0003] With the continuous advancement of technology, light-emitting diode lamps have been gradually developed. Light-emitting diodes (LEDs) are solid-state light sources that convert electrical energy into light energy, which have small volume, low driving voltage, and fast reaction rate. The characteristics of shock resistance and long life make the LED lamps gradually replace the tungsten lamps and are widely used. [0004] A conventional light-emitting diode lamp includes a lamp cap structure, a lamp cover mounted on the lamp cap structure, and a light-emitting diode module housed inside the lamp cover and attached to the inner bottom wall of the lamp cover, and the light-emitting diode The body module is electrically connected to the lamp head structure, and the lamp cover is usually made of metal. The heat generated when the LED module is operated is transmitted to the metal lamp cover for heat dissipation, but the heat dissipation effect is rather limited. [0005] In addition, in order to increase the illumination range and brightness of the light-emitting diode lamp, the light-emitting diode module usually has a plurality of light-emitting diodes, and with the light-emitting two form number A0101, page 4/23 pages, M392314 pole With the increase in the number of bodies and the development of high-power light-emitting diodes, the heat generated by the operation of the LED module is also rapidly rising. If the heat dissipation cannot be performed in time, the life of the LED lamp will be shortened and the maintenance will be repaired. The cost of use increases. [0006] Therefore, in order to dissipate heat more effectively, most of the heat dissipation fins are usually disposed on the outer periphery of the metal lamp cover, and the heat dissipation fins are used to enhance the heat dissipation effect. However, the heat generated by the LED module must be transmitted to the lower portion of the lampshade. Then, it is conducted from the lower part of the lamp cover to the lower part of the heat dissipation fin and the upper part of the lamp cover, and then is conducted to the upper part of the heat dissipation fin by the upper part of the lamp cover and the lower part of the heat dissipation fin, and has a long conduction path, a slow heat conduction rate, and non-uniform heat conduction, and heat is easily accumulated in the lamp cover. The lower part, the heat is not evenly distributed, two; unable to charge >#1^" deer number hot fins ## I _ powerful heat dissipation function. .3⁄4 ... [0007] In view of this, the creator has focused on the above-mentioned prior art, and has devoted himself to researching and using the theory to try to improve and enhance the performance, and finally to propose a design that is reasonable and effective. • r ·· < ? [New Content] [0008] One of the purposes of this creation is to provide a heat sink with a coiled heat pipe that can shorten the heat conduction path, accelerate the heat transfer rate, and distribute heat quickly and evenly. The heat is transmitted to the heat dissipating fins to improve the heat dissipation efficiency. [0009] In order to achieve the above object, the heat sink with the coiled heat pipe includes: [0010] a heat conducting base; [0011] a heat sink fin group, A plurality of heat dissipating fins are arranged in a radial arrangement, and a central hole for inserting the heat conducting base and a receiving space on a side of the central hole are formed in the center of the heat dissipating fins, and the heat is dissipated in the heat dissipating fins Form No. A0101, page 5 of 23, M392314, an annular groove is formed on the inner side of the fin to communicate with the receiving space; and [0012] at least one of the wound heat pipes includes an evaporation in thermal contact with the thermally conductive base a segment, and a condensation section embedded along the annular groove and in thermal contact with each of the heat dissipation fins. [0013] Another object of the present invention is to provide a light-emitting diode lamp capable of shortening a heat conduction path Speed up heat conduction And the heat is quickly and uniformly distributed to the heat dissipating fins to improve the heat dissipation efficiency. [0014] In order to achieve the above object, the light emitting diode lamp includes: [0015] heat dissipation of a wound heat pipe The device includes: [0016] a heat-dissipating susceptor; [0017] a heat-dissipating fin group comprising a plurality of heat-dissipating fins arranged in a radial arrangement, the heat-dissipating fins being respectively connected to the heat-conducting pedestal, and the heat-dissipating fins Forming a receiving space in the center of the sheet; and [0018] at least one wound heat pipe comprising an evaporation section in thermal contact with the heat conducting base, and being wound in a thermal contact with each of the heat radiating fins a condensing section; [0019] a light emitting diode module disposed in the accommodating space and attached to the side of the heat conducting base and the evaporation section; and [0020] a base structure disposed on the heat conducting base The other side of the socket is electrically connected to the LED module. [0021] Compared with the prior art, the present invention has the following effects: [0022] Most of the heat dissipation fins arranged in a radial arrangement surround the LED Module, Form No. A0101 Page 6 of 23 M392314 has the function of lampshade and good heat dissipation function. [0023] With the powerful and rapid heat conduction function of the heat pipe itself, the coiled heat pipe can quickly transfer the heat generated by the operation of the LED module through heat conduction. The pedestal is conducted to all areas of the heat dissipation fins to prevent heat from accumulating in a part of the heat dissipation fins, which can shorten the heat conduction path, accelerate the heat conduction speed, and evenly distribute the heat on the heat dissipation fins to achieve full utilization of heat dissipation. A powerful heat dissipation function for all heat dissipation areas of the fins. [0024]

While the powerful heat dissipation function of the heat sink fins is exerted, the working fluid in the coiled heat pipe can also be quickly condensed back into a liquid state in the condensation section [0025] flowing back to the evaporation section to make the coiled heat rise β The creation of the heat generated by the __,##光d榇 module with a coiled heat pipe is timely and effective, so that the LED module operates at an appropriate operating temperature. It can extend its service life, improve lighting efficiency, and increase the economics and practicality of LEDs.

[Embodiment] »»····. -I The detailed description and technical content of this creation will be described in conjunction with the drawing, such as -.. i, however, the drawings are for illustrative purposes only, not for use. Limit this creation. [0027] The present invention relates to a heat sink with a coiled heat pipe. Referring to the first to third figures, the heat sink 1 includes a heat conductive base 100, a heat sink fin set 200, and at least one Winding heat pipe 300. [0028] The heat-conductive pedestal 100 is made of a material having good thermal conductivity, and may be a metal, such as copper or aluminum. However, without limitation of the materials, a recess 110 is formed on one side of the heat-conductive susceptor 100. The other side of the thermal base 100 is provided with a form number A0101, page 7 / 23 pages, M392314, a slot 1 2 0. [0029] The heat dissipation fin assembly 200 includes a plurality of heat dissipation fins 210 arranged in a radial arrangement, and the heat dissipation fins 210 are integrally combined by fastening, soldering, bonding, screwing, etc., to avoid heat dissipation fins. The 210 is scattered and dropped, but is not limited by the combination means. The heat dissipation fins 210 are made of a material having good thermal conductivity, and may be metal, such as copper, aluminum, etc., but are not limited by these materials. A central hole 220 is formed in the center of the heat dissipating fins 210, and the inner lower portion of the heat dissipating fins 210 is formed around a central hole in which the heat conducting base 100 is embedded. In 22.0, the inner lower portions of the heat dissipation fins 210 are respectively connected to the outer circumference of the heat conduction base 100. [0031] Further, a receiving space 230 is formed in the center of the heat dissipating fins 210 at the side of the central hole 220, that is, the inner upper portion of the heat dissipating fins 210 is integrally formed around the central hole 220. The accommodating space 230, the slot 110 is connected to the accommodating space 230, and the slot 120 is formed on the side of the heat conducting base 10 0 outside the accommodating space 230. [0032] An annular groove 211 is formed in the upper portion of the inner side of the heat dissipation fins 210. Further, for example, a gap is formed in the inner upper portion of each of the heat dissipation fins 210. The notches are connected in series to form the annular groove 211. [0033] Further, a plurality of ridges 212 are formed on the outer side of each of the heat dissipation fins 210. Further, each of the ridges 212 is formed on a side of each of the heat dissipation fins 210 located outside the accommodating space 230, which can increase the heat dissipation fins. The heat dissipation surface area of the sheet 210 has a protective effect to prevent the user from being cut by the edge of the heat dissipation fin 210. Form number Α0101 Page 8 of 23 M392314

[0036]

The structure of the coiled heat pipe 300 is known in the art. It is embedded in the annular groove 211, that is, connected to the inner upper portion of each of the heat dissipation fins 210 in a wound shape. [0035] The connection relationship is described in detail. The end of the wound heat pipe 300 is embedded in the slot 110, that is, the slot 110 is embedded in the end of the winding heat pipe 300, and the end of the coiled heat pipe 300 is thermally conductive. The base 100 has a flat configuration, that is, the winding heat pipe 300 is not protruded from the surface of the heat conductive base 100, and the wound heat pipe 300 is a mussel IJ ship (four), and is wound around the ringing 211 Heat pipe 3||Things-^ service. Further, the winding type heat pipe 300 includes a vaporization section 310, a transmission section 320, and a condensation section 330, an evaporation section 310, a transmission section 320, and a condensation section 330 which are sequentially formed. In order to be disposed in the accommodating space 230, the evaporating section 310 is embedded in one side of the recessed groove 110 and connected to the heat conducting pedestal 100, and the illuminating base 100 is in a flat configuration and in thermal contact with the heat conducting pedestal 100, and the transmitting section 32D And the condensation section 330 is respectively embedded along the annular groove 211 and is wound up in a winding shape to be in thermal contact with the inner upper portion of each of the heat dissipation fins 210. [0037] The coiled heat pipe 300 further includes a heat transfer medium 340 ° coated between the evaporation section 310 and the heat conductive base 100, and between the condensation section 330 and the heat dissipation fins 210. [0038] In addition, the heat sink 1 can be Furthermore, the other winding heat pipe 300 having the same winding direction as the wound heat pipe 300 is arranged, and the pair of condensation sections 330 are arranged in a stacked manner, and the heat energy can be evenly distributed to the heat radiating fins on page 9 of 23 The entire area of the sheet 210, and the evaporation section 310 of the wound heat pipe 300, respectively, thermally contact the heat conducting base 丨00' to make the heat conduction area larger, thereby improving the heat dissipation efficiency. [0039] Alternatively, the heat sink 1 may further include another winding heat pipe 300 having a winding direction different from that of the wound heat pipe 3, which can shorten the heat conduction path and accelerate the heat conduction speed 'and the pair of condensation sections 330 are stacked The arrangement is such that the heat can be distributed to the entire area of each of the heat dissipation fins 210, and the evaporation section 310 of the wound heat pipe 3〇〇 is in thermal contact with the heat conduction base 1 ′, respectively, so that the heat conduction area is larger. And improve heat dissipation efficiency. [0040] This creation is more related to a light-emitting diode lamp, please refer to the fourth to sixth figures, the lamp 2 includes a winding type, heat pipe heat sink 1, a light-emitting diode module 400, a lens 500, a reflector 600, a light transmissive cover 700, a support guard ring 8〇〇, and a base structure. [0041] The structural composition of the heat sink 1 is as described above, and therefore will not be further described herein. [〇〇42] The LED module 400 is disposed in the receiving space 23〇 and is attached to the heat conducting base 10 0 side and the winding heat pipe 3 〇〇 end, due to the evaporation section 31 〇 and the heat conducting base The light-emitting diode 310 and the heat-conducting base 1 can be flatly attached by the light-emitting diode module 400. Further, the light-emitting diode module 400 includes a circuit board 41. And a plurality of light-emitting diodes 420 disposed on the side of the circuit board 410 and electrically connected to the electronic circuit of the circuit board 41 (). [〇_电路板41〇other-side is attached to the heat-conductive base 1〇〇 side and the thermal contact-wound heat pipe 300-end, that is, the thermal contact evaporation section 31〇, when the light-emitting diode 420 operates The heat can be transferred to the heat transfer base 1〇〇 and the evaporation section 3i of the coiled heat pipe 300 via the circuit board 41, and the heat transfer base 100 is transferred from the heat transfer base 100 to the heat transfer base 100. The heat is transmitted to the lower portion of each of the heat-dissipating heat-sinks, and the heat is transferred from the wound heat pipe 300 to the upper portion of each of the heat-dissipating heat pipes 300 for heat dissipation. In addition, between the circuit board 41A and the heat conductive base (10), and between the circuit board 41A and the bell heat pipe 300, an insulating layer (not shown) is interposed to avoid the electronic circuit of the circuit board 410. A short circuit occurs. [0045] The lens 50G is disposed in the space (4) 0 and surrounded by the winding heat (four) ,, the lens 500 covers the illuminating diode module gamma, that is, disposed on the side of the circuit board 410-- and covers each of the illuminating diodes; ^缉狄〇 is a point light source used to emit the light emitting diode 420

[0046] The reflector 600 is disposed around the housing space heat pipe 300, and the reflector 600 is disposed on the side of the lens 500 for

[0047] The light emitted by the polar body 420 is reflected to the outside of the lamp 2, and also has a projected effect field A ^ , v .. ^ ~.- Stay 0 f :丄•Ί.+ "·''' \ ·〆. The light-transmitting cover 700 is connected to the inner top of each of the heat-dissipating components 210 and seals the accommodation space 230. The light-transmitting cover 700 allows the light emitted by each of the light-emitting diodes 420. The light-transmitting cover 700 is mainly used to prevent foreign matter from entering the accommodation space 230 to prevent the LED module 400 from being damaged. [0048] The support guard ring 800 is mounted on the outer top of each of the heat dissipation fins 210. Further, the support guard ring 800 is mounted on one side of each of the heat dissipation fins 210 located outside the receiving space 230. The support guard ring 800 can be strengthened and stabilized. The connection between the heat dissipation sheets 210 and the protective effect are simultaneously formed to prevent the user from being cut by the corner end of the heat dissipation fin 210. Form No. A0101 Page 11 of 23 M392314 [0050] [0058] [0058] The form number A0101 is configured on the other side of the thermally conductive base 100 and is electrically connected to the LED module 400. [0058] For the connection, the structure of the base structure 900 and the manner of electrically connecting the LED module 40 are well known, and will not be repeated here. The base structure 900 is inserted into the slot 120, and the base structure 900 and the heat-conductive base 100 can be fastened, soldered, glued, screwed, etc., but the combination is not limited by these combinations. After the structure 900 is mounted on the external lamp holder, the LED module 400 can be powered. In summary, this creation has industrial utilization, novelty and progress, fully conforms to the patent application requirements, and applies for the patent law. Of course, this creation can have many other embodiments, without departing from the spirit of this creation. In the case of its essence, the technicians who are familiar with the 'domain': when various changes and deformations can be evolved according to this creation, but the corresponding changes and deformations should belong to the scope of protection of the patents applied for by this creation. . [Simple description of the diagram] The first figure is an exploded view of the heat sink. The second picture is a three-dimensional combination of the creation of the heat sink. The third figure is a combined sectional view of the present invention regarding the heat sink. The fourth picture is a three-dimensional exploded view of the light-emitting diode lamp. The fifth picture is a three-dimensional combination of the creation of the light-emitting diode lamp. The sixth figure is a combined cross-sectional view of the present invention regarding a light-emitting diode lamp. [Main component symbol description] Heatsink 1 Page 12 of 23 M392314

[0059] Luminaire 2 [0060] Thermal Base 100 [0061] Insert 110 [0062] Slot 120 [0063] Heat Sink Set 200 [0064] Heat Sink 210 [0065] Annular Trench 211 [0066] Convex Pattern 212 [0067] Center hole 2 2 0 [0068] Capacitor space 230 [0069] Winding heat pipe 300 [0070] Evaporation section 310 [0071] Transmission section 320 [0072] Condensation section 330 [0073] Heat transfer medium 340 [ 0074] Light Emitting Diode Module 400 [0075] Circuit Board 410 [0076] Light Emitting Diode 420 [0077] Lens 500

Form No. A0101 Page 13 of 23 M392314 [0078] [0081] Reflector Cover 600 Light Transmitter Cover 700 Support Ring 800 Lamp Head Structure 900 Form No. A0101 Page 14 of 23

Claims (1)

M392314 VI. Patent application scope: 1. A heat sink with a coiled heat pipe, comprising: a heat conducting base; a heat sink fin set comprising a plurality of heat radiating fins arranged radially, on the heat radiating fins a central hole is formed in the center, and a receiving space is disposed on the side of the central hole, and an annular groove is formed on the inner side of the heat dissipating fin to communicate with the receiving space; and a coiled heat pipe comprising an evaporation section in thermal contact with the thermally conductive base, and embedded along the annular groove and in thermal contact with each of the heat dissipation fins a condensation section. As claimed in item 1 of the claim, there is a roll of .3⁄43⁄41, wherein each of the ::η heat sink fins are formed with a plurality of convex uncles 1 on the outer side. The heat sink with a coiled heat pipe according to claim 1, wherein the heat conducting base is provided with a slotted groove 4 that communicates with the receiving space and is embedded in the evaporation section. The heat sink of the winding type heat camp, wherein the evaporation section and the heat conducting base are in a flat configuration. 5. The heat sink with a coiled heat pipe according to claim 1, further comprising another winding heat pipe having the same winding direction as the wound heat pipe, and the pair of condensation sections are arranged in a stacked configuration. 6. The heat sink with a coiled heat pipe according to claim 1, further comprising another winding heat pipe having a winding direction different from the wound heat pipe, and the pair of condensation sections are stacked Configuration. 7. The heat sink with a coiled heat pipe according to claim 1, wherein the coiled heat pipe further comprises a coating between the evaporation section and the heat conducting base, and the 099210388 form number Α0101 15th Page / Total 23 pages 0992031280-0 M392314 A heat transfer medium between the condensation section and the heat sink fins. 8. A light-emitting diode lamp, comprising: a heat sink with a coiled heat pipe, comprising: a heat-conducting base; a heat-dissipating fin set comprising a plurality of heat-dissipating fins arranged radially, the heat-dissipating fins The sheets are respectively connected to the heat conducting base, and a receiving space is formed in the center of the heat dissipating fins; and at least one winding heat pipe includes an evaporation section in thermal contact with the heat conducting base And a condensation section in a coiled shape for thermal contact with each of the heat dissipation fins; a light emitting diode module disposed in the receiving space and attached to the heat conducting base side and the evaporation section And a lamp cap structure disposed on the other side of the heat conducting base and electrically connected to the light emitting diode module. 9. The illuminating diode lamp of claim 8, wherein the thermally conductive base is provided with a slot for the lamp head structure to be inserted. 10. The light-emitting diode lamp of claim 8, wherein the heat-conducting base is provided with a recess for connecting the receiving space and for embedding the evaporation section. The illuminating diode lamp of claim 10, wherein the evaporating section and the thermally conductive pedestal are disposed in a flat configuration. The illuminating diode lamp of claim 8, wherein a central hole is formed in the center of the heat dissipating fins, and the receiving space is located at a side of the central hole. . The illuminating diode lamp of claim 8, wherein the heat dissipating fins are provided with at least one annular groove that communicates with the accommodating space and is embedded in the wraparound heat pipe. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The light-emitting diode lamp of claim 8, further comprising another winding heat pipe having the same winding direction as the wound heat pipe, and the pair of condensation sections are arranged in a stacked configuration. 16. The illuminating diode lamp of claim 8, further comprising another winding heat pipe having a winding direction different from the wound heat pipe, and the pair of condensing sections are arranged in a stacked manner. The illuminating diode illuminator of claim 8, wherein the illuminating diode module comprises a circuit board attached to one side of the thermally conductive base and the evaporation section, and electrically connected to the circuit board. Multiple hair. Light two interesting. worry. u '·*- ys Η - 一 一 . 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 The illuminating diode illuminator of the first embodiment of the present invention, wherein the illuminating diode is further disposed in the accommodating space and surrounded by a coiled heat pipe. The illuminating diode lamp of claim 8, wherein the illuminating device further comprises a supporting guard ring mounted on the outer side of the heat dissipating fins. The light-emitting diode lamp of claim 8, wherein the wound heat pipe further comprises coating between the evaporation section and the heat-conducting base, and between the condensation section and the heat-dissipating fin a heat transfer medium. 0992031280-0 099210388 Form Number A0101 Page 17 of 23