TWM381993U - Improved fin structure of heat sink - Google Patents

Improved fin structure of heat sink Download PDF

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Publication number
TWM381993U
TWM381993U TW99200027U TW99200027U TWM381993U TW M381993 U TWM381993 U TW M381993U TW 99200027 U TW99200027 U TW 99200027U TW 99200027 U TW99200027 U TW 99200027U TW M381993 U TWM381993 U TW M381993U
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TW
Taiwan
Prior art keywords
heat sink
fin
heat dissipation
heat
sink body
Prior art date
Application number
TW99200027U
Other languages
Chinese (zh)
Inventor
Yung-Chieh Lin
Original Assignee
Bestec Power Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bestec Power Electronics Co Ltd filed Critical Bestec Power Electronics Co Ltd
Priority to TW99200027U priority Critical patent/TWM381993U/en
Publication of TWM381993U publication Critical patent/TWM381993U/en

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Description

M381993 五、新型說明: 【新型所屬之技術領域】 本創作係為-種散熱㈣結構改良,尤指—種可排除該熱風回流與新 散熱風流而產生風損,以及減少該散熱風流對主韓片之風切,因而可降低 , 。喿音,且可使雜風由’加速排出,_可加速峨熱板本體散熱之目 的。 【先前技術】 • 按,一般散熱器’請參閱第一圖所示,其主要於該散熱器11設有散熱 本體16 ’該散熱本體16向上延伸設有複數片韓片12,藉由該風扇w出散熱 風流13 ’則可使該鰭片12達到散熱之效能; 該-般散熱器’其雖可達到散熱之效能,而當該風扇丨贿熱風流⑶欠 向_片12a寺,往往因該鰭片12底部與每一鰭片12形成封閉狀,導致該散 熱風流13碰抵該鰭片12底部後形成熱風回流14,而當該風扇i繼續作動吹向 該韓片12時,該散熱風流13碰撞該韓片12而產生風切,因而致使該縛片12 Φ 產生$音’且因熱風回流14而形成風損,又該熱風喊14無法排出,則又 易使錄熱風流13其溫度升高’因而導致散熱效果不佳,再者,該電子元 件15固設於散熱本體16-側時,該散熱本體16向上延伸所設之韓片12置設 於電子元件15上方’因而使該風扇)其散熱風流13無法直接吹至電子元件 15,因此降低散熱效果,故有予再改良之必要; 疋故’如何將上麟缺失加以摒除,即為本賴作人所欲解決之技術 困難點之所在。 3 M381993 【新型内容】 本創作之主要目的即在提供一種散熱鰭片結構改良,其包含: 月欠熱板本體,該散熱板本體係為片狀,又該散熱板本體兩側各延伸 «又有至j/ 一片主鰭片,該主鰭片係與該散熱板本體垂直延接,又該每一主 ’..’曰片至夕側延伸没有至少一片次韓片,該每一次讀片皆與該散熱板本體 呈平行’又該每-次轉片與次則之間具有最大間距; 11由該散熱板本體係為片狀、及該"片與該散熱板本體以垂直設 #置,俾當該風扇作動時,則可使該散熱風流直接從兩兩次雜片間所設之最 大間距即可排_熱朗流與新賴顺而產生風損,以及減少該 散熱風流對域片之風切,因而可降_音,且藉由該每—次則與次續 片之間具«大俾可使該減加速排出,進何加速該散熱板本體 散熱之目的。 【貫苑方式】 為使t«員枝簡捷瞭解本創作之其他特徵内容與優點及其所達 成之功效此夠更為顯現,兹將本創作配合附圖,詳細說明如下: 請參閱第二_示,樣舰—繼.物树,其包含: 延二US體2,該散熱板本體2係為片狀,又該散熱板本體2兩側各 …二V片主㈣3 ’該主則3係與該散熱板本體2垂直延接,又 柄-主則3至少—側延伸設有至少—片次 該散熱板本體2呈平行,且Μ Μ 讀片4皆與 丁域母一次藉片4均等長,又該每-次韓片技 次錯片4之間具有最大間距5,而如第三圖所示; 。 請再參閱第四圖所示,籍由該散熟板本體2係為片狀、及該主歸片3與 4 M381993 該散熱板本體2以垂直設置,則可使該散熱風流8直接從兩兩钱以間所設 之最大間距5排出,即可免除該熱風回流而與新散熱風流8產生風損,以及 可減》錄熱風流8對主鰭片3之風切,因而可降低噪音,再藉由該電子元 件7置叹於柄兩次轉片4之最大間距5内,又該電子元件7置設於該散熱板 本體2側’俾當該風扇6繼續作動時,該散熱風流8則順沿該散熱板本體2 兩織動’再藉由縣-次則4與次則4之間具有最大間距5,俾可使該 •熱風加速排出,因而可加速該散熱板本體2散熱,同時該散熱風流8亦可對 籲基板9上之其他電子元件了丨作散熱效果,且藉由該散熱風流S可直接吹至該 電子元件7 ’而可加速本創作散熱效果之目的。 為使本創歧加顯咖其進步性與實祕,祕—比較分析如下: 習用技術: 1、 極易產生噪音。 2、 熱風回流產生風損。 3'散熱效果不佳。 Φ 本創作優點: 1、 降低噪音。 2、 無熱風回流。 1 3、具有較佳之散熱效果。 【圖式簡單說明】 第一圖係為先前技術之側視及散熱風流示意圖。 第二圖係為本創作之立體示意圖。 第三圖係為本創作之側視示意圖。 5 M381993 第四圖係為本創作之實施示意圖。 【主要元件符號說明】 1.. 風扇 11.. 散熱器 12.. 鰭片 13.. 散熱風流 14.. 熱風回流 15.. 電子元件 16.. 散熱本體 2.. 散熱板本體 3.. 主鰭片 4.. 次鰭片 5.. 間距 6.. 風扇 7.. 電子元件 71.. 其他電子元件 8.. 散熱風流 9..基板 6M381993 V. New description: [New technical field] This creation is a kind of heat dissipation (four) structural improvement, especially the kind that can eliminate the hot air recirculation and new heat dissipation and generate wind loss, and reduce the heat dissipation to the main Han The wind is cut, so it can be reduced. The sound is humming, and the wind can be accelerated by 'expanding, _ can accelerate the heat dissipation of the heat sink body. [Prior Art] • Press, the general heat sink 'Please refer to the first figure, which is mainly provided with the heat sink body 16 of the heat sink 11 '. The heat sink body 16 extends upwardly to provide a plurality of Korean films 12, by the fan w out of the cooling air flow 13 'then can make the fin 12 reach the heat dissipation effect; the general radiator 'which can achieve the heat dissipation effect, and when the fan smashes the hot air flow (3) owes to the _ film 12a temple, often due to The bottom of the fin 12 is closed with each of the fins 12, so that the heat-dissipating airflow 13 hits the bottom of the fin 12 to form a hot air return 14, and when the fan i continues to blow toward the Korean film 12, the heat dissipation The wind flow 13 collides with the Korean piece 12 to generate a wind cut, thereby causing the piece 12 Φ to generate a $ sound ' and a wind loss due to the hot air return 14 , and the hot air shout 14 cannot be discharged, so that the recorded hot air flow 13 is easily The temperature rises, which results in a poor heat dissipation effect. Further, when the electronic component 15 is fixed on the side of the heat dissipation body 16 , the Korean chip 12 extending upwardly of the heat dissipation body 16 is disposed above the electronic component 15 The fan) its cooling airflow 13 cannot be directly blown to the electronic element 15, thus reducing the cooling effect, so it is necessary to be modified for; Cloth and so 'on how to exclude Lin be deleted, this is the point where the technical difficulties as human Lai desired solution. 3 M381993 [New content] The main purpose of this creation is to provide a heat sink fin structure improvement, which comprises: a monthly heat plate body, the heat sink plate system is in the form of a sheet, and the heat sink body extends on both sides of the heat sink body There is a main fin that has a main fin that extends perpendicularly to the heat sink body, and each of the main '..' slabs extends to the eve side without at least one piece of sub-Korean film. Both are parallel to the heat sink body' and have a maximum spacing between each of the rotors and the second one; 11 the heat sink is in the form of a sheet, and the sheet is perpendicular to the heat sink body. When the fan is actuated, the heat dissipation flow can be directly discharged from the maximum distance between the two or two pieces of the film. The heat loss is generated by the heat flow and the new heat, and the heat flow is reduced. The wind of the domain piece is cut, so that the _ tone can be lowered, and by this, the 俾 与 与 与 与 « « « « « « « « « « « « « « « « « « « « « « « « « « « « « [Chengyuan Way] In order to make t«members understand the other features and advantages of this creation and the effects achieved by it, it is more obvious. This article is combined with the drawings and detailed as follows: Please refer to the second _ Show, sample ship - following the object tree, which comprises: Yan 2 US body 2, the heat sink body 2 is in the form of a sheet, and the heat sink body 2 on both sides ... two V pieces main (four) 3 'the main 3 series The heat dissipation plate body 2 is vertically extended, and the handle-main 3 is at least-side extended at least one time. The heat dissipation plate body 2 is parallel, and the 读 读 reading film 4 is equal to the Ding domain mother and the second borrowing piece 4 Long, and the maximum spacing 5 between each of the four pieces of technology is as shown in the third figure; Please refer to the fourth figure again, because the bulk board body 2 is in the form of a sheet, and the main panel 3 and 4 M381993, the heat sink body 2 is vertically disposed, the heat dissipation airflow 8 can be directly from two The two moneys are discharged at the maximum spacing 5 set between the two, so that the hot air recirculation can be avoided to generate wind loss with the new heat dissipation airflow 8, and the wind can be reduced by recording the hot airflow 8 on the main fins 3, thereby reducing noise. Then, the electronic component 7 is sighed within the maximum pitch 5 of the turret twice, and the electronic component 7 is disposed on the side of the heat sink body 2. When the fan 6 continues to operate, the heat dissipation airflow 8 Then, along the heat dissipating plate body 2, two weavings 'have a maximum distance of 5 between the county and the fourth 4 and the second 4, so that the hot air can be accelerated and discharged, thereby accelerating the heat dissipation of the heat dissipating plate body 2, At the same time, the heat dissipation airflow 8 can also dissipate the heat dissipation effect on the other electronic components on the substrate 9, and the heat dissipation airflow S can be directly blown to the electronic component 7' to accelerate the heat dissipation effect of the present invention. In order to make this innovation add to its progressive and real secrets, the secret-comparative analysis is as follows: Conventional technology: 1. It is extremely prone to noise. 2, hot air backflow produces wind damage. 3' heat dissipation is not good. Φ Advantages of this creation: 1. Reduce noise. 2. No hot air backflow. 1 3, has a better heat dissipation effect. [Simple description of the diagram] The first diagram is a schematic diagram of the side view and heat dissipation of the prior art. The second picture is a three-dimensional diagram of the creation. The third picture is a side view of the creation. 5 M381993 The fourth picture is a schematic diagram of the implementation of this creation. [Main component symbol description] 1. Fan 11.. Radiator 12.. Fin 13.. Cooling airflow 14.. Hot air reflow 15.. Electronic component 16.. Heat sink body 2.. Heat sink body 3.. Main Fin 4.. Sub fin 5.. Spacing 6.. Fan 7.. Electronic component 71.. Other electronic components 8. Cooling airflow 9.. Substrate 6

Claims (1)

M381993 六、申請專利範圍: 1、 一種散熱鰭片結構改良,其包含: 一散熱板本體,該散熱板本體係為片狀,又該散熱板本體兩側各延伸 設有至少一片主鰭片,該主鰭片係與該散熱板本體垂直延接,又該每一主 鰭片至少一側延伸設有至少一片次鰭片,該每一次鰭片皆與該散熱板本體 呈平行。 2、 如申請專利範圍第1項所述之散熱鰭片結構改良,其中該每一次鰭 片其寬度均等長。 3、 如申請專利範圍第1項所述之散熱鰭片結構改良,其中該次鰭片與 次鰭片間具有最大間距。M381993 VI. Application Patent Range: 1. An improved fin structure, comprising: a heat sink body, the heat sink board is in the form of a sheet, and at least one main fin is extended on each side of the heat sink body. The main fins extend perpendicularly to the heat sink body, and at least one side of each of the main fins extends at least one sub-fin, each of which is parallel to the heat sink body. 2. The heat sink fin structure as described in item 1 of the patent application is improved, wherein each fin has an equal length. 3. The heat sink fin structure as described in claim 1 is improved, wherein the fin has a maximum spacing from the sub fin.
TW99200027U 2010-01-04 2010-01-04 Improved fin structure of heat sink TWM381993U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103987232A (en) * 2013-02-08 2014-08-13 技嘉科技股份有限公司 Heat radiator and heat radiating piece thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103987232A (en) * 2013-02-08 2014-08-13 技嘉科技股份有限公司 Heat radiator and heat radiating piece thereof

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