M381844 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作是關於一種積體電路（I ntegrated Ci rcui t， IC)組合，尤指一種具有天線之積體電路組合。 【先前技術】M381844 V. New Description: [New Technology Field] [0001] This work is about a combination of integrated circuits (ICs), especially a combination of integrated circuits with antennas. [Prior Art]
[0002] 隨著電子技術之高速發展，積體電路之整合度越來越高 ，其發熱量亦越來越大。因此，積體電路必須搭配散熱 片以將其工作時產生之熱量及時散去，以避免產生過熱 情況導致積體電路損壞。目前，射頻前端模組（RF front-end-module)已將平衡/非平衡轉換器（bal-ance/unbal ance converter )、功率放大器（power amplifier)、雙工器（diplexer)、交換器（switch )、帶通遽波器（band-pass filter)及低雜訊放大 器（low noise amplifier，LAN)整合進入了 單一封 裝中。然，無線通訊系統中最前端之元件天線，仍需要 另外安置於射頻前端模組之外。因此，其整合度仍待進 一步提高。 [0003] 為進一步提高通訊電子產品之積體電路之整合度，業界 亦採用具有嵌入式天線之積體電路（如圖1所示），天線 與積體電路作電性連接，具備訊號傳輸功能。然，該種 具有嵌入式天線之積體電路不具備散熱功能，另外安裝 散熱器需增加組件安裝成本，且影響天線接收信號。 【新型内容】 [0004] 鑒於以上内容，有必要提供一種整合度較高且具散熱功 表單編號A0101 第3頁/共12頁 M381844 能之積體電路組合。 [0005] —種積體電路組合，整合有一電路基板、一晶片及一與 所述晶片電性連接之天線，所述積體電路組合還包括一 晶片接地層，所述天線包括可向外散熱之一金屬本體部 及一與該金屬本體部一體成型之天線接地層，所述天線 之接地層與所述晶片接地層緊密熱接觸。 [0006] 相較於習知技術，本創作較佳實施方式將天線與晶片集 成於一起，提高了積體電路之整合度，且所述天線之接 地層與晶片接地層緊密熱接觸，因而所述積體電路組合 之天線可兼具通信及散熱片之功能。 【實施方式】 [0007] 請參閱圖2，本創作較佳實施方式積體電路組合100包括 一電路基板10、一置於所述電路基板10内之晶片20及一 天線30。所述電路基板10由多個走線層11、12、13、14 疊合而成。所述走線層11、12、13、14設有走線（ trace)及過孔（via)等（圖未視），用於電性連接至 所述晶片20，使晶片20能與外部較大之電路板電性連接 。所述電路基板10之背面設有多個用於連接一外部電路 之金屬焊球70。 [0008] 所述電路基板10之中部設有一凹部16供所述晶片20安裝 於其内。所述晶片20安裝到位後其上表面與所述電路基 板10之上表面平齊。 [0009] 所述積體電路組合100還包括一晶片接地層40，所述晶片 接地層40設置於所述電路基板10及所述晶片20之上表面 表單編號A0101 第4頁/共12頁 M381844 。所述晶片20内之接地點藉由内部走線連接至所述晶片 接地層40，可使干擾信號接地，從而排除干擾信號。所 述天線30包括一呈L形之金屬本體部（32及34)及〆天線 接地層50，所述天線接地層50貼合固定於所述晶片接地 層40上》 [0010] 所述天線3 0之L形金屬本體部包括一支撐部32及一自該支 撐部32之頂端垂直彎折而成之延伸部34，所述支撐部32 與所述天線接地層50垂直’所述延伸部34與所述天線接 地層50平行。所述天線30之支撐部32之末端穿過所述天 線接地層50及所述晶片接地層40並植入所述電路基板1〇 内並透過金線60 (wire bond)與所述晶片20電性連接 。所述金線60可將所述晶片20發出之信號傳送至所述天 線30，亦可將所述天線30接受之通訊信號傳送至所述晶 片20。 [0011] 於本創作較佳實施方式中，所述積體電路組合1〇〇之天線 本體與其接地層50 —體成型，所述天線30亦可設計為其 他便於一體成型之形狀，其接地層50可完全或者部分覆 蓋於所述晶片接地層40上，除了提供天線30本身之電性 參考平面外，亦可藉由金屬天線30與晶片接地層4〇之緊 密熱接觸而幫助晶片20散熱。 [0012] 圖3所示為所述積體電路組合100安裝於一電路板2〇〇上之 示意圖，所述積體電路組合100可為一射頻前端模組，所 述電路板200可安裝於一通信電子產品内。由於所述積體 電路組合100之天線30可用於訊號傳輸，同時此天線3〇因 為有大面積之金屬表面與空氣接觸而具有散熱片之功能 表單編號A0101 第5頁/共12頁 M381844 ，如此不僅可省去散熱片之成本，亦可將天線30與晶片 20整合。且此種天線30延伸至晶片20外部，其接收之信 號不會與晶片20内部訊號互相藕合干擾，可提升產品品 質。 [0013] 綜上所述，本創作確已符合新型專利要求，爰依法提出 專利申請。惟，以上所述者僅為本創作之較佳實施方式 ，舉凡熟悉本創作技藝之人士，爰依本創作之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0014] 圖1是一傳統之具有嵌入式天線之積體電路之示意圖。 [0015] 圖2是本創作較佳實施方式積體電路組合之剖面圖。 [0016] 圖3是本創作較佳實施方式積體電路組合安裝於一電路板 上之示意圖。 【主要元件符號說明】 [0017] 電路基板：10 [0018] 走線層：11、12、13、14 [0019] 凹部：16 [0020] 晶片：20 [0021] 天線：30 [0022] 支撐部：32 [0023] 延伸部：34 表單编號A0101 第6頁/共12頁 M381844 [0024] 晶片接地層：40 [0025] 天線接地層：50 [0026] 積體電路組合：100 [0027] 電路板：200 [0028] 金線：60 [0029] 金屬焊球：70[0002] With the rapid development of electronic technology, the integration of integrated circuits is getting higher and higher, and the heat generation is also increasing. Therefore, the integrated circuit must be equipped with a heat sink to dissipate the heat generated during its operation in time to avoid damage to the integrated circuit caused by overheating. Currently, the RF front-end-module has a bal-ance/unbal ance converter, a power amplifier, a diplexer, and a switch. ), a band-pass filter and a low noise amplifier (LAN) are integrated into a single package. However, the most advanced component antenna in a wireless communication system still needs to be placed outside the RF front-end module. Therefore, its integration still needs to be further improved. [0003] In order to further improve the integration of the integrated circuit of the communication electronic product, the industry also adopts an integrated circuit with an embedded antenna (as shown in FIG. 1), and the antenna is electrically connected with the integrated circuit, and has a signal transmission function. . However, the integrated circuit with the embedded antenna does not have a heat dissipation function, and the installation of the heat sink requires an increase in component mounting cost and affects the antenna receiving signal. [New content] [0004] In view of the above, it is necessary to provide a combination of high integration and heat dissipation. Form No. A0101 Page 3 of 12 M381844 can be combined. [0005] An integrated circuit circuit assembly, comprising a circuit substrate, a chip and an antenna electrically connected to the chip, the integrated circuit combination further comprising a chip ground layer, the antenna comprising an external heat dissipation A metal body portion and an antenna ground layer integrally formed with the metal body portion, the ground layer of the antenna being in close thermal contact with the wafer ground layer. [0006] Compared with the prior art, the preferred embodiment of the present invention integrates the antenna and the chip, improves the integration degree of the integrated circuit, and the ground layer of the antenna is in close thermal contact with the ground layer of the wafer, thus The antenna of the integrated circuit combination can function as both communication and heat sink. [0007] Referring to FIG. 2, a preferred embodiment of the integrated circuit assembly 100 includes a circuit substrate 10, a wafer 20 disposed in the circuit substrate 10, and an antenna 30. The circuit substrate 10 is formed by stacking a plurality of wiring layers 11, 12, 13, and 14. The trace layers 11, 12, 13, 14 are provided with traces, vias, etc. (not shown) for electrically connecting to the wafer 20, so that the wafer 20 can be externally compared. The large circuit board is electrically connected. The back surface of the circuit substrate 10 is provided with a plurality of metal solder balls 70 for connecting an external circuit. [0008] A recess 16 is formed in the middle of the circuit substrate 10 for the wafer 20 to be mounted therein. After the wafer 20 is mounted in position, its upper surface is flush with the upper surface of the circuit substrate 10. The integrated circuit assembly 100 further includes a wafer ground layer 40 disposed on the circuit substrate 10 and the upper surface of the wafer 20. Form No. A0101 Page 4 / Total 12 pages M381844 . The ground point within the wafer 20 is connected to the wafer ground plane 40 by internal traces to ground the interfering signal to eliminate interfering signals. The antenna 30 includes an L-shaped metal body portion (32 and 34) and a 〆 antenna ground layer 50, and the antenna ground layer 50 is attached and fixed to the wafer ground layer 40. [0010] The antenna 3 The L-shaped metal body portion of 0 includes a support portion 32 and an extension portion 34 bent perpendicularly from a top end of the support portion 32. The support portion 32 is perpendicular to the antenna ground layer 50. It is parallel to the antenna ground layer 50. The end of the support portion 32 of the antenna 30 passes through the antenna ground layer 50 and the wafer ground layer 40 and is implanted in the circuit substrate 1 and is electrically connected to the wafer 20 through a wire bond 60. Sexual connection. The gold wire 60 can transmit a signal from the wafer 20 to the antenna 30, and can also transmit a communication signal received by the antenna 30 to the wafer 20. [0011] In the preferred embodiment of the present invention, the antenna body of the integrated circuit assembly 1 is integrally formed with the ground layer 50, and the antenna 30 can also be designed as another shape suitable for integral molding, and the ground layer thereof. 50 may be completely or partially covered on the ground plane 40 of the wafer. In addition to providing an electrical reference plane of the antenna 30 itself, the wafer 20 may also be cooled by the close thermal contact of the metal antenna 30 with the ground plane of the wafer. [0012] FIG. 3 is a schematic diagram of the integrated circuit assembly 100 mounted on a circuit board 2, the integrated circuit assembly 100 can be a radio frequency front end module, and the circuit board 200 can be mounted on Within a communication electronics product. Since the antenna 30 of the integrated circuit assembly 100 can be used for signal transmission, the antenna 3 has a heat sink with a large-area metal surface in contact with air, and has a function sheet number A0101, page 5 of 12 pages, M381844, Not only can the cost of the heat sink be eliminated, but the antenna 30 can also be integrated with the wafer 20. Moreover, the antenna 30 extends to the outside of the chip 20, and the received signal does not interfere with the internal signals of the chip 20, thereby improving product quality. [0013] In summary, the creation has indeed met the requirements of the new patent, and the patent application is filed according to law. However, the above descriptions are only preferred embodiments of the present invention. Those who are familiar with the creative techniques, equivalent modifications or changes made in accordance with the spirit of this creation, shall be covered by the following patent applications. BRIEF DESCRIPTION OF THE DRAWINGS [0014] FIG. 1 is a schematic diagram of a conventional integrated circuit having an embedded antenna. 2 is a cross-sectional view showing the integrated circuit assembly of the preferred embodiment of the present invention. 3 is a schematic view showing the combination of the integrated circuit of the preferred embodiment of the present invention mounted on a circuit board. [0016] FIG. [Major component symbol description] [0017] Circuit substrate: 10 [0018] Trace layer: 11, 12, 13, 14 [0019] Recess: 16 [0020] Wafer: 20 [0021] Antenna: 30 [0022] Support :32 [0023] Extension: 34 Form No. A0101 Page 6 / Total 12 pages M381844 [0024] Wafer Ground Layer: 40 [0025] Antenna Ground Layer: 50 [0026] Integrated Circuit Combination: 100 [0027] Circuit Board: 200 [0028] Gold wire: 60 [0029] Metal solder ball: 70
表單编號A0101 第7頁/共12頁Form No. A0101 Page 7 of 12