TWM381652U - Thermally insulated and anti-stress board structure - Google Patents

Thermally insulated and anti-stress board structure Download PDF

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Publication number
TWM381652U
TWM381652U TW98221420U TW98221420U TWM381652U TW M381652 U TWM381652 U TW M381652U TW 98221420 U TW98221420 U TW 98221420U TW 98221420 U TW98221420 U TW 98221420U TW M381652 U TWM381652 U TW M381652U
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Taiwan
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heat
oxide
plate structure
insulating
structure according
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TW98221420U
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Chinese (zh)
Inventor
yi-shou Cai
Yu-Fan Su
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Tung Yu Hydraulic Machinery Co
Univ Feng Chia
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Application filed by Tung Yu Hydraulic Machinery Co, Univ Feng Chia filed Critical Tung Yu Hydraulic Machinery Co
Priority to TW98221420U priority Critical patent/TWM381652U/en
Publication of TWM381652U publication Critical patent/TWM381652U/en

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M381652 • 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種板材結構的技術領域，特別是以多個板體 單元疊置黏結成為一較大厚度的板材結構；其可應用在硫化機的 加熱位置提供隔熱及抗壓作用。 【先前技術】 一般加硫機需配置加熱設備用以對模具進行加熱。由於加熱 Φ 設備會產生高溫，所以加硫機上需搭配隔熱板以防止熱傳導致其 他部位。此外隔熱板會隨著加熱設備及/或模具移動且承受另一 模具的壓制’因此隔熱板需具備適當的結構強度抗壓，否則容易 破裂。 傳統隔熱板可利用粉體製成具有空孔的板體；複數板體互相 黏合後’表面再塗佈隔熱塗層。由於板體具有空孔，所以具備良 好的隔熱效果，但是結構強度不足。 • 另一種隔熱板是以玻璃纖維強化塑膠為材料一體成形。由於 材料特性，使得隔熱板具備良好的結構強度，但是隔熱效果較差。 【新型内容】 本創作的目的係在提供一種隔熱抗壓板結構，其具有能使隔 熱板產生良好的隔熱性及抗壓性的效果。 根據上述的目的與功效，隔熱抗塵板由多層的板體單元互相 結合而成，且相鄰的板體單元間的隔熱層除了提供黏著作用外， 更具隔熱效果，故隔熱板具備良好的隔熱效果。 3 M381652 又板體單元的構成材料包含基材，所以隔熱板具有多層基材 疊置的結構形式，因此固化後的隔熱板具有良好的結構強度。 以下即依本創作的目的及功效，舉出較佳實施例並配合圖式 詳細說明如下。 【實施方式】 請參閱第1圖，圖中揭露一板體單元（10)，其包含一基材（12 )’特別是布材、玻纖布或短纖維，以及在基材（12)表面覆著一隔 φ 熱層（14)。 請參閱第2圖，隔熱層（14)係包含膠體(22)、粉體(24)、硬 化劑(26)及偶聯劑（28)。一般而言膠體(22)是有機材料，粉體(24) 是無機材料，偶聯劑(28)可以對膠體(22)與粉體(24)產生鏈結， 使得膠體(22)與粉體(24)能具有良好的結合效果且能提高機械強 度。 上述的膠體(22)可以是熱固性高分子材料，例如選自環氧樹 φ 脂、酚搭樹脂、不飽和聚酯、聚醯亞胺或矽橡膠等材料的一種或 多種。 粉體(24)可以是二氧化石夕（silicondioxide)'氧化铭（alumi num oxide)、氧化鈦（titanium oxide)、氧化鐵（iron oxide)、 氧化鉻（chromium oxide)、氧化鉛（zirconium oxide)、氧化錳 (manganese ox i de )、乳化鎮（magnes i tun ox i de )、氧化釣（ca 1 c i uni oxide)、氧化鋇（barium oxide)、碳化矽（silicon carbide)、 碳酸鎂（magnesium carbonate)、碳酸鈣（calcic carbonate)、 4 M381652 梦酸錯（zirconium silicate)、梦酸舞（calcium silicate)、 欽酸鋇（barium titanate)、氫氧化飼（calcium hydroxide)、 氫氧化鐵（iron hydroxide)、奈米破管（carbon nanotube)、鈦 鐵礦（ilmenite)、黏土（clay)、蛭石（vermiculite)、雲母（mica)、 珍珠岩（perlite)、滑石（talc)、石夕灰石（wollastonite)、玻 璃（glass)等上述材料的一種或多種。 膠體(22)是環氧樹脂時，硬化劑(26)可為酸酐、胺類硬化劑 φ 或芳香類硬化劑。 請參閱第3圖，取複數板體單元（10)疊置，且搭配適當的壓 力、溫度使得相鄰的板體單元（10)的隔熱層（14)可以互相黏合； 俟組合的各板體單元（10)固化後即可形成一隔熱抗壓板。 更進一步而言’隔熱抗壓板由多層的板體單元(丨们互相結合 而成，且相鄰的板體單元（10)間的隔熱層（14)除了提供黏著作用 外，更因其材特性而具備隔熱效果，所以隔熱抗壓板具備良好的 Φ 隔熱效果。 另外各板體單元(10)的構成材料包含基材(未顯示），所以當 隔熱抗壓板具備多層基材(未顯示)疊置的結構形式。固化後的隔 熱抗壓板可藉由各疊置的基材(未顯示）而具備良好的結構強度。 請參閱第4圖，本發明的第二實施例係取一主體材料層（3〇) ，且在該主體材料層（30)的相對二侧貼附一板體單元(1〇)。其中 該板體單元（10)的組成結構及製作方法與前述相同，不再多言贅 述0 5 M381652 特別的是，主體材料層⑽係由粉體⑻、纖維材料(32)、 膝體(33)混合構成-體，且更可以混合適量的硬化劑(未顯示）。 上述的主體材料層（30)中的粉體(31)為二氧化矽（siHc〇n dioxide)、氧化鋁（aluminumoxide)、氧化鈦（titanium〇xide)、 氧化鐵（ironoxide)、氧化鉻（chr〇miumoxide)、氧化錯 (Zirc onium oxide)、氧化猛（manganese 〇xide)、氧化鎂（magnesium oxide)、氧化鈣（calcium oxide)、氧化鋇（barium 〇xide)、碳 馨化矽（silicon carbide)、碳酸鎂（magnesium carb〇nate)、碳 醆妈（calcium carbonate)、石夕酸鍅（zirconium silicate)、石夕 酸約（calcium silicate)、鈦酸鋇（barium titanate)、氫氧化 鈣（calcium hydroxide)、氫氧化鐵（iron hydroxide)、奈米碳 管（carbon nanotube)、鈦鐵礦（iimenite)、黏土（clay)、蛭 石（vermiculite)、雲母（mica)、珍珠岩（perlite)、滑石（talc)、 吩灰石（wo 1 las ton i te )、玻璃（glass)選用其中—種或多種’ • 總重量為膠體重量的0.卜30wt%。 上述主體材料層（30)中的纖維材料(32)為玻瑀纖維（glass Πbers )、石英纖維（quartz f ibers)、矽土纖維（si 1 icaf ibers )、 矽酸鹽纖維（silicate fibers)、碳纖維（carb〇n fibers)、陶 瓷纖維（ceramic fibers)、玻璃棉（glass wo〇l)、石棉（rock wool)、礦棉（slag wool)、玄武岩棉（basalt wool)選用其中 —種或多種，總重量為膠體重量的〇. 1〜3〇wt% β 上述主體材料層（30)中的膠體(33)為熱固性高分子材料。其 M381652 可選自環氧樹脂、酚醛樹脂、不飽和聚酯、聚醯亞胺或矽橡膠中 的一種或多種。 將板體單元（10)貼附在主體材料層（30)相對二側的方式之一 是分別製作板體單元（10)與主體材料層（30)，然後再予以互相黏 合。另外也可以先取一板體單元（10)置於模具内，然後在該模具 内形成主體材料層（30)，使板體單元（10)結合主體材料層（30)， 最後在主體材料層（30)表面再貼附另一板體單元(1〇)。 φ 上述實施例僅為例示性說明本創作之技術及其功效，而非用 於限制本創作。任何熟於此項技術人士均可在不違背本創作之技 術原理及精神的情況下，對上述實施例進行修改及變化，因此本 創作之權利保護範圍應如後所述之申請專利範圍所列。 【圖式簡單說明】 第1圖係本創作板體單元的結構示意圖。 第2圖係本創作隔熱層的構成示意圖。 φ 第3圖係本創作複數板體單元組成隔熱抗壓板的示意圖。 笫4圖係本創作第二實施例的結構示意圖。 【主要元件符號說明】 (10)板體單元 (14)隔熱層 (24)粉體 (28)偶聯劑 (31)粉體 (12)基材 (22)膠體 (26)硬化劑 (30)主體材料層 (32)纖維材料 M381652 (33)膠體M381652 • V. New description: [New technical field] This is a technical field of sheet metal structure, especially in which a plurality of plate units are stacked and bonded to form a plate structure having a large thickness; The heating position of the machine provides insulation and compression resistance. [Prior Art] A general vulcanizer is equipped with a heating device for heating the mold. Since the heating Φ equipment will generate high temperatures, the vulcanizer should be equipped with a heat shield to prevent heat transfer from causing other parts. In addition, the heat shield moves with the heating device and/or the mold and is subjected to the pressing of the other mold. Therefore, the heat shield needs to have a suitable structural strength to resist pressure, otherwise it is easily broken. The conventional heat insulation board can use the powder to form a plate body having voids; after the plurality of plate bodies are bonded to each other, the surface is coated with a heat insulation coating. Since the plate body has voids, it has a good heat insulating effect, but the structural strength is insufficient. • Another insulation board is integrally formed from fiberglass reinforced plastic. Due to the material properties, the insulation board has good structural strength, but the insulation effect is poor. [New content] The purpose of the present invention is to provide an insulating and pressure-resistant plate structure which has an effect of enabling the heat insulating plate to have good heat insulating properties and pressure resistance. According to the above object and effect, the heat-insulating dust-proof board is formed by combining the multi-layered plate unit, and the heat insulation layer between the adjacent board units is more heat-insulating than the adhesive effect, so the heat insulation is insulated. The board has good thermal insulation. 3 M381652 The material of the plate unit also includes the substrate, so the heat shield has a structure in which the multilayer substrate is stacked, so that the cured heat shield has good structural strength. The following is a description of the preferred embodiment and the following detailed description in conjunction with the drawings. [Embodiment] Referring to Figure 1, there is disclosed a plate unit (10) comprising a substrate (12), in particular a cloth, a fiberglass cloth or a short fiber, and a surface of the substrate (12). Covered with a thermal layer (14). Referring to Fig. 2, the heat insulating layer (14) comprises a colloid (22), a powder (24), a hardener (26), and a coupling agent (28). In general, the colloid (22) is an organic material, the powder (24) is an inorganic material, and the coupling agent (28) can cause a chain of the colloid (22) and the powder (24) to cause the colloid (22) and the powder. (24) It has a good bonding effect and can improve mechanical strength. The above colloid (22) may be a thermosetting polymer material, for example, one or more selected from the group consisting of epoxy resin, phenol resin, unsaturated polyester, polyimine or ruthenium rubber. The powder (24) may be a silicon dioxide oxide, an alumi num oxide, a titanium oxide, an iron oxide, a chromium oxide or a zirconium oxide. Manganese ox i de , magnesi tun ox i de , ca 1 ci uni oxide, barium oxide, silicon carbide, magnesium carbonate ), calcium carbonate, 4 M381652 zirconium silicate, calcium silicate, barium titanate, calcium hydroxide, iron hydroxide , carbon nanotube, ilmenite, clay, vermiculite, mica, perlite, talc, talite (wollastonite) One or more of the above materials, such as glass. When the colloid (22) is an epoxy resin, the hardener (26) may be an acid anhydride, an amine hardener φ or an aromatic hardener. Referring to Figure 3, the plurality of plate units (10) are stacked and matched with appropriate pressure and temperature so that the insulation layers (14) of adjacent plate units (10) can be bonded to each other; After the body unit (10) is cured, an insulation and pressure resistant plate can be formed. Furthermore, the 'insulation and compression plate is composed of a plurality of plate units (they are combined with each other, and the insulation layer (14) between the adjacent plate units (10) not only provides a sticky effect, but also The heat insulating and pressure-resistant plate has a good Φ heat insulating effect, and the heat insulating and pressure-resistant plate has a good Φ heat insulating effect. Further, the constituent material of each plate unit (10) includes a base material (not shown), so that the heat insulating and pressing plate is provided A multi-layer substrate (not shown) is stacked. The cured heat-insulating plate can have good structural strength by stacking substrates (not shown). Referring to Figure 4, the present invention In a second embodiment, a body material layer (3〇) is attached, and a plate unit (1〇) is attached to opposite sides of the body material layer (30). The composition of the plate body unit (10) And the manufacturing method is the same as the above, and the description is no longer repeated. 0 5 M381652 In particular, the body material layer (10) is composed of a powder (8), a fiber material (32), and a knee body (33), and can be mixed in an appropriate amount. Hardener (not shown). The powder (31) in the above-mentioned host material layer (30) is cerium oxide (si) Hc〇n dioxide), aluminum oxide, titanium oxide, iron oxide, chr〇miumoxide, Zirc onium oxide, manganese 〇xide, Magnesium oxide, calcium oxide, barium 〇xide, silicon carbide, magnesium carb〇nate, calcium carbonate, stone eve Zirconium silicate, calcium silicate, barium titanate, calcium hydroxide, iron hydroxide, carbon nanotube, titanium Imenite, clay, vermiculite, mica, perlite, talc, phoenix (wo 1 las ton i te ), glass Wherein - one or more ' • The total weight is 0.3% by weight of the colloidal weight. The fibrous material (32) in the above-mentioned body material layer (30) is glass Πbers, quartz fibers (quartz f ibers), Alumina fiber (si 1 icaf ibers ), silicate fibers, carb〇n fibers, ceramic fibers, glass wool, rock wool, slag wool, basalt cotton (basalt wool) One or more of them are used, and the total weight is 胶. 1~3〇wt% β The colloid (33) in the above-mentioned host material layer (30) is a thermosetting polymer material. Its M381652 may be selected from one or more of an epoxy resin, a phenol resin, an unsaturated polyester, a polyimide or a ruthenium rubber. One of the ways of attaching the plate unit (10) to the opposite sides of the body material layer (30) is to separately form the plate unit (10) and the body material layer (30), and then bond them to each other. Alternatively, a plate unit (10) may be first placed in the mold, and then a body material layer (30) is formed in the mold, the plate unit (10) is combined with the body material layer (30), and finally in the body material layer ( 30) The surface is attached to another plate unit (1〇). The above embodiments are merely illustrative of the techniques of the present invention and their effects, and are not intended to limit the present invention. Anyone skilled in the art can modify and change the above embodiments without violating the technical principles and spirit of this creation. Therefore, the scope of protection of this creation should be as listed in the patent application scope mentioned later. . [Simple description of the diagram] The first diagram is a schematic diagram of the structure of the board unit. Fig. 2 is a schematic view showing the structure of the heat insulating layer of the present invention. φ Fig. 3 is a schematic diagram of the heat-insulating pressure-resistant plate composed of a plurality of plate units. Figure 4 is a schematic view showing the structure of the second embodiment of the present creation. [Description of main component symbols] (10) Plate unit (14) Insulation layer (24) Powder (28) Coupling agent (31) Powder (12) Substrate (22) Colloid (26) Hardener (30 ) body material layer (32) fiber material M381652 (33) colloid

Claims (1)

mm652 六、申請專利範圍·· 1、一種隔熱抗壓板結構，其包含·· 一基材； —隔熱層’係為制性高分侦料且㈣在該顧表面及部 份渗入該基材内； 其中，該基材與該隔熱層的組合為—板體單元，複數板體單 70豐放，且相鄰的板體單元以其隔熱層互相結合。 鲁 2、如申晴專利範圍第1項所述之隔熱抗壓板結構，其中基 材為布材、玻纖布或短纖維。 3、 如申請專利範圍第1項所述之隔熱抗壓板結構，其中該 隔熱層是一勝體。 4、 如申請專利範圍第3項所述之隔熱抗壓板結構，其中該 膠體的成份為熱固性高分子材料。 5如申明專利範圍第4項所述之隔熱抗壓板結構，其中該 •熱固性高分子材料選自環氧樹脂、祕樹脂、不飽和聚醋、聚醯 亞胺或矽橡膠。 6、 如申請專利範圍第1項所述之隔熱抗壓板結構，更包含 硬化劑混於隔熱層。 7、 如申請專利範圍第6項所述之隔熱抗壓板結構，其中該 硬化劑可為酸酐、胺類硬化劑或芳香類硬化劑。 8、 如申請專利範圍第1項所述之隔熱抗壓板結構，更包含 至少一種粉體混於該隔熱層。 M381652 9、如申請專利範圍第8項所述之隔熱抗壓板結構，其中該 粉體選自二氧化矽（silicon dioxide)、氧化鋁（aluminum oxi de)、氧化鈦（titanium oxide)、氧化鐵（iron oxide)、氧化鉻 (chromiumoxide)、氧化锆（zirconium oxide)、氧化猛（manga nese oxide)、氧化鎂（magnesium oxide)、氧化鈣（calcium oxide)、氧化鋇（barium oxide)、碳化矽（SiHcon carbide)、 碳酸鎂（magnesium carbonate)、碳酸鈣（caicium carb〇riate)、 φ 矽酸锆（zirconium silicate)、矽酸飼（calcium siiicate) 、鈦酸領（barium titanate)、氫氧化弼（caicium hydroxide)、 氫氧化鐵（iron hydroxide)、奈米碳管（cart)〇n nan〇tube)、鈦 鐵碌（ilmenite)、黏土（Clay)、經石（vermiculite)、雲母(mica)、 珍珠岩（perlite)、滑石（talc)、矽灰石（wollast〇nite)、玻 璃（glass)。 10、一種隔熱抗壓板結構，其包含： • 一主體材料層，係由粉體、纖維材料、膠體混合構成一體； 二板體單元，係分別貼附在該主體材料層的相對二側，每一 该板體單兀包含-基材及一隔歸，其巾該隔熱義選自至少一 種高分子材料’其覆著在該基材表面且部份渗人絲材内。 π、如申明專利範圍帛10項所述之隔熱抗壓板結構其中該 主體材料層中的粉體為二氧化石夕（silic〇ndi〇xide)、氧化紹⑽ 麵讀ide)、氧化鈦（titaniu睛也）、氧化鐵（匕。讀说）、 氧化絡oxide)、氧化結（zi聰-ο·)、氧德 M381652 (manganese oxi de )、氧化錢（magnes i um oxide)' 氧化約（ca 1 c i um oxide)、氧化鋇（barium oxide)、碳化石夕（silicon carbide) 、碳酸鎂（magnesium carbonate)、碳酸鈣（calcium carbonate)、 矽酸鍅（zirconium silicate)、矽酸妈（calcium silicate)、 鈦酸鋇（barium titanate)、氫氧化妈（calcium hydroxide)、 虱氧化鐵（iron hydroxide)、奈米碳管（carbon nanotube)、鈦 鐵礦（ilmenite)、黏土（clay)、蛭石（vermiculite)、雲母（mica)、 φ 珍珠岩（perlite)、滑石（talc)、梦灰石（wollastonite)、玻 璃（glass)選用其中一種或多種，總重量為膠體重量的〇.卜3〇 wt%。 12、 如申請專利範圍第10項所述之隔熱抗壓板結構，其中該 主體材料層中的纖維材料為玻璃纖維（glass fibers)、石英纖維 (quartz f ibers)、矽土纖維（Si 丨 ica f ibers )、矽酸鹽纖維（si j icate fibers)、碳纖維（carb〇n fibers)、陶瓷纖維（ceramic ,fibers)玻璃棉（giass w〇〇i)、石棉（r〇ck w〇〇i)、礦棉（siag wool)、玄武岩棉（basalt w〇〇i)選用其中一種或多種，總重量 為膠體重量的〇. 1〜3〇wt%。 13、 如申請專利範圍第1〇項所述之隔熱抗壓板結構，其中該 主體材料層中_體為熱固性高分子材料。 14、 如申晴專利範圍第13項所述之隔熱抗壓板結構’其中該 熱雖㊉分子㈣為選自魏樹脂 ' 祕_、不飽和聚醋、聚 醯亞胺或矽橡膠中的一種或多種。 11 M381652 15、 如申請專利範圍第10項所述之隔熱抗壓板結構，其中該 板體單元的基材為布材、玻纖布或短纖維。 16、 如申請專利範圍第1〇項所述之隔熱抗壓板結構，其中該 板體單元的隔熱層是一膠體。 17、 如申請專利範圍第16項所述之隔熱抗壓板結構，其中該 膠體的成份為熱固性高分子材料。 18、 如申請專利範圍第17項所述之隔熱抗壓板結構，其中該 # 熱固性高分子材料選自環氧樹脂、酚醛樹脂、不飽和聚酯、聚醯 亞胺或矽橡膠。 19、 如申請專利範圍第10項所述之隔熱抗壓板結構，更包含 硬化劑混於該板體單元的隔熱層。 20、 如申請專利範圍第19項所述之隔熱抗壓板結構，其中該 隔熱層含有環氧樹脂，且該硬化劑為酸酐、胺類硬化劑或芳香類 硬化劑。 _ 21、如申請專利範圍第1〇項所述之隔熱抗壓板結構，更包含 至少一種粉體混於該隔熱層。 22、如申請專利範圍第21項所述之隔熱抗壓板結構，其中該 粉體選自二乳化石夕（silicon dioxide)、氧化紹（aluminum oxide )、氧化鈦（titanium oxide)、氧化鐵（iron oxide)、氧化鉻（chr omium oxide)、氧化錯（zirconium oxide)、氧化锰（manganese oxide)、氧化鎮（magnesium oxide)、氧化舞（calcium oxide)、 氧化領（barium oxide)、碳化碎（si 1 icon carbide )、碳酸鎮（mag 12 M381652 nes i um carbonate)、碳酸釣（ca 1c ium carb〇nate)、石夕酸結（z i r coniumsilicate)、石夕酸釣（calciumsiHcate)、鈦酸鋇（barium titanate)、氫氧化鈣（calcium hydroxide)、氫氧化鐵（iron hydroxide)、奈米碳管（carbon nanotube )、鈦鐵礦（i lmeni te)、 黏土（clay)、蛭石（vermiculite)、雲母（mica)、珍珠岩（per lite) /月石（talc)、石夕灰石（w〇uast〇nite)、玻璃（giass)。Mm652 VI. Scope of Application for Patention··1. A heat-insulating and anti-pressure plate structure, which comprises a substrate; a heat-insulating layer is a high-scoring material and (4) infiltrated into the surface and part of the surface In the substrate, wherein the combination of the substrate and the heat insulating layer is a plate unit, a plurality of plate bodies 70 are placed in abundance, and adjacent plate units are bonded to each other by a heat insulating layer thereof. Lu 2. The heat-insulating and anti-pressure plate structure mentioned in the first paragraph of Shen Qing Patent Range, wherein the base material is cloth material, fiberglass cloth or short fiber. 3. The heat-insulating pressure-resistant plate structure according to claim 1, wherein the heat insulation layer is a winning body. 4. The heat-insulating pressure-resistant plate structure according to claim 3, wherein the composition of the gel is a thermosetting polymer material. 5. The heat-insulating pressure-resistant plate structure according to claim 4, wherein the thermosetting polymer material is selected from the group consisting of epoxy resin, secret resin, unsaturated polyester, polyimine or ruthenium rubber. 6. The heat-insulating pressure-resistant plate structure described in claim 1 of the patent application, further comprising a hardener mixed with the heat insulation layer. 7. The heat-insulating pressure-resistant plate structure according to claim 6, wherein the hardener is an acid anhydride, an amine hardener or an aromatic hardener. 8. The heat-insulating pressure-resistant plate structure according to claim 1, further comprising at least one powder mixed with the heat insulation layer. M381652. The thermal insulation plate structure according to claim 8, wherein the powder is selected from the group consisting of silicon dioxide, aluminum oxide (odium oxi de), titanium oxide (titanium oxide), and oxidation. Iron oxide, chromium oxide, zirconium oxide, manga nese oxide, magnesium oxide, calcium oxide, barium oxide, tantalum carbide (SiHcon carbide), magnesium carbonate, calcium carbonate (caicium carb〇riate), φ zirconium silicate, calcium siiicate, barium titanate, barium hydroxide (barium titanate) Caicium hydroxide), iron hydroxide, cart 〇n nan〇tube, ilmenite, clay, vermiculite, mica, pearl Perlite, talc, wollast〇nite, glass. 10. A heat-insulating pressure-resistant plate structure comprising: • a body material layer integrally formed by mixing powder, fiber material and colloid; and two plate body units attached to opposite sides of the body material layer respectively Each of the plate bodies comprises a substrate and a spacer, and the heat insulating material is selected from the group consisting of at least one polymer material that is coated on the surface of the substrate and partially infiltrated into the wire. π. The heat-insulating pressure-resistant plate structure according to claim 10, wherein the powder in the body material layer is silica silicate (silic〇ndi〇xide, oxidized (10) surface read ide), titanium oxide (titaniu also), iron oxide (匕. read), oxidized oxide), oxidized (zi Cong-o), Ode M381652 (manganese oxi de), oxidized money (magnes i um oxide) (ca 1 ci um oxide), barium oxide, silicon carbide, magnesium carbonate, calcium carbonate, zirconium silicate, calcium Silicate), barium titanate, calcium hydroxide, iron hydroxide, carbon nanotube, ilmenite, clay, vermiculite (vermiculite), mica, φ perlite, talc, wollastonite, glass, one or more of them, the total weight is the weight of the colloid. %. 12. The heat-insulating pressure-resistant plate structure according to claim 10, wherein the fiber material in the body material layer is glass fibers, quartz fibers, and alumina fibers (Si 丨Ica f ibers ), si j icate fibers, carb〇n fibers, ceramic fibers (chiass w〇〇i), asbestos (r〇ck w〇〇i) ), siam wool, basalt w〇〇i, one or more of them, the total weight is 胶. 1~3〇wt% of the colloid weight. 13. The heat-insulating pressure-resistant plate structure according to claim 1, wherein the body material layer is a thermosetting polymer material. 14. The heat-insulating and anti-pressure plate structure as described in Item 13 of the Shenqing patent scope, wherein the heat is very high (four) is selected from the group consisting of Wei resin, secret polyacetate, polythenimine or yttrium rubber. One or more. The heat-insulating pressure-resistant plate structure according to claim 10, wherein the substrate of the plate unit is a cloth material, a fiberglass cloth or a short fiber. The thermal insulation plate structure according to claim 1, wherein the insulation layer of the plate unit is a gel. 17. The heat-insulating pressure-resistant plate structure according to claim 16, wherein the composition of the gel is a thermosetting polymer material. 18. The heat-insulating pressure-resistant plate structure according to claim 17, wherein the # thermosetting polymer material is selected from the group consisting of epoxy resins, phenolic resins, unsaturated polyesters, polyimine or ruthenium rubber. 19. The heat-insulating pressure-resistant plate structure according to claim 10, further comprising a heat-insulating layer in which the hardener is mixed with the plate unit. The heat-insulating pressure-resistant plate structure according to claim 19, wherein the heat insulating layer contains an epoxy resin, and the hardener is an acid anhydride, an amine hardener or an aromatic hardener. The heat-insulating pressure-resistant plate structure according to the first aspect of the invention, further comprising at least one powder mixed with the heat insulation layer. 22. The heat-insulating pressure-resistant plate structure according to claim 21, wherein the powder is selected from the group consisting of a silicon dioxide, a aluminum oxide, a titanium oxide, and an iron oxide. (iron oxide), chr omium oxide, zirconium oxide, manganese oxide, magnesium oxide, calcium oxide, barium oxide, carbonized (si 1 icon carbide ), carbon 12 M381652 nes i um carbonate, ca 1c ium carb〇nate, zir coniumsilicate, calciumsiHcate, barium titanate (barium titanate), calcium hydroxide, iron hydroxide, carbon nanotube, ilmenite, clay, vermiculite, Mica, per lite/talc, w〇uast〇nite, giass. 1313
TW98221420U 2009-11-17 2009-11-17 Thermally insulated and anti-stress board structure TWM381652U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112406216A (en) * 2020-12-01 2021-02-26 晋江市九皋智能科技有限公司 Novel heat insulation base plate for intelligent precision die

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112406216A (en) * 2020-12-01 2021-02-26 晋江市九皋智能科技有限公司 Novel heat insulation base plate for intelligent precision die

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