五、新型說明： 【新型所屬之技術領域】 [0001] 本創作是關於一種電子裝置殼體，尤指一種具有導風罩 之電子裝置殼體。 【先前技術】 [0002] 一般電腦殼體中均設置有散熱裝置，通常使用之散熱裝 置是由散熱器與風扇組合而成，散熱器之一表面與電子 元件接觸，另一表面形成複數散熱鰭片，所述散熱鰭片 之間形成氣流流道，風扇設於與所述氣流流道相通之一 側，從而加快其熱對流速度。然而、在高端市場中，增 加所述電腦殼體中的記憶體之後，因所述記憶體之高度 '' / . 高於所述散熱器之高度，所述散熱裝置已不能滿足熱能 散發之需求。其電腦系統内之熱量就會積存於多個記憶 體之間，嚴重影響電子元件之壽命以及電腦系統的穩定 性。 【新型内容】 ^ [0003] 鑒於以上内容，有必要提供一種具有導風罩之電子裝置 殼體。 [0004] 一種電子裝置殼體，包括一機殼及裝設於所述機殼内之 導風罩，所述機殼具有一前壁及一後壁，所述機殼内裝 設有一用以安裝電源供應器之固定架、及一用以安裝資 料存儲器之磁架，所述固定架固定於所述後壁上，所述 磁架固定於所述前壁上，所述前壁於所述磁架之一側開 設有進風口，所述後壁對應所述固定架開設有出風口， 表單編號A0101 第4頁/共16頁 M379307 [0005] [0006]V. New description: [New technical field] [0001] The present invention relates to an electronic device housing, and more particularly to an electronic device housing having an air guiding cover. [Prior Art] [0002] Generally, a heat sink is disposed in a computer casing, and a heat sink generally used is a combination of a heat sink and a fan. One surface of the heat sink is in contact with the electronic component, and the other surface is formed with a plurality of heat sink fins. The air flow channel is formed between the heat dissipation fins, and the fan is disposed on one side of the air flow passage to accelerate the heat convection speed. However, in the high-end market, after the memory in the computer casing is increased, since the height of the memory is higher than the height of the radiator, the heat sink cannot meet the demand for heat dissipation. . The heat in the computer system is accumulated between multiple memories, seriously affecting the life of the electronic components and the stability of the computer system. [New content] ^ [0003] In view of the above, it is necessary to provide an electronic device housing having an air hood. [0004] An electronic device housing includes a casing and a windshield disposed in the casing, the casing has a front wall and a rear wall, and the casing is provided with a a mounting bracket for mounting a power supply, and a magnetic frame for mounting a data storage, the fixing bracket being fixed to the rear wall, the magnetic frame being fixed to the front wall, the front wall being One side of the magnetic frame is provided with an air inlet, and the rear wall is provided with an air outlet corresponding to the fixed frame. Form No. A0101 Page 4 of 16 M379307 [0005] [0006]
[0007][0007]
[0008] [0009] 所述導風罩位於所述固定架與所述磁架之間，並可用以 遮擋設於所述機殼内之記憶體，所述導風罩可使從所述 進風口進入所述機殼内之冷空氣流經所述記憶體、所述 固定架與所述磁架之間、及所述固定架後，經由所述出 風口排到所述機殼外。 優選地，其中所述導風罩包括一罩設部，所述罩設部罩 設於所述記憶體之上方。 優選地，其中所述導風罩還包括有一連接部及一垂直於 所述連接部之蓋板，所述連接部包括一第一連接部、一 連接所述罩設部之第二連接部及一彎折部，所述磁架固 定有一支架，所述導風罩藉由所述第一連接部蓋合於所 述固定架之旁側，所述彎折部邊緣抵靠於所述支架上， 及所述蓋板覆蓋於所述固定架與所述磁架之上，從而使 進入所述機殼内之冷空氣流經所述記憶體後，經過所述 第二連接部而流入所述固定架與所述磁架之間。 優選地，其中所述支架平行所述前壁》 優選地，其中所述第一連接部設有一定位柱，所述機殼 具有底壁，所述底壁開設有收容所述定位柱之定位槽。 優選地，其中所述導風罩包括有一彎折板，所述彎折板 設有一第一卡扣部，所述支架開設有與所述第一卡扣部 卡扣配合之扣孔。 優選地，其中所述磁架固定有一固定件，所述固定件開 設有一第一卡固孔，所述蓋板設有可卡入所述第一卡固 孔之第一卡爪。 表單编號A0101 第5頁/共16頁 [0010] M379307 [0011] 優選地，其中所述機殼還包括一與所述前壁及後壁連接 之側壁，所述側壁彎折有折邊，所述蓋板設有一可與所 述折邊卡扣配合之第二卡扣部。 [0012] 優選地，其中所述固定件垂直所述側壁。 [0013] 優選地，其中所述折邊開設有一第二卡固孔，所述蓋板 設有可卡入所述第二卡固孔之第二卡爪。 [0014] 與習知技術相比，上述電子裝置殼體中之導風罩罩設於 所述記憶體之上，並卡扣於所述固定架與所述磁架之間 ，冷空氣進入所述機殼内後，便可流經所述記憶體、所 述固定架與所述磁架之間、及所碟固定架後，經由所述 出風口排到所述機殼外。就可很好地減少記憶體之間的 熱量，以降低記憶體之間的溫度。 【實施方式】 [0015] 請參閱圖1及圖2，本創作電子裝置殼體之一較佳實施方 式包括一機殼10及一裝設於所遠機felO中之導風罩30。[0008] The air hood is located between the fixing frame and the magnetic frame, and can be used to block a memory disposed in the casing, and the air hood can be made from the The cold air entering the casing through the tuyere flows through the memory, between the fixing frame and the magnetic frame, and after the fixing frame, and is discharged to the outside of the casing through the air outlet. Preferably, the air hood includes a cover portion, and the cover portion is disposed above the memory. Preferably, the air hood further includes a connecting portion and a cover plate perpendicular to the connecting portion, the connecting portion includes a first connecting portion, a second connecting portion connecting the cover portion, and a bent portion, the magnetic frame is fixed with a bracket, and the air guiding cover is covered by the first connecting portion to the side of the fixing frame, and the edge of the bent portion abuts against the bracket And the cover plate covers the fixing frame and the magnetic frame, so that after the cold air entering the casing flows through the memory, the second connecting portion flows into the Between the holder and the magnetic frame. Preferably, the bracket is parallel to the front wall. Preferably, wherein the first connecting portion is provided with a positioning post, the casing has a bottom wall, and the bottom wall is provided with a positioning slot for receiving the positioning post. . Preferably, the air hood includes a bending plate, and the bending plate is provided with a first fastening portion, and the bracket is provided with a fastening hole that is snap-fitted with the first fastening portion. Preferably, the magnetic frame is fixed with a fixing member, and the fixing member is provided with a first fastening hole, and the cover plate is provided with a first claw that can be inserted into the first fastening hole. Form No. A0101 Page 5 of 16 [0010] M379307 [0011] Preferably, wherein the casing further comprises a side wall connected to the front wall and the rear wall, the side wall is bent with a fold, The cover plate is provided with a second fastening portion that can be snap-fitted with the flange. [0012] Preferably, wherein the fixing member is perpendicular to the side wall. [0013] Preferably, the flange is provided with a second fastening hole, and the cover plate is provided with a second claw that can be inserted into the second fastening hole. [0014] Compared with the prior art, the air hood cover in the electronic device casing is disposed on the memory body, and is fastened between the fixed frame and the magnetic frame, and the cold air enters the After being described in the casing, it can flow through the memory, between the fixed frame and the magnetic frame, and after the disk holder is fixed, and is discharged to the outside of the casing through the air outlet. It is good to reduce the heat between the memories to reduce the temperature between the memories. [Embodiment] [0015] Referring to FIG. 1 and FIG. 2, a preferred embodiment of the present electronic device housing includes a casing 10 and a windshield 30 mounted in the remote machine felO.
‘ 、.- ，' ' .V 、. - -.· : -：-- [0016] 所述機殼10包括有一底壁11，一垂直於所述底壁11之前 壁13，一平行於所述前壁13之後壁15 (圖中僅顯示一部 分），及一連接並垂直於前壁13及後壁15之側壁17。所 述底壁11上開設有一定位槽112，並安裝有一用以固定電 源供應器之固定架20、一主機板40及一用以裝設光碟機 、硬碟機等資料存儲器之磁架60。所述固定架20位於所 述後壁15及所述側壁17之連接轉角處。所述主機板40位 於所述固定架20之一側，並插設有複數散熱器41及複數 記憶體43。所述散熱器41與所述記憶體43之間留有間隙 表單編號A0101 第6頁/共16頁 、。所述磁架6G上方固定有-固定件7G，並包括1離所 述側壁17之第-側板61、及—與所述侧壁17固定於一起 之並與所述第-側板61平行之第二側板63。所述固定件 7〇開設有—第—卡固孔7卜所述第—側板61之末端邊緣 於靠近所述記憶體43處垂直彎折一支架5〇。所述支架5〇 之上端孔51 L壁13於位於所述场架 ^側開設有進風口 13卜所述後壁15於對應所述固定架 [〇〇17] ㈣設出風σ15ι。所述側壁nf折有一折邊ΐ7ι。所述 邊171開設有一第二卡固孔1711。 杳述導風罩3G包括―可罩設於所述記㈣43之上的罩咬 2，—連接和及—餘35 1述罩設㈣包括一插 ^311及一擋板313。所述擋板313與所述插設部311垂 連接1朗述連接部33相連接之_麟成一斜面。 、^連接部33包括-垂直於所述蓋板35之第一連接部331 及=接所述蓋板35與所述罩設部31之第二連接部333、 仅萼折部335。所述第一連接部331之末端形成一可定 第二所述底壁11上之定位槽112中的定位部3310。所述 迷接部333連接所述罩設部31與所述蓋板35。 板Μ €折連接有—彎折板37 〇所述彎折板37與所述蓋 垂直連接，並設有一可卡扣於所述支架50之扣孔51 内的第一n 第 卞扣部371。所述蓋板35連接所述彎折板37之一 私邊緣"又有一第—^爪353。所述第—^爪353可卡固 述固定件70之第—卡固孔71内。所述蓋板35之垂直 所述第_i 邊緣之第二邊緣設有一第二卡扣部355及一第二 卡爪3 5 7 。所述第一卡扣部355可卡扣於所述側壁17之折 表舉〜101 第7頁/共16頁 M379307 邊171上。所述第二卡爪357可卡固於所述側壁17之折邊 171上的第二卡固孔1711内。所述蓋板35中部開設一開 口 359。 [0018] 請一起參閱圖3，組裝時，將所述導風罩30放置於所述機 殼10内，且使所述罩設部31位於所述記憶體43上，所述 蓋板35位於所述磁架60與所述固定架20之間，所述第一 連接部331之定位柱3310對齊所述底壁11的定位槽112， 所述第一卡爪353對齊所述固定件70之第一卡固孔71，所 述第二卡爪357對齊所述折邊171之第二卡固孔1711。向 下按壓所述導風罩30，使所述第一連接部331之定位柱 3310插入所述底壁11的定位槽112_，所述彎折板37之 第一卡扣部371卡入所述支架50之扣孔51内，所述第一卡 爪353卡扣於所述第一卡固孔71内，所述蓋板35之第二卡 扣部355與所述折邊171卡扣配合，所述第二卡爪357卡 扣於所述第二卡固孔1711内，即可將導風罩30安裝到所 述機殼10内。此時，所述導風罩30之連接部33的第一連 接部331蓋合於所述固定架20之旁侧，所述連接部33之彎 折部335抵靠於所述支架50上，所述蓋板35覆蓋於所述固 定架20與所述磁架60之上。所述導風罩30與所述固定架 20及所述磁架60相結合之位置就完全封閉。 [0019] 使用時，所述機殼10外部之空氣經由所述前壁13的進風 口 131進入機殼10内。其中，一部風冷空氣經由散熱器41 與散熱器41旁側之風扇（圖未示），再經過排氣扇（圖 未示）之作用而經由所述後壁15的通風口（圖未示）排 出機殼10 ;另一部分冷空氣藉由所述導風罩30之引導， 表單编號A0101 第8頁/共16頁 M379307 流經所述記憶體43、所述固定架20與所述磁架20間、所 述固定架20，再藉由位於所述出風口 151處之風扇（圖未 示），經由後板15之出風口151排出機殼10。這樣，就很 好地排除了記憶體43之熱量，大大減少了記憶體43之間 的溫度。 [0020] 綜上所述，本創作確已符合新型專利要求，爰依法提出 專利申請。惟，以上所述者僅為本創作之較佳實施方式 ，舉凡熟悉本創作技藝之人士，爰依本創作之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0021] 圖1是本創作電子裝置殼體之一立體分解圖》 [0022] 圖2是本創作電子裝置殼體中之導風罩的一立體圖。 [0023] 圖3是圖1之一立體組裝圖。 【主要元件符號說明】 [0024] 機殼：10 [0025] 底壁：11 [0026] 定位槽：112 [0027] 前壁：13 [0028] 進風口 ： 131 [0029] 後壁：15 [0030] 出風口 ： 151 表單编號A0101 第9頁/共16頁 M379307 [0031] 侧壁：17 [0032] 折邊：171 [0033] 第二卡固孔： 1711 [0034] 固定架：20 [0035] 導風罩：30 [0036] 罩設部：31 [0037] 插設部：311 [0038] 擋板：313 [0039] 連接部：33 [0040] 第一連接部： 331 [0041] 定位部：3310 [0042] 第二連接部： 333 [0043] 彎折部：335 [0044] 蓋板：35 [0045] 第一卡爪：353 [0046] 第二卡扣部： 355 [0047] 第二卡爪：357 [0048] 開口 ： 359 [0049] 彎折板：37 表單編號A0101 第10頁/共16頁 M379307', .- , ' ' .V , . - -.· : -:-- [0016] The casing 10 includes a bottom wall 11 , a wall 13 perpendicular to the front wall 11 , and a parallel The front wall 13 is followed by a wall 15 (only a portion of which is shown) and a side wall 17 that is joined and perpendicular to the front wall 13 and the rear wall 15. A positioning slot 112 is defined in the bottom wall 11 and a mounting bracket 20 for fixing the power supply, a motherboard 40, and a magnetic frame 60 for mounting a data storage device such as a CD player or a hard disk drive are mounted. The fixing frame 20 is located at a connecting corner of the rear wall 15 and the side wall 17. The motherboard 40 is located on one side of the holder 20 and is provided with a plurality of heat sinks 41 and a plurality of memories 43. A gap is left between the heat sink 41 and the memory 43. Form No. A0101 Page 6 of 16 . A fixing member 7G is fixed to the magnetic frame 6G, and includes a first side plate 61 away from the side wall 17, and a first portion that is fixed to the side wall 17 and parallel to the first side plate 61. Two side plates 63. The fixing member 7 is provided with a first fastening hole 7 and an end edge of the first side plate 61 for bending a bracket 5 垂直 vertically adjacent to the memory 43. The upper end hole 51 L of the bracket 5 壁 is provided with an air inlet 13 on the side of the field frame, and the rear wall 15 is provided with a wind σ15ι corresponding to the fixed frame [〇〇17] (4). The side wall nf is folded with a flange ΐ7ι. The side 171 defines a second fastening hole 1711. The air hood 3G includes a cover bit 2 that can be placed over the cover (four) 43. The connection and the remaining cover include a plug 311 and a baffle 313. The baffle 313 is connected to the insertion portion 311 and is connected to the connecting portion 33. The connecting portion 33 includes a first connecting portion 331 perpendicular to the cover plate 35, a second connecting portion 333 connecting the cover plate 35 and the cover portion 31, and a folded portion 335 only. The end of the first connecting portion 331 forms a positioning portion 3310 in the positioning groove 112 on the second bottom wall 11. The connecting portion 333 connects the cover portion 31 and the cover plate 35. The folding plate 37 is perpendicularly connected to the cover, and is provided with a first n first buckle portion 371 which can be buckled in the fastening hole 51 of the bracket 50. . The cover plate 35 is connected to one of the bent plates 37 and has a first edge. The first claw 353 can be engaged in the first fastening hole 71 of the fixing member 70. A second edge of the first _i edge of the cover plate 35 is provided with a second latching portion 355 and a second latching portion 357. The first fastening portion 355 can be fastened to the side wall 17 by a folding surface of the side wall 17 of the M379307 side. The second claw 357 can be locked in the second fastening hole 1711 on the folded edge 171 of the side wall 17. An opening 359 is defined in the middle of the cover plate 35. [0018] Referring to FIG. 3 together, when assembling, the air hood 30 is placed in the casing 10, and the cover portion 31 is located on the memory body 43, the cover plate 35 is located. Between the magnetic frame 60 and the fixing frame 20, the positioning post 3310 of the first connecting portion 331 is aligned with the positioning slot 112 of the bottom wall 11, and the first claw 353 is aligned with the fixing member 70. The first fastening hole 71 is aligned with the second fastening hole 1711 of the flange 171. Pressing the air guiding cover 30 downwardly, the positioning post 3310 of the first connecting portion 331 is inserted into the positioning groove 112_ of the bottom wall 11, and the first fastening portion 371 of the bending plate 37 is engaged with the The first clamping claw 353 is engaged in the first fastening hole 71, and the second fastening portion 355 of the cover 35 is snap-fitted with the folded edge 171. The second claw 357 is snapped into the second fastening hole 1711 to install the air guiding cover 30 into the casing 10. At this time, the first connecting portion 331 of the connecting portion 33 of the air guiding cover 30 covers the side of the fixing frame 20, and the bent portion 335 of the connecting portion 33 abuts against the bracket 50. The cover plate 35 covers the fixing frame 20 and the magnetic frame 60. The position where the air guiding cover 30 is combined with the fixing frame 20 and the magnetic frame 60 is completely closed. [0019] When in use, air outside the casing 10 enters the casing 10 via the air inlet 131 of the front wall 13. Wherein, an air-cooled air passes through the radiator 41 and a fan (not shown) on the side of the radiator 41, and then passes through the vent of the rear wall 15 through the action of an exhaust fan (not shown) (Fig. The casing 10 is discharged; another portion of the cold air is guided by the air hood 30, Form No. A0101, page 8 / page 16 M379307 flows through the memory 43, the holder 20 and the The magnetic frame 20 and the fixed frame 20 are discharged from the casing 10 via the air outlet 151 of the rear plate 15 by a fan (not shown) located at the air outlet 151. Thus, the heat of the memory 43 is well excluded, and the temperature between the memories 43 is greatly reduced. [0020] In summary, the creation has indeed met the requirements of the new patent, and the patent application is filed according to law. However, the above descriptions are only preferred embodiments of the present invention. Those who are familiar with the creative techniques, equivalent modifications or changes made in accordance with the spirit of this creation, shall be covered by the following patent applications. BRIEF DESCRIPTION OF THE DRAWINGS [0021] FIG. 1 is an exploded perspective view of one of the housings of the electronic device of the present invention. [0022] FIG. 2 is a perspective view of the air guiding cover in the housing of the electronic device. 3 is an assembled, isometric view of FIG. 1. [Main component symbol description] [0024] Case: 10 [0025] Bottom wall: 11 [0026] Positioning groove: 112 [0027] Front wall: 13 [0028] Air inlet: 131 [0029] Rear wall: 15 [0030] ] Air outlet: 151 Form No. A0101 Page 9 / Total 16 pages M379307 [0031] Side wall: 17 [0032] Folding: 171 [0033] Second fixing hole: 1711 [0034] Fixing bracket: 20 [0035 Air deflector: 30 [0036] Cover: 31 [0037] Insert: 311 [0038] Baffle: 313 [0039] Connection: 33 [0040] First connection: 331 [0041] Positioning :3310 [0042] Second connection: 333 [0043] Bend: 335 [0044] Cover: 35 [0045] First jaw: 353 [0046] Second snap: 355 [0047] Second Claw: 357 [0048] Opening: 359 [0049] Bending plate: 37 Form No. A0101 Page 10 of 16 M379307
[0050] [0051] [0052] [0053] [0054] [0055] [0056] [0057] [0058] [0059] [0060] 第一卡扣部：371 主機板：40 散熱器：41 記憶體：43 支架：50 扣孔：51 磁架：60 第一側板：61 第二側板：63 固定件：70 第一卡固孔：71[0060] [0058] [0059] [0060] [0060] [0060] First snap portion: 371 motherboard: 40 heat sink: 41 memory :43 Bracket: 50 Buttonhole: 51 Magnetic frame: 60 First side plate: 61 Second side plate: 63 Fixing member: 70 First fixing hole: 71
表單编號A0101 第11頁/共16頁Form No. A0101 Page 11 of 16