M378476 五、新型說明： 【新型所屬之技術領域】 本新型是有關於一種除塵裝置，特別是指一種用於半 導體元件之除塵裝置。 【先前技術】 半導體元件於完成封裝作業後通常會排列裝盛於一托 盤内，以方便曰後運送及組裝。然而，空氣中的污染塵會 在存放與運送過程中附著於該托盤内的所述半導體元件上 ，污染塵會造成半導體元件操作特性變差甚至導致半導體 元件損壞，因此必須在組裝前對置放於托盤内的半導體元 件進行清潔，以確保組裝後的產品品質。 參閱圖1，現有用於半導體元件的除塵方式是使用一能 輸出高壓氣流的高壓氣搶13對所述半導體元件u進行除塵 ，將附著於所述半導體元件u上的污染塵吹落並達到清潔 的效果。 然而因承載所述半導體元件u之托盤12僅設置多數凹 槽m供容納各半導體元件n’缺乏任何固定所述半導體 元件11之設計，以致當該高壓氣槍13對於所述半導體元件 η吹送高壓氣體進行清潔的同時，—旦風力大小控制不妥 或是該高壓氣搶13對所述半導體元件u的吹風距離拿捏不 當’非常容易吹亂所述半導體元件u的排序，甚至將所述 半導體元件11自該托盤12吹落，造成必須再以人力將掉落 的半導體元件u放回該托盤12的凹槽121内而導致作業上 虛耗人力，所述半導體元件u甚至也可能因碰撞而損壞， 3 M378476 造成生產成本的損失。 另外，該高壓氣槍13形成的高壓氣流過於集中，容易 使吹入所述凹# 121内的氣流反彈形成擾流氣旋，造成污 ㈣四處飛揚並污染環境’進而附著於其他的半導體元件 11形成二次污染，難以確實達到清潔的效果。 【新型内容】 因此，本新型之㈣，即在提供一種用以清潔並防止 半導體元件掉落的半導體元件之除塵裝置。 於是，本新型半導體元件之除塵裝置是適用於多數放 置於一托盤上的半導體元件，該除塵裝置包含一導引單元 、一限位單元，及一除塵單元。 該導引單元穩固地支撐於地面上。 該限位單元設置於該導引單元上，該限位單元包括一 用以對所述半導體元件提供限位作用的遮罩網件，及多數 間隔設置於該導引單元上並與該遮罩網件相連接且能帶動 該遮罩網件升降位移之升降驅動件。 該除塵單元包括一設於該導引單元的除塵本體，及一 认於該除塵本體内的送風管，該送風管具有一形成於該除 塵本體上且供一外界氣體輸入的入風孔、一形成於該除塵 本體上且朝向該遮罩網件的出風孔，藉此所述外界氣體輸 入該入風孔並經該送風管而由該出風孔朝向該遮罩網件輸 出’以對所述半導體元件進行吹風清潔作用。 本新型之功效在於··藉該遮罩網件遮蔽所述半導體元 件’該除塵單元透過該遮罩網件吹送除塵氣流對所述半導 4 駆叙坊閱圖2、圖4 ’在使㈣’所述升降驅動件42先是 -遮罩網件41上升’使裝盛有半導體元件21的托 二可置於所述滑軌31上並位於該遮罩網件41下方，待該 置妥後所述升降驅動件42再驅動該遮罩網件Μ 下降’使該遮罩網件41覆蓋住該托盤22並將所述半導體 兀件21限位於所述凹槽221内。 .二閱圖2與圖3 ’當所述半導體元件21被該遮罩網件 41遮蔽於該托盤22内之後，啟動該送風機8及該抽風機9 藉該喊機8將氣流輸人該除塵單元5之人風孔52ι並 經由該整流室⑵⑮流成敎的除塵氣流，進而由該出風 孔522朝向該遮罩網件41吹出，並透過該遮罩網件q對 該托盤22㈣所述半導體元件21進行吹風清潔，再利用 該抽風機9對該吸塵單元6的容室62抽風，進而使前述被 吹揚的污染塵經由該吸塵單元6的吸塵孔63被吸入該容室 62中再由該排出孔64排出。 >閱圖3與圖5 ’藉由該驅動單元7之伸縮桿u的伸 縮以帶動該滑動座32沿所述滑軌31相對於該遮罩網件Μ 來回移動。該除塵單元5與該吸塵單“並隨著該滑動座 32同步位移，同時藉除塵氣流將所述半導體元件21的污染 塵吹起’相該吸塵以6將㈣塵排丨，達 = 導體元件21進行清潔的效果。 κ 當該滑動座32沿所述滑軌31往返一趟之後該除塵 單元5與該吸麈單元6就停止運作，接著所述升降驅=件 42會驅動該遮罩網件41上升使該托盤22易於取出。 M378476 特別說明的是，在本實施例中，該除塵單元5與該吸 塵單元6是往返皆進行除塵與吸塵，當然也可以只在該驅 動單几7的伸縮桿72將該滑動座32拉靠近該驅動缸71時 進行清潔，當該伸縮桿72將時該滑動座32推遠離該驅動 缸71時，該除塵單元5與吸塵單元6就停止運作。 相較於現有對於半導體元件21的除塵方式而言，本新 型半導體元件之除塵裝置藉由該遮罩網件41所提供的限位 功能，使所述半導體元件21經過氣流吹襲卻依然不會脫離 该托盤22，避免所述半導體元件21因為被該除塵單元$吹 落或被該吸塵單元6吸入而造成損壞與作業上的不便。並 以4除塵單元5的整流室523將輸入的氣體整理成穩定的 除塵氣流，避免污染塵脫離所述半導體元件21後四處飛揚 k成所述半導體元件21二次污染。 此外，製程上不須針對各種形式之托盤22進行更換， 該遮罩網件41可相對各種形式之托盤22進行覆蓋限位的 功能，所以各式之托盤22可直接使用，增進工作效率。 ^參閱圖6,本新型半導體元件之除塵裝置之第二較佳實 大致類似於該第一較佳實施例，不同之處在於：該導 引早凡3還包括-設於所述滑軌31之間並用以將該托盤η ，送通過該遮罩網件41下方的輸送帶33，及—設於該導引 二:3的所述支揮件30上並用以連動該輸送帶33轉動的 勒送驅動件34 〇在本實施例中該輸送驅動件爿為可以連 /輸达f 33的滾輪，當然也可以使用鏈條或其他可以連 動輪送帶33的方式β 8 么在使用時，該托盤22由該輸送帶33 it入並位於該遮 罩網件41下方時，該輸送驅動件34會停止運作，然後所 迷升降驅動件42會驅動該遮罩網件41下降並將所述半導 元件21限位於所述凹槽221内。之後再以該驅動單元7 使該除塵單70 5與該吸塵單元6沿所述滑軌3 1來回移動並 進行β潔。在完成來回一趟的清潔後，所述升降驅動件Μ 驅動該遮罩網件41升起，該輸送驅動件34連動該輸送帶 進而將》亥托盤22送出。藉由該輸送帶33與該輸送驅動 件34將该托盤22送入並進行清潔的自動化作業模式可進 一步提升作業效率。 示上所述’本新型半導體元件之除塵裝置以該限位單 疋4的遮罩網件41將所述半導體元件21遮蔽限位於該托 盤22的所述凹槽221内，該除塵單元5透過該遮罩網件 °人送除塵氣流可避免所述半導體元件21在清潔的過程中被 吹落該托盤22而造成損壞。而該吸塵單元6也是透過該遮 罩網件41對所述半導體元件21進行清潔，因此，該遮罩 網件41也可以避免所述半導體元件21被吸入該吸塵孔63 内。該除塵單元5更藉由該整流室523使輸入的氣流轉變 成穩定的除塵氣流’以穩定的除塵氣流對所述半導體元件 21進行清潔時，可大幅減少由於擾流氣旋產生的揚塵造成 二次污染’故確實能達成本新型之目的。 惟以上所述者’僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 M378476 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一示意圖，說明現有使用高壓氣搶的除塵方式 ， 圖2是一局部剖視圖，說明本新型半導體元件之除塵 裝置的第一較佳實施例； 圖3疋一俯視圖，說明該第一較佳實施例之驅動單元 的伸縮桿伸長時； 圖4疋一側視圖，說明該第一較佳實施例的該遮罩網 件下降； 圖5疋一俯視圖，說明該第一較佳實施例之驅動單元 的伸縮桿縮短時；及 圖6是一俯視圖，說明本新型半導體元件之除塵裝置 的第二較佳實施例。 10M378476 V. New description: [New technical field] The present invention relates to a dust removing device, and more particularly to a dust removing device for a semiconductor component. [Prior Art] After completing the packaging operation, the semiconductor components are usually arranged in a tray to facilitate subsequent transportation and assembly. However, the dust in the air may adhere to the semiconductor component in the tray during storage and transportation, and the dust may cause the semiconductor component to deteriorate in operational characteristics or even cause damage to the semiconductor component, and therefore must be placed before assembly. The semiconductor components in the tray are cleaned to ensure the quality of the assembled product. Referring to FIG. 1, a conventional dust removing method for a semiconductor element is to perform dust removal on the semiconductor element u using a high-pressure gas 13 capable of outputting a high-pressure air stream, and to blow up and clean the dust adhering to the semiconductor element u. Effect. However, since the tray 12 carrying the semiconductor element u is provided with only a plurality of recesses m for accommodating the respective semiconductor elements n' lacks any design for fixing the semiconductor elements 11, so that when the high-pressure air gun 13 blows high-pressure gas to the semiconductor elements η At the same time of cleaning, if the wind power is not properly controlled or the blowing distance of the high-voltage gas 13 is insufficient for the semiconductor element u, it is very easy to blow up the order of the semiconductor elements u, even the semiconductor element 11 Since the tray 12 is blown off, it is necessary to manually put the dropped semiconductor element u back into the recess 121 of the tray 12, resulting in labor intensive work, and the semiconductor element u may even be damaged by collision. 3 M378476 caused a loss of production costs. In addition, the high-pressure airflow formed by the high-pressure air gun 13 is too concentrated, and the airflow blown into the recess #121 is easily rebounded to form a spoiler cyclone, causing the dirt (four) to fly around and pollute the environment' and then adhere to other semiconductor components 11 to form two. Secondary pollution, it is difficult to achieve a clean effect. [New content] Therefore, the fourth aspect of the present invention provides a dust removing device for cleaning and preventing a semiconductor element from falling. Therefore, the dust removing device of the novel semiconductor device is suitable for a plurality of semiconductor components placed on a tray, and the dust removing device comprises a guiding unit, a limiting unit, and a dust removing unit. The guiding unit is firmly supported on the ground. The limiting unit is disposed on the guiding unit, and the limiting unit includes a mask mesh member for providing a limiting function on the semiconductor component, and a plurality of spacers are disposed on the guiding unit and are opposite to the shielding unit The lifting member of the mesh member is connected and can drive the lifting and lowering movement of the mask net member. The dust removing unit includes a dust removing body disposed on the guiding unit, and a blowing pipe recognized in the dust removing body, the air supply pipe has an air inlet hole formed on the dust removing body and supplied with an external gas, An air outlet hole formed on the dust removing body and facing the mask net member, wherein the outside air is input into the air inlet hole and is outputted from the air outlet hole toward the mask net member through the air supply pipe. The semiconductor element performs a blow cleaning function. The effect of the novel is that the semiconductor element is shielded by the mask net member. The dust removing unit blows the dust-removing airflow through the mask net member to the semi-conductor. FIG. 2 and FIG. 4 'in the fourth (4) 'The lifting drive member 42 is first - the cover net member 41 is raised' so that the holder 2 containing the semiconductor component 21 can be placed on the slide rail 31 and under the mask net member 41, after the setting is completed The lifting drive member 42 drives the masking mesh member 下降 to lower the cover member 41 to cover the tray 22 and to confine the semiconductor element 21 to the recess 221 . 2 and FIG. 3 'After the semiconductor element 21 is shielded in the tray 22 by the mask net member 41, the blower 8 is activated and the blower 9 is used to input the airflow to the dust collector. The human air hole 521 of the unit 5 flows through the rectifying chamber (2) 15 to form a dust removal airflow, and is further blown toward the mask net member 41 by the air outlet hole 522, and is passed through the mask net member q to the tray 22 (4). The semiconductor element 21 is blown clean, and the chamber 62 of the dust suction unit 6 is exhausted by the exhaust fan 9, and the blown dust is sucked into the chamber 62 through the dust suction hole 63 of the dust suction unit 6. It is discharged from the discharge hole 64. > Read Fig. 3 and Fig. 5' by the extension of the telescopic rod u of the drive unit 7 to drive the slide base 32 to move back and forth along the slide rail 31 relative to the mask net Μ. The dust removing unit 5 and the dust collecting unit "and synchronously displace with the sliding seat 32, and at the same time, the dust of the semiconductor element 21 is blown off by the dust airflow", and the dust is drained by 6 to reach the conductor element. The effect of cleaning is performed. κ After the sliding seat 32 is reciprocated along the sliding rail 31, the dust removing unit 5 and the suction unit 6 are stopped, and then the lifting device 42 drives the mask net. The rise of the member 41 makes the tray 22 easy to take out. M378476 Specifically, in the embodiment, the dust removing unit 5 and the dust collecting unit 6 perform dusting and vacuuming on the reciprocating unit, and of course, only the driving unit 7 The telescopic rod 72 cleans when the sliding seat 32 is pulled close to the driving cylinder 71. When the telescopic rod 72 is pushed away from the driving cylinder 71, the dust removing unit 5 and the dust collecting unit 6 stop operating. Compared with the existing dust removing method for the semiconductor device 21, the dust removing device of the novel semiconductor device can prevent the semiconductor component 21 from being blown by the airflow by the limiting function provided by the masking mesh member 41. The tray 2 2. The semiconductor element 21 is prevented from being damaged and inconvenient in operation due to being blown by the dust removing unit $ or sucked by the dust suction unit 6. The gas is stabilized by the rectifying chamber 523 of the 4 dust removing unit 5 The dust-removing airflow is prevented from being polluted by the semiconductor element 21 to become secondary pollution of the semiconductor component 21. Further, the process does not need to be replaced for various forms of the tray 22, and the mask mesh member 41 can be relatively various. The tray 22 of the form performs the function of covering the limit, so that the trays 22 of various types can be directly used to improve work efficiency. Referring to FIG. 6, the second preferred embodiment of the dust removing device of the novel semiconductor component is substantially similar to the first comparison. a preferred embodiment, the difference is that the guide 3 includes: a conveyor belt 33 disposed between the slide rails 31 for feeding the tray η through the mask net member 41, and a delivery drive member 34 disposed on the support member 30 of the guide 2:3 for interlocking the rotation of the conveyor belt 33. In the embodiment, the delivery drive member is connectable/deliverable to f33. Roller, of course, can also make By means of a chain or other way of interlocking the belt 33, when in use, when the tray 22 is inserted by the conveyor belt 33 and located below the mask net 41, the transport drive 34 will cease to operate and then The lifting and lowering drive member 42 drives the masking net member 41 to lower and confine the semi-conductive member 21 to the recess 221. The dust removing unit 70 5 and the dust collecting unit 6 are then driven by the driving unit 7. Moving back and forth along the slide rail 31 and performing β cleaning. After the cleaning is completed, the lifting drive member Μ drives the mask net member 41 to rise, and the conveying driving member 34 links the conveyor belt. The "Hui tray 22" is sent out. The automated operation mode in which the tray 22 is fed and cleaned by the conveyance belt 33 and the conveyance drive member 34 can further improve work efficiency. The dust removing device of the present invention is characterized in that the semiconductor element 21 is shielded from the recess 221 of the tray 22 by the mask mesh member 41 of the limiting unit 4, and the dust removing unit 5 transmits The mask net member sends a dust-removing airflow to prevent the semiconductor component 21 from being blown off the tray 22 during cleaning to cause damage. The dust collecting unit 6 also cleans the semiconductor element 21 through the mask net member 41. Therefore, the mask net member 41 can also prevent the semiconductor element 21 from being sucked into the dust collecting hole 63. The dust removing unit 5 further converts the input airflow into a stable dust-removing airflow by the rectifying chamber 523. When the semiconductor component 21 is cleaned by the stable dust-removing airflow, the dust generated by the turbulent cyclone can be greatly reduced. Pollution can indeed achieve the purpose of this new type. However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the simple equivalent changes and modifications made by the novel application scope and the novel description. M378476 is still covered by this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a conventional dust removing method using a high-pressure gas grab, and FIG. 2 is a partial cross-sectional view showing a first preferred embodiment of the dust removing device of the novel semiconductor device; FIG. FIG. 4 is a side elevational view showing the mask net member of the first preferred embodiment descending; FIG. 5 is a top view illustrating the first A telescopic rod of a driving unit of a preferred embodiment is shortened; and FIG. 6 is a plan view showing a second preferred embodiment of the dust removing device of the novel semiconductor device. 10