五、新型說明： 【新型所屬之技術領域】 -本創作為提供-種電子元件 -牢固的與載帶接合的電子元件封裝帶之結構。 4兀正且 【先前技術】 造商:發茲領t ’’元件通常由製 在一個制;生应式砌〆,—」下個衣k商或用戶以作進一步處理。如：V. New description: [New technical field] - This creation provides a kind of electronic component - a structure of a solid electronic component packaging tape bonded to a carrier tape. 4兀正和 [Prior Art] Manufacturer: The hairpin t ’’ component is usually made in one system; the raw styling is built, and the next one is used for further processing. Such as:
-個製造商戋用二了製造出半導體晶片後，包裝並輸送到另-►的裝置丄:上述元其安裝在印刷線路板或類似 I PS)、電容5¾、、連接$、雙列直插式處理器（D 通，包裝在載提片片 容等 ，然’後捲繞成捲盤運送J用芦口 盍帶將相對應的口袋密封 元件被取出並被安“:在，用時’蓋帶從載帶表面剝離， 易地從載帶剥離，右，應用中，蓋帶必須可以容 脫落或不穩定的剝離。力要具有一疋的穩定性，才不會因此發生 有載=善=::=;:出一種封裝裝置，其主要包括 間設有複數個隔以向佈，平行的邊緣表面，邊緣表面之 蓋在载帶上，蓋帶採 電子元件。蓋帶覆 表面上，從而开n広接的方式結合在載帶的兩個邊缘 元件。㈣W雷射照射熱職區域，以封概置在凹部 尚待ίΐ述電子元件龍織纽科，為骑存在下觸題與缺失 此種接合方式只有敎 封落對於蓋帶中^ M377695 是以，要如何解決上述習用之問題鱼 與從事此行業之相關廠商所錢研究改善之方向作之創作人 【新型内容】 方評估及考量’並以丨:③：：土::搜集相關資料’經由多 修改，始設計出此種有以J以=::不斷試作及 封裝帶之結騎型專财。 ▼接合的電子元件 成’ -載帶上接合-蓋帶所構 j為線條封裝、點狀封裝哎令4嫜 丁 了在其方式 之此種 =式術並 更完整與載帶接合且不易脫落之實裝)的封裝部使蓋帶得以 【實施方式】 圖就f ’本創作所制之技術手段及構造，兹繪 -蓋帶3該嶋裝帶1係私^ 之縱_係界定有與綱- A manufacturer used two devices to make a semiconductor wafer, packaged and transported to another -► device: the above element is mounted on a printed circuit board or similar I PS), a capacitor 53⁄4, a connection $, a double in-line Type processor (D-pass, packaged in the carrying sheet capacity, etc., then 'wrap the reel into a reel to transport the J with the gusset strap to take the corresponding pocket sealing element out and be ": in use" The cover tape is peeled off from the surface of the carrier tape, and is easily peeled off from the carrier tape. In the right application, the cover tape must be able to be peeled off or unstable. The force must have a stable stability, so that the load does not occur. ::=;: A packaging device mainly comprises a plurality of spaced-apart fabrics, parallel edge surfaces, and the edge surface is covered on the carrier tape, and the cover tape is coated with electronic components. The way of opening and closing is combined with the two edge elements of the carrier tape. (4) The W laser is irradiated into the hot area, so that the seal is placed in the concave part, and the electronic component Long-woven Newcomer is still needed. The way to join is only the 敎 对于 对于 对于 对于 ^ ^ ^ M M M M M M M M M The above-mentioned problems of the fish and the creators of the research and improvement of the relevant manufacturers engaged in this industry [new content] Party evaluation and consideration 'and 丨: 3:: soil:: collecting relevant information' through multiple modifications, I have designed this kind of knot-type special-purpose money with J:=:: continuous trial and packaging tape. ▼Joined electronic components into '-------------------------------------------------------- The package part of the method of making the type of the method is more complete and the carrier is not easy to fall off, and the cover is made. And structure, drawing - cover tape 3, the armored belt 1 series private ^ vertical _ system defined with
1占4 3 1可為自轉層，而蓋帶3於兩側黏合部3 !二〜J M377695 係採用熱 下，33η袭組3設計，茲就本創作之使用作動情形說明如 平面圖及蓋帶剝除之動作示音愤佳實施例之 畀―士私/ 心圆由圖中可清楚看出，該載帶2上係 =有=可收谷有％子元件4的容置槽21，該電子元件4可為電 曰曰肢、連接器、雙列直插式處理器（ ^ 記憶體晶片哎阻犄哭算耸r邮、+-士、丄f 5 )电谷态、閘陣列、 於判-9 μ-:-寺所〜子讀4種類並*侷限於内），而 2偏又有仔以將該容置槽2 1完整封合的蓋帶3，該蓋Ξ 有ίί::2 ’且於該等黏合部31之間係界3 _ί 3，俾备使用者欲封合該等容置槽2 1時，可採用： 線雰量，使5 只需輕易剝除該蓋帶3即可不易脫洛，而當使用者欲剝離時 由圖創作第—較佳實施例之實施示意圖， 的容晉揭=看出載W a上係界定有數個供收容電子元件4 a 的莒帶^二；載帶2 3上係設有供完整封裝該容置槽2 1 a 條i旦口 =，！*3可細三條點狀封裝部3 2 a (此封裝線 、緊實，且不易脫落。…心心3 a於封裝時更為密合 由圖創作第二較佳實施例之實施示意圖， 的容載 界定有數個供收容電子元件4 b 二=載帶2 b上係設有供完整封裝該容置槽2 1 b 數量。A心“盍可3㈣物細線條封裝部3 2 b (此封裝線條 緊ί:ί=脫^侷限於内）’使該蓋帶3 b於封裝時更為密合、 由圖?ί、ΪΚϊ所示，，ίί本創作第三較佳實施例之實施示意圖， 的容置样Κ f載c上係f定有數個供收容電子元件4 c 的罢帶^ =而該載帶2 c上係設有供完整封㈣容置槽2 1 c 的43 c，該盍帶3 c係可採用點狀封裝部3 2 c (此封裝線條數 5 M377695 秘限於内)，使該蓋帶3c於封裝蚊為密合、緊 由円ΐίΐί七圖所示，係為本創作第四較佳實施例之實施示意圖， ΞίΐΖί’域帶2 d上係界定魏個做容電子元件4 d 的蓋mu 2 d上係設有供完整封裝該容置槽21 d 藉由該不同封裝方式（線 3 2使蓋帶3得以更完整與載帶全，）的封裝部 側係界定有與載帶2接合 ’膽該蓋帶3兩 部3 1，且習知採用全‘;封知益未有此自黏的黏合 術所在。 …’式，因此，本創作具有習之所未思的技 達到目帶之結構於使用時，為確實能 專利之申請要件，爰依法提㈣:：，二用f優異之創作，為符合新型 障創作人之辛苦創作，崎冑委早日賜准本創作，以保 ，創作人定當竭力配合，實感=番委有任何稽疑，請不吝來函指示 M377695 【圖式簡單說明】 '第一圖係為本創作較佳實施例之立體透視圖。 '第二圖係為本創作較佳實施例之平面圖。 .第三圖係為本創作蓋帶剝除之動作示意圖。 第四圖係為本創作第一較佳實施例之實施示意圖。 第五圖係為本創作第二較佳實施例之實施示意圖。 第六圖係為本創作第三較佳實施例之實施示意圖。 第七圖係為本創作第四較佳實施例之實施示意圖。 【主要元件符號說明】 籲封裝帶····1 載帶.....2、2a、2b、2c、2d 容置槽· · · ·21、2ΐ3、211^、21(：、2 蓋帶.....3、3a、3b、3c、3d 黏合部····31 封裝部···*32、32a、32b、32c、3 電子元件· · ·4、43、4ΐ3、4<:、4ά1 accounted for 4 3 1 can be the self-rotating layer, and the cover tape 3 is on the two sides of the adhesive portion 3! 2 ~ J M377695 is used under the heat, 33η 袭 group 3 design, the use of this creation is illustrated as the plan and cover tape The action of stripping is shown in the example of the best example of the stripping. The private label of the strip is clearly visible in the figure. The carrier tape 2 has a receiving slot 21 with a % sub-element 4. The electronic component 4 can be an electric squat, a connector, a dual in-line processor (^ memory chip 哎 犄 犄 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) It is judged that -9 μ-:--the temple-to-sub-read 4 types and *limited to the inside), and the second-side bias has the cover tape 3 which completely seals the accommodating groove 2 1 , and the cover has ίί:: 2 'and the boundary between the adhesive portions 31 3 _ ί 3, when the user wants to seal the accommodating grooves 2 1 , the linear atmosphere can be used, so that the cover tape can be easily peeled off by 5 3 can be difficult to take off, and when the user wants to peel off, the schematic diagram of the implementation of the preferred embodiment is shown in the figure, and it is seen that there are several 界定 for accommodating the electronic component 4 a on the wa. With ^2; carrier tape 2 3 is provided for The whole package accommodating groove 2 1 a strip port denier i = ,! *3 can be three thin dot-shaped package parts 3 2 a (this package line is tight, and it is not easy to fall off.... The heart 3 a is more closely sealed at the time of packaging, and the layout of the second preferred embodiment is created. The load defines a plurality of electronic components for receiving 4 b. The second carrier tape 2 b is provided with a number for accommodating the accommodating groove 2 1 b. A core "盍3 (4) fine line encapsulation portion 3 2 b (this package line Tightly: ί = ^ 局限于 局限于 ) ' ' 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖 盖The holding device f is provided with a plurality of stops for receiving the electronic component 4 c ^ and the carrier tape 2 c is provided with 43 c for the complete sealing (4) receiving groove 2 1 c. The belt 3 c series can adopt the dot-shaped encapsulation portion 3 2 c (the number of the package lines is 5 M377695 is limited to the inside), so that the cover tape 3c is tightly sealed in the packaged mosquito, and is closely shown by the figure 七ίΐί A schematic diagram of the implementation of the fourth preferred embodiment, the cover mu 2 d defining the Wei electronic component 4 d is provided on the cover 2 d for the complete encapsulation of the accommodating groove 21 d by the The encapsulation side of the same packaging method (the line 3 2 enables the cover tape 3 to be more complete and the carrier tape is fully), and the side of the package portion is defined to be engaged with the carrier tape 2, and the cover tape 3 is two parts 3 1 and is conventionally used; Feng Zhiyi does not have this self-adhesive bonding technique. ...', therefore, this creation has the technology of the unintentional technology to achieve the structure of the eye strap, when it is used, it is a patentable application requirement, and it is legally mentioned (4) ::, the use of f excellent creation, in order to meet the hard work of the new type of creator, the Rugged Committee has given this creation as soon as possible, in order to protect, the creator must make every effort to cooperate, the real sense = the CP has any doubts, please do not hesitate Instruction M377695 [Simple Description of the Drawings] 'The first drawing is a perspective view of a preferred embodiment of the present invention. 'The second drawing is a plan view of a preferred embodiment of the creation. The third drawing is a creative cover tape. The fourth figure is a schematic diagram of the implementation of the first preferred embodiment of the present invention. The fifth figure is a schematic diagram of the implementation of the second preferred embodiment of the present invention. A schematic diagram of the implementation of the preferred embodiment. Schematic diagram of the implementation of the four preferred embodiments. [Description of main component symbols] 封装Package tape····1 Carrier tape 2.. 2, 2a, 2b, 2c, 2d accommodating groove · · · · 21, 2ΐ3, 211^, 21(:, 2 cover tapes.....3, 3a, 3b, 3c, 3d Bonding parts····31 Package parts···*32, 32a, 32b, 32c, 3 Electronic components· ·4, 43, 4ΐ3, 4<:, 4ά