M368272 五、新型說明： 【新型所屬之技術領域】 種適用於去除積 本創作係關於一種除錫裝置，尤指 體電路元件表面上的鮮錫之除錫裝置。 5 ' 【先前技術】 ' 目前常見之積體電路元件，例如各式晶片组、中央處 理器（CPU)、快閃記憶體晶片（Flash)、通訊用Ic晶片等或 其他使用球閉陣列BGA(Ball Grid Array)封裝晶片技術之 K)產品，其重工（rework)作業時之清除錫球、錫渣動作，習 知是先塗佈助焊劑於錫球表面，再利用絡鐵的熱度運用吸 錫線將錫球或錫渣進行炫解、吸附與清除動作。但此種人 工#作技術’必須使用烙鐵加熱吸錫線直接對錫球或錫法 實施觸屢之動作，極易造成晶片板材損毀和刮傷、晶片產 15品上之焊墊剝離、或L型晶點被污染等現象，此外，還有 人工除錫速度緩慢及重工作業品質不一等缺點。 ^因此，有人提出一種除錫裝置改良，請參閱圖i，圖J 係習知積體電路元件之除錫裝置改良示意圖，其顯示治具 座8 〇上之除錫治具81固定有積體電路元件8例如球閘陣列 2〇 (BGA)封裝B曰片，炼錫罩82由上往下提供熱氣熔解積體電 路元件上之錫球或錫渣，再以除錫風刀83以傾斜之角度由 上向下將熔解之錫水吹離、並集中吹至盛錫槽84中。此種 習知除錫技術之操作雖較前述手工使用吸錫線來得方便， 但在錫水吹離的過程令’錫水常因流竄於積體電路元件8 M368272 之表面上，由於錫水與金屬焊墊材質之親和力以及錫水向 下之重力’仍會黏附污染到積體電路元件8上表面之其他焊 墊和L型晶點。 據此，習知技術中不論以吸錫線或除錫裝置清除踢球 5方A纟仍會造成焊塾和晶點污染之缺點，造成錫球重 工良率降低、速度緩慢。由此可知，如何達成一種能自動 化作業、又能大幅減少人力成本、且更能提高錫球重工的 良率和速度之除錫裝置，實在是產業上的一種迫切需要。 10 【新型内容】 本創作提供一種除錫裝置，用以除去積體電路元件， 例如球閘陣列（BGA)封裝晶片之表面上的鲜錫，例如錫球 或錫渣。其中，本創作之除錫裝置具有夹持治具、熱風吹 管、及承接|管。夾持治具可拆卸式央持著積體電路元件， 並使積體電路元件表面上之鲜錫朝向下方；熱風吹管组設 於夾持治具下方，熱風吹管具有吹出口，例如漸縮管 (nozzle) ’可提供一正壓之高溫熱風由下往上對應吹向積體 電路元件表面上之銲錫，以將其熱熔成為錫水並能利用重 力滴落；承接吸管組設於夾持治具下方，承接吸管具有承 20接入口，例如漸張管（diffuser)，較佳地是可提供一負壓並 對應承接在積體電路元件了彳，以0及取前述熱炼之錫水並 承接住因重力滴落下來之錫水，承接吸管之另一端更連接 至盛錫槽，用以回收吸回來之銲錫。藉此，本創作之除錫 M368272 裝置可方便且快速地清除積體電路元件表面上之_，俾 能提高錫球重工#良率和速度、且大幅減少人力成本。 本創作之除錫裝置中，夾持治具可具有治具座、及抵 緊件’積體電路元件可被夾持抵緊於治具座與抵緊件之 5間，前述抵緊件亦可改用其他如嵌卡、夹固、扣合·..等之 可拆#式等效央持構造以將積體電路元件夹持固定亦可。 .抵緊件還可包括有彈性件，其可以是愿縮彈箸，亦可改用 氣壓虹、油壓紅等亦可’以提供一彈性預力頂抵於治具座 並夾持住積體電路元件。前述彈性件亦可改用螺鎖元件以 10鎖固方式夾持住積體電路元件亦可。 *本創作之除錫裝置，#可更包括有加熱器，例如熱風 B、或電熱器...等或其他等效加熱裝置皆可，丨可組設於 二央持m具下方，加熱器可提供熱能以對應加熱積體電路 元件表面上之銲錫，藉以加速其熱熔成為錫水。 15 【實施方式】 "月參閱圖2為本創作一種除錫裝置之實施例的配置 圖’其，示本實施例之除錫裝置係可設置於—卫作平台7 或疋配合—輸送帶（圖未示）設置為較佳，用以除去一 積，電路7〇件6，例如—球閘陣列（BGa)封裝晶片之表面上 的銲錫6卜例如錫球或職等。圖2顯示本實關之除錫裝 置^"括&持治具1、一熱風吹管2、及-承接吸管3。 20 M368272 圖3為本實施例之夾持治具1之立體圖，其係可拆卸式 夾持著一或多個積體電路元件6，並使積體電路元件6表面 上之銲錫61朝向下方。 圖2可見本實施例之熱風吹管2係組設於夹持治具丄下 5方’熱風吹管2包括有一吹出口 21，例如一漸縮管（n〇zzle) 為最佳，其係提供一正壓之高溫熱風由下往上對應吹向積 體電路元件6表面上之銲錫61，以將其熱熔成為錫水並能利 用重力滴落。圖2更顯示承接吸管3亦組設於夾持治具ι下 方，承接吸管3包括有一上方之承接入口 31，較佳地是一漸 1〇張管（diffuser)，以對應承接在積體電路元件6下方，以承受 前述熱熔之錫水並承接住因重力滴落下來之錫水，若能提 供一負壓以吸取效果會更佳。承接吸管3之另一端32更連接 有一盛錫槽4，用以回收吸回來之銲錫61。 於本實施例中，夾持治具丨包括有一治具座11、及一抵 15緊件12,積體電路元件6係被夾持抵緊於治具座11之側壁與 抵緊件12之間，並使銲錫61面朝下方。圖2中抵緊件^包括 有一彈性件121，可提供一彈性預力以向後頂抵於治具座u 另一側壁、並向前夾持住積體電路元件6。除錫完畢後，可 壓下彈性件m以退開抵緊件12而輕易更換其他尚未除錫 之積體電路元件再繼續除錫作業。於一較佳之實施例中， 彈性件121可為壓縮彈簧。 圖2顯示本實施例之除錫裝置更增設有一加熱器5，例 如-熱風管’綠設於㈣料1τ方。以減管作為加熱 M368272 器5以提供熱能以對應加熱積體電路元件6表面上之銲錫 61 ’藉以加速其熱熔成為錫水。 以下係簡單說明本創作之除錫裝置的使用方法，首先 使夾持治具1之開口 13朝向上方’將多個積體電路元件6失 5持抵緊於治具座11與抵緊件12之間，再操作翻轉夾持治具1 ， 使其開口 13向下罩在工作平台7上’此使得積體電路元件6 表面上之銲錫61朝向下方。此時，先啟動熱風管之加熱器5 針對銲錫61作預熱加溫’接著再啟動熱風吹管2並順勢由左 > 到右方向移動。熱風吹管2將高溫強力熱風由下往上對應吹 10向積體電路元件6表面上之銲錫61，使其逐次熱熔成為錫 水，並受強力熱風吹離積體電路元件6。由於熔融錫水本身 之重力向下滴落趨勢，使其更容易脫離積體電路元件6表M368272 V. New description: [New technical field] It is suitable for the removal of the product. It is a kind of tin removal device, especially the tin removal device on the surface of the circuit components. 5 ' [Previous Technology] 'Commonly used integrated circuit components, such as various chip sets, central processing units (CPUs), flash memory chips (Flash), communication Ic chips, etc. or other ball-closed array BGAs ( Ball Grid Array) is a K) product that encapsulates wafer technology. It removes solder balls and solder slag during rework operations. It is customary to apply flux to the surface of the solder ball and then use the heat of the ferrite to absorb the tin. The wire will scatter, adsorb and remove the solder balls or tin slag. However, this kind of artificial technology must use a soldering iron to heat the tin wire directly to the solder ball or the tin method, which can easily cause damage and scratching of the wafer sheet, peeling off the solder pad on the wafer, or L. The phenomenon that the crystal point is contaminated, in addition, there are disadvantages such as the slow rate of manual tin removal and the quality of the heavy work industry. ^ Therefore, some people have proposed a tin-removing device improvement, please refer to Figure i, Figure J is a simplified schematic diagram of the tin-removing device of the conventional integrated circuit component, which shows that the tin-removing jig 81 on the jig 8 is fixed with an integrated body. The circuit component 8 is, for example, a ball grid array 2 (BGA) package B. The solder mask 82 is provided with a hot gas to melt the solder balls or tin slag on the integrated circuit component from the top to the bottom, and then tilted by the tin removing blade 83. The angle is blown away from the molten tin water from the top to the bottom and concentratedly blown into the tin bath 84. Although the operation of the conventional tin removal technology is more convenient than the manual use of the tin wire, the process of blowing the tin water often causes the tin water to flow on the surface of the integrated circuit component 8 M368272 due to the tin water and The affinity of the metal pad material and the downward gravity of the tin water will still adhere to other pads and L-type crystal spots contaminated to the upper surface of the integrated circuit component 8. Accordingly, in the prior art, the use of a tin-absorbing wire or a tin-removing device to remove the kicking ball 5 A will still cause defects in soldering and crystal point contamination, resulting in a decrease in the yield of the tin ball and a slow speed. From this, it can be seen that how to achieve a tin-removing device that can automate operations, can greatly reduce labor costs, and can improve the yield and speed of tin ball heavy work is an urgent need in the industry. 10 [New Content] This creation provides a tin removal device for removing traces of integrated circuit components such as solder balls on the surface of a ball cage array (BGA) package wafer, such as solder balls or tin slag. Among them, the tin-removing device of the present invention has a clamping fixture, a hot air blowing tube, and a receiving tube. The clamping fixture detachably holds the integrated circuit component and causes the fresh tin on the surface of the integrated circuit component to face downward; the hot air blowing pipe is disposed under the clamping fixture, and the hot air blowing pipe has a blowing outlet, such as a reducer (nozzle) 'A high-pressure hot air that can provide a positive pressure is blown from the bottom to the top on the surface of the integrated circuit component to fuse it into tin water and can be dripped by gravity; the suction pipe set is placed on the clamp Below the fixture, the suction pipe has a 20-port inlet, such as a diffuser, preferably a negative pressure is provided and correspondingly received in the integrated circuit component, and 0 and the previously heated tin water are taken. It also undertakes the tin water dripping from gravity, and the other end of the suction pipe is connected to the tin bath to recover the solder sucked back. In this way, the creation of the tin-removing M368272 device can easily and quickly remove the surface of the integrated circuit component, which can improve the yield and speed of the solder ball and greatly reduce the labor cost. In the tin-removing device of the present invention, the clamping fixture can have a fixture seat and a pressing member. The integrated circuit component can be clamped against the fixture seat and the abutting member, and the abutting member is also Others such as an inset card, a clip, a snap, etc. can be used instead of the detachable #-type equivalent holding structure to clamp the integrated circuit components. The abutting member may further comprise an elastic member, which may be a shrinking elastic file, or may be changed to a pneumatic rainbow, a hydraulic red, or the like to provide an elastic preload force against the fixture seat and clamp the product. Body circuit components. The elastic member may be replaced with a screw-locking member to clamp the integrated circuit component in a 10 locking manner. * The tin-removing device of this creation, # may further include a heater, such as hot air B, or electric heater, etc. or other equivalent heating means, which can be set under the two central holdings, the heater Thermal energy can be provided to heat the solder on the surface of the integrated circuit component, thereby accelerating its hot melt into tin water. [Embodiment] "Monthly Referring to Fig. 2 is a configuration diagram of an embodiment of a tin removing device, which shows that the tin removing device of the embodiment can be disposed on a guarding platform 7 or a splicing-conveying belt (not shown) is preferably provided to remove a product, such as solder balls 6 on the surface of a ball-gland array (BGa) package wafer, such as solder balls or grades. Fig. 2 shows the tin-removing device of the present embodiment. The <> holding fixture 1, a hot air blowing tube 2, and a receiving straw 3. 20 M368272 Fig. 3 is a perspective view of the clamp jig 1 of the present embodiment, which detachably holds one or more integrated circuit components 6 and faces the solder 61 on the surface of the integrated circuit component 6 downward. 2, it can be seen that the hot air blowing pipe 2 of the present embodiment is assembled on the lower side of the clamping fixture. The hot air blowing pipe 2 includes a blowing outlet 21, for example, a shrinking tube (n〇zzle) is optimal, which provides a The high-temperature hot air of the positive pressure is blown to the solder 61 on the surface of the integrated circuit component 6 from the bottom to the top to heat-melt it into tin water and can be dripped by gravity. 2 shows that the receiving straw 3 is also disposed under the clamping fixture ι, and the receiving straw 3 includes an upper inlet opening 31, preferably a diverging tube, to correspondingly receive the integrated circuit. Below the component 6, to withstand the aforementioned hot-melt tin water and to withstand the tin water dripping by gravity, it is better to provide a negative pressure to absorb the effect. The other end 32 of the suction pipe 3 is further connected with a tin bath 4 for recovering the sucked solder 61. In the present embodiment, the clamping fixture 丨 includes a jig 11 and an abutting 15 , and the integrated circuit component 6 is clamped against the side wall of the jig 11 and the abutting member 12 . Between and with the solder 61 facing down. The abutting member 2 of Fig. 2 includes an elastic member 121 which provides a resilient preload to urge the rear end against the other side wall of the jig base and to hold the integrated circuit component 6 forward. After the tin is completed, the elastic member m can be pressed to retreat the abutting member 12, and the other integrated circuit components which have not been removed by tin can be easily replaced and the tin removing operation can be continued. In a preferred embodiment, the elastic member 121 can be a compression spring. Fig. 2 shows that the tin removing device of the present embodiment is further provided with a heater 5, for example, the hot air duct 'green' is disposed on the (four) material 1τ side. The reduction tube is used to heat the M368272 to provide thermal energy to heat the solder 61' on the surface of the integrated circuit component 6 to accelerate its hot melt into tin water. The following is a brief description of the use method of the tin removing device of the present invention. First, the opening 13 of the clamping jig 1 is directed upwards. The plurality of integrated circuit components 6 are lost and held against the jig 11 and the abutting member 12 . In between, the flipping of the jig 1 is performed so that the opening 13 is covered on the work platform 7 downwards. This causes the solder 61 on the surface of the integrated circuit component 6 to face downward. At this time, the heater 5 for starting the hot air pipe is preheated and heated for the solder 61. Then, the hot air blowing pipe 2 is restarted and moved to the right by the left >. The hot air blowing pipe 2 blows the high-temperature strong hot air from the bottom to the top to the solder 61 on the surface of the integrated circuit component 6, and sequentially heat-melts it into tin water, and is blown away from the integrated circuit component 6 by strong hot air. Since the gravity of the molten tin water itself drops downward, it makes it easier to separate from the integrated circuit component 6
面，而不會滯留積體電路元件6表面亂竄再與其他焊墊或L 型晶點產生沾黏污染。最後，承接吸管3在下方吸取並承接 15前述熱熔之錫水，即可容易完成積體電路元件6之除錫作 業。 | 综上所述，相較於習知之吸錫線或除錫裝置清除錫球 ^ 之技術，本創作除錫裝置之夾持治具1將積體電路元件6夾 • 持使其表面之銲錫61朝向下方，故經熱風吹管2吹拂可有利 2〇於錫水熔融向下滴落，亦同時有利於承接吸管3在下方承接 並吸取滴下之錫水，故可更方便且快速地清除積體電路元 件表面上之銲錫，俾能提高錫球重工的良率和速度、且大 幅減少人力成本，實為一創新且具突破性之創作。 M368272 上述實施例僅係為了方便說明而舉例而已，本創作所 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述實施例。 5【圖式簡單說明】 圖1係習知除錫裝置之示意圖。 圖2係本創作一較佳實施例之除錫裝置之配置圖。 圖3係本創作一較佳實施例之夾持治具之立體圖。 10【主要元件符號說明】 1夾持治具 121彈性件 3承接吸管 4,84盛錫槽 61銲錫 82熔錫罩 11,80治具座 2熱風吹管 31承接入口 5加熱器 7工作平台 83除錫風刀 12抵緊件 21吹出口 32另一端 6,8積體電路元件 81除錫治具The surface does not stagnate the surface of the integrated circuit component 6 and is contaminated with other pads or L-type crystal dots. Finally, the tin removal operation of the integrated circuit component 6 can be easily accomplished by the suction pipe 3 sucking and receiving the aforementioned hot-melt tin water. In summary, compared with the conventional solder wire or tin removal device to remove the solder ball ^, the clamping fixture 1 of the creative tin removing device clamps the integrated circuit component 6 to the surface thereof. 61 is facing downward, so it can be beneficial to blow down the tin water by blowing it through the hot air blowing pipe 2, and at the same time, it is advantageous for the receiving straw 3 to receive and absorb the dripping tin water under the suction pipe 3, so that the integrated body can be more conveniently and quickly removed. Solder on the surface of circuit components, which can improve the yield and speed of tin ball rework, and significantly reduce labor costs, is an innovative and groundbreaking creation. The above embodiments are merely illustrative for the convenience of the description, and the scope of the claims is intended to be limited to the above embodiments. 5 [Simple description of the drawing] Fig. 1 is a schematic view of a conventional tin removing device. 2 is a configuration diagram of a tin removing device according to a preferred embodiment of the present invention. 3 is a perspective view of a clamping fixture of a preferred embodiment of the present invention. 10 [Main component symbol description] 1 clamping fixture 121 elastic member 3 accepting straw 4, 84 tin bath 61 solder 82 melting tin cover 11, 80 fixture seat 2 hot air blowing tube 31 bearing inlet 5 heater 7 working platform 83 Tin wind knife 12 abutting member 21 blowing port 32 other end 6, 8 integrated circuit component 81 in addition to tin fixture