M368194 五、新型說明： 【新型所屬之技術領域】 本創作有關於一種發光元件之封裝構造，其主要將— 定電流晶片及至少—發光二極體晶粒進行整合封裝，而 利於降低發光％件的製作成本及提高使㈣的便利性。 【先前技術】 •式發光二極體⑽；Light-Emitting Diode)由於具備有 壽命長、體積小、耗電量少、反應速度快、無輕射及單色性 發光之特性及優點，因此被廣泛應用於指示燈、廣告看板、 交通號誌燈、汽車車燈、顯示器面板、通訊器具二: 等各項產品中。 買包千 如第1圖所示，為制發光元件之封裝構造的剖面示意 圖，如圖所示，發光元件10主要包括有一第一導電架^ _及一 ί二導電架113,其中發光二極體晶粒（LED die)13設 '置在第一導電架1U上，並以導電線15連接發光二極體晶 '粒I3及第二導電架113。在使用時可對第一導電架1U及 第二導電架113輸入直流電流’以驅動發光二極體晶粒13。 —又，為了進一步提高對導電架u(包含第—導電架^ 及第二導電架113)、發光二極體晶粒13及導電線i5的保 濩’一般會選擇以一封裝膠體17對發光二極體晶粒13及導 電架11進行封裝。封裝膠體17可為一透光材料所製成，藉 此將可發光二極體晶粒13所產生的光源穿透封裝膠體17。 3 M368194 用上述的發光元件10時，必須對第一導電架111 及第一 V甩架113提供穩定的直流電流，以驅動發光二極體 00 ^ 3而對後端應用發光元件1 〇的廠商而言，將會造 成設計或使用時的不便利性。 a σ 【新型内容】 本創作之主要目的，在於提供一種發光元件之封裝構 造’主要將-定電流晶片及至少一發光二極體晶粒設置：同 封裝支架上，僅需要提供一直流電壓便可以驅動發光二極 體曰曰粒，而有利於提高發元件在使用上的便利性。 、本創作之次要目的，在於提供一種發光元件之封裝構 造，主要將定電流晶片及發光二極體晶粒整合在一起並進行 封裝，藉此將有利於簡化發光元件的構造。 ^本創作之又一目的，在於提供一種發光元件之封裝構 造’其中定電流晶片的供電接點及輸入接點，及/或定電流 晶片之輪出接點，皆與發光二極體晶粒相接，藉此將可以ς 光m粒的壓降狀電流晶片之供電接點提供一供^ 電壓’而有利於電路的簡化。 止本創作之又一目的，在於提供一種發光元件之封裝構 造二其中定電流晶片的供電接點及輸人接點相連接，使得定 電流晶片可直接與發光二極體晶粒串聯使用，而有利於提高 使用時的便利性。 本創作之又一目的，在於提供一種發光元件之封芽構 造’其中定電流晶片可連接至少一發光二極體晶粒，並^同 M368194 時對至少一發光二極體晶粒進行驅動。 本創作之又一目的，在於提供一種發光元件之封裝構 造，其中定電流晶片包括有一低壓降穩壓器，藉此將可對 定電流晶片内的其他電路提供一穩定的電壓。 為此，本創作提供一種發光元件之封裝構造，包括有： .一封裝支架；至少一定電流晶片，設置於封裝支架上，並 . 包括有一供電接點、一輸入接點及一輸出接點；至少一發 光二極體晶粒’設置於封裝支架上’並連接定電流晶片之 供電接點及輸入接點；一封裝膠體，用以覆蓋發光二極體 晶粒及定電流晶片。 本創作尚提供一種發光元件之封裝構造，包括有：一 封裝支架；至少一定電流晶片，設置於封裝支架上，並包 括有一供電接點、一輸入接點及一輸出接點；至少一發光 二極體晶粒組，包括有複數個發光二極體晶粒的串聯或並 聯，設置於封裝支架上，並連接定電流晶片之供電接點及 • 輸入接點；及一封裝膠體，用以覆蓋發光二極體晶粒組及 定電流晶片。 * 本創作再提供一種發光元件之封裝構造，包括有：一 封裝支架；至少一定電流晶片，設置於該封裝支架上，並 包括有一供電接點、一輸入接點及一輸出接點；至少一發 光二極體晶粒’設置於封裝支架上*並連接定電流晶片之 輸出接點；及一封裝膠體，覆蓋發光二極體晶粒及定電流 M368194 【實施方式】 睛參閱第2圖’為本創作發光元件之封裝構造—實# 例的電路連接示意圖。如圖所示，本創作所述之發光元件 20包括有一封裝支架21、一定電流晶片23及至少一欢 ν 一發光 二極體晶粒（LED die)。其中定電流晶片23及發光二極 晶粒組25皆設置在封裝支架21上，並以定電流晶片23 = 發光二極體晶粒組25提供一穩定的電流。上述之封襞支^ 21可以是一單片基板、一導線架（lead frame)或—特殊= 狀基板（包含多片組合型基板），再者，支架的結構並不= 於平面式或立體式。 义 定電流晶片23包括有至少三個接點，分別為一輪入接 點231、一供電接點233及一輸出接點235，並透過輪入 點231及供電接點233連接發光二極體晶粒組25。供M368194 V. New Description: [New Technology Field] This creation relates to a package structure of a light-emitting component, which mainly integrates a constant current chip and at least a light-emitting diode die, thereby reducing the amount of light-emitting components. The cost of production and the convenience of (4). [Prior Art] • Light-Emitting Diode (Light-Emitting Diode) is characterized by its long life, small size, low power consumption, fast response, no light and monochromatic illumination. Widely used in indicators, advertising billboards, traffic lights, car lights, display panels, communication devices 2: and other products. As shown in FIG. 1 , a package is a schematic cross-sectional view of a package structure of a light-emitting component. As shown in the figure, the light-emitting component 10 mainly includes a first conductive frame _ and a second conductive frame 113 , wherein the light-emitting diodes The body die (LED die) 13 is disposed on the first conductive frame 1U, and is connected to the light-emitting diode crystal grain I3 and the second conductive frame 113 by a conductive line 15. In use, a direct current '' can be input to the first conductive frame 1U and the second conductive frame 113 to drive the light-emitting diode die 13. - In order to further improve the protection of the conductive frame u (including the first conductive frame ^ and the second conductive frame 113), the light-emitting diode die 13 and the conductive line i5, it is generally selected to emit light by an encapsulant 17 The diode die 13 and the conductive frame 11 are packaged. The encapsulant 17 can be made of a light transmissive material, whereby the light source generated by the illuminable diode die 13 penetrates the encapsulant 17. 3 M368194 When using the above-mentioned light-emitting element 10, it is necessary to provide a stable direct current to the first conductive frame 111 and the first V-truss 113 to drive the light-emitting diode 00^3 and to apply the light-emitting element 1 to the rear end. In terms of it, it will cause inconvenience in design or use. a σ [New content] The main purpose of this creation is to provide a package structure for a light-emitting component. The main purpose is to set a constant current chip and at least one light-emitting diode die: on the same package bracket, only need to provide a DC voltage. The light-emitting diode particles can be driven, which is advantageous for improving the convenience of use of the hair element. The second objective of the present invention is to provide a package structure for a light-emitting element, which mainly integrates and packages a constant current chip and a light-emitting diode die, thereby facilitating the simplification of the structure of the light-emitting element. Another object of the present invention is to provide a package structure of a light-emitting element, in which a power supply contact and an input contact of a constant current chip, and/or a turn-off contact of a constant current chip, and a light-emitting diode die In order to connect the power supply contacts of the voltage drop current chip capable of illuminating m particles, a voltage supply is provided to facilitate the simplification of the circuit. Another object of the present invention is to provide a package structure of a light-emitting element. The power supply contact of the constant current chip and the input contact are connected, so that the constant current chip can be directly used in series with the light-emitting diode die. Conducive to improve the convenience of use. A further object of the present invention is to provide a bud structure of a light-emitting element, wherein a constant current wafer can be connected to at least one light-emitting diode die, and at least one light-emitting diode die is driven in the same manner as M368194. A further object of the present invention is to provide a package structure for a light-emitting element, wherein the constant current chip includes a low-dropout voltage regulator, thereby providing a stable voltage to other circuits in the constant current wafer. To this end, the present invention provides a package structure for a light-emitting component, comprising: a package holder; at least a current chip disposed on the package holder, and including a power supply contact, an input contact, and an output contact; At least one light-emitting diode die is disposed on the package holder and connected to the power supply contact and the input contact of the constant current chip; and an encapsulant for covering the LED die and the constant current chip. The present invention further provides a package structure for a light-emitting component, comprising: a package holder; at least a current chip disposed on the package holder, and including a power supply contact, an input contact, and an output contact; at least one light-emitting The polar body group includes a plurality of light emitting diode chips connected in series or in parallel, disposed on the package holder, and connected to the power supply contact of the constant current chip and the input contact; and an encapsulant for covering Light-emitting diode die set and constant current chip. The present invention further provides a package structure for a light-emitting component, comprising: a package holder; at least a current chip disposed on the package holder, and including a power supply contact, an input contact, and an output contact; at least one The light-emitting diode die is disposed on the package holder* and connected to the output contact of the constant current chip; and an encapsulant covering the light-emitting diode die and the constant current M368194. [Embodiment] See Fig. 2 The package structure of the present light-emitting element is a circuit connection diagram of the actual example. As shown, the light-emitting element 20 of the present invention includes a package holder 21, a current-carrying chip 23, and at least one LED die. The constant current chip 23 and the light emitting diode chip group 25 are all disposed on the package holder 21, and provide a stable current by the constant current chip 23 = the light emitting diode chip group 25. The above-mentioned sealing member 21 can be a single substrate, a lead frame or a special = substrate (including a plurality of combined substrates). Furthermore, the structure of the support is not = planar or three-dimensional formula. The constant current chip 23 includes at least three contacts, which are respectively a wheel-in contact 231, a power supply contact 233 and an output contact 235, and are connected to the light-emitting diode crystal through the wheel-in point 231 and the power supply contact 233. Granule group 25. for
點233主要用以接收—供電電壓卿，並以供電電 作為定電流晶片23的驅動蝥厭认 ^ n D 235分別為電流流入點及 剧入f 31及輸出接點 連接發光二極體晶粒組：二流出點’其中輸入接點231 供-穩定的直流電流ί ’亚向發光二極體晶粒組25提 二極體晶粒組25。轉此將可以直流電流I驅動發光 在本創作一實施例中 可與輸入接點卻相連接’定電流晶片23的供電接點233 -般的二極體，例如電流晶片23的特性如同 電流晶片23的輸入接點233 diode)。在使用時僅需要将定 各 及輸入接點231與至少〜| 1光二極體晶粒串聯，例如連接 M368194 弟一發光二極體晶粒251，便可以達到以直流電流j驅動 發光二極體晶粒組25之目的，如第2圖所示。 在實際應用時亦可使得定電流晶片23的供電接點挪 不與輸入接點231直接相連。如第2A圖所示，定電流晶 片23的輸入接點231連接複數個發光二極體晶粒，且發光 -二極體晶粒組25以串聯的方式設置。例如發光二極體晶粒 •組25包括有一第一發光二極體晶粒251、一第二發光二極 •體晶粒252及至少一第η發光二極體晶粒259 (n為大於2 的正整數），其中定電流晶片23的輸入接點231連接第一 發光—極體晶粒251，而定電流晶片23的供電接點233可 連接第二發光二極體晶粒252與第一發光二極體晶粒251 之間或連接第η發光二極體晶粒259與第n-1發光二極體 晶粒258之間，並由串聯的發光二極體晶粒組25向定電流 晶片23之供電接點233提供供電電壓VDD。當然在不同實 施例中’定電流晶片23亦可僅連接一個發光二極體晶粒， ⑩例如第一發光二極體晶粒251，如第2 B圖所示。 請參閱第3圖’為本創作發光元件之封裝構造一實施 例的電路連接示意圖。如圖所示，發光元件20包括有一定 電流晶片23及至少一發光二極體晶粒，其中定電流晶片 23與發光二極體晶粒組25相連接，並向發光二槌體^粒 組25提供一直流電流卜以達到驅動發光二極體晶粒组25 之目的。 '' 在本創作實施例中’定電流晶片23包括有〜電晶體 、一電阻243、一運算放大器245、一參考電壓源^47 7 M368194 及一低壓降穩壓器249。雷晶舻9/|1叮* 电日日體241可為一雙極性電晶 (BJT)或場效電晶體（FET),在 电日日遐 ；在本創作中是以場效電晶體作 為貝施例。電晶體2 41及f jj日9 j q + 及電阻243串接於定電流晶片23的 輸入接點2 3 1及輸出接點9 q ς 4 锥4 235之間，例如電晶體241的一 端連接定電流晶片23的輪入接si 9qi 掏入接點231，另—端則連接電且 243,並透過電阻243連接定雷、、&曰H ^ 丧疋電机日日片23的輸出接點235。 此外皂晶體2 41亦連接運瞀姑士哭 '放大TO 245，例如當電晶體μ 1 為一場效電晶體，且g管A + % 9 * 堤开放大為245連接電晶體241閘極 知？ 0 運算放大器245包括有一輸出^ 2451及兩輸入端 2453/2455，並連接電晶體24卜電阻243及參考電壓 2=例如運算放大$ 245的輪出端2451連接電晶體心 運异放大器241的第一輸入端2453連接電晶體241與 243β之間；運算放大器241的第二輸入端2455則連接參考 電壓源247。 / 低壓降穩壓器（LD〇, 1〇w dr〇p 〇utput)249連泰 接點233及參考電壓源247，低壓降穩壓器249是—個二 壓電路’主要是用以提供定電流晶片23的工作電源。低； 降，壓器249除了向參考電壓源247提供電源以外，亦 運算放大器245及其它定電流晶片23内部的電路提供; 源。低壓降穩壓器249由供電接點233接收供電電壓v 彻%疋的電壓，不論供電電壓VDD升高或是降低， 電電壓VDD的升降範圍在規格之内，^降_ ° 9都可對定電流晶片23内部所有電路提供固定且穩定 M368194 的電壓。 請參閱第4圖，為本創作發光元件之封裝構造一實施 例的剖面示意圖。如圖所示，發光元件20包括有一封裝支 架21、一定電流晶片23及至少一發光二極體晶粒，其中 發光二極體晶粒組25及定電流晶片23皆設置在封裝支架 -21上，且定電流晶片23串接發光二極體晶粒組25，並向 . 發光二極體晶粒組25提供一直流電流。 封裝膠體27為一具可設定區域透光或不透光的材料 所構成，以透光的部份覆蓋發光二極體晶粒組25及不透光 的部份覆蓋定電流晶片23，並對發光二極體晶粒組25及 定電流晶片23進行保護，例如封裝膠體27包括一第一封 裝膠體271及一第二封裝膠體273，並以不具透光特性的 第一封裝膠體271包覆定電流晶片23，而以具透光特性的 第二封裝膠體273包覆發光二極體晶粒組25。 本創作實施例所述的發光二極晶粒皆為裸晶（bare • die)，換言之，在將發光二極體晶粒組25設置在封裝支架 21後，發光二極體晶粒組25的每顆發光二極體晶粒外部 ’ 並不存在有任何的保護。因此在將發光二極體晶粒組25及 定電流晶片23設置在封裝支架21後，還需要在封裝支架 21上設置封裝膠體27，以對定電流晶片23及發光二極體 晶粒組25進行保護。 此外，為了提高使用時的便利性，亦可在發光元件20 上設置有一第一接腳201及一第二接腳203，例如第一接 腳201與發光二極體晶粒組25相連接，而第二接腳203則 M368194 與定電流晶片23相連接。封裝膠體27僅覆蓋部分的第一 接腳201及第二接腳203，使得部分的第一接腳2〇1及第 二接腳203外露於發光元件2〇外部，藉此將可以透過第一 接腳201及第二接腳203對發光元件2〇進行供電。 由於發光元件20内部設置有定電流晶片23，因此在 應用時僅需要向第一接腳2〇1及第二接腳2〇3提供一直流 電壓，便可以達到驅動發光二極體晶粒組25之目的，進一-步提兩了發光元件2 0在使用上的便利性。 - 請參閱第5圖，為本創作發光元件之封裝構造又一實_ 施例的電路示意圖。如圖所示，本創作所述之發光元件如 包括有複數個定電流晶片33及複數個發光二極體晶粒組 35，例如定電流晶片33包括有一第一定電流晶片331、一 第二定電流晶片333及至少一第n定電流晶片339，發光 二，體晶粒組35則包括有一第一發光二極體晶粒組351、 一第二發光二極體晶粒'组353及至少一第n發光二極體晶 粒組359，其中n係為大於2的正整數。 發光—極體晶粒組35各包括有一發光二極體晶粒或· 是複數個串聯的發光二極體晶粒。各個定電流晶片33與各 光-極體晶粒組35串聯，並分別向各組發光二極體晶 粒、，且35提供穩疋的直流電流。例如第一定電流晶片mi的 輸入接點3311及供電接點3313連接第一發光二極體晶粒 、、且351 ’第一定電流晶片犯3的輸出接點犯35連接第一發 光一極體晶粒組351 ’而第二定電流晶片挪的輸入接點 3331及（、電接黑占3333則連接第二發光二極體晶粒組奶3; M368194 弟η定電流晶片339的輪屮接赴qQQC； 甸出接點3395連接第二發光二極體 日日粒、、且353而第η定電流晶片339的輪入接點3391及供 電接點讓則連接第η發光二極體晶粒組3. 請參閲第6圖，為本創作發光元件之封裝構造又一實 施例的電路示意圖。如圖所示，本創作所述之發光元件40 •包括有一發光二極體晶粒組45及複數個定電流晶片43， .例如定電流晶片43包括有一第一定電流晶片431及至少一 φ第二定電流晶片433 ’其中第一定電流晶片431與第二定 電流晶片433並聯’且第一定電流晶片431及第二定電流 晶片433又與發光二極體晶粒組45串聯。 發光二極體晶粒組45包括有一發光二極體晶粒或是 複數個串聯的發光二極體晶粒。此外藉由第一定電流晶片 431及第二定電流晶片433的並聯，將可以對發光二極體 晶粒組45提供一較大的直流電流。例如，第一定電流晶片 431的輸入接點4311及供電接點4313連接發光二極體晶 • 粒組45 ’而第二定電流晶片433的輸入接點4331及供電 接點4333同樣連接發光二極體晶粒組45。 請參閱第7圖’為本創作發光元件之封裝構造又一實 施例的電路示意圖。如圖所示，本創作所述之發光元件50 包括有複數個發光一極體晶粒組55及一定電流晶片53， 例如發光二極體晶粒組55包括有一第一發光二極體晶粒 組551及至少一第二發光二極體晶粒組553，其中第一發 光二極體晶粒組551與第二發光二極體晶粒組553並聯， 並串聯定電流晶片53’則定電流晶片53將可以分別對第 M368194 一發光二極體晶粒組551及第二發光二極體晶粒組553提 供直流電流。 定電流晶片53的供電接點533可只與第一發光二極體 晶粒組551或第二發光二極體晶粒組553相連接，當然亦 可同時連接第一發光二極體晶粒組551及第二發光二極體 晶粒組553。而定電流晶片53的輸入接點531則同時與第 . 一發光二極體晶粒組551及第二發光二極體晶粒组553連 接。 在本創作第5圖至第7圖所述之實施例中，在完成發 ® 光二極體晶粒組35/45/55及定電流晶片33/43/53的設置 後，同樣可以第4圖所示的封裝膠體27包覆發光二極體晶 粒組35/45/55及定電流晶片33/43/53。再者，發光二極 體晶粒與電流晶片的數目及其排列組合並不侷限於上述之 實施例，本創作適用於任一數目之發光二極體晶粒與電流 晶片、發光二極體晶粒間之串聯或並聯型式、電流晶片間 之串聯或並聯型式以及發光二極體晶粒與電流晶片間之串 _ 聯或並聯型式。 ' 請參閱第8圖，本創作發光元件之封裝構造又一實施· 例的電路示意圖。如圖所述，本創作所述之發光元件6 0包 括有一封裝支架21、一定電流晶片23及至少一發光二極 體晶粒組25。其中定電流晶片23及發光二極體晶粒組25 皆設置在封裝支架21上，並以定電流晶片2 3向發光二極 體晶粒組25提供一穩定的電流I。 在本創作實施例中定電流晶片23包括有一輸入接點 12 M368194 231供电接點233及一輸出接點235，並透過榦+技 料光-極體晶粒組25，藉此以達到驅動 體晶粒組25之目的。|啼& 努先一極 之目的。供電接點咖主要用以接收— 廢VD’亚以供電電壓电電 在本創作每浐勹&罨机日日片23的驅動電壓。 ^ί H ，定電流晶片23的供電接點咖可盘輸 電雷她：？ 圖所示之連接方式(以供 電堊VDD作為定電流晶片23的驅動電壓）。 在本創作另一實施例中，發光二極體晶粒組烈的各個 發先二極體晶粒可以以串聯（ 方«• 弟8圖所不）及/或並聯的 ^式"置在龍支架21上並覆蓋於封裝膠體下。再者，發 、曰木體日日粒組的數！可為複數個，且複數個發光二極體 :粒^並聯的方式連接，再串聯定電流晶片之輸出接 香"亦可將本創作實施例的連接方式應用在 實施例中。 ^以上所述者，僅為本創作之實施例而已，並非用來限 ，本創作實施之範圍’即凡依本創作中請專利範圍所述之 形狀、構造、特徵及精神所為之均等變化與修飾，均應包 括於本創作之申請專利範圍内。 【圖式簡單說明】 第1圖：為習用發光元件之封裂構造的剖面示意圖。 第2圖.為本創作發A元件之封裝構造一f施例的電路連 接示意圖。 第2 A圖.為本創作發光元件之封裝構造又一實施例的電 13 M368194 路連接示意圖。 元件之封裴構造又一實施例的電 第2 B圖··為本創作發光 路連接示意圖。 之封裝構造一實施例的電路連 之封裝構造，實施例的剖面示 第3圖：為本創作發光元件 接示意圖。 第4圖：為本創作發光元件 意圖。 第5圖為本創作發“件之封裝構造又—實施例的電路 不意圖。 第6圖^本創作發光元件之封裝構造又 一實施例的電路 不意圖。 * 7圖·為本創作發光辑之封裝構造又—實施例的電路 示意圖。 第8圖’為本創作發光％件之封裝構造又—實施例的電路 示意圖。 11 導電架 113 第二導電架 15 導電線 201 第一接腳 21 封裝支架 231 輸入接點 235 輸出接點 【主要元件符號說明】 10 發光元件 111 13 17 20 203 23 233 第一導電架 發光二極體晶粒 封裝膠體 發光元件 第二接腳 定電流晶片 供電接點 14 M368194 241 電晶體 243 電阻 245 運算放大器 2451 輸出端 2453 第一輸入端 2455 第二輸入端 247 參考電壓源 249 低壓降穩壓器 25 發光二極體晶粒組 251 第一發光二極體晶粒 252 第二發光二極體晶粒 258 第n-1發光二極體晶粒 259 第η發光二極體晶粒 27 封裝膠體 271 第一封裝膠體 273 第二封裝膠體 30 發光元件 33 定電流晶片 331 第'一定電流晶片 3311 輸入接點 3313 供電接點 333 第二定電流晶片 3331 輸入接點 3333 供電接點 3335 輸出接點 339 第η定電流晶片 3391 輸入接點 3393 供電接點 3395 輸出接點 35 發光二極體晶粒組 351 第一發光二極體晶粒組 353 第二發光二極體晶粒組 359 第η發光二極體晶粒組 40 發光元件 43 定電流晶片 431 第一定電流晶片 4311 輸入接點 4313 供電接點 433 第二定電流晶片 4331 輸入接點 4333 供電接點 45 發光二極體晶粒組 15 M368194 50 發光元件 531 輸入接點 55 發光二極體晶粒組 551 第一發光二極體晶粒組 553 第二發光二極體晶粒組 60 發光元件 53 533 定電流晶片 供電接點 16Point 233 is mainly used to receive the power supply voltage, and the power supply is used as the driving of the constant current chip 23. The D 235 is the current inflow point and the input f 31 and the output contact are connected to the light emitting diode die. Group: Two outflow points 'where the input contacts 231 are supplied - a stable DC current ί 'the sub-light emitting diode die set 25 is a pair of diode die sets 25. In this case, the direct current I can be driven to emit light. In the present embodiment, the input contact can be connected to the power supply contact 233 of the constant current chip 23, for example, the current chip 23 has the same characteristics as the current chip. 23 input contact 233 diode). In use, it is only necessary to connect the respective input contacts 231 and at least the ~1 1 photodiode die, for example, connecting the M368194 and the light-emitting diode die 251, so that the light-emitting diode can be driven by the direct current j. The purpose of the die set 25 is as shown in Fig. 2. In actual application, the power supply contact of the constant current chip 23 can also be directly connected to the input contact 231. As shown in Fig. 2A, the input contacts 231 of the constant current chip 23 are connected to a plurality of light emitting diode dies, and the luminescent-diode die groups 25 are arranged in series. For example, the light-emitting diode die group 25 includes a first light-emitting diode die 251, a second light-emitting diode chip 252, and at least one n-th light-emitting diode die 259 (n is greater than 2). a positive integer), wherein the input contact 231 of the constant current chip 23 is connected to the first light-emitting body die 251, and the power supply contact 233 of the constant current chip 23 is connectable to the second light-emitting diode die 252 and the first Between the light-emitting diode crystal grains 251 or between the n-th light-emitting diode crystal grains 259 and the n-1th light-emitting diode crystal grains 258, and the constant current is transmitted from the series of light-emitting diode crystal grains 25 The power supply contact 233 of the chip 23 provides a supply voltage VDD. Of course, in different embodiments, the constant current wafer 23 may be connected to only one light emitting diode die, 10, for example, the first light emitting diode die 251, as shown in Fig. 2B. Please refer to Fig. 3' for a circuit connection diagram of an embodiment of the package structure of the light-emitting device of the present invention. As shown in the figure, the light-emitting element 20 includes a current chip 23 and at least one light-emitting diode die, wherein the constant current chip 23 is connected to the light-emitting diode chip group 25, and is directed to the light-emitting diode group. 25 provides a continuous current to achieve the purpose of driving the light emitting diode die set 25. In the present embodiment, the constant current chip 23 includes a transistor, a resistor 243, an operational amplifier 245, a reference voltage source ^47 7 M368194, and a low dropout regulator 249.雷晶舻9/|1叮* The electric Japanese body 241 can be a bipolar electro-crystal (BJT) or field-effect transistor (FET), which is used in electric days; in this creation, it is a field effect transistor. Besch. The transistor 2 41 and the f jj day 9 jq + and the resistor 243 are connected in series between the input contact 2 3 1 of the constant current chip 23 and the output contact 9 q ς 4 cone 4 235, for example, one end of the transistor 241 is connected. The wheel of the current chip 23 is connected to the contact point 231, the other end is connected to the power and 243, and the resistor 243 is connected to the output contact of the fixed lightning, & H ^ 疋 疋 motor day and day 23 235. In addition, the soap crystal 2 41 is also connected to the Yunshi Gushi crying 'magnification TO 245, for example, when the transistor μ 1 is a potent transistor, and the g tube A + % 9 * the dike opening is 245 connected to the transistor 241 gate know? The operational amplifier 245 includes an output ^ 2451 and two input terminals 2453/2455, and is connected to the transistor 24 and the resistor 243 and the reference voltage 2 = for example, the wheel terminal 2451 of the operational amplification $245 is connected to the transistor core amplifier 241. An input terminal 2453 is connected between the transistors 241 and 243β; a second input terminal 2455 of the operational amplifier 241 is connected to the reference voltage source 247. / Low-dropout regulator (LD〇, 1〇w dr〇p 〇utput) 249 Liantai junction 233 and reference voltage source 247, low-dropout regulator 249 is a two-voltage circuit 'mainly to provide The operating power of the constant current chip 23. In addition to the supply of power to the reference voltage source 247, the voltage regulator 249 is also provided by circuitry within the operational amplifier 245 and other constant current chips 23; The low-dropout regulator 249 receives the voltage of the power supply voltage v by %疋 from the power supply contact 233. The rise and fall of the electrical voltage VDD is within the specification regardless of whether the power supply voltage VDD rises or falls, and the voltage drop _ ° 9 can be All circuits within the constant current die 23 provide a fixed and stable voltage for the M368194. Please refer to Fig. 4, which is a cross-sectional view showing an embodiment of a package structure of the light-emitting device of the present invention. As shown in the figure, the light-emitting device 20 includes a package holder 21, a current-carrying chip 23, and at least one light-emitting diode die. The light-emitting diode chip group 25 and the constant current chip 23 are disposed on the package holder-21. And the constant current chip 23 is connected in series with the light emitting diode chip group 25, and supplies a direct current to the light emitting diode chip group 25. The encapsulant 27 is made of a light-transmissive or opaque material, and the light-transmitting portion covers the LED array 25 and the opaque portion covers the constant current wafer 23, and The LED chip group 25 and the constant current chip 23 are protected. For example, the encapsulant 27 includes a first encapsulant 271 and a second encapsulant 273, and is coated with a first encapsulant 271 having no light transmitting property. The current chip 23 is coated with the light-emitting diode chip group 25 with a second encapsulant 273 having a light transmitting property. The light-emitting diode chips described in the embodiments of the present invention are all bare (die), in other words, after the light-emitting diode chip group 25 is disposed on the package holder 21, the light-emitting diode chip group 25 There is no protection for the outer part of each of the light-emitting diodes. Therefore, after the LED array 25 and the constant current wafer 23 are disposed on the package holder 21, it is also necessary to provide an encapsulation 27 on the package holder 21 for the constant current wafer 23 and the LED array 25 Protect. In addition, in order to improve the convenience in use, a first pin 201 and a second pin 203 may be disposed on the light-emitting element 20, for example, the first pin 201 is connected to the LED array 25 of the light-emitting diode. The second pin 203 is connected to the constant current chip 23 by M368194. The package body 27 covers only a portion of the first pin 201 and the second pin 203, so that a portion of the first pin 2〇1 and the second pin 203 are exposed outside the light-emitting element 2, thereby being transparent to the first The pin 201 and the second pin 203 supply power to the light-emitting element 2A. Since the constant current chip 23 is disposed inside the light-emitting element 20, it is only necessary to provide a DC voltage to the first pin 2〇1 and the second pin 2〇3 in application, so that the light-emitting diode chip group can be driven. For the purpose of 25, the convenience of the use of the light-emitting element 20 is further improved. - Please refer to Fig. 5, which is a circuit diagram of another embodiment of the package structure of the present light-emitting device. As shown in the figure, the light-emitting element of the present invention includes a plurality of constant current chips 33 and a plurality of light-emitting diode chip groups 35. For example, the constant current wafer 33 includes a first constant current chip 331 and a second. The constant current chip 333 and the at least one nth constant current chip 339, the light emitting diode, the body die group 35 includes a first light emitting diode chip group 351, a second light emitting diode die group 353 and at least An nth light emitting diode die set 359, wherein n is a positive integer greater than two. The illuminating-pole body group 35 each includes a light-emitting diode die or a plurality of series-connected light-emitting diode grains. Each of the constant current wafers 33 is connected in series with each of the photo-polar body die sets 35, and provides a steady direct current to each of the sets of light-emitting diode crystal grains, respectively. For example, the input contact 3311 of the first constant current chip mi and the power supply contact 3313 are connected to the first light emitting diode die, and the output contact of the 351 'first constant current chip 3 is 35 connected to the first light emitting pole. The body die set 351 'and the second constant current chip shifting input contacts 3331 and (, the electrical connection black 3333 is connected to the second light emitting diode die set milk 3; the M368194 brother η constant current wafer 339 rim Going to qQQC; the junction contact point 3395 is connected to the second light-emitting diode day-to-day grain, and the 353 and the n-th constant current chip 339 are connected to the contact point 3391 and the power supply contact point is connected to the n-th light-emitting diode crystal GRAPHICS 3. Please refer to Fig. 6, which is a circuit diagram of still another embodiment of the package structure of the light-emitting device of the present invention. As shown, the light-emitting element 40 of the present invention includes a light-emitting diode chip group. 45 and a plurality of constant current chips 43, for example, the constant current wafer 43 includes a first constant current wafer 431 and at least one φ second constant current wafer 433 'where the first constant current wafer 431 is connected in parallel with the second constant current wafer 433' And the first constant current chip 431 and the second constant current chip 433 are combined with the hair The diode die set 45 is connected in series. The light-emitting diode die set 45 includes a light-emitting diode die or a plurality of series-connected light-emitting diode die. Further, by the first constant current chip 431 and the second The parallel connection of the constant current chip 433 will provide a large direct current to the LED array 45. For example, the input contact 4311 of the first constant current chip 431 and the power supply contact 4313 are connected to the LED. • The grain group 45' and the input contact 4331 and the power supply contact 4333 of the second constant current chip 433 are also connected to the light-emitting diode die set 45. Please refer to FIG. 7 for another implementation of the package structure of the light-emitting device of the present invention. The circuit diagram of the present invention includes a plurality of light-emitting monopole die sets 55 and a constant current die 53. For example, the light-emitting diode die set 55 includes a first light-emitting device. a diode pattern group 551 and at least one second LED array 553, wherein the first LED array 551 is connected in parallel with the second LED array 553, and the current chip is connected in series 53', the current chip 53 will be able to separate The light-emitting diode chip group 551 and the second light-emitting diode chip group 553 provide a direct current. The power supply contact 533 of the constant current chip 53 can only be combined with the first light-emitting diode die group 551 or the first The two light-emitting diode chip groups 553 are connected, and of course, the first light-emitting diode chip group 551 and the second light-emitting diode chip group 553 are connected at the same time. The input contact 531 of the constant current chip 53 is At the same time, it is connected to the first light-emitting diode chip group 551 and the second light-emitting diode chip group 553. In the embodiment described in the fifth to seventh figures of the present invention, the light-emitting diode is completed. After the die set 35/45/55 and the constant current chip 33/43/53 are set, the package colloid 27 shown in FIG. 4 can also be coated with the light emitting diode die set 35/45/55 and the constant current chip. 33/43/53. Furthermore, the number of light-emitting diode dies and current chips and their arrangement are not limited to the above embodiments. The present invention is applicable to any number of light-emitting diode dies and current chips, and light-emitting diode crystals. Series or parallel type between particles, series or parallel type between current chips, and series-to-parallel type between light-emitting diode die and current die. 'Refer to Fig. 8, a schematic circuit diagram of another embodiment of the package structure of the present light-emitting device. As shown, the light-emitting element 60 of the present invention includes a package holder 21, a current-carrying chip 23, and at least one light-emitting diode chip group 25. The constant current chip 23 and the light emitting diode chip group 25 are disposed on the package holder 21, and provide a stable current I to the light emitting diode chip group 25 by the constant current chip 23. In the present embodiment, the constant current chip 23 includes an input contact 12 M368194 231 power supply contact 233 and an output contact 235, and transmits the dry + technology light-pole body die set 25, thereby reaching the driver body. The purpose of the die set 25 is. |啼& The power supply contact coffee is mainly used to receive - the waste VD' sub-power supply voltage electric power in the creation of each 浐勹 & ^ί H, the power supply contact of the constant current chip 23 can be used to drive the lightning. She:? The connection mode shown in the figure (with the power supply VDD as the driving voltage of the constant current wafer 23). In another embodiment of the present invention, the respective diodes of the light-emitting diodes may be arranged in series (not shown) and/or in parallel. The dragon bracket 21 is covered and covered under the encapsulant. In addition, the number of hair groups in the hair and the eucalyptus body! A plurality of light-emitting diodes may be connected in a plurality of light-emitting diodes in a manner of being connected in parallel, and then connected in series to form an output of the current-sampling wafer. The connection method of the present embodiment may also be applied to the embodiment. The above is only the embodiment of this creation, and is not intended to be limiting. The scope of the implementation of this creation is the same as the shape, structure, characteristics and spirit described in the scope of the patent application in this creation. Modifications shall be included in the scope of the patent application of this creation. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a fracture structure of a conventional light-emitting element. Fig. 2 is a schematic diagram showing the circuit connection of the package structure of the A component of the present invention. Fig. 2A is a schematic diagram showing the connection of the electric 13 M368194 road according to still another embodiment of the package structure of the present light-emitting element. The sealing structure of the component is another embodiment of the electric power. FIG. 2B is a schematic diagram of the connection of the created luminous path. The package structure of the circuit structure of one embodiment is shown in the cross section of the embodiment. Fig. 3 is a schematic view showing the light-emitting element of the present invention. Figure 4: The intention of the light-emitting component of this creation. Fig. 5 is a schematic diagram of the package structure of the present invention, and the circuit of the embodiment is not intended. Fig. 6 is a schematic diagram of another embodiment of the package structure of the present light-emitting device. The package structure is again a circuit diagram of the embodiment. Fig. 8 is a schematic circuit diagram of the package structure of the present invention. 11 conductive frame 113 second conductive frame 15 conductive wire 201 first pin 21 package Bracket 231 Input contact 235 Output contact [Main component symbol description] 10 Light-emitting element 111 13 17 20 203 23 233 First conductive frame light-emitting diode die package Glow light-emitting element Second pin constant current chip power supply contact 14 M368194 241 Transistor 243 Resistor 245 Operational Amplifier 2451 Output 2453 First Input 2455 Second Input 247 Reference Voltage Source 249 Low Dropout Regulator 25 Light Emitting Diode Chip Group 251 First LED Diode 252 Second light-emitting diode die 258 n-1 light-emitting diode die 259 n-th light-emitting diode die 27 package colloid 271 first encapsulant 273 second Package colloid 30 Light-emitting element 33 Constant current chip 331 'Constant current chip 3311 Input contact 3313 Power supply contact 333 Second constant current chip 3331 Input contact 3333 Power supply contact 3335 Output contact 339 η Constant current chip 3391 Input connection Point 3393 Power supply contact 3395 Output contact 35 Light-emitting diode die set 351 First light-emitting diode die set 353 Second light-emitting diode die set 359 η-light-emitting diode die set 40 Light-emitting element 43 constant current chip 431 first constant current chip 4311 input contact 4313 power supply contact point 433 second constant current chip 4331 input contact 4333 power supply contact point 45 light emitting diode die set 15 M368194 50 light emitting element 531 input contact 55 Light-emitting diode die set 551 First light-emitting diode die set 553 Second light-emitting diode die set 60 Light-emitting element 53 533 Constant current chip power supply contact 16