M367455 五、新型說明： 【新型所屬之技術領域】 本創作是有關於—種電連接器，特職有關於一種 ，電路板作為轉接端子並透過支#機構的設計來達 到薄型化之電連接器。 【先前技術】 _ 由於液晶顯示器和系統主機之間的訊號通訊量，非 f的魔大且頻率非常高，所以，目前架設在液晶顯示 器介面與系統主機板介面之間的高頻訊號傳輸系統， 係採用具有超高速（1.4Gb/s)、低功耗及低電磁輻射特 性的低壓差分信號（LVDS，Low Vo 11age D i f f erent i a i Signal)接收器作為液晶顯示器介面的訊號傳輸介 面，並經由訊號傳輸線（Transmission Line)的連接， 與系統主機板介面上的訊號傳輸介面，即，與系統主 · 機板介面上的連接器插座，一起構成訊號連接，和共 同組成一種習用的LVDS訊號傳輸系統。 一般使用在這種習用之LVDS訊號傳輪系統中之公 端連接器，其結構包括有上鐵殼、絕緣本體、導電端 子、軟性排線以及下鐵殼’下鐵殼上先安裝設置絕緣 本體’絕緣本體上插設導電端子，導電端子上再搭接 軟性排線，上鐵殼設置於絕緣本體上。此種習知的連 接器的結構較為複雜，故製程步驟較多且成本較高， M367455 另外此種連接器所佔的體積較大，對現今產品設計講 求輕薄短小的趨勢潮流而言，並不符合需求。 【新型内容】 習知連接器之結構較為複雜，製作成本較高，且所 佔的體積較大，不符合現今產品設計講求之輕薄短小 的趨勢潮流。 本創作提供一種電連接器，包括電路板、第一殼體 以及支撐機構，其中電路板具有對接部以及搭接部， 對接部上形成有複數個第一接點，搭接部上形成有複 數個第二接點，該些第一接點及第二接點係相互連 接，且該些第二接點之間的第二間距係大於該些第一 接點之間的第一間距，該些第一接點係用以與一對接 連接器相連接。第一殼體組裝於電路板上以及用以支 撐第一殼體之一支撐機構。 本創作提供另一種電連接器，包括電路板、第一殼 體以及支撐機構，其中電路板具有對接部以及搭接 部，對接部上形成有複數個第一接點，搭接部上形成 有複數個第二接點，該些第一接點及第二接點係相互 連接，且該些第二接點之間的第二間距係等同於該些 第一接點之間的第一間距，該些第一接點係用以與一 對接連接器相連接。第一殼體組裝於電路板上以及用 以支撐第一殼體之一支撐機構。 M367455 本創作提供又一種電連接器，包括電路板、第一殼 體以及支撐機構，其中電路板具有對接部以及搭接 部，對接部上形成有複數個第一接點，搭接部上形成 有複數個第二接點，該些第一接點的數量係不等同於 該些第二接點的數量，該些第一接點係用以與一對接 連接器相連接。第一殼體組裝於電路板上以及用以支 撐第一殼體之一支撐機構。 本創作所提供之電連接器，其係利用電路板作為電 連接器之前後兩端之轉接端子，並設計用以支撐第一 殼體之支撐機構，此電路板與支撐機構的組合取代了 習知連接器結構中的導電端子與絕緣本體，由於電路 板與支撐機構的體積厚度一般而言較絕緣本體與導電 端子的組合體來的小，且結構較為簡單，製程上也較 為簡便，因此可解決習知連接器之結構複雜、製作成 本高與所佔體積大的問題。此外，配合電路板前後兩 端之金手指之間距與數量的特殊設計，還可以達到各 種不同的功能要求，例如前後兩端金手指等間距或不 等間距以及等數量或不等數量的設計，以避免發生焊 接不良或短路的問題，如此來達到滿足不同產品之客 製化的需求。 【實施方式】 請參閱第一圖至第六圖，本創作係提供一種電連 接器，該電連接器1包括第一殼體10、絕緣本體12 M367455M367455 V. New description: [New technical field] This creation is about a kind of electrical connector, special purpose is related to one type, the circuit board is used as a transfer terminal and through the design of the support mechanism to achieve thinned electrical connection. Device. [Prior Art] _ Due to the signal communication between the LCD display and the system host, the non-f is very large and the frequency is very high. Therefore, the high-frequency signal transmission system currently installed between the LCD interface and the system board interface is The low-speed differential signal (LVDS, Low Vo 11age D ir erent iai Signal) receiver with ultra-high speed (1.4Gb/s), low power consumption and low electromagnetic radiation is used as the signal transmission interface of the liquid crystal display interface, and the signal is transmitted through the signal. The transmission line (Transmission Line) connection, together with the signal transmission interface on the system board interface, that is, the connector socket on the system main board interface, constitutes a signal connection, and together constitute a conventional LVDS signal transmission system. Generally used in the conventional LVDS signal transmission system, the male connector has a structure including an upper iron shell, an insulating body, a conductive terminal, a flexible cable, and a lower iron shell. The conductive terminal is inserted into the insulating body, and the flexible terminal is overlapped on the conductive terminal, and the upper iron shell is disposed on the insulating body. The structure of such a conventional connector is relatively complicated, so the number of manufacturing steps is high and the cost is high. The M367455 has a large volume of such a connector, and is not a trend of lightness and shortness in today's product design. meets requirements. [New content] The structure of the conventional connector is relatively complicated, the production cost is high, and the volume occupied is large, which is not in line with the trend of lightness and thinness in today's product design. The present invention provides an electrical connector including a circuit board, a first housing, and a support mechanism, wherein the circuit board has an abutting portion and a lap portion, and the plurality of first contacts are formed on the mating portion, and the lap portion is formed with a plurality of a second contact, the first contact and the second contact are connected to each other, and the second spacing between the second contacts is greater than a first spacing between the first contacts, These first contacts are used to connect with a pair of connectors. The first housing is assembled to the circuit board and supports a support mechanism of the first housing. The present invention provides another electrical connector, including a circuit board, a first housing, and a support mechanism, wherein the circuit board has an abutting portion and a lap portion, and the plurality of first contacts are formed on the mating portion, and the lap portion is formed with a plurality of second contacts, the first contacts and the second contacts are connected to each other, and the second spacing between the second contacts is equivalent to the first spacing between the first contacts The first contacts are used to connect with a pair of connectors. The first housing is assembled to the circuit board and supports a support mechanism of the first housing. M367455 The present invention provides another electrical connector, comprising a circuit board, a first housing and a supporting mechanism, wherein the circuit board has an abutting portion and a lap portion, and the plurality of first contacts are formed on the mating portion, and the lap portion is formed There are a plurality of second contacts, the number of the first contacts is not equal to the number of the second contacts, and the first contacts are used to connect with the pair of connectors. The first housing is assembled to the circuit board and supports a support mechanism of the first housing. The electrical connector provided by the present invention uses a circuit board as a transfer terminal at the front and rear ends of the electrical connector, and is designed to support a support mechanism of the first housing, and the combination of the circuit board and the support mechanism replaces The conductive terminal and the insulating body in the conventional connector structure are generally smaller than the combination of the insulating body and the conductive terminal due to the volume thickness of the circuit board and the supporting mechanism, and the structure is relatively simple, and the process is also relatively simple, so The problem that the conventional connector has a complicated structure, high manufacturing cost, and large volume can be solved. In addition, with the special design of the distance between the gold fingers and the number of the front and rear ends of the circuit board, various functional requirements can also be achieved, such as the spacing or unequal spacing of the gold fingers at the front and rear ends, and the equal or unequal number of designs. To avoid the problem of poor soldering or short circuit, so as to meet the needs of different products for customization. [Embodiment] Referring to the first to sixth figures, the present invention provides an electrical connector including a first housing 10 and an insulative housing 12 M367455
以及電路板14，絕緣本體丨2設置於電路板ι4上， 一殼體10設置於絕緣本體12上，絕緣本體12介於第 一殼體10與電路板14之間，以作為支撐第一彀體第 之用，其中電路板14之前後兩端上係具有對接部10 以及搭接部142，對接部141上形成有複數個第一41 點143 ’搭接部142上形成有複數個第二接點144，接 些第-接點143及第二接點丨44之數量係彼此相这 相互對應連接’且該些第二接點144之間的第且 P2係大於該些第-接點143之間的第一間距心矩 第一接點143係用以與—對接連接器（未纷^些 該些第-接點144制以與複數條導線2相連 由於《亥些第二接，點144之間的 太口以°又°十的較小，卻不妨礙第二間距P2彀計的巨 是，7接於第二接點144上，理解Ξ 搭接部一間距P1’所， 1選擇是，：:則端對接部141之面積。另 接點144之叙：電路佈局的設計使得部份第二 積約等於前端對以達到後端搭接部142之面 接點144 對接邛141之面積的目的，例如將第二 如此、44中有關於接地之接點全部合併成—個接點， 量，達到第〜接點144之數量少於第一接點I"之數 匕時該'^第二接點144之間的第二間距P2 —樣是 M367455 ; 設計為大於該些第一接點143之間的第一間距PI，此 種設計不但具有避免導線2焊接於第二接點144時產 生不良的功用外，還具有縮小搭接部142面積大小的 效果。 在本實施例中，電路板14係為硬式印刷電路板 (PCB)，其板厚大約為0. 28丽，其中該電路板14設 有複數個貫穿的通孔145，第一殼體10上設有複數個 嵌合部101，該些嵌合部101係嵌合於該些通孔145 • 中，用以將電路板14安裝固定於第一殼體10之上方。 金屬層16設置於電路板14之下表面上，其中金屬層 16係延伸至該些通孔145中以及部份電路板14之上 表面上，以使金屬層16接觸嵌合部101，如此可達到 防止電磁干擾的效果，並節省了下鐵殼的設計。在本 實施例中，金屬層16係為電鍍銅層，且此電鍍銅層係 可沿著通孔145披覆於通孔145内側壁及部份電路板 14之上表面。為了使電路板14更穩定地固持於第一 * 殼體10上，還可另外利用焊接的方式將該些嵌合部 1〇1焊接固定於該些通孔145中。由於絕緣本體12介 於第一殼體10與電路板14之間，因此在絕緣本體 12上係設有至少與部份該些嵌合部101相對應之複 數個開口 121。 絕緣本體12、第一殼體10以及電路板14之間係 形成一容置空間18，該些第二接點144係位於該容 置空間18。複數條導線2係分別焊固於該些第二接 M367455 點144上，使該些導線2與該些第二 :r提:中該些導線2係位於該容置二^ =接…突出於該第_殼=:= 一低雷懕％接部141以及該些第一接點143係带成 -低電[差分訊號（LVDS)之連接器公端〜成And the circuit board 14, the insulative housing 2 is disposed on the circuit board ι4, a housing 10 is disposed on the insulative housing 12, and the insulative housing 12 is interposed between the first housing 10 and the circuit board 14 to serve as the first support For the first purpose, the front and rear ends of the circuit board 14 have an abutting portion 10 and a lap portion 142. The abutting portion 141 is formed with a plurality of first 41 points 143. The lap portion 142 is formed with a plurality of second portions. The contact 144, the number of the first contact 143 and the second contact 丨 44 are mutually connected to each other and the first and the P2 between the second contacts 144 are larger than the first contacts The first pitch moment 143 between the 143 is used to connect with the docking connector (there are some of the first-contacts 144 to be connected with the plurality of wires 2 due to the second connection, The yoke between 144 is smaller than ° and ten, but does not hinder the second pitch P2, and 7 is connected to the second contact 144, understanding Ξ lap a pitch P1', 1 The choice is::: the area of the end docking portion 141. The other point 144 is described: the circuit layout is designed such that part of the second product is equal to the front end pair For the purpose of the surface contact 144 of the rear end lap 142 to the area of the 邛 141, for example, the contacts of the second, 44, which are related to the ground, are all combined into one contact, and the quantity reaches the number of the first contact 144. The second pitch P2 between the second contacts 144 is less than the first contact I", which is M367455; and is designed to be larger than the first pitch PI between the first contacts 143, This design not only has the effect of avoiding the defective function when the wire 2 is soldered to the second contact 144, but also has the effect of reducing the size of the lap portion 142. In the present embodiment, the circuit board 14 is a hard printed circuit board ( The PCB has a thickness of about 0.28, wherein the circuit board 14 is provided with a plurality of through holes 145, and the first housing 10 is provided with a plurality of fitting portions 101, and the plurality of fitting portions 101 are provided. The metal layer 16 is disposed on the lower surface of the circuit board 14 with the metal layer 16 extending to the upper surface of the circuit board 14 The through hole 145 and the upper surface of the portion of the circuit board 14 are such that the metal layer 16 contacts the fitting portion 101, such as This can achieve the effect of preventing electromagnetic interference and save the design of the lower iron shell. In this embodiment, the metal layer 16 is an electroplated copper layer, and the electroplated copper layer can be covered in the through hole along the through hole 145. 145 the inner side wall and a part of the upper surface of the circuit board 14. In order to make the circuit board 14 more stably held on the first * casing 10, the fitting portions 1〇1 may be separately welded and fixed by welding. The plurality of openings corresponding to the portions of the mating portions 101 are disposed on the insulative housing 12 . The insulative housing 12 is disposed between the first housing 10 and the circuit board 14 . 121. An accommodating space 18 is formed between the insulative housing 12, the first housing 10, and the circuit board 14. The second contacts 144 are located in the accommodating space 18. a plurality of wires 2 are respectively soldered to the second connection M367455 point 144, so that the wires 2 and the second: r: the wires 2 are located in the receiving device The _shell=:= a low Thunder% junction 141 and the first contacts 143 are tied into a low-voltage [Differential Signal (LVDS) connector male end~
板（另哪^選擇是，該電路板14亦可為軟性印刷電路 板（FPC)，為了增加與對接連接器相連接昧1電路 與厚度，可另外設置第二殼體（未 、、強度 刷電路板之下，且此第二殼體盘第」 此軟性印 成卡接扣合的干涉㈣。/、㈣之間係可形 電連;=閱第七圖至第十三圖，本創作係提供另一種 34,第二C器3包括第一殼體30以及電路板 第戏體30設置於電路板3 €硌板 之前後兩端上係具有對接部341 、中電路板34 對接部341上形成有複數個部342’該 ⑽上形成有複數個第二接點⑽二:該搭接部 及第二接點344係相磙些第一接點343 間的第二間距P2係大於該些第第= 广4之 間距P1，該些第一接點3 接點343之間的第一 繪示）相連接，該些第二接點^與—對接連接器（未 線4相連接。可㈣解的是用以與複數條導 大小係大於對接部341，如此方’部342所佔面積的 接連接器插拔之用。另—種雜f於電連接器3與對 、疋’該些第二接點344 M367455 之間的第二間距P2亦可設计為等同於該些第一接點 343之間的第一間距P1，以使得對接部341的大小約 等於搭接部342的大小。 在本實施例中’電路板34係為硬式印刷電路板 (PCB)，然不限於此’其它例如是應用雷射直接成型 (Laser-Direct-Structuring ’ LDS)的方法在塑膠上製 作電路的板狀塑膠基材也可以使用在本創作中。電路 板14的板厚大約為〇. 28mm，其中該電路板34之上表The board (which is also selected, the circuit board 14 can also be a flexible printed circuit board (FPC), in order to increase the connection with the mating connector 昧 1 circuit and thickness, an additional second housing (not, strength brush) Under the circuit board, and the second housing disk is softly printed with the interference of the snap-fit (four). /, (4) is a formable electrical connection; = read the seventh to the thirteenth, this creation Another type 34 is provided. The second C3 includes the first casing 30 and the circuit board. The actor 30 is disposed on the circuit board 3. The front end has abutting portion 341 and the middle circuit board 34 butting portion 341. Forming a plurality of portions 342' on the (10), forming a plurality of second contacts (10) 2: the second spacing P2 between the overlapping portions and the second contacts 344 relative to the first contacts 343 is greater than the Some of the first = wide 4 distances P1, the first contacts 3 between the first contacts 3 are connected to each other, and the second contacts are connected to the butt connectors (not connected to the wires 4). The fourth (4) solution is for inserting and unplugging the connector with the size of the plurality of strips larger than the mating portion 341, and the area occupied by the square portion 342. The second pitch P2 between the electrical connector 3 and the pair of second contacts 344 M367455 can also be designed to be equivalent to the first pitch P1 between the first contacts 343 so that the abutting portion The size of 341 is approximately equal to the size of the lap portion 342. In the present embodiment, the 'circuit board 34 is a hard printed circuit board (PCB), but is not limited thereto. Others are, for example, laser direct structuring (Laser-Direct-Structuring) The 'LDS' method can also be used in the creation of a circuit-shaped plastic substrate on a plastic. The thickness of the circuit board 14 is approximately 〇 28 mm, wherein the circuit board 34 is on the surface
面上设有複數個接合區346以及複數個貫穿電路板34 上下表面的通孔345。第一殼體3〇具有一支撐部3〇2 以及複數個嵌合部301，該支撐部3〇2設置於電路板 34上，且其係用以支撐第一殼體3〇並使第一殼體別 位於該電路板34之上方，在本實施射，該支撐部 3〇2係焊接固定於該接合區346 i，該些嵌合部3〇1 係嵌合固定於該些通孔345中，如此以將[殼體3〇 ;固地安裝設置於電路板34之上方。在本實施例中， i體30與電路板34之間的間隔係藉由支揮部搬 形成之類似L型的切架所構成，此L型 :底端係為焊接腳’以用與電路板接 =46相連接。此切物因為具有與= =提到之絕緣本體12類似的㈣功能，因此本電 連接器3可以省略絕緣本 當雷的使用與成本，此外， *要設相更薄魏時，亦即其高度還 M367455 • 要更小時，少了絕緣本體12支撐設計的電連接器3 更能達到薄型化的要求。 電路板34、第一殼體30以及其支撐部302三者之 間係形成一容置空間38，該些第二接點344係位於 該容置空間38中。複數條導線4係分別焊固於該些 第二接點344上，使該些導線4與該些第二接點344 形成電性連接，其中導線4之一端係位於容置空間 38中。在本實施例中，為使導線4能與第一殼體30 φ 之間形成接地效果，在此些導線4上設有一接地棒40 (ground bar )，當此些導線4之一端焊固於第二接 點344上，此接地棒40係剛好可與第一殼體30之彈 片303相接觸且位於容置空間38内，之後可再利用焊 接方式將彈片303焊固於接地棒40上，如此就可將 具有接地功能之導線4與第一殼體30之間形成接 觸。值得一提的是，此硬式印刷電路板之對接部341 以及該些第一接點343係突出於該第一殼體30，如 ® 此電路板34之對接部341以及該些第一接點343係 形成一低電壓差分訊號（LVDS)之連接器公端接頭。 在本實施例中，電路板34之下表面上沒有裝設任 何的金屬殼體，然不限於此，亦可選擇裝設第二殼體 (未繪示）於電路板34之下表面上，或者是利用披覆 一金屬層（未繪示）於電路板34之下表面上，其中金 屬層係延伸至該些通孔345中，以使金屬層接觸故合 部301，如此也可達到防止電磁干擾（EMI)的效果， M367455 . 並節省了下鐵殼的設計。為了使電路板34更穩定地 固持於第一殼體30上，還可另外利用焊接的方式將該 些嵌合部301焊接固定於該些通孔345中。 另一種選擇是，該電路板34亦可為軟性印刷電路 板（FPC)，為了增加與對接連接器相連接時的強度 與厚度，可將此軟性印刷電路板先設置於第二殼體 (未繪示）上，再將第一殼體30焊接固定於軟性印 刷電路板上或者是將第一殼體30固定於第二殼體 • 上，且此第二殼體與第一殼體30之間係可形成卡接 扣合的干涉狀態。 請參閱第十四圖至第十六圖，本創作係提供又一種 電連接器，此電連接器5包括有上殼體50、彈性絕 緣體52以及電路板54,其中上殼體50組裝於電路 板54上，彈性絕緣體52位於電路板54及上殼體50 之間。此電連接器5與上述電連接器1的主要差別在 於利用彈性絕緣體52來替換絕緣本體12，由於一般 ® 的絕緣本體12係使用工程塑膠所製成的組裝件（或 稱膠芯），由於其材質較硬，組裝時不容易直接設置 於複數條導線6上，而必須組裝於平坦的電路板14 上，才能支撐位於其上的第一殼體10，但在本實施 例中，彈性絕緣體52由於其具有較佳的彈性，故可 以直接貼設於複數條導線6上，然後再直接將上殼體 50組裝於彈性絕緣體52上，就可以達到支撐上殼體 50並且讓上殼體50與導線6之間產生絕緣的效果。 M367455 另外，此電連接器5又不像前述之電連接器3需要將 支撐部302焊接固定於接合區346上的設計，所以製 程上較為簡便，且其所產生之薄型化的效果更優於電 連接器3與電連接器1。 在本實施例中，此彈性絕緣體52係為絕緣泡綿， 然不限於此，絕緣矽膠等其他絕緣貼附件亦可應用於 本創作中。另一種選擇是，此彈性絕緣體52之貼附 件亦可選用環氧樹酯或UV膠等塗覆件所替代，其作 • 法係先將環氧樹酯或UV膠等塗覆件塗覆於複數條導 線6與電路板14上，然後再經由固化或硬化等步驟， 使其具有一定的強度，之後再將第一殼體10組裝於 塗覆件與電路板14上，就可以達到類似於彈性絕緣 體52的作用與效果。金屬層56設置於電路板54之 下表面上，如此可達到防止電磁干擾的效果，可以理 解的是，此金屬層56亦可用一下鐵殼（未繪示）來 替換。 ® 請參閱第十七圖至第十九圖，本創作係提供再一種 電連接器，此電連接器7包括有上殼體70、絕緣層 72、電路板74以及下殼體76，其中上殼體70組裝 於電路板74之上，絕緣層72位於上殼體70與電路 板74之間，下殼體76位於電路板74之下。在本實 施例中，此絕緣層72設置於上殼體70上，其係用以 防止焊固於電路板74上的導線8與上殼體70接觸， 12 M367455 . 另一種選擇是，此絕緣層72亦可設置且覆蓋於導線 8與電路板74上。 此絕緣層72的高度由於遠比上述實施例中提到 的彈性絕緣體52、支撐部302與絕緣本體12來的小， 所以僅依靠著絕緣層72並無法提供完全足夠的支撐 力於上殼體70，因此在本實施例中，上殼體70之侧 邊設有上扣合部700，此上扣合部700係搭接在下殼 體76之下扣合部760上，以使此下殼體76與上殼體 • 70之間形成卡接扣合的干涉狀態。此上扣合部700 與下扣合部760係共同形成一支撐機構，用以支撐上 殼體70，使其位於電路板74之上方。由於絕緣層72 的高度可以製作的更小，如此使得電連接器7更能達 到薄型化的要求。在本實施例中，此絕緣層72為麥拉 片（MYLAR)，然不限於此，其他的絕緣貼片或是鐵 氟龍的絕緣塗料亦可應用於本創作中。可以理解的 是，將此電路板74先設置於下殼體76上，亦可增加 ® 此電路板74與對接連接器相連接時的強度。 綜上所述，本創作之電連接器係利用電路板作為前 後兩端之轉接端子，且配合用以支撐第一殼體之支撐 機構的設計，使得電連接器可以達到結構簡單、製程 簡便與薄型化的目的，因此可解決習知連接器之結構 複雜、製作成本高與所佔體積大的問題。此外，電路 板前後兩端之金手指之間距大小或數量的特殊設計， 還可以達到各種產品的不同需求，例如兩端金手指數 13 M367455 . 量不同以及間距不同的設計，不會影響到對接部與搭 接部所佔面積的大小差異過大，並且不等間距的設計 可以避免發生焊接不良或短路的問題，又或者是兩端 對接部與搭接部所佔面積的大小有差異以利於電連接 器與對接連接器插拔之用等。再者，本創作所提供之 電連接器係利用不同形式的支撐機構，用以支撐上殼 體，使其位於電路板之上。此支撐機構除了是外加於 上殼體與電路板之間的絕緣本體外，也可以是直接從 • 上殼體延伸之一支撐部，或者是上殼體與下殼體之間 所共同形成之卡接扣合結構來替代，並且絕緣本體依 材料的種類可包括有組裝件、塗覆件及貼覆件等三種 不同的選擇，其使得絕緣本體的高度大小可以跟著變 化，如此可增加產品設計的多元性，特別是當要使電 連接器達到薄型化的要求時，用以支撐上殼體之支撐 機構的設計就要跟者繼績向下減小南度大小，以滿足 電子產品之薄型化的要求。另外，本創作之電連接器 ® 可在電路板背面鋪銅來與上殼體產生電性導通作用， 達到防止電磁干擾（EMI)的目的，且可節省了下殼體 的設計與成本。 上述詳細說明為針對本創作一種較佳之可行實施 例說明而已，惟該實施例並非用以限定本創作之申請 專利範圍，凡其它未脫離本創作所揭示之技藝精神下 所完成之均等變化與修飾變更，均應包含於本創作所 涵蓋之專利範圍中。 14 M367455 【圖式簡單說明】 第一圖係本創狀電連翻之續組合示意圖。 第二圖係本_之電連接紅另—方向的立體組合示意圖 第三圖係本創作之電連接器之立體分解示意圖。 第四圖係第三财之電連接n之立體放大示意圖。 第五圖係第三圖中之電連接器之另—方向的放大示意圖。 第六圖係第-圖中之電連接器沿ΑΑ線段之剖面示意圖。 第七圖係本創作之另-電連接器之立體組合示意圖。 第V圖係第七®之電連接II之另—方向的立體組合示意圖。 第九圖係第七圖之電連接器之立體分解示意圖。 第十圖係壯圖之電連接H之另—方向的立體分解示意圖。 第十-圖係第九圖之電連接ϋ之第—殼體的立體示意圖。 第十二圖係第十-圖之電連接I!之第—殼體之另—方向的 立體示意圖。 第十三圖係第七®之電連接器沿ΒΒ線段之剖面示意圖。 第十四圖係本創作之又—電連翻之域組合示意圖。 第十五_料四®之電連接器之立齡解示意圖。 第十六_奸四圖之電連接H沿(^線段之触示意圖。 第十七圖係本創作之再一電連接器之立體組合示意圖。 第十八圖係第十七圖之電連接器之立體分解示意圖。 第十九_第十七圖之電連接雜⑽線段之剖面示意圖。 【主要元件符號說明】 15 M367455A plurality of bonding regions 346 and a plurality of through holes 345 extending through the upper and lower surfaces of the circuit board 34 are disposed on the surface. The first housing 3 has a support portion 3〇2 and a plurality of fitting portions 301. The support portion 3〇2 is disposed on the circuit board 34 and is configured to support the first housing 3 and make the first The housing is located above the circuit board 34. In the present embodiment, the support portion 3〇2 is soldered and fixed to the joint region 346i, and the fitting portions 3〇1 are fitted and fixed to the through holes 345. In this way, the [casing 3 〇; fixed installation is placed above the circuit board 34. In this embodiment, the space between the i body 30 and the circuit board 34 is formed by an L-shaped cleavage formed by the support portion. The L type: the bottom end is a soldering leg' Board connection = 46 phase connection. Since the cut has a similar function as the (4) of the insulative body 12 mentioned by ==, the electrical connector 3 can omit the use and cost of the insulation, and in addition, *the phase is thinner, that is, Height also M367455 • To be smaller, the electrical connector 3 with less insulation body 12 support design can achieve thinner requirements. An accommodating space 38 is formed between the circuit board 34, the first housing 30, and the support portion 302. The second contacts 344 are located in the accommodating space 38. A plurality of wires 4 are respectively soldered to the second contacts 344, and the wires 4 are electrically connected to the second contacts 344, wherein one end of the wires 4 is located in the accommodating space 38. In this embodiment, in order to form a grounding effect between the wire 4 and the first casing 30 φ, a ground bar 40 is disposed on the wires 4, and one end of the wires 4 is welded to In the second contact 344, the grounding bar 40 is just in contact with the elastic piece 303 of the first casing 30 and is located in the accommodating space 38. Then, the elastic piece 303 can be welded to the grounding rod 40 by welding. Thus, the wire 4 having the grounding function can be brought into contact with the first casing 30. It is to be noted that the abutting portion 341 of the rigid printed circuit board and the first contacts 343 protrude from the first housing 30, such as the abutting portion 341 of the circuit board 34 and the first contacts. The 343 is a connector male connector that forms a low voltage differential signal (LVDS). In this embodiment, no metal housing is disposed on the lower surface of the circuit board 34. However, the second housing (not shown) may be optionally disposed on the lower surface of the circuit board 34. Alternatively, a metal layer (not shown) is coated on the lower surface of the circuit board 34, wherein the metal layer extends into the through holes 345 so that the metal layer contacts the disengagement portion 301, so as to prevent Electromagnetic interference (EMI) effects, M367455. and save the design of the lower iron shell. In order to securely hold the circuit board 34 on the first housing 30, the fitting portions 301 may be soldered and fixed to the through holes 345 by soldering. Alternatively, the circuit board 34 may be a flexible printed circuit board (FPC). In order to increase the strength and thickness when connecting with the mating connector, the flexible printed circuit board may be first placed in the second housing (not Illustrated, the first housing 30 is soldered to the flexible printed circuit board or the first housing 30 is fixed to the second housing, and the second housing and the first housing 30 are The inter-system can form an interference state of the snap-fit. Referring to Figures 14 to 16, the present invention provides yet another electrical connector including an upper housing 50, an elastic insulator 52, and a circuit board 54, wherein the upper housing 50 is assembled in the circuit On the plate 54, the resilient insulator 52 is located between the circuit board 54 and the upper housing 50. The main difference between the electrical connector 5 and the electrical connector 1 described above is that the insulating body 12 is replaced by an elastic insulator 52, since the insulating body 12 of the general® is an assembly (or rubber core) made of engineering plastic, The material is relatively hard and is not easily disposed directly on the plurality of wires 6 during assembly, but must be assembled on the flat circuit board 14 to support the first casing 10 located thereon, but in the present embodiment, the elastic insulator Because of its better elasticity, the 52 can be directly attached to the plurality of wires 6, and then the upper casing 50 is directly assembled on the elastic insulator 52, so that the upper casing 50 can be supported and the upper casing 50 can be obtained. The effect of insulation between the wire 6 and the wire 6 is produced. M367455 In addition, the electrical connector 5 does not need to be soldered and fixed to the joint region 346 as the electrical connector 3 described above, so that the process is simple and the effect of thinning is better. Electrical connector 3 and electrical connector 1. In the present embodiment, the elastic insulator 52 is an insulating foam, but is not limited thereto, and other insulating adhesives such as insulating silicone can also be used in the present invention. Alternatively, the attachment of the elastic insulator 52 may be replaced by an applicator such as epoxy resin or UV glue, which is applied to a coating such as epoxy resin or UV glue. A plurality of wires 6 and the circuit board 14 are then subjected to steps of curing or hardening to have a certain strength, and then the first casing 10 is assembled on the coating member and the circuit board 14, so that a similarity can be achieved. The action and effect of the elastic insulator 52. The metal layer 56 is disposed on the lower surface of the circuit board 54, so that the electromagnetic interference can be prevented. It can be understood that the metal layer 56 can also be replaced by a lower iron casing (not shown). ® Referring to Figures 17 through 19, the present invention provides yet another electrical connector including an upper housing 70, an insulating layer 72, a circuit board 74, and a lower housing 76, wherein The housing 70 is assembled over the circuit board 74 with the insulating layer 72 between the upper housing 70 and the circuit board 74 and the lower housing 76 below the circuit board 74. In the present embodiment, the insulating layer 72 is disposed on the upper casing 70 for preventing the wires 8 soldered to the circuit board 74 from contacting the upper casing 70, 12 M367455. Alternatively, the insulation is Layer 72 can also be disposed over and overlying conductors 8 and circuit board 74. Since the height of the insulating layer 72 is much smaller than that of the elastic insulator 52, the supporting portion 302 and the insulating body 12 mentioned in the above embodiments, the insulating layer 72 alone cannot provide sufficient supporting force to the upper casing. 70, so in the present embodiment, the upper side of the upper casing 70 is provided with an upper fastening portion 700, and the upper fastening portion 700 is lapped on the lower fastening portion 760 of the lower casing 76 to make the lower casing The interference between the body 76 and the upper housing 70 forms a snap-fit engagement. The upper fastening portion 700 and the lower fastening portion 760 together form a supporting mechanism for supporting the upper casing 70 so as to be positioned above the circuit board 74. Since the height of the insulating layer 72 can be made smaller, the electrical connector 7 can be made thinner. In the present embodiment, the insulating layer 72 is a Mylar sheet (MYLAR), but is not limited thereto, and other insulating patches or Teflon insulating coatings may also be used in the present creation. It can be understood that the circuit board 74 is first disposed on the lower casing 76, and the strength of the circuit board 74 when connected to the mating connector can also be increased. In summary, the electrical connector of the present invention utilizes a circuit board as a transfer terminal at the front and rear ends, and cooperates with a support mechanism for supporting the first housing, so that the electrical connector can achieve a simple structure and a simple process. With the purpose of thinning, it is possible to solve the problem that the conventional connector has a complicated structure, a high manufacturing cost, and a large volume. In addition, the special design of the size or number of gold fingers between the front and rear of the board can also meet the different needs of various products, such as the gold hand index of 13 M367455 at both ends. The design of different amounts and different spacing will not affect the docking. The difference between the size of the area occupied by the lap and the lap is too large, and the design of the unequal spacing can avoid the problem of poor soldering or short circuit, or the difference in the area occupied by the butt joint and the lap at both ends to facilitate the electricity. Connector and docking connector for plugging and unplugging, etc. Furthermore, the electrical connector provided by this creation utilizes different forms of support mechanisms for supporting the upper casing over the circuit board. The supporting mechanism may be a supporting portion directly extending from the upper casing or a joint between the upper casing and the lower casing, in addition to the insulating body applied between the upper casing and the circuit board. The snap-fit structure is replaced, and the insulating body may include three different options, such as an assembly, an applicator and a sticker, depending on the type of material, so that the height of the insulative body can be changed accordingly, thereby increasing product design. The versatility, especially when the electrical connector is required to be thinned, the design of the supporting mechanism for supporting the upper casing is reduced to the south to meet the thinness of the electronic product. Requirements. In addition, the created electrical connector ® can be copper-plated on the back of the board to electrically conduct electricity to the upper case to prevent electromagnetic interference (EMI) and save the design and cost of the lower case. The above detailed description is intended to illustrate a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and other equivalents and modifications may be made without departing from the spirit of the invention. Changes are to be included in the scope of patents covered by this creation. 14 M367455 [Simple description of the diagram] The first diagram is a schematic diagram of the combination of the creation of the electrical connection. The second figure is a three-dimensional schematic diagram of the electrical connection of the present invention. The third figure is a three-dimensional exploded view of the electrical connector of the present invention. The fourth figure is a three-dimensional enlarged schematic diagram of the third financial connection n. The fifth figure is an enlarged schematic view of the other direction of the electrical connector in the third figure. The sixth figure is a schematic cross-sectional view of the electrical connector along the ΑΑ line segment in the first figure. The seventh figure is a three-dimensional combination diagram of the other-electric connector of the present invention. Figure V is a three-dimensional combination diagram of the other direction of the seventh electrical connection II. The ninth drawing is a perspective exploded view of the electrical connector of the seventh figure. The tenth figure is a three-dimensional exploded view of the other direction of the electrical connection H of the Z-picture. The tenth-figure is a perspective view of the first housing of the electrical connection port of the ninth figure. The twelfth figure is a perspective view of the other direction of the first-to-case of the electrical connection I! The thirteenth figure is a schematic cross-sectional view of the seventh connector of the electrical connector along the ΒΒ line segment. The fourteenth figure is a schematic diagram of the combination of the domain of the creation. The fifteenth _ material four ® electrical connector of the age of the solution diagram. The sixteenth _ traits of the four diagrams of the electrical connection H along the line of the ^ line diagram. The seventeenth figure is a three-dimensional combination of the electrical connector of the creation. The eighteenth figure is the electrical connector of the seventeenth figure Schematic diagram of the three-dimensional decomposition. Schematic diagram of the electric connection (10) line segment of the nineteenth to seventeenth. [Main component symbol description] 15 M367455
〔本創作〕 1 電連接器 10 第一殼體 101 嵌合部 12 絕緣本體 121 開口 14 電路板 141 對接部 142 搭接部 143 第一接點 144 第-一接點 145 通孔 16 金屬層 18 容置空間 2 導線 3 電連接器 30 第一殼體 301 嵌合部 302 支撐部 303 彈片 34 電路板 341 對接部 342 搭接部 343 第一接點 M367455[Creation] 1 Electrical connector 10 First housing 101 Fitting portion 12 Insulating body 121 Opening 14 Circuit board 141 Butting portion 142 Lap portion 143 First contact 144 First contact 145 Through hole 16 Metal layer 18 Accommodating space 2 wire 3 electrical connector 30 first housing 301 fitting portion 302 supporting portion 303 spring 34 circuit board 341 abutting portion 342 lap portion 343 first contact M367455
344 第二接點 345 通孔 346 接合區 38 容置空間 4 導線 5 電連接器 50 上殼體 52 彈性絕緣體 54 電路板 56 金屬層 6 導線 7 電連接器 70 上殼體 700 上扣合部 72 絕緣層 74 電路板 76 下殼體 760 下扣合部 8 導線344 second contact 345 through hole 346 junction area 38 accommodating space 4 wire 5 electrical connector 50 upper casing 52 elastic insulator 54 circuit board 56 metal layer 6 wire 7 electrical connector 70 upper casing 700 upper fastening portion 72 Insulation layer 74 circuit board 76 lower housing 760 lower fastening portion 8 wire