TWM366269U - Soft printed circuit board structure - Google Patents

Soft printed circuit board structure Download PDF

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Publication number
TWM366269U
TWM366269U TW98209215U TW98209215U TWM366269U TW M366269 U TWM366269 U TW M366269U TW 98209215 U TW98209215 U TW 98209215U TW 98209215 U TW98209215 U TW 98209215U TW M366269 U TWM366269 U TW M366269U
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Taiwan
Prior art keywords
layer
circuit board
polymer layer
printed circuit
polymer
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TW98209215U
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Chinese (zh)
Inventor
Zhi-Ming Lin
Shou-Rui Xiang
jian-hui Li
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Asia Electronic Material Co
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Priority to TW98209215U priority Critical patent/TWM366269U/en
Publication of TWM366269U publication Critical patent/TWM366269U/en

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
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Description

M366269 五、新型說明: 【新型所屬之技術領域】 *本創作係有關-種印刷電路板結構,尤指一種具有防 窺性能之軟性印刷電路板結構。 【先前技術】 ▲目前於電路板的表面上可設有高性能薄膜材料,而該 南性能薄膜材料中,㈣亞㈣膜(PQlyimideFiim)是且 ^的熱穩定性、電氣性及柔軟性的商業化產品,因而 領域中不可替代的最主要的基本材料,且該聚醯 亞月女賴的高可靠性更是其不可替代的原因之一。目前市 ,上^分的聚酿亞胺薄膜為亮光性聚醯亞胺薄膜,例 如’為了使聚酿亞胺保謨膜 ^ m 妝什錢具有遮敝電路佈局的功能,係 圖所示之聚酿亞胺薄膜η之上形成黑色黏著層 二然:’此種結構雖達到遮蔽之目的,但聚酿亞胺薄膜 表面^光澤度仍過亮,無法滿足特定光學應用之需求。、 為,市場對消光性聚酿亞胺保護膜之需求。另一 •:::構係如第1B圖所示,其係使用 色聚醯亞胺薄胺】】。,# ## ^ 成黏著層仏,、以此種方色聚酿亞胺薄膜山上形 好之消光效果,缺而之聚酿亞胺保護臈雖有較 與m '、、、而‘、、、色“亞胺薄膜Ua之成本過高, Λ際!產日4符需求,且含 存有抗拉強度、尺寸安定性等性質變差^=㈣護㈣ 二如板結構之性能的情況下,製造 先性良好的電路板結構,乃為目前仍待解 M366269 決之課題。 【新型内容】 鑒此,本創作提供—種軟性 5至5〇微米厚之第一¥入铷爲 k路板結構,包括: 物及選自碳粉、奈米碳管 物詹ϋ合 且該添加物含量佔π人物其混合物之添加物, 化,屬層,係形成於該第一聚合物層上;】〇 = 之弟t聚合物層,係形成於該圖案化金屬層上;以lf0 至35 Μ米厚之黏著層,係形成於 θ 入4知β m⑽h …x圖木化金屬層與第二聚 案化金屬層與第二聚合物層,且該 弟一聚5物層及黏著層之至少—声 pe 營、望舍銪钮4、* a匕s廷自石厌粉、奈米碳 B黑色顏枓或其混合物之添加物。 有粗::::體實施例中,該第二聚合物層的外表面可具 有粗心化⑽,且賴關·為料狀或波浪狀。 厚度為至3礒米之消光層’係形成於該第二聚合物層上, 該消光層包括W黏劑及分散於該膠黏劑中且選自二曰氧化 矽、二氧化鈦或其混合物之消光粉。 依前述結構,該消光層之外側表面可具有粗链化紋 路,且該紋路可例如為㈣狀或波浪狀;較佳地,該第二 聚合物層於與該消光層接觸的表面亦可具有粗||化紋路, 而該紋路亦可為鋸齒狀或波浪狀。 由土可知,本創作藉由該第一聚合物層、第二聚合物 層及黏著層之材質特性,提供遮蔽電路圖案之效果,以保 M366269 護該圖案化金屬層之樣式;再者,藉由設於該第二聚合物 層上之消光層,於保持該第二聚合物層之性能下,達到消 光的效果,不僅實施方式簡單,且毋須耗費過高之成本, ' 有效解決習知技術之缺失。 【實施方式】 以下係藉由特定的具體實例說明本創作之實施方 '式,熟悉此技藝之人士可由本說明書所揭示之内容輕易地 瞭解本創作之優點及功效。本創作亦可以其它不同的方式 ® 予以實施,即,在不悖離本創作所揭示之範疇下,能予不 同之修飾與改變。 在本文中,明度(lightness,又稱L值),係指根據 琢摩照明委員會( International Commission on Illumination )對色彩的明暗程度的定義。通常,白色明 度最高,黑色明度最低,而調整銅箔基板之聚醯亞胺層或 黏著層為接近黑色,明度則相對降低。本創作之明度係透 φ 過色差儀(ColorQuest XEhunterlab)測量。 光澤度(Gloss)係指本創作之銅箔基板聚醯亞胺層表 面之反光程度,光澤度不具有單位,但其數值越大,代表 其反射光之強度越強,反之,數值越小,代表其反射光之 強度越弱。本創作係以光澤度計(TVovo Gloss ™)測量光澤 度。 請參閱第2A至2E圖,係顯示本創作之軟性印刷電路 板結構之不同貫施例。 如第2A及2B圖所示,該軟性印刷電路板結構係包 M366269 括:第一聚合物層21、圖案化金屬層22、第二聚合物層 23、以及黏著層24。 所述之第一聚合物層21係5至50微米厚,於本實施 例中,該第一聚合物層21係電路板之本體;該第一聚合物 層21係包括聚合物及選自碳粉、奈米碳管、黑色顏料或其 混合物之添加物,且該添加物含量佔該聚合物固含量之3 至 20 wt%。 所述之圖案化金屬層22係形成於該第一聚合物層21 上,於本實施例中,該圖案化金屬層22係電路板之線路層。 所述之第二聚合物層23或23’係12至25微米厚,且 形成於該第一聚合物層21及圖案化金屬層22上。 所述之黏著層24係10至35微米厚,係形成於該圖 案化金屬層22與第二聚合物層23或23’之間以黏合該圖 案化金屬層22與第二聚合物層23或23’,於本實施例中, 該黏著層24係用以黏合於電路板上,例如電路板上之線路 〇 其中,如第2A圖所示,該第二聚合物層23’包含選自 碳粉、奈米碳管、黑色顏料或其混合物之添加物;亦可如 第2B圖所示,該黏著層24’包含選自碳粉、奈米碳管、黑 色顏料或其混合物之添加物。然,於另一實施態樣中,該 電路板結構之第二聚合物層23’與黏著層24’均可包含選自 碳粉、奈米碳管、黑色顏料或其混合物之添加物,於此並 未以圖式表示。 本創作藉由該第一聚合物層21及第二聚合物層23 =M366269 V. New description: [New technical field] * This creation is related to a kind of printed circuit board structure, especially a soft printed circuit board structure with anti-spy performance. [Prior Art] ▲ Currently, high-performance thin film materials can be provided on the surface of the circuit board, and among the south performance film materials, (4) PQlyimideFiim is a commercial of thermal stability, electrical properties and flexibility. Chemical products, and thus the most important basic materials that are irreplaceable in the field, and the high reliability of the Juyi Yayue Lai is one of the irreplaceable reasons. At present, the film of the brewing imine film is a bright polyimide film, for example, in order to make the polystyrene film have a concealing circuit layout, the figure shows A black adhesive layer is formed on the polyaniline film η: 'This structure achieves the purpose of shielding, but the surface gloss of the polyimide film is still too bright to meet the needs of specific optical applications. For the market demand for matt polyimide protective film. The other :::: structure is shown in Figure 1B, which uses a polyimine amide. , # ## ^ Into the adhesive layer 仏,, in this kind of square color, the imine film has a good matting effect on the mountain, and the lack of poly-imine protection is better than m ',, and ', , "The cost of the imine film Ua is too high, Λ !! The production day 4 symbol requirements, and the presence of tensile strength, dimensional stability and other properties deteriorated ^ = (four) protection (four) two as the performance of the board structure The manufacture of a good-precision circuit board structure is still a problem to be solved by M366269. [New content] In view of this, this creation provides a soft 5 to 5 〇 micron thick first 铷 铷 k k 板The structure comprises: an additive selected from the group consisting of carbon powder and carbon nanotubes, and the additive content is a mixture of π characters, and the genus layer is formed on the first polymer layer; 〇 = brother t polymer layer, formed on the patterned metal layer; lf0 to 35 厚 thick adhesive layer, formed in θ into 4 know β m (10) h ... x figure wood metal layer and second Forming the metal layer and the second polymer layer, and the at least one layer of the layer and the adhesive layer are at least - the sound pe camp, the 铕 铕 button 4, * a 匕Addition of steen self-stone powder, nano carbon B black enamel or a mixture thereof. There is a coarse:::: body embodiment, the outer surface of the second polymer layer may have carelessness (10), and a material or wavy. A matte layer having a thickness of up to 3 mils is formed on the second polymer layer, the matting layer comprising a W adhesive and dispersed in the adhesive and selected from the group consisting of ruthenium oxide a matte powder of ruthenium, titanium dioxide or a mixture thereof. According to the foregoing structure, the outer side surface of the matte layer may have a thick chain pattern, and the texture may be, for example, a (four) shape or a wave shape; preferably, the second polymer layer is The surface in contact with the matting layer may also have a thick texture, which may also be serrated or wavy. It is known from the soil that the first polymer layer, the second polymer layer and the adhesive layer are adhered to. The material properties of the layer provide the effect of shielding the circuit pattern to protect the M366269 from the patterned metal layer; further, the second polymer layer is maintained by the matte layer disposed on the second polymer layer Under the performance, the effect of matting is achieved, not only the implementation is simple There is no need to use excessively high cost, 'effectively solve the lack of the prior art. [Embodiment] The following is a specific example to illustrate the implementation of the present invention, and those skilled in the art can disclose the contents disclosed in the present specification. Easily understand the merits and effects of this creation. This creation can also be implemented in a variety of different ways, ie, without modification or change, without departing from the scope of this creation. In this article, brightness ( Lightness (also known as L value) refers to the definition of the degree of color shading according to the International Commission on Illumination. Generally, the white brightness is the highest, the black brightness is the lowest, and the polyimine layer of the copper foil substrate is adjusted. Or the adhesive layer is close to black, and the brightness is relatively low. The brightness of this creation is measured by the φ Colorimeter (ColorQuest XEhunterlab). Gloss refers to the degree of reflection of the surface of the copper foil substrate of the present invention. The gloss does not have a unit, but the larger the value, the stronger the intensity of the reflected light. Conversely, the smaller the value, The weaker the intensity of the reflected light. This creation measures gloss with a gloss meter (TVovo GlossTM). Please refer to Figures 2A through 2E for a different example of the flexible printed circuit board structure of this creation. As shown in Figs. 2A and 2B, the flexible printed circuit board structure package M366269 includes a first polymer layer 21, a patterned metal layer 22, a second polymer layer 23, and an adhesive layer 24. The first polymer layer 21 is 5 to 50 micrometers thick. In the embodiment, the first polymer layer 21 is a body of the circuit board; the first polymer layer 21 comprises a polymer and is selected from the group consisting of carbon. Addition of powder, carbon nanotubes, black pigment or a mixture thereof, and the additive content is from 3 to 20% by weight of the solid content of the polymer. The patterned metal layer 22 is formed on the first polymer layer 21. In the embodiment, the patterned metal layer 22 is a circuit layer of the circuit board. The second polymer layer 23 or 23' is 12 to 25 microns thick and is formed on the first polymer layer 21 and the patterned metal layer 22. The adhesive layer 24 is 10 to 35 microns thick and is formed between the patterned metal layer 22 and the second polymer layer 23 or 23' to bond the patterned metal layer 22 and the second polymer layer 23 or 23', in the embodiment, the adhesive layer 24 is used for bonding to a circuit board, such as a circuit board on a circuit board. As shown in FIG. 2A, the second polymer layer 23' comprises a carbon selected from carbon. Addition of powder, carbon nanotubes, black pigment or a mixture thereof; as shown in Fig. 2B, the adhesive layer 24' comprises an additive selected from the group consisting of carbon powder, carbon nanotubes, black pigments or mixtures thereof. However, in another embodiment, the second polymer layer 23' and the adhesive layer 24' of the circuit board structure may each comprise an additive selected from the group consisting of carbon powder, carbon nanotubes, black pigments, or a mixture thereof. This is not represented by a schema. The creation is performed by the first polymer layer 21 and the second polymer layer 23 =

I M366269 或黏著層24’之材質特性,提供遮蔽視線之效果,以令該 圖案化金屬層22之頂侧及底侧均無法透視,令使用者無法 由該電路板之外表得知線路層之佈線,俾有效保護該圖案 化金屬層22之設計。在本創作中,如前所示者,第二聚合 物層或黏著層之添加物含量可佔該層添加物以外成分固含 量之3至20 wt%。 在本創作之第2A及2B圖之態樣中,含有3至20 wt 0 %添加物即可使軟性印刷電路板之明度為小於或等於 25,光穿透率小於3%且光澤度為小於或等於30。 如第2C及2D圖所示,該軟性印刷電路板結構復包 括消光層25,該消光層25厚度為1至3微米,且形成於 該第二聚合物層23或23’上,該消光層25包括膠黏劑及 分散於該膠黏劑中且選自二氧化矽、二氧化鈦或其混合物 之消光粉。通常,於製備該消光層25時,係使用液態矽橡 膠或鐵氟龍(TEFLON)膠水作為膠黏劑,待該膠黏劑固化後 形成消光層25,由於本創作之消光層25係形成於聚合物 .上,不至於因分散之消光粉而影響聚合物之特性,且該固 化後之消光層25可令光線散射,達到整體結構之消光效 果;再者,本創作之消光層25之厚度為遠小於聚合物,且 以1至2微米為佳,故不至於影響聚合物之平坦性。 通常,具有消光層之軟性印刷電路板,係預先製備具 有消光層之覆蓋膜,因此,於製作上,可利用含浸滚輪沾 附包含膠黏劑及消光粉之液體,使得該液體得以被塗佈於 第二聚合物層表面上。通常,於製作時係控制用以形成消 7 M366269 光層=液體黏度在至·啊之間,且液體中包括膠黏 浏及'肖光粉之固含量在15至25 wt%之間。接著,當聚合 第二聚合物層)通過並接觸刮塗裝置時,可藉由刮 ί裝置之刮刀或線棒控制該液體所形成之消光層厚度為3 ^米以下,較佳為1至2微米的厚度。此外,固含量為15 =%的消光騎可使軟性印刷電路板的光澤度再降低至 一士第^2D圖所示,當該軟性印刷電路板結構設有該消 寸忒黏著層24’可包含選自碳粉' 奈米;ε炭管、黑 色顏料或其混合物之添加物;相同地,該第二聚合物層23, '、可匕3、自奴粉、奈米碳管、黑色顏料或其混合物之添 加物。 Η所示’遠軟性印刷電路板結構復包括保護 6丄依帛2D圖所不之結構為基礎,該保護層26係設於 該消光層25外側面上。可選用適合的材f作為保護層%, 例如水合物材質’ $ ’於本實施例中,該保護層係用以避 免消光粉脫落,故該保護層2 6之厚度僅需小於㈣光層即 可’甚至材質亦可同於消光層,只是不包括消光粉。 ⑭本創作藉由設於該第二聚合物層23上且厚度為】至3 "米之/肖光層25 ’並利用該消光層25含有分散於其令且 選自二氧切、二氧化鈦或其混合物之消光粉,使得該第 -聚合物層23具有消光性之外觀’且保持該第二聚合物層 ^之性能情況下,達到消光的效果,此f施方式簡單,毋 須乾費過高之成本,確實解決習知技術之缺失。 M366269 5月参閱第3A至3C圖,為增強消光效果,係於該軟 •性印刷電路板結構中設計粗链化紋路。 • 如弟3A圖所示,依第2B圖所示之結構 於·|歹第一取人 ^ 17丁、 丄 來δ物層23的外表面形成粗I造化紋路230,具體 而。忒紋路為鋸齒狀或波浪狀,然,亦可以第2Α圖所 ':之、'’°構為基礎’令該第二聚合物層23,的外表面具有粗 -糙化紋路,並無特定限制。 广 該消:二?,3 C圖所示,當該軟性印刷電路板結構設有 a 25日守’係於該第二聚合物層23與消光層乃接觸 紗絲糙化紋路挪,,然,如» 3C圖所示,該消 曰之外側表面亦可具有粗糙化紋路25〇 献路係為鋸齒狀或波浪狀。 ^而5 層及=材=藉由該第-聚合物層、第二聚合物 圖案化金異:供遮蔽視線之效果,以保護該 ,-之消光層,於伴藉由設於該第二聚合物層上 •效果,不僅實::;:聚:物層之性能下,達到消光的 解決習知技術之缺失毋須耗費過高之成本,有效 =說明書及實施例僅為例示 及其功效,而非用於限 个剜作之原理 應如後述之中請專利範圍所本創作之權利保護範圍, 【圖式簡單說明】 =:_為習知聚酸亞胺保護膜結構; 2EW_,她瞒路板結構示意 9 M366269 圖;以及 第3A至3C圖係為本創作另一軟性印刷電路板結構 之示意圖。 【主要元件符號說明】 11、11a 聚醯亞胺薄膜 12 、 12a 黏著層 21 第一聚合物層 22 圖案化金屬層 23 ' 23? 第二聚合物層 230 、 230, 粗糙化紋路 24 ' 24, 黏著層 25 消光層 250 粗糙化紋路 26 保護層 10The material characteristics of the I M366269 or the adhesive layer 24' provide the effect of shielding the line of sight so that the top side and the bottom side of the patterned metal layer 22 are not transparent, so that the user cannot know the circuit layer from the outside of the circuit board. The wiring, 俾 effectively protects the design of the patterned metal layer 22. In the present creation, as indicated above, the second polymer layer or the adhesive layer may be added in an amount of from 3 to 20% by weight based on the solid content of the component other than the layer additive. In the aspect of Figures 2A and 2B of the present invention, the inclusion of 3 to 20 wt% of the additive can make the brightness of the flexible printed circuit board less than or equal to 25, the light transmittance is less than 3% and the gloss is less than Or equal to 30. As shown in FIGS. 2C and 2D, the flexible printed circuit board structure further includes a matting layer 25 having a thickness of 1 to 3 μm and formed on the second polymer layer 23 or 23 ′, the extinction layer. 25 includes an adhesive and a matting powder dispersed in the adhesive and selected from the group consisting of ceria, titania or a mixture thereof. Generally, in the preparation of the matting layer 25, liquid enamel rubber or Teflon glue is used as an adhesive, and after the adhesive is cured, a matting layer 25 is formed, since the matting layer 25 of the present invention is formed. On the polymer, the characteristics of the polymer are not affected by the dispersed matting powder, and the cured matte layer 25 can scatter light to achieve the matting effect of the overall structure; further, the thickness of the matte layer 25 of the present invention It is much smaller than the polymer and preferably 1 to 2 microns, so that it does not affect the flatness of the polymer. Generally, a flexible printed circuit board having a matte layer is prepared by previously preparing a cover film having a matte layer. Therefore, in the production, a liquid containing an adhesive and a matting powder can be adhered by an impregnating roller so that the liquid can be coated. On the surface of the second polymer layer. Usually, it is controlled to form the light layer of the M366269 liquid viscosity between the two, and the liquid includes the adhesive and the solid content of the 'Xiaoguang powder is between 15 and 25 wt%. Then, when the second polymer layer is polymerized and passed through the blade coating device, the thickness of the matte layer formed by controlling the liquid by the scraper or the wire bar of the scraping device is 3 μm or less, preferably 1 to 2 microns thickness. In addition, the extinction ride with a solid content of 15 =% can reduce the gloss of the flexible printed circuit board to the one shown in Figure 2, when the flexible printed circuit board structure is provided with the adhesive layer 24'. Containing an additive selected from the group consisting of carbon powder 'nano; ε carbon tube, black pigment or a mixture thereof; similarly, the second polymer layer 23, ', 匕3, from slave powder, carbon nanotube, black pigment An additive to or a mixture thereof. The "flexible printed circuit board structure" shown in Fig. 为 is based on the structure of the protective layer 26, which is provided on the outer side of the matte layer 25. A suitable material f can be selected as the protective layer %, for example, the hydrate material ' $ '. In the present embodiment, the protective layer is used to prevent the matting powder from falling off, so the thickness of the protective layer 26 is only required to be smaller than (4) the optical layer. Can even 'material can also be the same as the matte layer, but does not include matting powder. 14 The present invention is provided on the second polymer layer 23 and has a thickness of 3 to quot; m/xiao light layer 25' and utilizes the matting layer 25 to be dispersed therein and selected from the group consisting of dioxate and titanium dioxide. Or the matting powder of the mixture, such that the first polymer layer 23 has a matte appearance and maintains the performance of the second polymer layer to achieve the matting effect, which is simple and does not require The high cost does solve the lack of conventional technology. M366269 May 3rd to 3C, in order to enhance the matting effect, the thick chained texture is designed in the soft printed circuit board structure. • As shown in Fig. 3A, the structure shown in Fig. 2B is formed on the outer surface of the δ layer 23 on the outer surface of the δ layer 23, specifically. The ruthenium road is serrated or wavy. However, the second polymer layer 23 may have a rough-roughened grain on the outer surface of the second polymer layer 23, which is not specific. limit. Widely cancel: two? As shown in Fig. 3C, when the flexible printed circuit board structure is provided with a 25-day guard, the second polymer layer 23 and the matting layer are in contact with the roughening of the yarn, and, as in the 3C diagram It can be noted that the outer surface of the eliminator can also have a roughened texture 25, and the road is zigzag or wavy. And 5 layers and = material = by the first polymer layer, the second polymer patterning gold: the effect of shielding the line of sight to protect the - matte layer, by being provided in the second On the polymer layer, the effect is not only the actual::;: poly: the performance of the layer, the elimination of the extinction technology, the lack of the conventional technology does not require excessive cost, effective = the description and examples are only examples and their effects, The principle of not limiting the operation should be as described in the scope of patent protection in the following paragraphs. [Simple description of the diagram] =: _ is the traditional polyimide protective film structure; 2EW_, her circuit board Structure Figure 9 M366269 diagram; and diagrams 3A to 3C are schematic diagrams of another flexible printed circuit board structure. [Main component symbol description] 11, 11a Polyimine film 12, 12a Adhesive layer 21 First polymer layer 22 Patterned metal layer 23' 23? Second polymer layer 230, 230, roughened grain 24' 24, Adhesive layer 25 matte layer 250 roughened texture 26 protective layer 10

Claims (1)

M366269 六 、申請專利範圍: -種軟性印刷電路板結構,包括: 包括微米厚之第—聚合物層’該第—聚合物層 入物選自碳粉、奈繼、黑色顏料或其混 ::之:加物,且該添加物含量佔該聚合物固含量之3 至 20 wt% ; 圖案化金屬層,係形成於該第—聚合物層上. 化金==厚之第二聚合物層,係形成:該圖案 #盘1第G至取35人"1米厚之黏著層’係形成於該圖案化金屬 二t4 間以黏合該圖案化金屬層與第二 I物層’且該第二聚合物層及黏著層之至少一層包 :選自碳粉、奈米碳管、黑色顏料或其混合物之:加 物。 請專利範圍第i項之軟性印刷電路板結構,復包 厚度為1至3微米之消光層,係形成於該第二聚合 物層上,該消光層包括膠黏劑及分散於該膠黏劑令且 選自二氧化矽、二氧化鈦或其混合物之消光粉。 3·如申請專利範圍第2項之軟性印刷電路板結構,其中, 該消光層之外侧表面具有粗糙化紋路。 ^ ΐ π專利範圍第3項之軟性印刷電路板結構,其中, 。亥紋路為鑛#狀或波浪狀。 5·如中請專利第2至4項中任—項之軟性印刷電路 板、,,。構’其中,该第二聚合物層與該消光層接觸的表 6.M366269 VI. Scope of Application: - A flexible printed circuit board structure comprising: a micron thick layer - a polymer layer - the first polymer layer is selected from the group consisting of carbon powder, Nei, black pigment or a mixture thereof: Adding material, and the additive content is 3 to 20 wt% of the solid content of the polymer; the patterned metal layer is formed on the first polymer layer. The gold==thick second polymer layer Forming: the pattern #盘1第G至取35人"1 meter thick adhesive layer' is formed between the patterned metal two t4 to bond the patterned metal layer and the second I layer' and At least one layer of the second polymer layer and the adhesive layer: an additive selected from the group consisting of carbon powder, carbon nanotube, black pigment or a mixture thereof. The soft printed circuit board structure of the invention of claim i, the matting layer having a thickness of 1 to 3 micrometers is formed on the second polymer layer, the matting layer comprising an adhesive and dispersed in the adhesive A matting powder selected from the group consisting of ceria, titania or a mixture thereof. 3. The flexible printed circuit board structure of claim 2, wherein the outer surface of the matte layer has a roughened texture. ^ ΐ π Patent Area No. 3 of the flexible printed circuit board structure, in which. The Hai Road is a mine-like or wavy shape. 5. Please refer to the flexible printed circuit board of any of the items in items 2 to 4 of the patent. a table in which the second polymer layer is in contact with the matte layer. 路板結構, 化紋路。 路板結構, M366269 面係具有粗糙化紋路。 如申請專利範圍第5項之軟性印刷 該紋路為料狀錢浪狀。 毛路板結構 如:請專利範圍第1項之軟性印刷電 该乐二聚合物層的外表面係具有粗糙 f申請專利範圍第7項之軟性印刷電 5亥紋路為鋸齒狀或波浪狀。 ’其中, 其中, 其中, ,復包Road structure, morphing road. The road board structure, M366269 has a rough texture. For example, the soft printing of item 5 of the patent application scope is a material-like money wave. The structure of the hairboard is as follows: Please apply the flexible printing of the first item of the patent range. The outer surface of the polymer layer is rough. f The soft printed circuit of the seventh application patent scope 5 is a jagged or wavy shape. Among them, among them,
TW98209215U 2009-05-26 2009-05-26 Soft printed circuit board structure TWM366269U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573499B (en) * 2015-12-03 2017-03-01 Nat Kaohsiung First Univ Of Science And Tech Flexible thin printed circuit board manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573499B (en) * 2015-12-03 2017-03-01 Nat Kaohsiung First Univ Of Science And Tech Flexible thin printed circuit board manufacturing method

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