TWM364878U - Image forming apparatus for coating substrate - Google Patents

Description

M364878 VIII. New description: [New technical field] The new type relates to an imaging device, and the side is related to a multi-layer dielectric coated with high reflection, low penetration and high penetration to visible light. Film imaging. ...[Previous technology] In recent years, 'there are horrific activities in the world, and the terrorist activities in Europe and the United States have caused the government to _ a total of power to apply for more women’s full surveillance surveillance (known (3) (10) camera), to appropriate for the villains Prevention and deterrence, such as in the community, metropolitan streets, stores and other public places, etc. In the event of theft, sexual assault or major events, the images recorded by the surveillance cameras can be observed and restored. . But the advancement of technology has led to improvements in the evil knowledge and skills of thieves or terrorists. A clear example is the theft of surveillance cameras or the deliberate avoidance of surveillance sites. Therefore, the anti-theft surveillance type camouflage hidden (c〇ncea|ed Camera) photography φ device is an urgently needed security device in Europe and the United States and other countries in the world, especially for the public security protection field after the 9/11 incident in the United States, and the US homeland security. The announcement that "public safety is more important than personal privacy" is more obvious. For the camouflage hidden photographic device, a mask coated with a transparent film on a transparent substrate is used to cover the camera. When the incident light is incident on the metal film, it is divided into two lights, and most of the light is reflected on the front surface of the metal film. The bright mirror can hide the camera, and a small part of the light is transmitted through the surface of the metal film into the camera lens. In order to reduce the reflection caused by the mask and again incident on the camera lens to form overlapping ghosts, affecting the image quality, a corresponding metal anti-reflection film layer is often added. 5 M364878 For example, 'The Republic of China's new patent certificate No. Hemispherical hood photographic device created in 2007', and the Chinese utility model patent published in 2007, 200720154044.5 "Photographic hemisphere with anti-reflection film aluminized mirror surface A mask, etc., is a highly reflective metal film on the front side of a transparent substrate, which is reflected by frontal incident light. • Used to cover (hide) the camera, and to plate an anti-reflective metal film on the back side of a transparent substrate. It is used to absorb and reduce the reflection in the coating mask, so as not to affect the quality of the camera photography in the coating mask. The reflective film is mainly used to increase the reflectivity of the optical surface. Generally, it can be divided into two categories, one is a metal reflective film, and the other is a full dielectric reflective film. In addition, there is a metal dielectric reflective film that combines the two. The metal reflective film has the advantages of simple preparation process and wide working wavelength range; the disadvantage is that the optical loss is large and the reflectance is not high. Metallic coatings are relatively wide and are relatively insensitive to incident light angles. The metal film has an absorption band for the infrared, which is disadvantageous for infrared night vision photography. Dielectric coatings can achieve high reflectance at specific wavelengths and are insensitive to small angles of incident light. When large angles change (eg, 45 degrees), the reflectivity will vary greatly. Generally speaking, the dielectric film has higher reflectance than the metal film, has good firmness, strong damage resistance, and is transparent in visible light and infrared. 6 M364878 [New Content] The problems to be solved in this creation are as follows: (1) How to improve the reflectivity of the coated substrate and increase its penetration rate at the same time? (2) How to make the coated substrate have a high penetration (above) in the infrared range? (3) How to make the back side of the substrate have attenuated reflective light, and improve the image quality of the image pickup unit on the back surface of the forged film substrate? The technical solution adopted by this creation is: On the transparent substrate, a multi-layer dielectric film and a metal film layer are substituted for the metal film plated on the transparent substrate of the prior art. Transparent substrates, transparent substrates can be divided into two categories: optical grade transparent glass and transparent resin. The transparent substrate must first have high transparency, and the surface quality requirements must be strict. • Try not to have any defects such as streaks, pores, whitening, halo, black spots, discoloration, poor luster, etc. > Visible light and infrared are transparent The transparency of the substrate is generally affected by factors such as reflection, penetration, absorption, and scattering of "light." A multilayer dielectric film and a metal film layer are plated on a transparent substrate. Multilayer Dielectric Films Today, in thin film optics, we can easily apply a multi-layer quarter-wave film stack with high refractive index and high refractive index on the optical grade transparent substrate by vector method or admittance trajectory method. The penetration rate is T%. In theory, it is also proved that the same multi-layer number is used, and the quarter-wave film stack has a higher reflectance than the non-quarter-wave film stack of 7 M364878 R°/〇. The more the number of layers, the greater the reflectivity. In other words, it is easy to control the split ratio of penetration and reflection. In the currently available coating materials, the high refractive index in the visible light region is 2.4 or less and the low refractive index is 1.35 or more, so the width of the high reflection band of the single quarter film stack is limited. Therefore, in order to satisfy the present embodiment, it is possible to have a wide reflection band like a metal film in the visible light region, and it is necessary to broaden the high reflection band of the dielectric film. The design of the coating can basically be started from the standard film system. For example, high reflection mirrors are designed on the basis of a quarter-wave film stack, regardless of the width or single or double wave number. When the initial design fails to meet the optical performance of the demand, it is optimized or synthesized using current commercially designed computer software. As shown in FIG. 4 of the following embodiment, the plating material used in the multilayer dielectric film of the present embodiment is an oxide film, and the film having different refractive indices of Ti3〇5 and Si〇2 is alternated in the coating machine. Evaporation of 18 layers. _ Metal film layer, the plating material used in the metal film layer of this embodiment has metal chromium Cr which absorbs incident light. Please refer to Figure 1 for a schematic diagram of the design of the authoring device. As shown in Fig. 1, a coated substrate 1, a casing 2 and a CCD camera 3 are included. The key film substrate 1 further comprises a transparent substrate 1a and a multilayer dielectric film layer (hereinafter referred to as a dielectric film layer Mb and a metal film layer 1ce, the housing 2 is an opaque container, and the housing 2 has On the open side, the open side is placed with a plated 8 M364878 film substrate 1 'The inside of the casing 2 houses a CCD camera 3, wherein the lens 31 of the CCD camera 3 is aligned with the back surface of the coated substrate 1 (the face having the metal film layer ic) Fig. 1 also includes representative light rays which are conveniently described, such as incident light L1, reflected light Lla, and transmitted light Lib, Lie, Lid, and Lie, etc. As shown in Fig. 1, incident light L1 is incident on the coating film. The substrate 1 generates a light splitting effect. The incident light L1 is partially reflected on the front surface of the coated substrate 1 as reflected light Lia, and a part of the light penetrates through the key film substrate 1 and becomes a transmitted light Lie into the lens 31 of the CCD camera 3. It is assumed that the light energy ratio of the incident light L1 is 1 〇〇〇 / 0. When the reflected light Lla > 50% of the incident light L1, a significantly bright mirror surface (human eye) can be formed on the front surface of the coated substrate 1 It looks like a mirror.) This creation is expected to be made on the front surface of the chain film substrate 1. Bright specular highly reflective now. So, this is a creative design conditions Lla set to 60% (greater than 50%).

Lie enters the lens 31 of the CCD camera 3 so that the CCD camera 3 can be imaged. This creative design condition is to set Lie to 15%. That is to say, this creation assumes that the incident light L1 is 100%, and the design conditions are that the reflected light Lla is 60% and the transmitted light Lie is 15%. As shown in Fig. 1, when the incident light L1 is 1 〇〇〇/0, the reflected light L1a is 60% and the transmitted light Lie is 15%; the incident light L1 is absorbed on the coated substrate 1 (light energy loss) by 25. /. (100%-60%-15%). 9 M364878 Now 'this design condition is that the reflected light Lla & 6〇%, the absorption rate is 25% and the transmitted light Lie is 15%'. There are two problems to be solved: (1) How to determine 15% of the transmitted light L1e Can you meet the imaging conditions of CCD Care 3? And, (2) How to control the absorption rate of the coated substrate 1 2504? In the original design, the following experiment was carried out to explain (-) that 15% of the transmitted light Lie can meet the imaging conditions of the CCD camera 3: The experimental indoor frame is provided with six illuminating light sets of different sizes, and the environment of the object to be ingested before the key film substrate) shows an illuminance of about 28 〇 Lux through a general illuminometer. The color CCD camera 3 used in the present embodiment is an image sensor of a general-purpose Japanese-style s〇ny, and the manufacturer's specification indicates the lowest-intensity illuminance 1 Lux. The transmitted light Lie penetrated during the test is about 42 Lux (that is, 280 Lux multiplied by 15%), and the image of the object can be displayed by the color CCD camera. The general induction illuminance is ten times the minimum illuminance. The quality of the images taken above was very good. In the illuminance environment in which the illuminance is reduced to about 1 〇〇 Lux in the laboratory, the lens 31 of the color CCD camera 3 behind the coated substrate i is approximately i 〇〇 | _ ux * 15% = 15 Lux light amount 'by color The image output of the CCD camera 3 can also display an image of the object. When the laboratory _ _ _ about 5 GLux town, the object image presented by the face is changed from color to black and white (commonly known as day and night type), and even sometimes (slightly lower order products) images are white spots or It is not clear that in the case of a5Lux, the general color CCD camera 3 does not see the M364878 clear object image. Therefore, when the light transmittance percentage ratio T% (Transmittance °/〇) of Lie is set to 15%, it is not necessarily just 15%! Especially for the image sensor of the higher-order color CCD camera 3, it can be set. At 10. /. Or lower. At present, the high-end Sony color CCD camera 3 has the lowest illumination of 0.005 Lux. That is to say, the lower the light transmittance Lie φ demand can be employed using a higher order color camera. The present embodiment considers the cost problem, and adopts a color camera (Color CCD) of a general low-end price. Further experiments have shown that the light transmittance when using Color Cmos Lie is adjusted to be between 25% and 35%. The minimum illuminance that can be sensed by the Image Sensor of a commercially available color camera is about 1 Lux. Some high-end types are between 0.01 and 0.001 LUX, and there are also low-illuminances called 星_〇〇2 Lux. The image sensor of the commercially available low-order Cmos is also around 2 Lux. For the 2Lux image sensor, in the illuminance environment adjusted to about 280Lux in the laboratory, the 42Lu>((ie 280Lux multiplied by 15%) light input amount is more than 2Lux. When the ambient illumination of the environment drops to the sense of insufficient image sensor, the image output from the video output of the camera often displays a snowflake-like spot on the image display (Monitor), resulting in poor imaging quality. Or can't image. At this time, you can change the image to a higher-order (low-illuminance) camera in the required environment (11), 11 M364878 or (2) increase the auxiliary light source (increasing the intensity of the incident light L1) to improve the image quality. That is to say, the transmitted light Lie is 15%, which is not necessarily just 15% of the reason! Therefore, 15% of the transmitted light Lie can satisfy the imaging condition of the CCD camera 3, the size (intensity) of the incident light L1 and the CCD camera 3 image sensor quality is a key factor 8 Of course, when the transmitted light Lie is greater than 15%, that is, the larger the image, the better the image quality can be achieved. If the closer to the incident light 100% is the best, but the transmission Light Lie , the reflected light Lla is lowered. Because L1 and Lie are inversely proportional to L1, Lla is small and Lla is small. Lla reduces the specular reflection effect and loses the hidden decorative meaning. The pinch is mainly determined by the ambient illuminance and the quality of the image taking unit. Next, it is explained how to control the absorption rate of the coated substrate 1 at 25%. In fact, the optical properties of the coated substrate 1 as shown in Fig. The phenomenon is not only the reflected light Lla, but also the transmitted light Lib, Lie, Lid, Lie, etc. For example, the interface between the transparent substrate la and the dielectric film layer lb, such as Lib, may also have numerous reflected light reflected to Complex dielectric calculations are involved in the dielectric film la, and then transmitted through the transparent substrate 1a. For the sake of simplicity, these complicated mathematical calculations such as reflected light and transmitted light are omitted. Figure 1 shows the reflected light L1. After the light energy penetrates into the transparent substrate la, Lib remains, Lib penetrates to the dielectric film layer lb and remains Lie, and Lie penetrates into the metal film layer lc and remains Lie. Finally, in the shell 2 There is a transmitted light Lie into which the incident light L1 is converted. 2 M364878 This transmitted light Lie is the light source required for imaging of the camera 3. The mathematical expression of the absorptivity A% of the coated substrate 1 is: A%=L1b+L1c+L1d=25%. The absorption or loss of light energy in each medium such as the transparent substrate la, the dielectric film layer 1b and the metal film layer lc can be affected by the optical phenomenon on the complicated medium and each medium interface. The image quality involved is not obvious, so it can be ignored. Due to the transparent requirements of the transparent substrate la, the transparency of the visible film and infrared of the dielectric film ib film, the above A%=L1b+L1c+ L1d=25%, which can be simplified as; A0/〇= L1d=25%. That is, controlling the thickness of the plating film of the metal film layer lc can control the absorption rate A% of the plating substrate 1. After plating a multilayer dielectric film ib and a metal film layer lc on a transparent substrate 1a, the spectrum of the Hitachi spectrometer U-4100 is tested and automatically plotted as shown in FIG. 4 curve 4A1. The transmittance τ% of the visible light range of 400 nm to 700 nm averaged 27.1%, and the reflectance R% averaged about 56% (Fig. 5). On the other hand, the transmittance T% of the infrared 780 nm to 1,000 nm portion is about 75% on average. That is, a coated substrate 1 formed by plating a multilayer dielectric film ib and a metal film layer lc on a transparent substrate 1a, for a simple incident light, the coated substrate 1: 13 M364878 (1 The 56% reflectance R% forms a specular high reflection on the front surface of the coated substrate 1 (like a mirror) 9 (2) Its 27% transmittance T% images the camera on the back side of the coated substrate 1. .- (3) The absorption rate of 17% (100%-56%-27%) causes unnecessary reflection on the back side of the coated substrate 1 to be absorbed to avoid ghosting and affecting the quality of photography. (4) 75% of it The infrared transmittance T% enables the camera on the back of the coated substrate 1 to capture infrared images. From the parameters of (1) to (4), the expected efficacy of the technical solution adopted by this creation can be known. Among them, as in (3), the absorption rate of 17% is actually the relationship of the metal plating layer 1c. If the coated substrate 1 is plated with only one multi-layer dielectric film lb without a metallization layer, the 17% loss (a) can be added to the 56% reflectance r% of the coated substrate i to make this reflection The rate becomes 73% (56% + 17%), or (2) can be added to the 27% transmittance τ% of the coated substrate 1 so that the transmittance becomes 44% (27% + 17%). 〇), or (3) may be separately added (equal or unequal ratio) to the reflectance R% and the transmittance T% of the coated substrate i. This is another benefit of plating a multilayer dielectric film over a metallized layer. The problem is that it is necessary to solve the problem that the back surface of the coated substrate 1 has an attenuating reflection effect and the image quality of the image pickup unit on the back side of the coated substrate 1 is improved. In the following embodiments, there are two methods: First - ” An opaque black soft cover 32 is placed around the photographic lens 31 to block the reflection of the back surface of the coated substrate 14 M364878. Secondly, a casing 2 is disposed on the back surface of the coated substrate 1, and a black or dark rough surface is formed on the inner surface of the casing 2 for absorbing and scattering the reflection of the back surface of the coated substrate 1. Therefore, when the metal plating film is not used on the coated substrate 1, the above two methods can also be employed. ® The technical effect of the technical solutions and features adopted by this creation: One of the effects of this creation is that for the same incident light, because the metal film has a relatively large loss of light energy, the plating of the multilayer dielectric film is used instead of the metal plating. The film can increase the reflectance thereof, so that the front surface of the key film substrate presents a bright high mirror surface for hiding the image capturing unit of the back surface of the decorative coated substrate. The second effect of the present invention is that the visible light and the infrared light transmitted through the coated substrate 1 can image the image capturing unit 3 on the back surface of the key film substrate 1. + The effect of the creation of the third substrate is the back of the substrate; the unnecessary reflection is given to the attenuation (absorption) to improve the imaging quality of the image capturing unit 3 and the hidden image capturing unit 3 15 M364878 [Embodiment] This embodiment The nouns of the examples are defined as follows: transparent ruthenium and transparent (1) transparent substrate la, transparent substrate ia can be divided into two major categories of optical grade resin. Explanation of the transparent substrate la: The transparent glass of the optical grade in the transparent substrate la is suitable for the use of flatness and can be purely purely «贱合采肝录, (4)

Transparent glass, clear glass with blue, or whiteboard glass forehead Β __7, etc. I glass test effect is better. *In the whiteboard, the transparent resin is a non-crystalline body with less light scattering. For example, transparent industrial resins. • Transparent resin or general transparent polymer with a fine interface inside and light scattering, which is typically a crystalline structure. For example, it is also water and ice composed of H2〇. Water is transparent, and ice is mostly opaque. This is because ice is a crystal, and light scattering occurs. Light is transmitted through the age. Water is amorphous, and light scattering is small, so it is transparent.

Resins with good transparency in industrial plastics are: PMMA (transparency 93%), PC (transparency 88%), PS (transparency 89〇/〇), CR-39 (transparency 90%), SAN 16 M364878 resin ( Transparency 90%), MS resin (transparency 90%), poly-4methylpentene-(ΤΡΧ) (transparency > 90%). In addition, transparency such as decyl methacrylate, styrene copolymer (MAS), PET, PP, and PVC is excellent. Among these general-purpose transparent resins, the light transmittance includes not only visible light having a wavelength of from 380 nm to 780 nm but also a near-infrared field having a wavelength of from 780 nm to 1000 nm. • The transparency of visible light and infrared light in transparent resins is generally affected by factors such as reflection, penetration, absorption, and scattering of “light”. When light enters the transparent resin, some of it will be reflected on the surface and lost. The example of reflection is usually when the refractive index n1 (=1) of the light is perpendicularly incident on the polymer having the refractive index n2, and the calculated surface reflectance R% is divided by the square of (η-l) by (n+ The square of l) is expressed. The data shows that the refractive index of transparent acrylic (Plexiglas) pmma (Polymethylmethacrylate) is L49, and the surface reflectance RO/〇 is calculated to be about 4%. The total light transmittance of PMMA is about 93%. This loss of light is mostly caused by the secondary reflection of the surface back and forth, while the internal loss such as absorption and scattering is very small. When the light hits the transparent resin molecule, the molecule will absorb its energy and rotate, causing the light absorption to reduce the permeability, and the scattering occurring during the light-off will greatly reduce the light transmission. Since the scattering system in the transparent resin (4) is proportional to the refractive index of 8 squares and inversely proportional to the wavelength 4, the scattering loss of the material having a low refractive index is small, and the scattering is in the visible light region where the wavelength of the wave is longer than M. Less affected. In the infrared field with longer wavelengths, the effect of the scattering is almost as small as zero. This argument is to support the fact that this embodiment only deals with the interpretation of reflection, penetration and absorption of light without discussing more complex scattering phenomena. Moreover, some foreign matter generated or incorporated by the transparent resin or a transparent polymer during the manufacturing process also reduces the light transmittance due to scattering. According to the manufacturer's data, the optical grade PMMA foreign matter is only one tenth of the general molding pmmA, and the foreign matter particle size is 0.5叩~0.〇7, the optical grade PMMA foreign matter is about 600~2000. The amount of foreign matter of the general-grade PMMA is about 4,000 to 20,000 pieces/g. This is why this embodiment suggests the use of optical grade PMMA. In practical applications, the refractive index is greatly affected by changes in the temperature and humidity of the environment. In general, the higher the refractive index of the transparent resin, the greater the reflectance. The structure of the transparent resin is not uniform, optically causing unevenness in the refractive index on the microscopic surface, and the refractive index of the optical grade is relatively uniform. At present, acrylic PMMA (poly(decyl methacrylate)) is the first of its kind in plastics. It can also fully see through the object when the thickness of the cast sheet is 1〇〇mm. It can also use the dye to freely color, and the surface gloss is very good and non-toxic to the human body. The spectral light transmittance of PMMA manufactured by Mitsubishi Rayon is increased in the ultraviolet light from around 250 nm, and is not absorbed at all in the visible light field. PMMA belongs to a kind of amorphous plastic (Am〇 “ph〇us”. The polymer chain is disorderly arranged and entangled. It does not form an orderly structure. There is no crystal nucleus and grain growth process during solidification. It is only free. The polymer chain is "frosted" (frozen), so it has a high transparent appearance. The hybrid polymer has good light transmittance, and the density of the material f is also low. Due to the different refractive indices of spherulites and amorphous regions, the crystalline crystals have poor light transmittance and high material density, which is not suitable for use in this embodiment. PMMA acrylic sheets have good processing properties and can be used in heat. Molding (including molding, blow molding and vacuum blistering), can also be drilled, car, cut, etc. by mechanical processing. Micro-computer controlled mechanical cutting and engraving not only improve the processing precision, but also can not be produced in the traditional way. Finished pattern and shape. Further, it can be followed by coating, coating, etc., which is very suitable for the use of the embodiment of the present invention. The above argument is also suggested to use optical grade PMMA in this embodiment. Cause: Polycarbonate PC (Polycarbonate) which is slightly less transparent than PMMA (transparency of about 88%) is another transparent resin used in this embodiment. The difference between the two is as follows: PMMA disadvantage: high water absorption It has a slightly poor heat resistance, is less resistant to impact, and is easier to ignite. PC disadvantage: poor formability. Because of the high viscosity of PC, the forming temperature is also higher. However, it does not require particularly difficult forming technology. The coating method adopted in this embodiment is in vacuum evaporation, the temperature resistance of the transparent glass is about 300 ° C, the temperature resistance of the PC is about ll 〇 ° C and the temperature resistance of the PMMA is about 70 ° C, and the cold treatment with PMMA is more Difficult' but this is not technically difficult for manufacturers with coating experience and better equipment. In the coated substrate 1 coated in this embodiment, the starting transparent substrate la is relatively easy to vaporize using transparent glass. A little experience, then take the PC, and then use the 19 M364878 PMMA which is difficult (the temperature is too high to deform, the temperature is too low, the adhesion of the film is not good). (2) Dielectric film layer lb, dielectric film The film of layer lb contains an oxide film. Explanation of layer lb: The requirements for the use of the film in this embodiment are: transparent in the visible and infrared ranges. For example, Ti〇2, Ti2〇5, Ti3〇5, Nb2〇5, Zr〇2, Hf〇2 For Si〇2, etc., if there is no ion source assisted plating (IAD), the transparent substrate is suitable for high temperature to 250 ° C ~ 300 ° C, and after vacuuming, about 15 mPa of spring oxygen evaporation, a strong transparent oxide film can be obtained. However, if the transparent substrate 1& is a pc substrate or a PMMA substrate, ion source plating must be supplemented if a good film quality is to be obtained. Optical coating technology has been rapidly developed in recent years as well as other technologies. There are many kinds of coating technology, which can be roughly divided into two types: liquid and gas molding. Most of the former involve chemical changes, such as the common sol method (S0|_ge丨). Some of the latter use chemical action, while others are physical.験Please refer to Figure 2 for the relationship between the reflectance of the film (bond film) and the optical thickness. It is known from the optical film interference phenomenon that when the light is perpendicularly incident on the single layer film, and the optical thickness Nd (which is the product of the film reflectance and the film thickness) is (2; ι 〇 / 2), λ 〇, (3 λ 〇 / 2) ... the reflection intensity of the film layer is invariant; if the optical thickness Nd is (λ()/4), (3; U/4), (5 λq/4)..., the reflectance will be a maximum or a minimum value. And its value depends on whether the refractive index η of germanium is larger or smaller than the refractive index nS of the substrate. When n > nS, the reflectance is a maximum value, and at η < nS, the reflectance is a minimum value, as shown in Fig. 2. It can be seen from Fig. 2 that the optical thickness of one layer is an odd multiple of one-fourth of the wavelength of the incident light, which causes the reflected wave to form destructive interference, that is, 20 M364878 can obtain the anti-reflection effect of 〇. However, the reflectance for other wavelengths is not 〇, so in order to obtain a wide reflectance in the visible range, it is usually a multi-layered structure, and the wavy (four) reflectance can be obtained by appropriately selecting the wavy layerless design of the film layer. As can be seen from Fig. 2, a layer of optical thickness is quarter-wavelength, and the refractive index is used as an anti-reflection film. • The surface reflectance is lowered, for example, on the surface of glass (ΒΚ7, η=1·53). Single-layered town (MgF2, η = 1.38) 'is a simple structure of anti-reflection film. In contrast, if a material with a sufficiently high refractive index is recorded on the surface of the glass, it will greatly increase the reflectivity of the glass surface, so the film can be used as a good spectroscope, a single layer of dioxygen 〇2, η = 2.2) or vulcanized (ZnS, η = 2.35) films are often used for this purpose, with a reflectivity of about 30%. Substantially the superposition of a single layer of film is a multilayer film. When using multilayer films, we can use a combination of high and low refractive index films to create a wide range of film designs to produce the optical properties we require. Common examples include anti-reflectors, high-reflectors, cut-off filters, band-pass filters, band-stop filters, and spectroscopic effects corresponding to this implementation. The emergence of computers has not only made optical film design (computer-aided software) more convenient, but also related research on optical films. So far, the difficulty of optical film fabrication has been reported in the design. As long as the characteristics are reasonable, for example, the application examples of the embodiment, the applicable multilayer film structure can always be designed. The key problem is the improvement of the film plating process. How to precisely control the thickness and refractive index of each layer to obtain the desired optical properties and mechanical properties' even to consider the mass production and cost reduction of the production, as well as the development of thin film materials, the development of advanced clock technology and the film Measurement, etc., are not the model 21 M364878. In the film optics, we can easily apply multi-layered four-points with high refractive index on the optical grade substrate by vector method or admittance trajectory method. One of the diaphragm stacks can achieve the expected penetration rate τ%. In theory, it is also proved that the same multi-layer number is used, and the one-quarter diaphragm stack has a higher reflectance R% than the non-quarter-wave stack. The more the number of layers, the greater the reflectivity. That is to say, it is easy to control the split ratio of penetration and reflection. Among the currently available coating materials, the high refractive index in the visible light region is 2.4 or less and the low refractive index is 1.35 or more, so the width of the high reflection band of the single quarter-wave film stack is limited. Therefore, in order to satisfy the present embodiment, it is possible to have a wide reflection band like a metal film in the visible light region, and it is necessary to widen the high reflection band of the dielectric film. One of the methods of broadening is to have a regular increase in the thickness of each layer of the film system (depending on the number of steps or the number of steps) so that there can be enough film at any wavelength in a wide area. The layer, whose optical thickness is also close enough to a quarter wave. However, the high reflectance reflectance thus produced has many falling ripples that must be optimized using the Simplex method. Other methods include stacking a quarter-wave film with a shorter center wavelength on another quarter-wave film stack. The design of the coating can basically be started from the standard film system. For example, high reflection mirrors are designed on the basis of a quarter-wave film stack, regardless of the width or single or double wave number. When the initial design fails to meet the optical performance of the demand, it is optimized or synthesized using current commercially designed computer software. Some optimizations use mathematical techniques and are constantly improving in 22 M364878. For example, the most commonly used are the simple optimization method, the least square adjustment method (Least-square fit or damped least squares) and the synthesis method 0 (3) metal film layer lc metal film layer lc 'the main function of the metal film layer lc is designed in "Absorbing all of the light energy in the casing 2" includes all of the reflected light that passes through the recording film substrate 1 and enters the casing 2. The reflected light in the casing 2 is absorbed or attenuated in the metal film layer lc. As the above formula "L1b+L1c+L1d=25%" holds, since the Lib of the transparent substrate ia is relatively large (absorption is almost negligible, that is, about Llc+Lld=25%), it is known that the plating is good. When the metal film layer lc is plated after the electric film layer 1b, the thickness of the metal film layer lc can be controlled to grasp the 25% movement. After this, the reflected light in the casing 2 is absorbed by the metal film layer to produce two functions: First, the human eye cannot see the contents of the casing 2 when viewed from the coated substrate 1 into the casing 2 ( For example, camera 3). Therefore, if only a transparent substrate ia of the coated substrate 1 and a dielectric film layer 1b are easily visible in the article 2, since the transparent substrate 1a is transparent, the commonly used dielectric The film layer lb is also transparent in the visible light range, so that the transparent substrate la and the dielectric film are layered at an angle (for example, a 45 degree angle of view), and the articles in the casing 2 are easily seen. Shown. The second is to absorb other reflected light in the casing 2, so as to prevent these other reflected light from directly or indirectly reflecting into the lens interference (for example, reflective) image f of the camera 3, as shown in detail in FIG. 23 M364878. Generally, the larger the metal extinction coefficient, the faster the attenuation of the light amplitude, and the less the light energy entering the metal interior, the higher the reflectivity. For example, my new patent number M326646 "plated in the hemispherical hood photographic device" The rate is about 55% (where the visible light transmittance

About 18%). Simply put, the physical properties of light are determined by both amplitude and wavelength. The amplitude determines the intensity of the light, and the wavelength distinguishes the characteristics and types of the color, that is, the difference in amplitude, giving the difference between light and dark; and the difference in wavelength gives the difference in hue. The industry always selects those metals having a large extinction coefficient and a relatively stable optical property as a metallized film material. For example, the metal film material commonly used in the ultraviolet region is aluminum, which is commonly used in the visible region and silver, and gold, silver and copper are commonly used in the infrared region. In addition, chromium Cr and platinum are also commonly used as special coating materials. Since materials such as aluminum, silver, and copper are easily oxidized in the air to lower the performance, they must be protected by a dielectric film. The commonly used protective film materials are cerium oxide, magnesium fluoride, MgF2, and the like. Since the function of the metal film layer lc is to "all the light energy in the absorbing casing 2", the film of the metal film layer lc is not limited to chrome-plated Cr. Please refer to FIG. 3 for the spectrum of the sample A of this embodiment. As shown in FIG. 3, the requirements for the sample design of this embodiment are as follows: (1) In the visible light (400 nm to 700 nm) portion, it is desirable to control the average at 18 〇/〇. (2) The penetration rate in the infrared (780 nm to 1,000 nm) portion is %, and it is desirable to control the average value at 70% or more. 24 M364878 Preparation - A transparent cyan plate with a thickness of 3 mm is cleaned and reinforced and placed in a coater for Mg. There are three or more sheets in the coating machine, which are equipped with membranes such as leakage 5, Si〇2, and Cr. In Figure 3, the ordinate is the percentage of penetration T% (Transmjttance 0/〇). The abscissa is the spectral wavelength (in nm). Other parameters are (丨) white light environment, (2) frontal incident angle (twist) (3) reference wavelength is 450 nm., (4) is designed in a qUarter-wave-stack multi-layered mode. The film of the multi-layer dielectric film lb is selected as much as possible by selecting the least two combinations. It is not easy to find one or more when adding an appropriate combination. In the present embodiment, the dielectric film lb is formed by alternately vapor-depositing two kinds of film materials having different refractive indexes in a coater. Generally, two kinds of refractive index materials are selected, and there are often oxide films, such as Ti〇2 having a high refractive index and si〇2 having a low refractive index. Since Τι〇2 is prone to oxygen loss, and there are different structures (such as anatase coffee core, etc.). At present, electron retort or sputtering Ti2〇5 or Ti3〇5 is more stable than Ti〇2. The Ti3〇5 film is easier to absorb and scatter than the Ti〇2 film. Therefore, in this embodiment, a film having a different refractive index of Ti3〇5 (substituting Ti〇2) and Si〇2 is alternately vapor-deposited in the coating machine by 18 layers. The first layer: Ti3〇5. Optical film thickness = 〇. 5075 Second layer: Si〇2. Optical film thickness = 0.4615 Third layer: Ti3〇5. Optical film thickness = 2. 0697 Fourth layer: Si〇2. Optical film thickness = 〇. 3996 25 M364878 Fifth layer: Ti3〇5. Optical film thickness = 1. 2309 Sixth layer: Si〇2 plating. Optical film thickness = 0.921 The seventh layer: Ti3〇5. Optical film thickness = 0.656 '8th layer: Si〇2 plating. Optical film thickness = 1.2178 Ninth layer: Ti3〇5. Optical film thickness = 1.4742 Tenth layer: Si〇2 plating. Optical film thickness = 0.3776 11th layer: Ti3〇5. Optical film thickness = 4.1621 I Twelfth layer: Si镀2 plating. Optical film thickness = 0.8100 The thirteenth layer: Ti3〇5. Optical film thickness = 1. 7303 Fourteenth layer: Si〇2 plating. Optical film thickness = 1.5163 The fifteenth layer: Ti3〇5. Optical film thickness = 1.1209 Sixteenth layer: Si〇2 plating. Optical film thickness = 1.7299 The seventeenth layer: Ti3〇5. Optical film thickness = 1.4229 Eighteenth layer: Si〇2 plating. Optical film thickness = 2. 8657 & After plating the dielectric film lb, the metal film lc is plated, and the metal film has Cr. The layer of the Cr layer is 3 nm (Physical thickness). After the shovel film treatment is completed, the Japanese Hitachi spectrometer U-4100 is tested and the error is too large and corrected until the error is within the allowable range. Among them, sample A was made into two samples: sample Αι and sample A2. The sample is plated with a dielectric thin film on a surface of a 3 mm transparent green plate, and a metal film lc is plated on the same surface. Therefore, the sample A1 can be referred to as a face mask film. 26 M364878 When the sample is A2 is a thin film of 3mm transparent slab glass, while the metal film lc is on the other surface of the chain. Therefore, the sample A2 can be referred to as a double-sided forged film. • Finally, the spectrometer U-4100 test computer draws the curve 4A2 of the sample curve 4A1 and sample A2 as shown in Fig. 4. Fig. 4 is the actual spectrum of the sample A. In Figure 4, the ordinate is the percentage of penetration T% (Transmjttance %). The horizontal position is marked as the wavelength of the spectrum (in nm). As shown in Figure 4, the sample A after the coating is completed is tested by the spectrometer U-4100. The actual spectral curve of the sample is shown. (4) Three solid samples A were originally used. The simulated spectral curve of the design has a drop. The originally designed spectral curve (Fig. 3) is the penetration T of the desired lesion in the visible light range of 4〇〇nm~7〇〇nm. /. The average control is 18% » while the penetration rate T% of the infrared 780nm to 1,000nm part ® is controlled above 70%. However, in the actual spectral curve after the completion of the coating; the transmittance τ of the curve 4A1 in the visible light portion of 400 nm to 700 nm. /. The average (automated by the spectrometer) has a downward trend after 27.1%' to the long wavelength direction of 580 nm and rises until 75 〇 nm. In the infrared 780 nm to 1,000 nm portion, the transmittance τ% average (manual visual estimation) is about 75%. Curve 4A2 has a transmittance in the visible light range of 400 nm to 700 nm. The /0 average (spectrum meter 27 M364878 is automatically calculated) is 23%, and there is an upward trend in the long-wave direction. The average (% (manual visual estimation) of the transmittance in the infrared 780 nm to 1,000 nm portion is about 7〇% or more. From the curve 4Α1 and the curve 4Α2, the effect of plating double-sided and single-sided plating is not very different, but the working time of plating double-sided is relatively large (the flipping of the double-sided plating in this embodiment and the other side is required) Relatively high. Moreover, it is often necessary to add a protective film to the outer surface of the substrate which is easily stained and scratched. Moreover, when a single mask is applied, as shown in Fig. 4, there is a curve that is obviously convex in the visible light portion (such as at 570 nm). This is in addition to the refractive index of different colors in the visible light portion. In addition to the normal dispersion, the dielectric film layer lb is too close to the bond metal film (Cr) lc, which affects the interference of the dielectric film ratio, but it can be known from the actual situation. In the common ring thief, the non-professional high-resolution type has little effect on photographic imaging (the color shift phenomenon at 57 〇nm is not seen). _ If the difference between the high-bump point of the visible light portion curve and the low-pitched point of the curve is too large, it is possible to generate a color shift corresponding to the wavelength at the wavelength corresponding to the difference. To put it simply, if most of the difference checks correspond to the red silk circumference of the New York, the visible light image captured by the camera will produce a "red" color. If necessary, the design of increasing the number of layers can make the difference between the high-bump and the gamma of Figure 4 in the visible part of the hip, which will increase the manufacturing cost. In another example of the present embodiment, if the transparent substrate la is pMMA, the pMMA may be deformed due to the increase in the number of layers, and the initial solution of the 28 M364878 type is a slightly longer time interval when the layer is further plated. One point, so that there is enough time to cool down. In the latter application examples, the image tests of the samples A1 and A2 revealed that these curved curves in the visible light portion did not significantly affect the quality of the image (e.g., color shift phenomenon). In fact, for a design like Round Three, different coating machines will have different results. As described above, the computer can be corrected or the key film can be modified one or two more times. After the correction, the file will be stored and the same coating machine will be used to produce a stable product in the future. In addition, if the 3 nm thickness of the Cr-plated layer is tested by the final spectrometer, if the transmittance of Lie is less than 18% (or not ideal) after the test, the thickness of the Cr-plated layer is reduced (or re-corrected) and plated again. Until Lie's penetration rate is close to 18% (or close to the ideal value). After adjusting the penetration rate of Lie, what is the effect of plating the metal film lc? Lu, please refer to Figure 5 for the reflection spectrum of sample A1. In the reflection spectrum of Figure 5, the ordinate is the reflectance percentage R〇/〇. The abscissa is the spectral wavelength (in nm). In the reflection spectrum circle of sample A1, curve A10 is the front side (no coating surface) reflection spectrum curve of sample A1. The curve All is the reflection spectrum curve of the back side (the metal film ic surface) of the sample A1. It can be seen from the curve A10 and the curve All hyperbola that the lower reflection curve A11, 29 M364878 does have a metal film lc having an anti-reflection effect. That is to say, cr is built into the effect of "absorption", so it is also called a Cr layer as a metal film layer. Please refer to the reflection spectrum of sample A2. In the reflection spectrum of Figure 6, the ordinate is the reflectance percentage R%. The abscissa is the spectral wavelength (in nm). In the reflection spectrum of the sample A2, the curve A20 is a reflection spectrum curve of the front surface (plated dielectric layer lb surface) of the sample A2. The curve A21 is a reflection spectrum curve of the back surface (metal plated film lc plane) of the sample A2. From the curve A20 and the curve A21 hyperbola, it can be seen that the lower reflection curve A21, indeed, the metallized film lc has an anti-reflection effect. In other words, Cr achieves the effect of "absorption." The thickness of the Cr-plated layer is proportional to the effect of "absorption". That is, the thinner the thickness of the Cr-plated layer, the less the amount of absorption. The coated substrate 1 (including a 3 mm thick transparent blue plate glass, a TisOs and Si〇 2 dielectric film and a metal plated Cr film layer) after the above ore film is completed, and the lens 31 of the camera 3 is aligned with the coating base. The metal Cr film layer of the material 1 is used for application. Please refer to the seventh application diagram of the device in this embodiment. Figure 7 is also a schematic diagram of the application of the device shown in Figure 1. Fig. 7 includes a coated substrate 1, a housing 2, a camera 3, and a 30 M364878 image display 4 formed by sample A1. Also included are representative light rays that are conveniently described, such as L1, Lla, Lle, and L2a, L2b, L2c and L3, L3a, L3b, and the like. When the incident light LI (100%) is incident on the front surface of the coated substrate 1, the reflected light Lla is about 56% as shown in the fifth spectrum diagram, and the transmitted light penetrating through the coated substrate 1 as shown in the fourth spectrum. Lie is about 27%. About 56% of the reflected light Lla has a bright mirror surface on the front surface of the coated substrate 1 (see a mirror like a mirror). About 27% of the transmitted light Lie enters the photographic lens 31 for imaging. About 17% (100%-56%-27%) is lost in the coated substrate 1 (mostly absorbed by the Cr-plated layer). When the other incident light L2 (100%) is incident on the front surface of the coated substrate 1, the transmitted light L2a (the same as the transmitted light Lie) penetrating through the coated substrate 1 is about 27%. However, the transmitted light L2a does not directly enter the photographic lens 31 but is reflected in the casing 2 to form another reflected light L2b. When the reflected light L2b is reflected to the back surface of the coated substrate 1, a further reflected light L2c' is generated. The reflected light L2c is reflected into the photographic lens 31 for imaging, and the reflected light L2c and the transmitted light Lie enter the photographic lens 31 to cause overlapping images, which is commonly called ghost image affecting the quality of imaging. When the reflected light L2c is reflected to the back surface of the coated substrate 1 by about 56%, the light energy is about 15.1% (27% * 56%) of the incident light L2. M364878 In the test of this embodiment, if the incident light L2 is too small (for example, 5〇j_ux), the reflected light L2c is about 7.5Lux, and the reflected light L2c enters the photographic lens 31 together with the transmitted light Lie' on the image display 4 No image of L2c is displayed. If the incident light L2 is too large (for example, 300 Lux), the reflected light L2c is about 45 Lux, and the reflected light L2c enters the photographic lens 31 together with the transmitted light Lie to cause an overlapping image, and the image of the L2c is clearly displayed on the image display 4. In order to prevent or reduce the reflected light L2c from entering the photographic lens 31, there are three methods: First, an opaque black soft cover 32 is placed around the photographic lens 31 to block the reflected light L2c. The black soft cover 32 must be close to the back surface of the coated substrate without a light-transmissive gap, and the stray light other than the light directly entering the front of the photographic lens 31 (e.g., Ue) is blocked by the black soft cover 32. The black soft cover 32 is preferably black or dark. If white is used, the white reflection causes the eye to see a white trap image from the front surface of the coated substrate. The first method above, if applied to the currently popular High Speed Dome Camera, has a certain degree of difficulty. Because the mirror chatter of this type of high-speed dome camera is often used as an idle button, the black soft cover 32 on which it is placed will be hit to cause damage to the back surface of the coated substrate 1. Second, a black or dark thick wheel surface is formed on the inner surface 21 of the shell 2 . The purpose is to absorb and scatter L2a, making L2b difficult to form. That is to say, L2c is indirectly made indirectly. 32 M364878 In the second method above, if the coated substrate 1 is not a flat plate, but the new patent number M326646 "aluminized hemispherical cover photographic device" is generally hemispherical, the incident light L2 is transmitted to a hemispherical shape. When the substrate 1 is coated, it may be re-transmitted from the other side of the coated substrate 1 and is not transmitted to the inner surface 21 of the casing 2 at all. At this time, if someone looks at the incident direction of L2, it is easy to see the camera 3 behind the coated substrate. Second, a metal film layer is added in front of the photographic lens 31 to absorb or reduce the light energy. The third method above is one of the design priorities of this embodiment. Therefore, the third method as above is more suitable, but if the three methods can be combined, the application can exert a better effect. Please refer to FIG. 8 for the experimental example of the device in this embodiment. The difference between Figure 8 and Figure 7 is that the housing 2 of Figure 7 is removed in Figure 8. As shown in FIG. 8, when the incident light L2 is incident on the coated substrate 1 and the transmitted light L2a does not touch the object (for example, the casing 2), L2a continues straight ahead until the light energy is exhausted, and there is no occurrence. Reflect the problem of L2b. At this time, if the human eye sees the coated substrate 1 from the direction of L2, it will be found that the coated substrate 1 is in a transparent state, and the human eye can easily see the object behind the coated substrate 1, especially the illuminance behind the coated substrate 1 is greater than the coated substrate. The illuminance of the front of the material 1 (in the same direction as the human eye) is more obvious. 33 M364878 When the background environment of the coated substrate 1 is dark (for example, dark blue) or black (for example, in the casing 2), in the general environment (for example, an illumination environment of about 2 〇〇 Lux), the human eye is coated from the coating base. The front side of the material 1 can exhibit the effect of specular reflection when it has 50% or more of reflected light. More than 60% of the reflected light is more like a mirror surface, and more than 7〇% of the reflected light is more like a side ~ mirror. Figure 8 is one of the test work when the coated substrate 1 is completed, mainly testing the imaging of the coated back surface of the coated substrate 1 effect. This work is to align the lens 31 of the camera 3 with the back surface of the coated substrate 1, and then connect the image display 4 to test the imaging effect of the transmitted light Lie. The imaging effect displayed on the image display 4 depends mainly on the light energy of the transmitted light Lie and the imaging quality of the camera 3 under a certain ambient illumination. The larger the light energy ratio (percentage of incident light L1) of the transmitted light Lie, the better the imaging effect displayed on the image display 4. # However, the larger the light energy ratio of the transmitted light L1e, the smaller the relative reflected light L1a. The smaller the reflected light Lla, the less visible the mirror surface. Without the bright mirror surface, it is not easy to hide the object behind the decorative coating substrate 1 (such as the camera 3), which also loses the hidden decoration of this embodiment. The purpose of imaging. It is economical and reasonable to choose the light energy ratio of the transmitted light L1e from 10% to 30%. As for the imaging quality of the camera 3, it mainly refers to the sensitivity quality of the image sensor of the camera 3. There are many types of products commonly used in domestic and foreign markets, including Japanese s〇ny, Sharp and South Korea's Samsung, which have different types of high-end (end) and low-order (L〇w 34 M364878 end) models. For example, the camera 3 of the present embodiment has tested more than ten models of CCD and Cmos, and has achieved different imaging effects in different illumination environments. In order to save on the purchase of high-end, low-light cameras, it is an alternative to only purchase low-end cameras and properly pair the auxiliary light sources. Figure 8 shows the test work when the forged film substrate 1 is completed. That is to say, when the forged film substrate 1 is mass-produced, the coated substrate 1 can be separately sold to the quality test of the camera manufacturer or the system manufacturer. That is to say 'the separate forged film substrate 1 can be sold as a key component. A housing 2 is often added to the actual application to form a product that can be directly applied and sold. Please refer to Figure 9 for a schematic diagram of the application of the built-in infrared light source. Another application device is shown in FIG. The difference between FIG. 9 and FIG. 7 lies in that an infrared light source 5 and an aluminum casing 2 for facilitating heat dissipation of the infrared light source 5 are added to FIG. In recent years, the International Safety Equipment Exhibition has shown that there are day and night type anti-theft surveillance cameras, most of which combine the auxiliary infrared light source for night vision with the camera lens and then put it into the same aluminum housing 2 for convenient construction. . During the daytime (enough ambient light energy), visible light is taken, and at night (the ambient light energy is insufficient), the auxiliary infrared light source is used for photography. An infrared light-emitting diode called IR-LED is commonly used for night vision auxiliary light sources, and is the cheapest and convenient night vision auxiliary light source on the market. The center wavelength is usually 850nm, and the single power is about 100mW. In the finished products of day and night anti-theft cameras, 12, 24, 36 or even more than one hundred R-LEDs are often surrounded by a circuit board. And a circular cavity in the center of the circuit 35 M364878 is placed directly around the camera lens 31. An infrared light source 5 added in FIG. 9 is the same as a small-sized anti-theft surveillance photographing device (commonly known as a gun in Taiwan and China), which is also a combination of the infrared light source 5 and the camera lens 31. Placed in the same cabinet 2. The infrared light source 5 can also be disposed outside the casing 2 or independently of the casing 2. In recent years, most of the newly-produced rushing machines have adopted protective covers of single or double-layer transparent glass. _ Figure 9 is a protective cover for replacing the transparent glass with the coated substrate 1. The light emitted by the LED light source is 850 nm in the infrared range, which is within the range recognizable by the human eye. Therefore, the red glow is often referred to as the "red burst" in the industry, and is exposed at night. main reason. As shown in FIG. 9, the infrared ray radiated by the newly added infrared light source 5 in the case 为 2 is infrared L3 (the infrared radiation energy is assumed to be 100%), and when the infrared L3 is incident on the chain film substrate 1, 豢 infrared L3 is about 75% of the coated substrate 1 is infrared transmitted light L3b (as shown in Figure 4) and about 15% is infrared reflected light L3a (Figure 5), and most of the others are absorbed by the metal film lc of the mineral film substrate i. Drop it. When the infrared transmitted light L3b penetrates the coated substrate 1 and is incident on the object a, the object a is absorbed and then radiated out through the coated substrate 1, and the L3C enters the photographic lens 31 to be imaged (infrared image). In addition, if the infrared reflected light L3a is not blocked by the black soft cover 32, it may enter the 36 M364878 into the camera lens 31 for imaging, and the white exposed block is displayed on the image display 4. 'This white exposed block is the infrared light source 5 radiates infrared Block image. For example, if there is only one circular 5 mm infrared light emitting diode (|R-LED), the white exposed block is a circular white exposed block. If an object A is in front of the coated substrate 1, the transmitted light Lie enters the camera lens 31 under the incident of visible light L1, and finally the visible image of the object A is displayed on the image display 4. If the camera 3 is a color camera, the visible light image is a color image. If the camera 3 is a black and white camera, the visible light image is a black and white image. However, if an object A is in front of the coated substrate 1, when the infrared light source 5 emits light, the transmitted infrared light L3c enters the camera lens 31 for imaging, and finally an infrared image of the object A is displayed on the image display 4. This infrared image is a monochrome image that is similar to but different from the black and white image for the human eye. _ If an object A is in front of the coated substrate 1, when the incident of the visible light L1 and the infrared light source 5 are emitted, an overlapping image of the visible light image and the infrared image of the object A is displayed on the image display 4. At this time, if the visible light image is larger than the infrared image, the visible light image "over" the infrared image causes the visible light image of the object A to be displayed on the image display 4. At this time, if the visible light image is smaller than the infrared image, the infrared image "over" the visible light image causes the image display 4 to display an infrared image of the object A. At this time, if the visible image is close to the infrared image, both the visible light image and the infrared 37 M364878 image exist at the same time, so that the visible light image of the object A is displayed on the image display 4 but has a block similar to overexposure, resulting in poor image quality. . In order to avoid the display of an image of the visible light of the object A visible on the image display 4, the image is usually detected by a photoresistor (CDS) element. When the ambient illumination is insufficient (for example, about 1〇 Lux), the CDS component startup control circuit turns on the infrared light source 5 to generate infrared light. In this case, the infrared image is larger than the visible light image, so that the infrared image of the object A is displayed on the image display 4. . Figure 9 omits the CDS component because the CDS is a conventional component. The only thing to note is that the CDS component does not pass through the coated substrate 1 in the direction of incident visible light, because the transmittance of the coated substrate 1 is only 15% of the incident visible light, and is placed in the transparent glass with the usual CDS components (almost incident) 90% of visible light is different. If it must be placed in the position of the coated substrate 1, the sensitivity of the CDS element must be adjusted. That is to say, if the CDS element placed in the transparent glass is adjusted to be activated at 10 Lux, the CDS element placed after the coated substrate 1 should be adjusted between 60 and 70 Lux. At present, the high-end products are added to the space between the lens 31 of the camera 3 and the front of the image sensor, plus an automatic dual filter switching device. The automatic dual filter switching device currently on the market is simply a device that automatically switches two filters such as an infrared cut filter 丨CF (Infraredcutfiltter) and a common transparent glass filter. When the infrared cut filter is cut into the front of the image sensor, the entrance of the infrared L3c is blocked, and the image sensor only senses the visible light Lie. When the infrared cut-off filter is removed from the front of the image sensor, the image-sensing 38 M364878 sensor can sense both the visible light Lie and the infrared L3c due to the cut-in relationship of the ordinary transparent glass filter. In this embodiment, the camera 3 is further modified into a camera 3 with an automatic dual filter switching device according to FIG. 9 , wherein the CDS element is placed on the casing 2 (without passing through the film substrate 1), and the original The setting of the CDS component (starting at i〇Lux) remains unchanged. - The result is found that the visible light Lie and the infrared L3c can be sensed when the image sensor of the camera 3 cuts into the ordinary transparent glass filter. The main reason is that when the ambient illuminance is about 10 Lux, the CDS component starts to move the ordinary transparent glass filter into the image sensor of the camera 3, so that the visible light L1 e and the infrared L3c both enter the image sense of the camera 3. Detector imaging. Among them, the camera 3 of the high-order product has an ambient illumination of about 〇Lux, and the CDS element activates the infrared light source 5 in addition to the automatic dual filter. This gives the opportunity to have both an image of visible light Lie and infrared L3c (causing an image with a similar exposure, unless it is a professional artistic photography, it is not suitable for anti-theft photography surveillance purposes). In order to make both the visible light Lie and the infrared L3c images, there is no chance to simultaneously display them on the image display 4. In this embodiment, the ordinary transparent glass optical passage of the automatic double filter switching device is removed, and a type of IPF (Infrared Pass filtter) is used, which is opposite to the ICF. The 丨PF only allows infrared Pass through the visible light Lie through. With such an automatic dual filter (IPF and ICF) switching device, the chance of an image appearing in which the visible light Lie and the infrared L3c are mixed on the image display becomes not easy. 39 M364878 In summary, the above-mentioned coated substrate is imaged, Suitable for the camera, the housing 2 including an opaque container is placed on the side of the housing 2 with the _coated substrate t and the inside of the housing 2 housing an image taking unit (camera 3). The summary is as follows: (1) In order to prevent or attenuate the reflected light L2c and the infrared reflected light L3a from entering the photographic lens 31, if only one layer of dielectric film is plated on the coated substrate ,, the periphery of the photographic lens 31 is nested. An opaque black soft cover 32 or a black or dark raw sugar surface is formed on the inner surface 21 of the casing 2. (2) In order to prevent or attenuate the reflected light L2c and the infrared reflected light L3a from entering the photographic lens 31, such as a multilayer dielectric film lb and a metal film layer lc, the metal film layer 1c can be used to reflect the light L2c and the infrared The reflected light L3a absorbs and attenuates. The multilayer dielectric film lb and a metal film layer lc may be forged together on the same side of the coated substrate j or separately on the different faces of the coated substrate 1. (3) In order to prevent or attenuate the reflected light L2c and the infrared reflected light L3a from entering the photographic lens U head 31, a black soft cover 32 may be added, or a black or dark roughness may be formed on the inner surface 21 of the casing 2. One of the three or three or three of the surface or a metal film layer lc is plated. (4) In order to prevent the reflected light L2c and the infrared reflected light L3a from entering the photographic lens 31 at the same time, an automatic double filter switching device is added in front of the image sensor of the camera 3, which includes an infrared cut filter ICF ( Infraredcutfiltter) and a switching device for infrared through the two filters of the PF (Infrared Passfiltter). M364878 (5) In order to achieve higher reflectance (e.g., reflected light Lla), a multi-layer dielectric film lb is plated on the coated substrate 1 to replace the prior art metal-plated aluminum. The above specific embodiments are illustrative of the embodiments of the present invention, and those skilled in the art can readily appreciate the other advantages and functions of the present invention from the disclosure herein. The present invention can also be implemented or applied by various other specific embodiments. The details of the present specification can also be modified and changed without departing from the spirit of the present invention. 41 M364878 [Simplified description of the drawings] FIG. 1 is a schematic diagram of the device design of the embodiment. Figure 2 is a graph showing the relationship between the reflectance of the film and the optical thickness. Figure 3 is a spectrum diagram of the sample A of this example. -_ Figure 4 shows the actual spectrum after the coating of Sample A is completed. Figure 5 is a reflection spectrum of sample A1. * Figure 6 is a reflection spectrum of sample A2. FIG. 7 is a schematic diagram of the application of the device in the embodiment. Figure 8 is a schematic view of the apparatus of the present embodiment. Figure 9 is a schematic diagram of the application of the built-in infrared light source. 42 M364878 [Description of main components] L1 incident light-Lla reflected light... Lib transmitted light Lie transmitted light φ Lid transmitted light Lie transmitted light L2 incident light L2a transmitted light L2b reflected light U L2c reflected light L3 incident light L3a infrared reflected light L3b Infrared transmission light N film refractive index Ns substrate refractive index M364878

Nd optical thickness R% reflectance percentage • T% transmittance percentage ^ 1 coated substrate la transparent substrate # lb multilayer dielectric film lc metal film layer 2 housing 21 housing inner surface 3 camera U 31 lens 32 black soft Set of 4 image display 5 infrared light source 44

Claims (1)

M364878 IX. Patent Application Range 1. A coated substrate imaging device suitable for photography, comprising: a plate and a casing, the casing being an opaque container, and a side of the casing is provided with a forged film base An image capturing unit is disposed in the interior of the housing; the shovel substrate includes a transparent image substrate coated with a plurality of dielectric films, and the image capturing window of the image capturing unit is The back surface of the coated substrate, 'the multilayer dielectric film in which visible light is incident on the coated substrate exhibits high reflection: through; and the infrared dielectric film incident on the coated substrate exhibits an ancient reflection and penetrates therein. According to a coated substrate image forming apparatus according to the above application, the inner surface of the casing is formed with a black or dark rough surface. Wherein, wherein, according to the scope of the patent application, a coated substrate imaging device is provided, and an infrared light source is disposed inside the casing. </ br> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 5. According to the application of the scope of the patent application, the two types of high and low refractive index of the key multi-clearing, wherein the 6. according to the scope of claim 5 of the money film substrate imaging device mine-species Coating materials of different refractive indices are two oxides. In the middle, the 7th is run according to the application. Among them, the 45 M364878 is coated with two kinds of high and low refractive index discs. 8. According to the application of the general group 4, the type of the base is reduced, wherein the metal of the metallized layer is chromium (cr)e. 9. The mineral film substrate imaging apparatus according to the invention of claim 1, wherein the key film substrate is a flat, curved surface or a mixture of a plane and a curved surface. 10. A coated substrate image forming apparatus according to the invention of claim 1, wherein the transparent substrate is glass. Λ 11. The coated substrate imaging apparatus of claim i, wherein the transparent substrate is an optical grade resin. Λ 12. A coated substrate image forming apparatus according to claim 6, wherein the optical grade resin is a polybroken acid resin PC. The invention relates to a key media substrate imaging device according to the invention of claim 1, wherein the image capturing unit is a CMOS. S 14· The seed surface substrate imaging device according to the claim 1 , wherein the image capturing unit is a CCD. The coated substrate imaging apparatus according to claim 15, wherein the CCD is provided with a dual-light-switching device including an infrared light-passing sheet and an infrared-cutting light-emitting sheet. A coated substrate imaging apparatus according to any one of claims 13 to 14, wherein the lens unit of the image taking unit has a black soft cover. 47