M354974 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種軟性電路板，尤指一種具良好散熱 效果之發光二極體軟板。 【先前技術】 目前應用於發光燈條的發光二極體軟性電路板幾乎採 用雙面銅箔基板，請參考第五圖所示，一發光二極體軟板 係包含一雙面銅II基板（40)，該雙面銅猪基板（4〇)主要由一 絕緣板體（41)(如聚醯亞胺（p|)、聚對苯二甲酸乙二醇醋 (PET))之上下表面各設有一層銅箔（42)所構成，該雙面銅 羯基板上（40)之銅箔（42)係形成銅箔線路及設有與鋼猪（42) 線路連接的複數焊墊，利用表面黏著技術（SMT)將發光二極 體（50)搭載到焊墊上，經過電流導通銅箔線路，使一連串 發光二極體（50)產生光亮，可應用作液晶螢幕背光模組裡 的背光源。M354974 V. New description: [New technical field] This creation is about a flexible circuit board, especially a light-emitting diode soft board with good heat dissipation effect. [Prior Art] At present, a light-emitting diode flexible circuit board applied to a light-emitting light bar uses almost a double-sided copper foil substrate. Please refer to the fifth figure, a light-emitting diode flexible board includes a double-sided copper II substrate ( 40), the double-sided copper pig substrate (4〇) is mainly composed of an insulating plate body (41) (such as polyimine (p|), polyethylene terephthalate (PET)) A copper foil (42) is formed, and the copper foil (42) on the double-sided copper substrate (40) forms a copper foil line and is provided with a plurality of pads connected to the steel pig (42) line, and the surface is utilized. Adhesive technology (SMT) mounts the light-emitting diode (50) on the pad, and conducts a series of light-emitting diodes (50) through the current conduction copper foil line, which can be used as a backlight in the LCD backlight module.
當應用於液晶顯示器（LCD)的背光源時，請參考第六 圖，前述發光二極體軟板係組裝於一背光模組的框架（6〇) 内，一膠帶（600)係黏設於該雙面銅箔基板（4〇)之外側邊而 將該發光二極體軟板固定於框架（60)底部一侧，且可令膠 帶（600)呈白色以增加發光二極體的平均亮度。一般為保護 銅箔，係於雙面銅箔基板（40)的上下表面設有保護膠片 (70)，該保護膠片（70)係由塑膠層（71)(如p|)與接著劑 (72)(如環氧樹脂)所構成，由於保護膠片 佳，無法有效地將熱能傳導至背光模組的框架(導二^ .M354974 法提供發光二極體良好的散熱效果，容易造成發光二極體 色度以及署命衰減。 【新型内容】 由上述說明可知’傳統發光二極體軟板之結構無法提 供發光二極體良好的散熱效果。 有鑑於此’本創作之主要目的在於提供一種發光二極 體軟板’其組I於液晶螢幕之框架時，可有效將發光二極 春 體產生的熱能傳導至框架。 欲達上述目的所使用之主要技術手段，係令該發光二 極體軟板包含： 上、 而與 一軟性電路板，係具有—上表面及一下表面’ 下表面皆形成有鋼箔線路； 複數發光二極體’係設於該軟性電路板之上表 銅箔線路連接； 絕緣導熱膠，係佈設於該軟性電路板之下表面；及 二金屬層，係設於該絕緣導熱膠上。 B光二極體軟板組裝於-背光模組之金屬框架 $ -極體軟板之金屬層係貼附 緣導熱膠與金屬岸站道舶尨杏 木由於、，，邑 光二極體發光心？的：:： 可將軟性電路板因發 勝與金屬層傳得以經由下表面的絕緣導熱 者先模組的金屬框架上，而獲得散熱。 【實施方式】 4 M354974 睛參考第-、二及三圖所示，係本創作發光二極體軟 板一較佳實施例，該發光二極體軟板係包含： 一軟性電路板（10)，係具有一上表面以及一下表面， 本實施例中，該軟性電路板（10)係為一雙面軟性電路板， 其包含一軟質的塑膠板體（10a)以及兩銅猪層（1〇b)，該兩 銅箔層（10b)係分別設於該塑膠板體（10a)之上、下表面， •該兩銅箔層（10b)係圖案化而具有線路並設有連接線路以提 -供發光二極體設置的焊墊，再者，上、下表面的銅荡層（10b) • 亚視線路設計需求而藉由導電件穿過該塑膠板體（10a)使上 下線路電性連接導通； 複數發光二極體（2〇)，係設於該軟性電路板（10)之上 表面，本實施例中，該些發光二極體（20)係排列於軟性電 路板（10)上表面一側； 一絕緣導熱膠（11)，係佈設於該軟性電路板（1〇)之下 表面；及 一金屬層（12)，係設於該絕緣導熱膠（11)上，本實施 • 例中，該金屬層（12)係一單體銅箔。 本實施例中，該軟性電路板（1 〇)之上表面可進一步設 •有反光層（13)，可為白色油墨，該反光層（13)可幫助反射 其一旁發光二極體（20)所發出的光使亮度均勻明亮。 明參考第四圖所示，當本創作發光二極體軟板應用於 为光模組時，係設於組裝於—背光模組的金屬框架一 般為鋁製）底部一側以作為側入式光源，並藉由黏設一膠帶 (3〇〇)於發光二極體軟板的軟性電路板（1 0) —側邊，而將該 發光一極體軟板固定於該金屬框架（3〇)底部—側，此時該 5 M3 54974 發光二極體軟板的金屬層（12)係μ附該金屬框架（3())，藉由 具良好導熱係數的絕緣導熱膠（n)以及金屬層（12)，該^光 二極體軟板的熱能可傳導至金屬框架（3Q)而達到良好的散 熱效果。 該軟性電路板⑽-端並延伸有—可撓延伸部（1〇〇)以 作為發光二極體軟板與外部電路連接之可換曲區段，由於 該可撓延伸部（⑽）上表面並未設置發光二極體（2q)，故無 .須設置白色油墨。3)幫助光反射，亦無散熱問題而無需於 ♦下表面設置絕緣導熱膠⑴）與金屬層（12)，該可捷延伸部 (1〇〇)表面可設置一保護膠片(14)以提供保護，本實施例 中該可撓延伸部（100)係為前述塑膠板體（10a)與其上表 面之銅箔層（1〇b)的部分延伸。 ,綜上所述，本創作主要於一設有複數發光二極體的軟 性電路板下表面設有絕緣導熱膠以及-設於導熱膠上的金 屬層以便當組裳於背光模组金屬框架時，可藉絕緣導熱 膠與金屬層提供軟性電路板與金屬框架之間 鲁導途徑，俅俨八止_ 叮j…得 传發先—極體軟板的散熱問題獲得改善。 【圖式簡單說明】 第圖·係本創作一較佳實施例之局部俯視圖。 —圖：係本創作沿第一圖A-A割面線之剖視圖。 ^ · 係本創作沿第一圖B - B割面線之剖視圖。 —四圖.係本創作組裝於一背光模組框架時的剖視圖。 五圖’係既有一發光二極體軟板之側剖圖。 M354974 第六圖：係第五圖之發光二極體軟板組裝於一背光模 組框架之示意圖。 【主要元件符號說明】 (10)軟性電路板 (10a)塑膠板體 (10b)銅箔層 (100)可撓延伸部 (11)絕緣導熱膠 (1 2)金屬層 (13)白色油墨 (14)保護膠片 (20)發光二極體 (30)金屬框架 (40)雙面銅箔基板 (41)絕緣板體 (42)銅箔 (50)發光二極體 (60)框架 (600)膠帶 (70)保護膠片 (71)塑膠層 (72)接著劑 (300)膠帶When applied to a backlight of a liquid crystal display (LCD), please refer to the sixth figure, the light-emitting diode soft board is assembled in a frame (6〇) of a backlight module, and a tape (600) is adhered to The light-emitting diode flexible board is fixed to the bottom side of the frame (60) on the side of the double-sided copper foil substrate (4 〇), and the tape (600) is white to increase the average of the light-emitting diodes. brightness. Generally, the copper foil is protected by a protective film (70) on the upper and lower surfaces of the double-sided copper foil substrate (40). The protective film (70) is composed of a plastic layer (71) (such as p|) and an adhesive (72). ) (such as epoxy resin), because of the good protection film, can not effectively transfer thermal energy to the frame of the backlight module (guide 2 ^ M354974 method provides good heat dissipation effect of the light-emitting diode, easily cause the light-emitting diode Chromaticity and deceleration of the system. [New content] It can be seen from the above description that the structure of the traditional light-emitting diode soft board cannot provide good heat dissipation effect of the light-emitting diode. In view of this, the main purpose of this creation is to provide a light-emitting two. The polar soft board's group I can effectively transmit the heat energy generated by the light-emitting dipole spring to the frame when the frame is in the frame of the liquid crystal screen. The main technical means used for the above purpose is to make the light-emitting diode soft board The method comprises: an upper, and a flexible circuit board, the upper surface and the lower surface are formed with a steel foil line; the plurality of light emitting diodes are disposed on the flexible circuit board and are connected by a copper foil line; Absolutely The thermal conductive adhesive is disposed on the lower surface of the flexible circuit board; and the two metal layers are disposed on the insulating thermal conductive adhesive. The B light diode soft board is assembled in the metal frame of the backlight module $ - the polar flexible board The metal layer is attached to the edge of the thermal conductive adhesive and the metal shore station road, the apricot wood, and the light-emitting diode of the light-emitting diode::: The flexible circuit board can be insulated from the metal layer through the lower surface. The heat conductor is firstly cooled on the metal frame of the module. [Embodiment] 4 M354974 The eye is shown in the first, second and third figures, which is a preferred embodiment of the present invention. The polar flexible board comprises: a flexible circuit board (10) having an upper surface and a lower surface. In the embodiment, the flexible circuit board (10) is a double-sided flexible circuit board, which comprises a soft a plastic plate body (10a) and two copper pig layers (1〇b), the two copper foil layers (10b) are respectively disposed on the upper surface and the lower surface of the plastic plate body (10a), and the two copper foil layers (10b) ) is patterned and has lines and connection lines for the light-emitting diode setting Solder pad, in addition, the copper layer on the upper and lower surfaces (10b) • The ATV line design requires the conductive member to pass through the plastic plate body (10a) to electrically connect the upper and lower lines; the complex light-emitting diode (2〇) is disposed on the upper surface of the flexible circuit board (10). In this embodiment, the light emitting diodes (20) are arranged on one side of the upper surface of the flexible circuit board (10); a glue (11) disposed on a surface of the flexible circuit board (1); and a metal layer (12) disposed on the insulating heat conductive adhesive (11). In the embodiment, the metal layer ( 12) is a single copper foil. In this embodiment, the upper surface of the flexible circuit board (1 〇) may further be provided with a reflective layer (13), which may be a white ink, and the reflective layer (13) can help reflect The light emitted by the light-emitting diode (20) makes the brightness uniform and bright. Referring to the fourth figure, when the soft LED of the present invention is applied to the optical module, it is disposed on the bottom side of the metal frame assembled in the backlight module, which is generally made of aluminum. The light source is fixed to the metal frame by attaching a tape (3 〇〇) to the flexible circuit board (10) of the light-emitting diode board. Bottom-side, at this time, the metal layer (12) of the 5 M3 54974 light-emitting diode soft board is attached to the metal frame (3()), by an insulating thermal conductive adhesive (n) having a good thermal conductivity and metal The layer (12), the thermal energy of the soft diode can be conducted to the metal frame (3Q) to achieve a good heat dissipation effect. The flexible circuit board (10)-end extends with a flexible extension (1〇〇) as a bendable section of the light-emitting diode flexible board connected to the external circuit, due to the upper surface of the flexible extension ((10)) The light-emitting diode (2q) is not provided, so no white ink is required. 3) to help the light reflection, there is no heat dissipation problem, and it is not necessary to provide the insulating thermal conductive adhesive (1) and the metal layer (12) on the lower surface of the ♦, and a protective film (14) may be disposed on the surface of the extendable extension (1) to provide Protection, in the present embodiment, the flexible extension (100) is a partial extension of the plastic plate body (10a) and the copper foil layer (1〇b) on the upper surface thereof. In summary, the present invention mainly consists of an insulating thermal conductive adhesive on the lower surface of a flexible circuit board having a plurality of light-emitting diodes and a metal layer disposed on the thermal conductive adhesive so as to be in the metal frame of the backlight module. The insulating conductive paste and the metal layer can be used to provide a ruined route between the flexible circuit board and the metal frame, and the heat dissipation problem of the polar body is improved. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial plan view of a preferred embodiment of the present invention. —图: A cross-sectional view of the creation along the line A-A of the first figure. ^ · This section is a cross-sectional view of the cut line along the first line B-B. - Four figures. A cross-sectional view of the present invention assembled in a backlight module frame. The five figures are a side cross-sectional view of a light-emitting diode soft board. M354974 Fig. 6 is a schematic diagram of the light-emitting diode soft board of the fifth figure assembled in a backlight module frame. [Main component symbol description] (10) Flexible circuit board (10a) Plastic plate body (10b) Copper foil layer (100) Flexible extension (11) Insulation thermal adhesive (1 2) Metal layer (13) White ink (14 Protective film (20) light-emitting diode (30) metal frame (40) double-sided copper foil substrate (41) insulating plate body (42) copper foil (50) light-emitting diode (60) frame (600) tape ( 70) Protective film (71) plastic layer (72) adhesive (300) tape