M352161 八、新型說明： 【新型所屬之技術領域】 本新型是有關於-種護蓋，特別是指一種用於晶片模 組的護蓋及s蒦盖與晶片模組的組合。 【先前技術】 -般電子計算機用的中央處理器（CPU)是—種晶片模 組，該晶片模組係由-基板及一導熱罩將一晶片封裝在其 中，在基板底面設有導電墊或導電端子。為方便晶片模組 與電路板電連接’在電路板上設有電連接器。為符合高速 運算的需求，晶片模組的導電墊密度增加，而電連接器的 導電端子也對應增加，所以在將晶片模組組裝至電連接器 的過程中，若施力不當或者晶片模組未達定位前即掉落， 容易導致晶片模組或電連接器的導電端子受損，造成晶片 模組或電連接器報鎖。 為解決前述問題，例如美國專利us 7,311，534號揭露 種CPU的治具，操作者可利用該治具，將CPU從盛放的 托盤夾取至電連接器，再鬆開治具將CPU放置於連接器插 座雖然使用治具可以避免手指接觸CPU，且將CPU擺放 ; ，插座時可較為平穩，但是該治具結構複雜、體積 大，且以金屬製作’重量不輕，不易操作，在夹取或放置 CPU的過程中’可能因沒有爽緊使㈣掉落，或者因為爽 取不正而無法順利將CPU置入插座内而損壞插座及導電端 ° j^~ ’ *+务 右麵作人員不小心使治具碰撞CPU或連接哭插 座’也會導致CPU或連接器㈣損。 〇〇 M352161 又例如中華民國專利新型專利M276237號（美國對 應案US 7,001，186)揭露一種較上述專利結構較為簡單的治 具’參閱SM ’治具9包含—框體91、設於框體91内側四 角落的四限位部92、兩組位於相對側的彈性部93、複數設 於框體91底側的對位部94，及二由框體91兩相對側往上 延伸的拿持部95，彈性部93上形成有限位凸緣931。 CPU90可由框體91底側方向置人治具9 (圖式中治具9呈 倒置狀態）’藉由限位部92與限位凸緣931將CPU90夾置 固定在框體91的開口 911中，參閱圖2〜圖4，將〇ρυ置入 治具9後再倒轉治具9，操作者可手持於拿持部95將治具 9的框體91與連接器的座體96對位，如圖3及圖4所示， 對位部94可限制框體91相對於座體％移動，欲將cpu9〇 置放於座體96時，必須施壓使CPU9〇通過限位凸緣93i， 才能使CPU90脫離治具9，此施壓過程會使cpU9〇重壓於 連接器的導電端子（圖未示）上，容易損壞導電端子。而 且，在將CPU90置入治具9時，必須先從盛放Cpu9〇的托 盤（圖未示）以手動取出，再翻轉治具9將CPU9〇置入， 因為CPU90扁平不易拿取，容易使CPU90掉落而受損，所 以治具9仍有不易操作的缺點。 【新型内容】 因此，本新型之一目的，即在提供一種容易操作使用 並具有保護功能的護篕。 本新型之另一目的，在提供一種晶片模組與前述護蓋 的組合。 M352161 於疋本新型瘦蓋，包含··一板體、一圍繞壁及二彈 性扣件。該板體概呈矩形，具有兩相對之第—側邊及兩相 對的第二側邊。該圍繞壁由該板體周緣往下凸伸，具有二 分別相鄰各該第一側邊的第一側壁部，及二分別相鄰各該 第二側邊的第二側壁部，該圍繞壁與該板體的底面共同界 疋一第一框限空間。各該彈性扣件分別設於各該第一側壁 部處，各包括一彈性臂及一卡鉤，該彈性臂連接該第一側M352161 VIII. New description: [New technical field] The present invention relates to a cover, in particular to a cover for a wafer module and a combination of a cover and a wafer module. [Prior Art] A central processing unit (CPU) for an electronic computer is a wafer module in which a chip is packaged by a substrate and a heat transfer cover, and a conductive pad is provided on the bottom surface of the substrate. Conductive terminal. In order to facilitate the electrical connection between the chip module and the circuit board, an electrical connector is provided on the circuit board. In order to meet the requirements of high-speed computing, the density of the conductive pads of the chip module is increased, and the conductive terminals of the electrical connectors are correspondingly increased, so if the wafer module is assembled into the electrical connector, if the force is improper or the chip module Dropping before reaching the positioning may easily cause damage to the conductive terminals of the chip module or the electrical connector, causing the wafer module or the electrical connector to report lock. In order to solve the aforementioned problems, for example, the U.S. Patent No. 7,311,534 discloses a CPU fixture, which can be used by an operator to take the CPU from the tray to the electrical connector, and then release the fixture to place the CPU. Although the connector socket can prevent the finger from contacting the CPU and the CPU is placed, the socket can be relatively stable, but the fixture has a complicated structure, large volume, and is made of metal, which is not light in weight and difficult to operate. During the process of clamping or placing the CPU, it may be caused by the fact that it is not cooled (4), or the CPU cannot be placed in the socket and the socket and the conductive end are damaged due to improper handling. j^~ ' *+ If a person accidentally causes the jig to collide with the CPU or connect to the crying socket, it will also cause damage to the CPU or connector (4). 〇〇M352161 Further, for example, the Republic of China Patent No. M276237 (U.S. Patent No. 7,001,186) discloses a jig that is simpler than the above-mentioned patent structure. Referring to the SM' jig 9 includes a frame 91 and is disposed in the frame 91. a four-restricted portion 92 on the inner four corners, two elastic portions 93 on the opposite side, a plurality of alignment portions 94 provided on the bottom side of the frame 91, and two holding portions extending upward from opposite sides of the frame 91 95. A limit flange 931 is formed on the elastic portion 93. The CPU 90 can be placed in the bottom side of the frame 91 to fix the fixture 9 (the fixture 9 is in an inverted state in the drawing). The CPU 90 is clamped and fixed to the opening 911 of the frame 91 by the limiting portion 92 and the limiting flange 931. Referring to FIG. 2 to FIG. 4, after the 〇ρυ is placed in the jig 9, the jig 9 is reversed, and the operator can hold the frame 91 of the jig 9 and the seat 96 of the connector by hand in the holding portion 95, such as As shown in FIG. 3 and FIG. 4, the aligning portion 94 can restrict the movement of the frame 91 relative to the seat body. When the cpu 9 欲 is placed on the seat body 96, the CPU 9 must be pressed to pass the limit flange 93i. The CPU 90 is disengaged from the jig 9. This pressing process causes the cpU 9 to be pressed against the conductive terminals (not shown) of the connector, which easily damages the conductive terminals. Moreover, when the CPU 90 is placed in the jig 9, it is necessary to manually take out the tray (not shown) that holds the CPU 9〇, and then flip the jig 9 to place the CPU 9 into the CPU 9 because the CPU 90 is not easy to handle, and it is easy to make The CPU 90 is dropped and damaged, so the jig 9 still has the disadvantage of being difficult to handle. [New content] Therefore, it is an object of the present invention to provide an ankle that is easy to operate and has a protective function. Another object of the present invention is to provide a combination of a wafer module and the aforementioned cover. M352161 The new slim cover of Sakamoto, including a plate body, a surrounding wall and two elastic fasteners. The plate has a rectangular shape with two opposite first sides and two opposite second sides. The surrounding wall protrudes downward from the periphery of the plate body, and has two first side wall portions respectively adjacent to the first side edges, and two second side wall portions respectively adjacent to the second side edges, the surrounding wall A first frame space is defined by a common surface of the bottom surface of the plate body. Each of the elastic fasteners is disposed at each of the first side wall portions, and each includes an elastic arm and a hook, and the elastic arm is connected to the first side
壁部及該卡鉤，該卡鉤具有一與該彈性臂連接的扳動部及 一由該板動部往下延伸且末端往該板體内側呈勾狀的扣持 部。 此外，本新型晶片模組與護蓋的組合，包含：一具有 一基板及一設於該基板上的散熱罩之晶片模組，及一護蓋 。該護蓋包含··一板體、一圍繞壁及二彈性扣件。該板體 概呈矩形’具有兩相對之第一侧邊及兩相對的第二側邊。 該圍繞壁由該板體周緣往下凸伸，具有二分別相鄰各該第 一側邊的第一側壁部，及二分別相鄰各該第二側邊的第二 側壁部’該圍繞壁與該板體的底面共同界定一第一框限空 間’該第一框限空間可容置該晶片模組之散熱罩。各該彈 性扣件分別設於各該第_側壁部處，各包括一彈性臂及一 卡鉤，該彈性臂連接該第一側壁部及該卡鉤，該卡釣具有 一與該彈性臂連接的扳動部及一由該板動部往下延伸且末 端往該板體内側呈勾狀的扣持部，該二扣持部可對應勾扣 於該晶片模組之基板底緣。 藉由該板體與該圍繞壁所界定的第一框限空間可將該 M352161 晶片模組限位，並藉由該等彈性扣件可輕易將該晶片模組 夾取或鬆開，且該護蓋可以在該晶片模組封裝完成時，即 可加裝於該晶片模組上，可隨該晶片模組置於托盤上，直 到該晶片模組被組裝於電連接器後，可再回收使用，不僅 操作使用方便，還具有保護的功能。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二較佳實施例的詳細說明中，將可清 楚的呈現。 在本新型被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖5與圖6，本新型晶片模組與護蓋的組合之第一 較佳實施例包含一晶片模組U一護蓋2。晶片模組】具有 一基板π及一設於基板u上的散熱罩12。散熱罩12具有 一上層121及一下層122，上層121周緣較下層122周緣内 縮，使散熱罩丨2周緣呈階梯狀。在本實施例中，晶片模也 \為一中央處理器（CPU)，且其散熱罩12具有兩層結構，但 是晶片模組1的散熱罩12也可以僅有一層結構，不以本實 施例為限。 板體3、一圍繞壁4、二彈性扣件 €蓋2包含 二抓持部6及複數對位塊7。板體3概呈矩形，具有兩才" 之第一側邊31及兩相對的第二側邊32,中央設有一穿子 W。圍繞壁4由板體3周緣往下凸伸，具有二分別相鄰^ 第-侧邊31的第-側壁部41’及二分別相鄰各第二彻“ M352161 3?第二側壁部42。該等對位塊7由圍繞壁4往下凸伸， 對位Γ固對位塊7佈設於圍繞壁4的四角落處，另外四個 對位塊7分別位於各彈性扣丰 繞壁4…… 兩側。板體3的底面與圍 同界疋一弟一框限空間（圖未標號），可容置晶片 模組1之散熱罩12的上層121 (夂間 ^ 121 ® 7 8) , 塊7與圍繞壁4部分底面丘因反—墙 底面共同界疋-第二框限空間（圖The wall portion and the hook have a pulling portion connected to the elastic arm and a latch portion extending downward from the plate portion and having a hook shape on the inner side of the plate body. In addition, the combination of the novel chip module and the cover comprises: a wafer module having a substrate and a heat dissipation cover disposed on the substrate, and a cover. The cover comprises a plate body, a surrounding wall and two elastic fasteners. The panel has a rectangular shape & has two opposite first sides and two opposite second sides. The surrounding wall protrudes downward from the periphery of the plate body, has two first side wall portions respectively adjacent to the first side edges, and two second side wall portions respectively adjacent to the second side edges A first frame space is defined together with the bottom surface of the plate body. The first frame space can accommodate the heat dissipation cover of the chip module. Each of the elastic fasteners is disposed at each of the first side wall portions, and includes a resilient arm and a hook. The elastic arm connects the first side wall portion and the hook, and the card fishing has a connection with the elastic arm. The latching portion and a latching portion extending downward from the plate-moving portion and having a hook toward the inner side of the plate body, the two latching portions are correspondingly hooked to the bottom edge of the substrate of the wafer module. The M352161 chip module can be limited by the first frame space defined by the board and the surrounding wall, and the chip module can be easily clamped or loosened by the elastic fasteners, and the The cover can be attached to the chip module when the chip module package is completed, and can be placed on the tray with the chip module until the chip module is assembled into the electrical connector, and can be recycled. It is easy to use and has the function of protection. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of FIG. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to Figures 5 and 6, a first preferred embodiment of the combination of the present wafer module and the cover comprises a wafer module U-cover 2. The chip module has a substrate π and a heat dissipation cover 12 disposed on the substrate u. The heat dissipation cover 12 has an upper layer 121 and a lower layer 122. The periphery of the upper layer 121 is retracted from the periphery of the lower layer 122, so that the periphery of the heat dissipation cover 2 is stepped. In this embodiment, the wafer mold is also a central processing unit (CPU), and the heat dissipation cover 12 has a two-layer structure, but the heat dissipation cover 12 of the wafer module 1 may have only one layer structure, not in this embodiment. Limited. The plate body 3, a surrounding wall 4, and two elastic fasteners, the cover 2 includes two gripping portions 6 and a plurality of alignment blocks 7. The plate body 3 has a rectangular shape with a first side edge 31 and two opposite second side edges 32, and a wearer W is disposed at the center. The surrounding wall 4 is protruded downward from the periphery of the plate body 3, and has two first side wall portions 41' and two second "M352161 3? second side wall portions 42 respectively adjacent to the first side-side 31. The alignment blocks 7 are protruded downward from the surrounding wall 4, and the alignment aligning alignment blocks 7 are arranged at the four corners of the surrounding wall 4. The other four alignment blocks 7 are respectively located at the respective elastic buckle walls 4... ... on both sides. The bottom surface of the plate body 3 and the surrounding space of the same boundary frame (not shown) can accommodate the upper layer 121 of the heat dissipation cover 12 of the wafer module 1 (夂121 121 8 8) The block 7 and the bottom surface of the surrounding wall 4 are partly bounded by the anti-wall bottom surface - the second frame space (Fig.
未，)’可容置散熱罩12的下層122 (參閱圖7及圖8) 各洋性扣件5分別設於各第—側壁部41冑，各包括一彈 :臂Η及一卡釣52，彈性臂51用以連接第一側壁部μ及 鉤/2。各彈性臂51具有二相間隔的臂部511，該等臂部 511係由各第-側壁部41彎曲往上延伸且上端與卡鉤52連 各卡鉤52具有-扳動部521及一扣持部522，板動部 521兩側與彈性臂51的二臂部511上端連接，扣持部522 由扳動部521之介於兩臂部511之間的區域往下延伸且末端 板體3内側呈勾狀，使各扣持部522位於相對應的該等 臂部5U之間。各抓持部6由板體3各第二側邊32處往外 凸伸。在本實施例中，護蓋2配合具有兩層結構散熱罩 的曰日片模組1而設置對位塊7以形成第二框限空間，若散 熱罩僅有一層結構，則可不用設置對位塊7，以第一框限空 間容置散熱罩即可。 參閱圖7及圖8,護蓋2可覆蓋於晶片模組丨，使其散 熱罩12的上層121位於第一框限空間，下層m位於第二 框限空間，並利用二彈性扣件5的扣持部522對應勾扣於 晶片模組1之基板11底緣，而可將護蓋2固定於晶片模組 M352161 1上欲將護蓋2置於晶片模組1時，將二卡鉤52的扳動 邛521往相對方向扳動，即可使二扣持部522往外張開， 待晶片模組1的散熱罩12進入第一、第二框限空間到達 定位後，放開扳動部521，則二扣持部522可藉由彈性臂 51的彈性回復原位，並將晶片模組丨扣持。或者是，由於 扣持部522末端往板體3内側呈勾狀，在末端處有弧狀的 邊緣，可以把護蓋2直接對準晶片模組丨壓下，可以使扣 持部522末端抵壓基板u邊緣自動張開及彈性回復後扣持 住基板11底緣。 參閱圖9，一般晶片模組！封裝完成後會置於托盤 中’以方便運送。護蓋2可在晶片模组i封裝完成後，即 與晶片模組1組裝，並可一起置於托盤8〇中運送，不會影 響托盤8G的盛放空間，還可避免晶片模組！受到碰撞損傷 ’具有保護功能。 參閱圖10與圖11，欲將晶片模組丨組裝至電連接器8 時，可手持護蓋2兩側的抓持部6,將護蓋2連同晶片模組 1從托盤80取出，再移動至電連接器8處。參閱圖12及圖 13，圖式中為便於說明將部分元件移除，由於晶片模組工 的基板11外圍可顯露於護蓋2外側，因此容易將晶片模組 1與電連接器8的導接區域81 (參閱圖u )對位，而將晶 片模組1直接置入導接區域81後，再扳動二彈性扣件$的 卡鉤52，使二扳動部521往相對方向移動，而將扣持部 522往外張開後，將護蓋2往上移動，即可使護蓋2脫離晶 片模組1。若晶片模組1與護蓋2產生吸附現象，則可通過 10 M352161 護蓋2的穿孔33輕輕按住晶片模組丨的散熱罩12頂面， 即可使晶片模組1與護蓋2分離。卸除護蓋2的過程不會 施壓於晶片模組丨，故可避免損壞電連接器8的導電端子（ 圖未示）。護蓋2卸除後，可再回收使用。No, the lower layer 122 of the heat-dissipating cover 12 can be accommodated (see FIGS. 7 and 8). Each of the foreign fasteners 5 is disposed on each of the first side wall portions 41, each of which includes a bullet: an arm boom and a card fishing 52. The elastic arm 51 is for connecting the first side wall portion μ and the hook/2. Each of the elastic arms 51 has two arm portions 511 which are spaced apart from each other. The arm portions 511 are bent upwardly from the first side wall portions 41 and the upper ends are connected with the hooks 52. Each of the hooks 52 has a latching portion 521 and a buckle. The holding portion 522 has two sides of the plate-moving portion 521 connected to the upper ends of the two arm portions 511 of the elastic arm 51, and the fastening portion 522 extends downward from the region between the two arm portions 511 of the pulling portion 521 and the end plate body 3 The inner side is hook-shaped, so that each of the fastening portions 522 is located between the corresponding arm portions 5U. Each of the grip portions 6 protrudes outward from the second side edges 32 of the plate body 3. In this embodiment, the cover 2 is provided with the two-layer heat-dissipating cover of the solar module 1 to form the alignment block 7 to form a second frame space. If the heat-dissipating cover has only one layer structure, the pair may not be provided. The bit block 7 can accommodate the heat sink cover in the first frame space. Referring to FIG. 7 and FIG. 8 , the cover 2 can cover the chip module 丨 such that the upper layer 121 of the heat dissipation cover 12 is located in the first frame space, the lower layer m is located in the second frame space, and the second elastic fastener 5 is utilized. The fastening portion 522 is hooked to the bottom edge of the substrate 11 of the wafer module 1 , and the cover 2 can be fixed to the wafer module M352161 1 . When the cover 2 is placed on the wafer module 1 , the second hook 52 is The pulling lever 521 is pulled in the opposite direction to open the two fastening portions 522 outward. After the heat dissipation cover 12 of the wafer module 1 enters the first and second frame spaces, the positioning portion is released, and the pulling portion is released. 521, the two holding portions 522 can be restored to the original position by the elasticity of the elastic arm 51, and the wafer module is clamped. Alternatively, since the end of the latching portion 522 is hooked toward the inner side of the plate body 3 and has an arcuate edge at the end, the cover 2 can be directly aligned with the wafer module, and the end of the latching portion 522 can be abutted. The edge of the substrate u is automatically opened and elastically restored to hold the bottom edge of the substrate 11. See Figure 9, General Chip Module! Once packaged, it will be placed in the tray' for easy shipping. The cover 2 can be assembled with the wafer module 1 after the wafer module i is packaged, and can be transported together in the tray 8〇 without affecting the storage space of the tray 8G, and the wafer module can be avoided! Damaged by collision ‘has a protective function. Referring to FIG. 10 and FIG. 11, when the wafer module is assembled to the electrical connector 8, the gripping portions 6 on both sides of the cover 2 can be hand-held, and the cover 2 and the wafer module 1 are taken out from the tray 80, and then moved. To the electrical connector 8. Referring to FIG. 12 and FIG. 13 , in order to facilitate the description of some components, since the periphery of the substrate 11 of the chip molder can be exposed outside the cover 2, it is easy to guide the wafer module 1 and the electrical connector 8. After the wafer module 1 is directly placed in the guiding area 81, the hooks 52 of the two elastic fasteners are pulled to move the two pulling portions 521 in opposite directions. After the fastening portion 522 is opened outward, the cover 2 is moved upward to disengage the cover 2 from the wafer module 1. If the wafer module 1 and the cover 2 are adsorbed, the top surface of the heat dissipation cover 12 of the wafer module can be gently pressed through the through hole 33 of the 10 M352161 cover 2, so that the wafer module 1 and the cover 2 can be made. Separation. The process of removing the cover 2 does not apply pressure to the wafer module, so that the conductive terminals of the electrical connector 8 (not shown) can be avoided. After the cover 2 is removed, it can be recycled.
參閱圖14、圖15及圖16,本新型晶片模組與護蓋的 組合之第二較佳實施例’與第—較佳實施例大致相同，惟 ，本實施例之護蓋2’還包含二分別對應各該彈性扣件5設 置的保護牆60,及四個分別從該圍繞壁4向外延伸且位於 外圍的四Μ的L形外限位部7Ge各保護牆6()概呈Μ ，u形兩端分別與圍繞壁4連接並將各對應的彈性扣件5圍 設其中’且純護牆6〇與各彈性扣件5相隔—定距離，使 其不影響各彈性扣件5的可動_。各保護牆60鄰近其對 應之各彈性扣件5的扳動部52"則，具有一由頂緣往下凹 陷形成之缺口 6卜缺σ 61位於保護牆6()的中央處，可使 扳動部521部分露出，以方便使用者施力於板動部切。保 護牆60圍設於彈性扣件5外側’僅在缺口 61處露出部分 扳動部52卜用以降低使用者誤觸板動部521或其他物件碰 撞扳動部521而使晶片模組丨鬆脫的機率。 該等外限位部7G中兩兩分別與同側的各保護牆Μ的 兩相對側相連接，亦即，各保護牆⑽分別與其相鄰的兩外 限位部7〇相連接’可同時增加保護牆6〇及外限位部7〇的 各外限位部是由圍繞壁4再往外延伸，並與 對位塊7間隔一定距離，且與晶片；i Μ 、 興日日月楔組1的外緣間隔一定 11 M352161 距離。參閱圖17斑 木aUh , 、圖18，虽日日片模組1置於托盤80中， ° 2 了如第-較佳實施例所述的方式蓋設於晶片模組i ，且還可利用其四個外限位部7〇先 位壁謝對位，使在托盤心 過程更為谷易進行。同樣地，參_ 19〜24,將護蓋2，連同 晶片模組1自托盤8〇取出後，欲將晶片模、组i置放於電連 接器8的導接區域81時’可藉由四個外限位部7q與電連 接盗8的周圍側壁82的四角落對位，如圖23及圖24所示 ’外限位部7G的内緣可相鄰電連接器8的側壁82外緣， 可具有對位效果。再者’由圖22〜圖23可知，利用護蓋2, 夾持晶片模組i置於電連接器"，晶片模組ι可平穩地 位於導接區域81上。如圖25所示，待板動該等板動部521 將扣持部522 (參閱圖22)往外張開後，將護蓋2，往上移 動即可卸除遵蓋2,，並使晶片模組j穩定地留置於電連 接器8上，完成晶片模組1與電連接器8的組裝。 综上所述，本新型晶片模組i與護蓋2、2，的組合，藉 由護蓋2、2’的第-、第二框限空間可將晶片模組i限位， 並利用該等彈性扣彳5可輕易將晶片模組i夾取或鬆開， 操作使用方便，容㈣護蓋2、2，組裝於晶片模組ι ^容易 卸除，不會施壓於電連接器8的導電端子，可避免損壞導 電端子。再者，護蓋2 '2,體積輕巧，可隨晶片模組i運送 ，還具有保護功能，並可回收再使用。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 12 M352161 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體圖，說明一習知CPU的治具與一 CPU ; 圖2〜圖4是說明利用該習知cpu治具組裝該cpu至 一電連接器的步驟流程； 圖5疋一立體分解圖，說明本新型晶片模組與護蓋的 組合之第一較佳實施例； 圖6是一說明圖5中一護蓋的底面視圖； 圖7是一圖5的組合圖，說明該第一較佳實施例之晶 片模組與護蓋的組合關係； 圖8是一沿圖7中VIII-VIII直線所取的剖視圖； 圖9是一立體圖，說明該第一較佳實施例至於一托盤 中； 圖10是一立體圖，說明該第一較佳實施例從該托盤取 出； 圖11是一立體圖，說明該第一較佳實施例欲置於一電 連接器； 圖12是一立體圖，說明該第一較佳實施例置於該電連 接器； 圖13是一立體圖，說明該晶片模組置於該電連接器後 ’將該護蓋卸除； 圖14是一立體分解圖，說明本新型晶片模組與護蓋的 、且σ之弟一較佳實施例，其中該s蔓蓋與該晶片模組在組合 13 M352161 前的狀態； 圖】5是一圖]4的反面視圖； 圖16是一圖15的組合圖； 圖〗7是一立體分解圖，說明該第二較佳實施例之護蓋 與置於一托盤中的該晶片模組組裝前的狀態； 圖18是一圖17的組合圖，說明該護蓋與該晶片模組 組合後在該托盤中的狀態； 圖19是一立體圖 器； 圖20是一立體圖 接器的狀態； ，s兒明該第二較佳實施例與一電連接 ，說明該第二較佳實施例置於該電連Referring to FIG. 14, FIG. 15, and FIG. 16, the second preferred embodiment of the combination of the present wafer module and the cover is substantially the same as the first preferred embodiment. However, the cover 2' of the present embodiment further includes Two protective walls 60 respectively corresponding to the elastic fasteners 5, and four L-shaped outer limiting portions 7Ge respectively extending outward from the surrounding wall 4 and located at the periphery, each of the protective walls 6 () The ends of the u-shape are respectively connected with the surrounding wall 4 and the corresponding elastic fasteners 5 are enclosed therein, and the pure retaining wall 6〇 is separated from the elastic fasteners 5 by a distance, so that the elastic fasteners 5 are not affected. Movable _. Each of the protective walls 60 is adjacent to the corresponding pivoting portion 52 of the elastic fastener 5; then, there is a notch 6 formed by the top edge recessed downward, and the σ 61 is located at the center of the protective wall 6 (). The moving portion 521 is partially exposed to facilitate the user to apply force to the cutting portion. The protective wall 60 is disposed around the outer side of the elastic fastener 5. Only a part of the pulling portion 52 is exposed at the notch 61 to reduce the user's accidental contact with the driving portion 521 or other objects colliding with the pulling portion 521 to loosen the chip module. The probability of taking off. Two of the outer limiting portions 7G are respectively connected to opposite sides of the protective wall rafts on the same side, that is, the protective walls (10) are respectively connected to the two outer limiting portions 7 相邻 adjacent thereto. The outer limiting portions of the protective wall 6〇 and the outer limiting portion 7〇 are extended from the surrounding wall 4 and spaced apart from the alignment block 7 by a certain distance, and the wafer; i Μ , 兴日日月The outer edge of 1 is separated by a distance of 11 M352161. Referring to FIG. 17, a wood aUh, FIG. 18, although the solar module 1 is placed in the tray 80, the film module i is covered in the manner described in the first embodiment, and can also be utilized. The four outer limit parts 7 〇 壁 壁 谢 对 对 , , , , , , , , , , , , 对 托盘 托盘 托盘Similarly, referring to _ 19 to 24, the cover 2, together with the wafer module 1 being taken out from the tray 8 , is intended to be placed on the conductive region 8 of the electrical connector 8 by the wafer module 1 The four outer limiting portions 7q are aligned with the four corners of the surrounding side wall 82 of the electrical connection thief 8, as shown in FIGS. 23 and 24, the outer edge of the outer limiting portion 7G may be adjacent to the side wall 82 of the electrical connector 8. Edge, can have a matching effect. Further, as is apparent from Figs. 22 to 23, the wafer module i is placed in the electrical connector by the cover 2, and the wafer module ι can be smoothly positioned on the lead-out area 81. As shown in FIG. 25, after the plate-moving portion 521 is opened, the latching portion 522 (see FIG. 22) is opened outward, and the cover 2 is moved upward to remove the cover 2, and the wafer is removed. The module j is stably placed on the electrical connector 8 to complete the assembly of the wafer module 1 and the electrical connector 8. In summary, the combination of the novel chip module i and the cover 2, 2 can limit the chip module i by the first and second frame spaces of the cover 2, 2', and utilize the The elastic buckle 5 can easily clamp or loosen the chip module i, and is convenient to operate, and the (4) cover 2, 2 is assembled in the wafer module, and is easily removed, and does not apply pressure to the electrical connector 8 The conductive terminals prevent damage to the conductive terminals. Furthermore, the cover 2'2 is lightweight and can be transported with the wafer module i. It also has a protective function and can be recycled and reused. However, the above is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change of the scope and the new description of the new patent application 12 M352161 is Modifications are still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a conventional CPU fixture and a CPU; FIG. 2 to FIG. 4 are flowcharts showing the steps of assembling the CPU to an electrical connector using the conventional cpu jig; FIG. 5 is a perspective exploded view showing a first preferred embodiment of the combination of the present wafer module and the cover; FIG. 6 is a bottom view of a cover of FIG. 5; FIG. 7 is a combination of FIG. FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7; FIG. 9 is a perspective view showing the first preferred embodiment. The embodiment is in a tray; FIG. 10 is a perspective view showing the first preferred embodiment taken out from the tray; FIG. 11 is a perspective view showing the first preferred embodiment intended to be placed in an electrical connector; Is a perspective view showing the first preferred embodiment placed in the electrical connector; FIG. 13 is a perspective view showing the wafer module being placed after the electrical connector to remove the cover; FIG. 14 is a perspective view Exploded view, illustrating the preferred implementation of the novel chip module and the cover , wherein the s vine cover and the wafer module are in a state before the combination of 13 M352161; FIG. 5 is a reverse view of FIG. 4; FIG. 16 is a combination view of FIG. 15; The state of the cover of the second preferred embodiment before the assembly of the wafer module placed in a tray is illustrated; FIG. 18 is a combination view of FIG. 17 illustrating the combination of the cover and the wafer module. Figure 19 is a perspective view; Figure 20 is a perspective view of the connector; and the second preferred embodiment is electrically connected to the second preferred embodiment. even
圖21是一圖20的俯視圖； 圖22是—沿圖21 直線所取的剖視圖； 圖23是—沿圖21的_1直線所取的剖視圖； 7是—沿圖21的1㈣直線所取的剖視圖；及 圖2 5疋—立體圖，％昍j。加Figure 21 is a plan view of Figure 20; Figure 22 is a cross-sectional view taken along the line of Figure 21; Figure 23 is a cross-sectional view taken along line 1 of Figure 21; 7 is - taken along the line 1 (four) of Figure 21 Cutaway view; and Figure 2 5疋-stereoscopic view, %昍j. plus
將該護蓋卸除。 一片椟•且置於該電連接器 14 M352161 【主要元件符號說明】Remove the cover. A piece of 椟• and placed in the electrical connector 14 M352161 [Main component symbol description]
1 ..........晶片板組 11 .........基板 12 .........散熱罩 121 .......上層 122 .......下層 2 ..........護蓋 2’ .........護蓋 3 ..........板體 31 .........第一側邊 32 .........第二側邊 33 .........穿孔 4 ..........圍繞壁 41 .........第一側壁部 42 .........第二側壁部 5 ..........彈性扣件 51 .........彈性臂 511 .......臂部 52 .........卡鉤 521 .......扳動部 522 .......扣持部 6 ..........抓持部 60 .........保護牆 61 .........缺口 7 ..........對位塊 70.........外限位部 8 ..........電連接器 80.........托盤 801 .......限位壁 81 .........導接區域 82 .........側壁 9 ..........治具1 ..... wafer set 11 ... ... substrate 12 ... ... heat shield 121 ... ... upper layer 122 ... .... lower layer 2 .......... cover 2' ......... cover 3 .......... plate body 31 ..... ....first side 32 ... ... second side 33 ... ... perforation 4 ..... around the wall 41 ... ...the first side wall portion 42 ... the second side wall portion 5 ..... elastic fastener 51 ... ... elastic arm 511 .......arm 52 ......... hook 521 . . . 522 . . . . . . . . . . . . . . ..... gripper 60 ... ... protective wall 61 ... ... gap 7 .......... alignment block 70.... ..... outer limit portion 8 ..... electrical connector 80 ......... tray 801 .... limit wall 81 .... ..... Guide area 82 ......... side wall 9 .......... fixture
90.........CPU 91.........框體 92··.......限位部 93 .........彈性部 931 .......限位凸緣 94 .........對位部 95 .........拿持部 96 .........座體 1590.........CPU 91.........Frame 92··....... Limiting portion 93 .... Elastic portion 931 . ......limit flange 94 ......... aligning portion 95 ... ... holding portion 96 ... ... seat body 15