M350035 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種光源模組，且特別是一種應用於 液晶顯示器（LCD)來作為面光源的背光模組（backlight module) ° 【先前技術】 液晶顯示器主要包括液晶面板及背光模組，其中背光 模組是設置於液晶面板後方的面光源。依照燈管的配置不 同，背光模組可分為直下式背光模組與側光式背光模組。 側光式背光模組的原理是將燈管（即線光源）設置於導光 板的側邊，使得燈管所發出的光線可從導光板的側面入 射’再從導光板的正面出射。 圖1A為習知之一種背光模組的爆炸圖，圖1B為圖i 之月光模組於組合後的局部剖面圖。請參考圖1A圖， • f知的背光模組100包括一導光板110及-反射片112, 其中反射片m配置於導光板110的底面。背光模組1〇〇 更包括兩對燈管12〇、兩對固定套122及一對反射罩13〇， 其中這兩對燈管120藉由這兩對固定套122分別容置於這 對反射罩13〇内。每個反射罩請具有一金屬材質之罩合 部132及-反射層133，其中反射層133配置於對應的罩 合部132的内面。 背光模組1GG更包括—金屬下框14Qa及—塑膠上框 140b。在这兩對燈f 120分別藉由這兩對固定套容置 6 M350035 以後’使得這對反射罩13G分別夾持 及反射片112的關緣。接著，將導光板11〇、 反射^ 112、這些燈管12〇、這錢定套122、這些反 130文置於金屬下框14〇a中，並將塑膝上框屬扣接至 金屬下框14Ga ’用定上述元件的相對位置。背光模組 爾更包括多個光學膜片15〇,例如擴散片及增光片等，、其M350035 VIII. New description: [New technical field] This creation is about a light source module, and in particular a backlight module applied to a liquid crystal display (LCD) as a surface light source. The liquid crystal display mainly comprises a liquid crystal panel and a backlight module, wherein the backlight module is a surface light source disposed behind the liquid crystal panel. According to the configuration of the lamp, the backlight module can be divided into a direct-lit backlight module and an edge-lit backlight module. The principle of the edge-lit backlight module is that the lamp tube (ie, the line source) is disposed on the side of the light guide plate so that the light emitted by the lamp tube can be incident from the side of the light guide plate and then exit from the front surface of the light guide plate. 1A is an exploded view of a conventional backlight module, and FIG. 1B is a partial cross-sectional view of the moonlight module of FIG. Referring to FIG. 1A , the backlight module 100 includes a light guide plate 110 and a reflective sheet 112 , wherein the reflective sheet m is disposed on the bottom surface of the light guide plate 110 . The backlight module 1 further includes two pairs of lamps 12 〇, two pairs of fixing sleeves 122 and a pair of reflectors 13 〇, wherein the two pairs of lamps 120 are respectively accommodated in the pair of reflections by the two pairs of fixing sleeves 122 Cover 13 inside. Each of the reflectors has a metal cover portion 132 and a reflective layer 133, wherein the reflective layer 133 is disposed on the inner surface of the corresponding cover portion 132. The backlight module 1GG further includes a metal lower frame 14Qa and a plastic upper frame 140b. After the two pairs of lamps f 120 are respectively accommodated by the two pairs of fixing sleeves 6 M350035, the pair of reflecting covers 13G are respectively clamped and the closing edges of the reflecting sheets 112 are respectively. Next, the light guide plate 11〇, the reflection 112, the lamps 12〇, the money sleeve 122, the reverse 130 are placed in the metal lower frame 14〇a, and the plastic laptop frame is fastened under the metal. Block 14Ga' uses the relative positions of the above components. The backlight module further includes a plurality of optical films 15 such as a diffusion sheet and a brightness enhancement sheet, etc.
依序疊置於導光板110上，並限位於導光板UG及塑膠1 框140b之間。 ’ 值得注意的是’金屬下框i術除了可配合塑膠上框 1働來固定上述元件的相對位置以外，更作為導熱路捏的 中間物120位於其末端的電極所產生的熱可依序經 過反射層133、罩合部132及金屬下框14〇a傳遞至外界: 然而’反射罩130的罩合部132與金屬下框14如並非緊密 接觸’這使得罩合部132與金屬下框140a之間的導熱屬ς 非緊密接觸導熱，其導熱效果較差。 【新型内容】 本創作之一實施例提供一種背光模組，具有一導光 板、至少一光源、至少一反射罩及一上框。導光板具有一 頂面、一連接頂面與底面的第一側面及一連接頂面、底面 與第一側面的第二側面。反射罩具有一罩合部、一第—導 熱部及一弟二導熱部。光源配置於罩合部内。罩合部失持 V光板以使光源鄰近導光板的第一側面。第一導熱部從 罩合部延伸至導光板的底面。第二導熱部從該第一導熱部 7 M3 5003 5 延伸至導光板的第二侧面，而該上框扣接至罩合部及第二 導熱部，以容納導光板。 在本創作之一實施例中，背光模組更包括至少一對扣 合結構，而這對扣合結構分別為—鉤及—槽，其分別 形成於上框及罩合部。 在本創作之一實施例中，背光模組更包括至少一對扣 合結構，而這對扣合結構分別為—^釣及—^槽，f分別 形成於上框及第二導熱部。 在本創作之一實施例中’光源為一冷陰極射線管或一 發光二極體陣列基板。 在本創作之一實施例中，背光模組更包括一對固定 套，藉由這固定套將光源的兩端容置於罩合部内。 在本創作之一實施例中’背光模組更包括一反射片， 配設於導光板的底面，而罩合部夾持導光板及反射片。 在本創作之一實施例中，反射罩更具有一反射層，其 配設於罩合部的内面。 在本創作之一實施例中，反射罩更鎖附至上框。 在本創作之一實施例中，上框為—塑膠上框。 在本創作之一實施例中，背光模組更包括至少一光學 膜片’疊置於導光板的頂面上。 在本創作之一實施例中，光學膜片限位於上框與導光 板之間。 在本創作之一實施例中，背光模組更包括一防漏光 片，配設於反射片之下方。 8 M350035 在本創作之一實施例中 一導熱部與反射片之間。 在本創作之一實施例中 一導熱部。 防漏光片的局部更配置於第 防漏光片的局部更貼附於第 在本創作之一實施例中The LED board 110 is stacked on the light guide plate 110 and is disposed between the light guide plate UG and the plastic frame 140b. ' It is worth noting that the metal lower frame i can be used in conjunction with the plastic upper frame to fix the relative position of the above components, and the heat generated by the electrode at the end of the intermediate portion 120 of the heat conduction path can be sequentially passed. The reflective layer 133, the cover portion 132, and the metal lower frame 14A are transmitted to the outside: However, the cover portion 132 of the reflector 130 is not in close contact with the metal lower frame 14, which causes the cover portion 132 and the metal lower frame 140a. The heat transfer between them is not in close contact with heat conduction, and its thermal conductivity is poor. [New Content] An embodiment of the present invention provides a backlight module having a light guide plate, at least one light source, at least one reflective cover, and an upper frame. The light guide plate has a top surface, a first side surface connecting the top surface and the bottom surface, and a second side surface connecting the top surface, the bottom surface and the first side surface. The reflector has a cover portion, a first heat conducting portion and a second heat conducting portion. The light source is disposed in the cover portion. The cover portion is deviated from the V-plate such that the light source is adjacent to the first side of the light guide plate. The first heat transfer portion extends from the cover portion to the bottom surface of the light guide plate. The second heat conducting portion extends from the first heat conducting portion 7 M3 5003 5 to the second side of the light guide plate, and the upper frame is fastened to the cover portion and the second heat conducting portion to accommodate the light guide plate. In an embodiment of the present invention, the backlight module further includes at least one pair of fastening structures, and the pair of fastening structures are respectively - hooks and grooves, which are respectively formed on the upper frame and the cover portion. In one embodiment of the present invention, the backlight module further includes at least one pair of fastening structures, and the pair of fastening structures are respectively - a fishing and a groove, and f is formed in the upper frame and the second heat conducting portion, respectively. In one embodiment of the present invention, the light source is a cold cathode ray tube or a light emitting diode array substrate. In an embodiment of the present invention, the backlight module further includes a pair of fixing sleeves, and the fixing sleeves are used to accommodate both ends of the light source in the covering portion. In one embodiment of the present invention, the backlight module further includes a reflective sheet disposed on the bottom surface of the light guide plate, and the cover portion sandwiches the light guide plate and the reflective sheet. In an embodiment of the present invention, the reflector further has a reflective layer disposed on the inner surface of the cover portion. In one embodiment of the present invention, the reflector is more locked to the upper frame. In an embodiment of the present invention, the upper frame is a plastic upper frame. In an embodiment of the present invention, the backlight module further includes at least one optical film disposed on the top surface of the light guide plate. In one embodiment of the present invention, the optical film is limited between the upper frame and the light guide plate. In an embodiment of the present invention, the backlight module further includes a light leakage preventing sheet disposed under the reflective sheet. 8 M350035 In one embodiment of the present invention, a thermally conductive portion and a reflective sheet are used. In one embodiment of the present invention, a heat conducting portion. The portion of the anti-leakage sheet is further disposed on the portion of the anti-leakage sheet and is further attached to the first embodiment.
只冗,,,々郝》7υ门❺一鋁箔片。 本創作之上述實施例可以從反射罩之罩合部 出來的導熱部來取代先前技術的金屬下框， ^伸 果及降低轉成本。 導熱效 為讓本創作之上述特徵和優點能更明顯易 舉多個實關，並配合所_式，作詳纟下y文特 【實施方式】 下列各實施例的說明是參考附加的圖式，用以例示 創作可用以實施之特定實施例。本創作所 語，例如「上」、「下」、「前」、「後」、「左」「右用 等，僅是參考附加圖式的方向。因此，使用的方向用語是」 用來說明，而非用來限制本創作。 口 圖2A為本創作之一實施例的一種背光模組的爆炸 圖，圖2B為圖2A之背光模組於組裝後的局部剖面圖。請 參考圖2A及圖2B，本實施例之背光模組2〇〇包括一導光 板210、至少一光源22〇、至少一反射罩23〇及—上框以卜 在本實施例令，此背光模組2〇〇是雙邊側邊入光式之倍光 模組200，因此光源、22〇與反射罩23〇之數量皆以兩個為 例，但不以此為限。導光板21〇具有—頂面21加、一相對 9 M350035 於頂面210a的底面210b、一連接頂面21〇a與底面21〇b 的第一側面21〇c及一連接頂面21〇a、底面210b與第一侧 面210c的第二側面210d。 在本實施例中，這對光源220分別構成自一對冷陰極 射線管。在另一未繪示的實施例中，這對光源22〇亦可構 成自一對發光二極體陣列基板，其中發光二極體陣列基板 可構成自一線路基板及多顆陣列地配置在此線路基板上的 發光二極體。 母個反射罩230具有一罩合部232，而這對光源220 分別配置於這對罩合部232内。在本實施例中，背光模組 2〇〇更可包括兩對固定套222，並藉由這兩對固定套222 對應將這對光源220的兩對末端固定至這對罩合部232 内，用以將這對光源220分別容置於這兩個罩合部232内。 在將這對光源220分別組裝至這兩個罩合部232以 後，使得這兩個罩合部232分別夾持導光板21〇的兩側。 因此這對光源220鄰近導光板210的兩個相對第一侧面 210c。 為了有效利用光線’背光模組200更可包括一反射片 212，其配設於導光板210的底面210b。此時，這兩個罩 合部232將同時夾持導光板21()及反射片212。同樣地， 為了有效利用光線，每個反射罩230更可具有一反射層 233，其配設於罩合部232的内面。此時，這些反射罩23〇 將可分別經由這些反射層233來接觸導光板210及固定套 222。 M350035 這些光源220的末端是其電極的所在，這使得這些運 作中的光源220的末端會產生高熱。因此，為了散逸這些 光源220的末端的高熱來降低溫度，每個反射罩230更具 有一第一導熱部234，其從對應的罩合部232的一側延伸 至導光板210的底面210b ’因而增加導熱途徑。在本實施 例中’每個反射罩230更可具有兩第二導熱部236，其從 對應的第一導熱部234延伸至導光板210的第二側面 210d。因此’這有助於增加這些光源220的末端的導熱途 徑0 值得注意的是，本實施例無須先前技術的金屬下框， 而是以反射罩230之延伸自罩合部232的第一導熱部234 來取代，故本實施例相較於先前技術可以降低零件成本。 此外，當第一導熱部234與罩合部232 —體成形時，第一 導熱部234與罩合部232的一體成形在導熱效果上較優於 先前技術的金屬下框與罩合部的非緊密接觸。另外，在本 實施例中’在已提供足夠導熱效果的情況下，這些第一導 熱部234可無須佔據導光板210的底面21〇b的全部，因而 降低材料成本。 背光模組200之上框240與這些反射罩230相扣接， 以固定其他元件的相對位置。具體而言，多個設置於上框 240的扣合結構240a可分別與多個設置於這些罩合部m2 的扣合結構232a相扣接’而在上框240另一邊之多個設置 於上框240的扣合結構240b可分別與多個設置於這些第二 導熱部236的扣合結構236a相扣接。 11 M350035 在本實施例中，上框24〇之扣合結構鳩斑反射罩 230之扣合結構232a可成對地存在，並可為一卡鉤及一卡 槽。此外，上框240之扣合結構24〇b與反射罩23〇之扣合 結構236a亦可成對地存在，並可為—卡鉤及一卡槽。另 外，上框240可為一塑膠上框，而這些反射罩23〇更可經 由螺絲鎖附至上框240 ’以增加結構強度。 ^ 背光模組200更可包括多個光學膜片25〇，例如擴散 ❿ 片及增光片等，其依序疊置於導光板21〇的頂面21〇a上。 在本λ知例中，這些光學膜片250更限位於上框240與導 光板210之間。具體而言，這些光學膜片25〇的邊緣相對 於導光板210受到上框240的限位。 為了防止光線洩漏，背光模組2〇〇更可包括一防漏光 片260，其配設於反射片212之下方，亦即反射片a〗中 由第一導熱部234所暴露的區域。在本實施例中，防漏光 片260的局部更可配置於第一導熱部234與反射片212之 間，而防漏光片260可為一鋁箔片。當防漏光片26〇的材 ’質採用金屬時’防漏光片260亦具有阻絕電磁干擾 (electromagnetic interference，ΕΜΙ)的功能。 圖3為本創作之另一實施例的一種背光模組的局部剖 面圖。相較於圖2B的實施例的背光模組200的防漏光片 260是位在第一導熱部234與反射片212之間，圖3之實 • 施例的背光模組200A則是將防漏光片260A貼附於這些第 一導熱部234。同樣地，當防漏光片260A的材質採用金屬 時’防漏光片260亦具有阻絕電磁干擾（EMI)的功能。 12 M350035 綜上所述，在本創作之上述實施例中，可以從反射罩 之罩合部所延伸出來的導熱部來取代先前技術的金屬下 框，以提高導熱效果’並可降低零件成本。此外，第一導 熱部與罩合部的一體成形在導熱效果上較優於先前技術的 金屬下框與罩合部的非緊密接觸。另外，在已提供足夠導 熱效果的情況下，這些第一導熱部可無須佔據導光板的底 面的全部，因而降低材料成本。 —雖然本創作已以多個實施例揭露如上，然其並非用以 限定本創作，任何所屬技術領域中具有通常知識者，在不 脫離本創作之精神和範#可作些許之更動與调飾， 因此本創#之保護範圍當視;^附之申請專利κ圍所界定者 為準。本創作的實關或冑請專利範圍不須達成本創作所 揭，之ΐ部目的或優點或特點。摘要和標題僅是辅助專利 文件搜哥之用’财用総制本創作之縣範圍。 【圖式簡單說明】 圖1Α為習知之一種背光模組的爆炸圖。 =1Β為圖1之背光模組於組合後的局部剖面圖。 圖。Α為本創作之-實施_-種背光模組的爆炸 圖2Α之背光模組於組裝後的局部剖面圖。 δ圖。創作之另—實施例的一種背光模組的局部剖 13 M350035 【主要元件符號說明】 100 :背光模組 110 .導光板 112 :反射片 120 :光源 122 :固定套 130 :反射罩 132 :罩合部 ® 133 :反射層 140a :金屬下框 140b :塑膠上框 150 :光學膜片 200 :背光模組 210 :導光板 210a :頂面 210b :底面 • 210c:第一側面 210d :第二側面 212 :反射片 220 :光源 ' 222 :固定套 • 230:反射罩 232 :罩合部 232a :扣合結構 14 M350035 233 :反射層 234 :第一導熱部 236 :第二導熱部 236a :扣合結構 240 :上框 240a :扣合結構 240b ··扣合結構 242 :螺絲 250 :光學膜片 260 :防漏光片 260A :防漏光片Only redundant,,, Hao Hao, 7 υ ❺ an aluminum foil. The above embodiment of the present invention can replace the prior art metal lower frame from the heat transfer portion of the cover portion of the reflector, and reduce the cost of rotation. The heat transfer effect makes the above-mentioned features and advantages of the present creation more obvious and easy to implement, and cooperates with the formula to make a detailed description. [Embodiment] The following embodiments are described with reference to the additional drawings. To exemplify a particular embodiment in which an authoring can be implemented. The terms of this creation, such as "upper", "lower", "before", "after", "left", "right", etc., are only referring to the direction of the additional schema. Therefore, the direction used is "" Instead of limiting this creation. 2A is an exploded view of a backlight module according to an embodiment of the present invention, and FIG. 2B is a partial cross-sectional view of the backlight module of FIG. 2A after assembly. Referring to FIG. 2A and FIG. 2B , the backlight module 2 本 of the embodiment includes a light guide plate 210 , at least one light source 22 , at least one reflective cover 23 , and an upper frame for the backlight of the embodiment. The module 2 is a double-sided side-input type double-light module 200. Therefore, the number of the light source, the 22-inch and the reflective cover 23 is two, but not limited thereto. The light guide plate 21 has a top surface 21, a bottom surface 210b opposite to the top surface 210a, a first side surface 21b connecting the top surface 21a and the bottom surface 21b, and a connecting top surface 21a. The bottom surface 210b and the second side surface 210d of the first side surface 210c. In the present embodiment, the pair of light sources 220 are respectively formed from a pair of cold cathode ray tubes. In another embodiment, the pair of light sources 22 〇 can also be formed from a pair of light emitting diode array substrates, wherein the light emitting diode array substrate can be configured from a circuit substrate and a plurality of arrays. Light-emitting diodes on the circuit substrate. The mother reflector 230 has a cover portion 232, and the pair of light sources 220 are disposed in the pair of cover portions 232, respectively. In this embodiment, the backlight module 2 can further include two pairs of fixing sleeves 222, and the two pairs of ends of the pair of light sources 220 are fixed to the pair of covering portions 232 by the two pairs of fixing sleeves 222. The pair of light sources 220 are respectively accommodated in the two cover portions 232. After the pair of light sources 220 are assembled to the two cover portions 232, respectively, the two cover portions 232 are respectively clamped to both sides of the light guide plate 21A. Thus, the pair of light sources 220 are adjacent to the two opposite first sides 210c of the light guide plate 210. In order to utilize the light efficiently, the backlight module 200 further includes a reflective sheet 212 disposed on the bottom surface 210b of the light guide plate 210. At this time, the two cover portions 232 will simultaneously sandwich the light guide plate 21 () and the reflection sheet 212. Similarly, in order to effectively utilize the light, each of the reflectors 230 may further have a reflective layer 233 disposed on the inner surface of the cover portion 232. At this time, the reflectors 23 can contact the light guide plate 210 and the fixing sleeve 222 via the reflective layers 233, respectively. M350035 The end of these light sources 220 is where their electrodes are located, which causes the end of the light source 220 in these operations to generate high heat. Therefore, in order to dissipate the high heat of the ends of the light sources 220 to lower the temperature, each of the reflectors 230 further has a first heat conducting portion 234 extending from one side of the corresponding cover portion 232 to the bottom surface 210b of the light guide plate 210. Increase the thermal conductivity path. In the present embodiment, each of the reflectors 230 may further have two second heat conducting portions 236 extending from the corresponding first heat conducting portions 234 to the second side faces 210d of the light guide plate 210. Therefore, this helps to increase the thermal conduction path of the ends of the light sources 220. It is worth noting that the present embodiment does not require the metal lower frame of the prior art, but the first heat conducting portion of the reflective cover 230 extending from the cover portion 232. 234 is substituted, so this embodiment can reduce the cost of parts compared to the prior art. In addition, when the first heat conducting portion 234 and the cover portion 232 are integrally formed, the integral forming of the first heat conducting portion 234 and the covering portion 232 is superior to the prior art metal lower frame and the covering portion in heat conduction effect. Close contact. Further, in the present embodiment, in the case where a sufficient heat conduction effect has been provided, these first heat conducting portions 234 need not occupy all of the bottom surface 21b of the light guide plate 210, thereby reducing the material cost. The upper frame 240 of the backlight module 200 is fastened to the reflectors 230 to fix the relative positions of the other components. Specifically, a plurality of the fastening structures 240a disposed on the upper frame 240 are respectively fastened to the plurality of fastening structures 232a disposed on the cover portions m2, and a plurality of the other sides of the upper frame 240 are disposed on the upper side. The fastening structure 240b of the frame 240 can be respectively fastened to the plurality of fastening structures 236a disposed on the second heat conducting portions 236. 11 M350035 In this embodiment, the fastening structure 232a of the snap-action structure fringe reflector 230 of the upper frame 24〇 can exist in pairs, and can be a hook and a card slot. In addition, the fastening structure 24〇b of the upper frame 240 and the fastening structure 236a of the reflective cover 23〇 may also exist in pairs, and may be a hook and a card slot. In addition, the upper frame 240 can be a plastic upper frame, and the reflective cover 23 can be attached to the upper frame 240' by screws to increase the structural strength. The backlight module 200 further includes a plurality of optical films 25, such as diffusion films and brightness enhancement sheets, which are sequentially stacked on the top surface 21A of the light guide plate 21A. In the present example, the optical film 250 is more limited between the upper frame 240 and the light guide plate 210. Specifically, the edges of these optical films 25 are constrained by the upper frame 240 with respect to the light guide plate 210. In order to prevent light leakage, the backlight module 2 can further include a light leakage preventing sheet 260 disposed under the reflective sheet 212, that is, a region exposed by the first heat conducting portion 234 in the reflective sheet a. In this embodiment, a portion of the leakage preventing sheet 260 may be disposed between the first heat conducting portion 234 and the reflective sheet 212, and the leakage preventing sheet 260 may be an aluminum foil sheet. When the material of the leakage preventing sheet 26 is made of metal, the anti-leakage sheet 260 also has a function of blocking electromagnetic interference (ΕΜΙ). 3 is a partial cross-sectional view of a backlight module in accordance with another embodiment of the present invention. The light leakage preventing sheet 260 of the backlight module 200 of the embodiment of FIG. 2B is located between the first heat conducting portion 234 and the reflective sheet 212, and the backlight module 200A of the embodiment of FIG. 3 is for preventing light leakage. The sheet 260A is attached to the first heat transfer portions 234. Similarly, when the material of the leakage preventing sheet 260A is made of metal, the anti-leakage sheet 260 also has a function of blocking electromagnetic interference (EMI). 12 M350035 In summary, in the above embodiment of the present invention, the heat transfer portion extending from the cover portion of the reflector can replace the prior art metal frame to improve the heat conduction effect and reduce the cost of parts. In addition, the integral formation of the first heat conducting portion and the covering portion is superior to the prior art non-close contact of the metal lower frame and the covering portion in heat conduction effect. In addition, in the case where sufficient heat conduction effect has been provided, these first heat transfer portions do not have to occupy the entire bottom surface of the light guide plate, thereby reducing the material cost. Although the present invention has been disclosed in the above embodiments in various embodiments, it is not intended to limit the present invention, and any person having ordinary knowledge in the art can make some changes and adjustments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation # is deemed to be; the attached patent application is defined by the patent. The actual scope of the creation or the scope of the patent application does not require the achievement of the purpose of the creation, or the purpose or merits or characteristics. The abstract and title are only used to assist the patent file search. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is an exploded view of a conventional backlight module. =1 is a partial cross-sectional view of the backlight module of FIG. 1 after combination. Figure. ΑThis is the creation-implementation_-explosion of the backlight module. Figure 2 is a partial cross-sectional view of the backlight module after assembly. δ map. Another part of the creation of a backlight module is a partial section 13 M350035 [Main component symbol description] 100: backlight module 110. Light guide plate 112: reflection sheet 120: light source 122: fixed sleeve 130: reflector 132: cover Part® 133: reflective layer 140a: metal lower frame 140b: plastic upper frame 150: optical film 200: backlight module 210: light guide plate 210a: top surface 210b: bottom surface • 210c: first side 210d: second side 212: Reflecting sheet 220: light source '222: fixing sleeve 230: reflecting cover 232: cover portion 232a: fastening structure 14 M350035 233: reflective layer 234: first heat conducting portion 236: second heat conducting portion 236a: fastening structure 240: Upper frame 240a: fastening structure 240b · fastening structure 242: screw 250: optical film 260: leakage preventing sheet 260A: leakage preventing sheet