M342720 、八、新型說明： 【新型所屬之技術領域】 本創作是關於-種舰器，且特別是關於—種由多個區塊所 的飼服器。 【先前技術】 年來，由於資訊科技的進步以及網路的普及，伺服器的應用 愈來愈多。然而，伺服器的市場並不同於一般的個人電腦市^。^個 #人電腦的市場中，其規格較為大眾化，因此個人電腦的製造商較容易 取得經濟規模的效益。但是，在伺服器的市場，不同的客戶所需要的 規格可能彼此不同，因此在製造時較難以發揮規模經濟的效益。:外， 在組裝舰料，需要藉由錄的線路（軟性__如為銅線外包 覆有絕緣層的軟性電線）連接不同的基板。如此一來，也常常花費呼 多組裝的時間。j 因此，在組裝伺服器時，如何發揮規模經濟的效益，且避免因線 路的繁雜所造成的困擾，是值得本領域具有通常知識者去思量地。 • 【新型内容】 本創作主要目的係提供一種伺服器，該伺服器可發揮規模經濟的 •效益且可避免因線路的繁雜所造成的困擾。 為了達成上述目的與其他目的，本創作提供一種伺服器，其包括 一機殼、一橫向隔板、至少一第一縱向隔板、多個第一基板承載機構 與多個基板。橫向隔板是設置於機殼内，且橫向隔板將機殼内的空間 分割成一第一區塊與一第二區塊。橫向隔板的兩侧具有多個連接埠， 且橫向隔板内設有連接線路，該連接線路電性連接該些連接埠。第一 縱向隔板設置於第一區塊内，此第一縱向隔板將第一區塊分割成一第 5 M342720 一次區塊與一第二次區塊，其中第一次區塊的兩旁設有多個滑軌。第 一基板承載機構層疊在第一次區塊中，且這些基板承載機構適於與滑 轨相滑接。此外，基板分別設置在第一基板承载機構上，這些基板上 設有多個硬性連接器，這些硬性連接器適於與橫向隔板上的連接埠相 結合。 於上述之伺服器中，第二區塊設置有至少一第二縱向隔板，此第 二縱向隔板將第二區塊分割成一第三次區塊與一第四次區塊。而且， 第三次區塊與第四次區塊的兩旁皆設置有至少一滑軌，這些滑軌上滑 鲁設有至少一第二基板承載機構。 ★於上述之伺服器中，更包括-風扇模組，該風扇模組面向於該些 第-基板承載機構。而且，這些第一基板承載機構上的基板皆設置有 -風罩，風罩雜置對應於風麵組之其巾—風扇的風口處。 於上述之祠服器中，第-風罩及該第二風罩内或入口處的晶片是 基板上發熱量最高的晶片。 於上述之舰11巾，基板承賴構上設置有乡侧絲，這些 絲將基板承載機構鎖合在機殼與縱向隔板上，這些螺絲的螺頭適於 讓使用者直接用手指將螺絲旋開。 ' 多個凸點，這些凸點與第-基板 連接 於上述之飼服器中，基板間並未使用軟性的線路進行電性 由於在組裝及祕摘作之値糾，顧者在 的狀況下，只要將基板承載機構往橫向隔板的方向推，使基 6 M342720 插人至橫向隔板的連接蟑後，基板間便能藉由橫向隔板而彼 此電性連接。如此-來’便可大幅減少錬器的組裝及維修時間。而 且’不同的基板承賴構可在不同的生產線上進行生產後，再依據需 要組合在値n上，因此可娜賴轉的效益。此外，由於基板是 使用^性連接—未使錄性的線路，除了可減纽裝及維修的時間 外，還能增加美觀。 為使熟悉該項技藝人士瞭解本創作之目的、特徵及功效，兹藉由 下述具體實施例，並配合繼之圖式，對摘作詳加說明如后。 【實施方式】 請同時參關1A與圖1B，圖1A_示為本創作之第一實施例 的舰器之立體圖，圖1B所繪示為圖1A之螺絲的放大圖，此飼服器 1例如為晴通湖服器，伺服器丨的機殼1G後端設置有—風扇模組 U ’此風扇模組U是利用二螺絲1U而鎖合在第一基板承載機構18, (如圖2所示，將於後述）後端。此螺絲m的螺頭mi之侧面且有 許多的溝槽mia，而這些溝槽lllla可增加螺頭mi與使用者^手 指間的摩擦力，故使用者可直接用手指將螺絲m制，而不需使用 鲁螺絲起子。 請同時參照圖1A與圖2A,圖2A所繪示為第一實施例的伺服器 之内α卩視圖。伺服器！的内部還設置有一橫向隔板13，此橫向隔板U 將機殼10的内部空間分割成一第一區塊15與一第二區塊14。在第一 區塊15中設置有一第一縱向隔板16，此第一縱向隔板16將第一區塊 15 =割成第一次區塊15ι與第二次區塊ι52。而且，在橫向隔板u 上還設有許多不同的連接埠，如：第一連接埠131與第二連接埠132， ，橫向隔板13的内部則還設有連接線路（未繪示），不同的連接埠可 藉由這些連接線路而彼此電性連接。 7 M342720 在第-次區塊151中，其兩旁設置有多個滑軌i7，這些滑軌 (sliding edge)181 ^ 181 17 , ^ -基板承賴構18,使第-基板承載機構18能在職i7上進行移動弟 圖2B所繪示為第-連接埠的放大圖，第一連接㈣i具有多個 插孔。請同時參照圖2A與圖2B，第一基板M342720, VIII, new description: [New technical field] This creation is about the kind of ship, and especially about the feeding device of multiple blocks. [Prior Art] Over the years, due to the advancement of information technology and the popularity of the Internet, the application of servers has become more and more. However, the market for servers is different from the general PC market. In the market of #人电脑, its specifications are more popular, so manufacturers of personal computers are more likely to achieve economies of scale. However, in the server market, different customers may require different specifications, so it is more difficult to achieve economies of scale in manufacturing. : In addition, in assembling the ship material, it is necessary to connect different substrates by recording the circuit (soft __ such as a flexible wire covered with a copper wire and covered with an insulating layer). As a result, it often takes time to assemble. j Therefore, when assembling the server, how to make full use of the economies of scale and avoid the trouble caused by the complexity of the line is worthy of consideration by those who have the usual knowledge in the field. • [New Content] The main purpose of this creation is to provide a server that can achieve economies of scale and avoid the problems caused by the complexity of the line. In order to achieve the above and other objects, the present invention provides a server comprising a casing, a transverse partition, at least one first longitudinal partition, a plurality of first substrate carrying mechanisms and a plurality of substrates. The transverse partition is disposed in the casing, and the lateral partition divides the space inside the casing into a first block and a second block. The two sides of the transverse partition have a plurality of connecting ports, and the connecting blocks are provided with connecting lines, and the connecting lines are electrically connected to the connecting ports. The first longitudinal partition is disposed in the first block, and the first vertical partition divides the first block into a 5th M342720 primary block and a second secondary block, wherein the first block is provided on both sides Multiple slide rails. The first substrate carrying mechanism is laminated in the first sub-block, and the substrate carrying mechanisms are adapted to be slidably coupled to the slide rail. Further, the substrates are respectively disposed on the first substrate carrying mechanism, and the substrates are provided with a plurality of rigid connectors adapted to be combined with the ports on the lateral spacers. In the above server, the second block is provided with at least one second longitudinal partition, and the second vertical partition divides the second block into a third sub-block and a fourth sub-block. Moreover, at least one slide rail is disposed on both sides of the third block and the fourth block, and the slide rails are provided with at least one second substrate supporting mechanism. In the above server, the fan module further includes a fan module, and the fan module faces the first substrate carrier mechanism. Moreover, the substrates on the first substrate supporting mechanisms are all provided with a windshield, and the windshield is disposed at a tuyere corresponding to the towel-fan of the wind surface group. In the above-described server, the wafer in the first hood and the second hood or at the entrance is the wafer having the highest heat generation on the substrate. In the above-mentioned ship 11 towel, the substrate bearing structure is provided with a rural side wire, and the wire locks the substrate supporting mechanism on the casing and the longitudinal partition plate, and the screw head of the screw is suitable for the user to directly screw the screw with the finger Unscrew. 'A plurality of bumps, the bumps and the first substrate are connected to the above-mentioned feeding device, and the flexible circuit is not used for electrical connection between the substrates, because the assembly and the secrets are made, and the person is in the situation. As long as the substrate supporting mechanism is pushed in the direction of the lateral partition, the base 6 M342720 is inserted into the connection of the lateral partition, and the substrates can be electrically connected to each other by the lateral partition. This - to 'can greatly reduce the assembly and repair time of the device. Moreover, the different substrate-receiving structures can be produced on different production lines, and then combined on the 値n according to the needs, so the benefits can be changed. In addition, since the substrate is connected by using a non-recording line, in addition to reducing the time required for loading and repairing, it is also possible to increase the appearance. In order to familiarize the person skilled in the art with the purpose, features and effects of the present invention, the following detailed description is taken in conjunction with the following drawings. [Embodiment] Please refer to both 1A and FIG. 1B, FIG. 1A_ is a perspective view of the first embodiment of the present invention, and FIG. 1B is an enlarged view of the screw of FIG. 1A, the feeding device 1 For example, for the Qingtong Lake service device, the rear end of the 1G of the server casing is provided with a fan module U'. The fan module U is locked to the first substrate supporting mechanism 18 by using two screws 1U (as shown in FIG. 2). Show, will be described later). The screw m of the screw m has a plurality of grooves mia on the side of the screw head mi, and the groove 111a increases the friction between the screw head mi and the user's finger, so the user can directly use the finger to make the screw m. No need to use a Lu screwdriver. Referring to FIG. 1A and FIG. 2A simultaneously, FIG. 2A is a view of the inside of the server of the first embodiment. server! The interior of the casing 10 is further divided into a first block 15 and a second block 14. A first longitudinal partition 16 is provided in the first block 15, and the first longitudinal partition 16 cuts the first block 15 = into the first sub-block 15ι and the second sub-block ι52. Moreover, a plurality of different connecting ports are disposed on the lateral partition u, such as a first connecting port 131 and a second connecting port 132, and the inside of the lateral partition 13 is further provided with a connecting line (not shown). Different connections can be electrically connected to each other by these connection lines. 7 M342720 In the first sub-block 151, a plurality of slide rails i7 are disposed on both sides thereof, and these sliding edges 181 ^ 181 17 , ^ - the substrate receiving structure 18 enables the first substrate bearing mechanism 18 to be employed The mobile terminal is shown in FIG. 2B as an enlarged view of the first connection port, and the first connection (four) i has a plurality of jacks. Please refer to FIG. 2A and FIG. 2B simultaneously, the first substrate
=機構18，上分別設置有基板脱與基板财。在基板，i8J_^ 性連魅183，這些硬性連接器183具有多個插針，這此插 緣接璋131上的插孔相插合。另外，也可在基板182,的凸 緣上貼覆金屬薄片（未繪示），以形成硬性連接器1821，，此硬性連接 =8=1與橫向隔板13上的第二連接蜂132相連接。當第一基板承 被插入後，使用者便可利用螺絲185將第一基板承載機構 *疋在機殼10及第-縱向隔板16上。由於螺絲185的結構與螺絲 111相同，故在此便不再贅述。 由^硬性連接器的設置，因此使用者只要將第一基板承載麵18, • 彺锅向隔板13的方向推，使基板182與基板182,上的硬性連接器 ^3, ^21’插入至橫向隔板13的連接埠後，基板丨82與基板182,便能 ‘猎由^隔板13而彼此電性連接。因此，使用者在組裝祠服器1時， 便不，藉由軟性的線路來連接不同的基板。如此一來，便可大幅減少 伺服器1的組裝時間。而且，不同的第一基板承載機構18可在不同的 線上進行生產後，再依據需要組合在伺服器1上，因此可發揮規 ^經濟的效益。此外，由於基板脱、i8r是使用硬性連接器而未使用 幸人陳的線路’故除了可減少組裝的時間外，還能增加伺服器1内部之 美觀。 接著，將對滑執17的結構做一敘述。請同時參照圖2Α與圖3， 8 M342720 圖3所繪示為將基板承載機構移去後的伺服器之内邱視圖。由圖3可 知，滑上具有多個凸點m，這些凸點m轉間距分佈在滑執 17上。當第一基板承載機構18組裝於伺服器丨上後，其滑邊1幻是 與凸點171相滑接。之所以要設置凸•點171的原因在於：凸點171的 設置可減少第-基板承載機構18與滑軌17間的摩擦係數，從而減少 第一基板承載機構18與滑執Π間的摩擦力。另外，在機殼10的底部 則^置有凸點1G3 ’當第一基板承載機構18’組裝在伺服器丨上後，除 _ 了第一基板承載機構18’的滑邊181，與凸點171相滑接外，第一基板 籲承載機構I8’的底部也會與凸點1〇3相滑接，而凸點1〇3的功用也是在 於減少第一基板承載機構18，與機殼1〇間的摩擦力。 當然，並非每一次區塊皆需設置滑軌17。在本實施例中，第二次 區塊152並未設置滑軌，伺服器丨用的電源供應器12是放在此第二次 區塊152中。此外，在本實施例中，第一次區塊151内疊合有二個基 板承載機構（亦即··第一基板承載麵18與第一基板承載機構！8，）， 但本領域具有通常知識者也可視情況將機殼1〇的高度加大並設置更 多的滑執17，如此便可疊合更多的基板承載機構。 φ 凊參照圖4，圖4所繪示為伺服器之部分爆炸圖。在本實施例中 、此伺服裔1的風扇模組U内具有三個風扇，這些風扇例如為抽氣式風 扇^而基板182上則設置有一第一風罩184，在基板182，上則設置有 一第二風罩184’。在本實施例中，第一風罩184及第二風罩184，的位 置與風扇模組11之中間的風扇相對應。亦即，第一風罩184及第二風 罩184’的位置是在風扇的風口處。由於風罩能增強熱對流的效果，故 设置在第-風罩I84或第二風罩⑽，内或入口處的晶片往往是基板 182或基板182上發熱量最咼的晶片。例如，設置於散熱片”,下的晶 片為基板182上發熱量最高的晶片，而此晶片是設置在第二風罩184， 的入風σ處。 M342720 再來，請參照圖3與圖5，在第二區塊14處也可設置一第二縱向 隔板16’以將第二區塊14分割成第三次區塊141與第四次區塊142。 在第三次區塊141與第四次區塊142中，皆有設置類似於第一次區塊 151中之滑軌17的機構，故使用者可將第二基板承載機構18，，與第二 基板承載機構18’”以滑動的方式推入至伺服器1内。而且，基板182,， 與基板182上分別设置有硬性連接器183”與硬性連接器1幻，，，，故使 用者基板182”與基板182’”推入後，硬性連接器ία，，與硬性連接器 183’”便會與橫向隔板13上的連接埠相連接。在本實施例中，第三次 ♦區塊141與第四次區塊142接只設置一滑執，但本領域具有通常知識 者也可依據情況將第三次區塊141或第四次區塊142的高度增高，並 設置多個滑執，這樣在第三次區塊141或第四次區塊142便設多 個第一基板承載機構。 凊同時參照圖5細6，圖6所繪示為殼體與機殼間的關係圖。 由圖6 y知，機殼10包括一第一殼體101與一第二殼體102，第二殼 體1〇2是組裝在第-殼體101上。由於第二殼體1〇2可組裝在第一殘 二此製造者可在不同的生產、線上將第二基板承載機構組ΐ I至弟一Λ又體102後，再將第二殼體102組裝在第一殼體1〇1上。 ’並非已以具體實施例揭露如上，然其所揭露的具體實施例 rS，創作，任何熟悉此技藝者，在不脫離本創作之精神和 作1範4 H各種之更動細飾’其所狀更賴顺皆屬於本創 乍之乾可本創作之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 厂= Mechanism 18, which is provided with a substrate off substrate and a substrate. On the substrate, the hard connectors 183 have a plurality of pins, and the jacks on the flanges 131 are inserted. Alternatively, a metal foil (not shown) may be attached to the flange of the substrate 182 to form a rigid connector 1821. The rigid connection = 8 = 1 and the second connection bee 132 on the lateral spacer 13 connection. After the first substrate is inserted, the user can use the screw 185 to clamp the first substrate carrying mechanism to the casing 10 and the first longitudinal partition 16. Since the structure of the screw 185 is the same as that of the screw 111, it will not be described here. By the arrangement of the rigid connector, the user only needs to push the first substrate carrying surface 18, the crucible to the partition 13, and insert the rigid connector ^3, ^21' on the substrate 182 and the substrate 182. After the connection to the lateral spacers 13, the substrate 丨 82 and the substrate 182 can be electrically connected to each other by the spacers 13. Therefore, when the user assembles the server 1, the user does not connect the different substrates by a flexible circuit. As a result, the assembly time of the server 1 can be greatly reduced. Moreover, the different first substrate supporting mechanisms 18 can be combined on the servo 1 after being produced on different lines, so that economical benefits can be achieved. In addition, since the substrate is removed and the i8r is a hard connector and the circuit is not used, the appearance of the inside of the server 1 can be increased in addition to the time required for assembly. Next, the structure of the slipper 17 will be described. Please refer to FIG. 2A and FIG. 3 simultaneously. 8 M342720 FIG. 3 is a view showing the inside of the server after the substrate supporting mechanism is removed. As can be seen from Fig. 3, the slide has a plurality of bumps m which are distributed on the slipper 17 at a pitch. When the first substrate supporting mechanism 18 is assembled on the servo cartridge, its sliding edge 1 is slidably coupled to the bump 171. The reason why the convex dot 171 is to be provided is that the arrangement of the bumps 171 can reduce the friction coefficient between the first substrate supporting mechanism 18 and the sliding rail 17, thereby reducing the friction between the first substrate supporting mechanism 18 and the sliding stub. . In addition, at the bottom of the casing 10, a bump 1G3 is placed. When the first substrate supporting mechanism 18' is assembled on the server, the sliding edge 181 of the first substrate supporting mechanism 18' and the bump are removed. In addition to the 171 phase sliding connection, the bottom of the first substrate snap bearing mechanism I8' is also slidably coupled to the bump 1〇3, and the function of the bump 1〇3 is also to reduce the first substrate supporting mechanism 18, and the casing 1 Friction between the turns. Of course, it is not necessary to set the slide rail 17 every time. In the present embodiment, the second block 152 is not provided with a slide rail, and the power supply 12 for the server is placed in the second block 152. In addition, in the embodiment, the first sub-block 151 is superposed with two substrate supporting mechanisms (that is, the first substrate carrying surface 18 and the first substrate supporting mechanism! 8), but the field has the usual The knowledgeer can also increase the height of the casing 1 并 and set more slips 17 as needed, so that more substrate supporting mechanisms can be superposed. Φ 凊 Refer to FIG. 4, which is a partial exploded view of the server. In the embodiment, the fan module U of the Servant 1 has three fans, and the fans are, for example, an air extracting fan, and the first hood 184 is disposed on the substrate 182, and is disposed on the substrate 182. There is a second windshield 184'. In the present embodiment, the positions of the first hood 184 and the second hood 184 correspond to the fan in the middle of the fan module 11. That is, the positions of the first hood 184 and the second hood 184' are at the tuyere of the fan. Since the hood can enhance the effect of heat convection, the wafer disposed in the inner or inlet of the first hood I84 or the second hood (10) tends to be the heat-generating wafer on the substrate 182 or the substrate 182. For example, the wafer disposed under the heat sink is the wafer with the highest heat generation on the substrate 182, and the wafer is disposed at the inlet σ of the second windshield 184. M342720 Referring again, please refer to FIG. 3 and FIG. A second longitudinal partition 16' may also be disposed at the second block 14 to divide the second block 14 into a third sub-block 141 and a fourth sub-block 142. In the third block 141 and In the fourth block 142, there is a mechanism similar to the slide rail 17 in the first block 151, so the user can use the second substrate carrying mechanism 18, and the second substrate carrying mechanism 18'" The sliding mode is pushed into the server 1. Moreover, the rigid connector 183" and the rigid connector 1 are respectively disposed on the substrate 182, and the substrate 182, so that after the user substrate 182" and the substrate 182'" are pushed in, the rigid connector ία, The rigid connector 183'" is connected to the port on the transverse bulkhead 13. In this embodiment, the third block 141 and the fourth block 142 are only provided with a slippery, but those having ordinary knowledge in the art may also use the third block 141 or the fourth sub-region according to the situation. The height of the block 142 is increased, and a plurality of sliders are disposed, so that a plurality of first substrate supporting mechanisms are disposed in the third block 141 or the fourth sub-block 142. Referring to FIG. 5 at the same time, FIG. 6 is a diagram showing the relationship between the casing and the casing. As shown in Fig. 6, the casing 10 includes a first casing 101 and a second casing 102, and the second casing 1 is assembled on the first casing 101. Since the second housing 1〇2 can be assembled in the first residue, the manufacturer can assemble the second substrate carrier mechanism to the second substrate 102 on different production lines. It is assembled on the first housing 1〇1. 'The above is not disclosed in the specific embodiment, but the specific embodiment rS, creation, and anyone familiar with this art, without departing from the spirit of this creation and making a variety of changes, The scope of protection of this creation is subject to the definition of the patent application scope attached to it. [Simple description] Factory
實施例的觸之立體㈣1B 圖2Α所繪不為第一實施例的伺服器之内部視圖，圖2Β所繪示 M342720 第一連接埠的放大圖。 圖3所繪示為將基板承載機構移去後的伺服器之内部視圖。 圖4所繪示為伺服器之部分爆炸圖。 圖5所繪示為第二基板承載機構與伺服器間的關係圖。 圖6所繪示為殼體與機殼間的關係圖。 _【主要元件符號說明】 ^ 1 :祠服器 10 :機殼 101 :第一殼體 102:第二殼體 103 :凸點 11 :風扇模組 • 111 :螺絲 1111 :螺頭 1111a:溝槽 12 :電源供應器 13 :橫向隔板 131 :第一連接埠 132 :第二連接埠 11 M342720 、 14:第二區塊 141 ··第三次區塊 142 ··第四次區塊 15 ··第一區塊 151 ··第一次區塊 152 :第二次區塊 16 :第一縱向隔板 16’：第二縱向隔板 17 :滑軌 171 :凸點 18、18’ ：第一基板承載機構 18”、18”，：第二基板承載機構 181、18Γ ·•滑邊 修 182、182,、182”、182”，：基板 1821’、183、183”、183’’’ ：硬性連接器 ' 184:第一風罩 184’ ··第二風罩 185 :螺絲 19’ ：散熱片 12The touch stereo (4) 1B of the embodiment is not shown in the internal view of the server of the first embodiment, and the enlarged view of the first port of the M342720 is shown in FIG. FIG. 3 is an internal view of the server after the substrate carrying mechanism is removed. Figure 4 is a partial exploded view of the server. FIG. 5 is a diagram showing the relationship between the second substrate supporting mechanism and the server. Figure 6 is a diagram showing the relationship between the housing and the casing. _[Main component symbol description] ^ 1 : Server 10 : Case 101 : First case 102 : Second case 103 : Bump 11 : Fan module • 111 : Screw 1111 : Screw head 1111a : Groove 12: power supply 13: lateral partition 131: first connection 埠 132: second connection 埠 11 M342720, 14: second block 141 · · third block 142 · · fourth block 15 · · First block 151 · First block 152: Second block 16: First longitudinal partition 16': Second longitudinal partition 17: Slide 171: Bumps 18, 18': First substrate Carrying mechanism 18", 18",: second substrate carrying mechanism 181, 18" · slide trim 182, 182, 182", 182", substrate 1821', 183, 183", 183"': rigid connection '184: first windshield 184' · second windshield 185: screw 19': heat sink 12