M342608 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種晶圓研磨定位環（retaining ring)，特別 是關於一種組合式之晶圓研磨定位環。 【先前技術】 1 目前的半導體製程中，為避免黃光製程於對焦時發生失 焦的現象，平坦化製程已成為晶圓製造時不可或缺的步 • 驟。於深次微米甚至奈米的世代中，化學機械研磨（Chemical Mechanical Polishing，CMP)技術已逐漸取代傳統的回蝕 (etching back)或旋塗式玻璃（Spin_〇nGlass，s〇G)披覆，而 成為半導體平坦化製程的主流。 現今的化學機械研磨機台大多是利用一研磨頭 (polishing head)挾持一晶圓以進行研磨，各研磨頭具有一 %繞於該晶圓外圍之定位環，用以限制該晶圓，以避免該 晶圓於研磨時滑出該研磨頭而造成毀損。 • S位環多採用聚合物材f，其係將一聚合物製成的圓棒 ， 依其斷面方向切割出一圓盤，再將該圓盤進行加工。該圓 • 盤中間必須配合晶圓的直徑挖空以容納該晶圓，而其上表 面則鑽製螺孔，以便配合組裝於研磨頭。之後，將該定位 裱於研磨時將接觸研磨墊之下表面進行拋光，以避免研磨 時損及該研磨墊。 依據上述的作法，萬一該定位環產生局部刮傷時，必須 整個更換，相當不符合經濟效益。 【新型内容】 M342608 本創作係提供-種晶圓研磨定位環，利用其組合式的設 计，可即省材料成本，且方便進行局部的更換。 本創作之晶圓研磨定位環包含一研磨環及一基環。該基 環設有複數個等角度環狀排狀第_螺孔，而該研磨環設 有複數個等角度環狀排列之第二螺孔。該第—螺孔及第二 螺孔係相應設置，以供螺絲將該基環及研磨環疊設結合。 外根據本創作之-實施例’ $中該基環於該第—螺孔周圍 設置第一凹槽，該研磨環於讀笛— 5 β衣％ 4弟一螺孔周圍設置第一凸 塊’該第-凸塊係迫緊卡入該第一凹槽，以避免產生缝細。 因本創作之研磨環磨損時，只需更換受損之研磨環即 可，而不需整體進行更換’故可有效降低維護成本。 【實施方式】 本創作將依以下圖式加以說明，以清楚說明本創作之技 術特徵。 圖1顯示-晶圓研磨定位環10之立體分解示意圖，其包 含-基環20及-研磨環30。圖2係圖i之晶圓研磨定位琴 1〇翻轉後之立體分解示意圖。該基環2G與該研磨環3〇係 璺設固定。 ' 本實施例之晶圓研磨定位環10係使用於12付之晶圓研 磨。該基環20設有18個等角度環狀排列之第一螺孔U， 該研磨環3G設有18個等角度環狀排列且相應於該第―螺 孔2 2之第二螺孔3 2，以便利用螺絲鎖人第—螺孔2 2和第 二螺孔32，而疊設結合基環20及研磨環3〇。 此外，該基環2〇另設有18個等角度環狀排列之第三螺 M342608 孔:4,該研磨s3〇另設# 18個等角度環狀排列且相應於 :第：螺孔24之第四螺孔34’以便利用螺絲將該晶圓研磨 定位^ 10固定於一研磨頭（圖未示出）。 絲％ 2G可由不錄鋼或無合金製成，以增加整體的剛性 及韌性。該研磨環3〇可選自具耐磨及耐腐蝕特性之聚苯檔 硫（P〇lyPhenylene Sulfide，pps)、聚醚醚甲酮 (Polyether-etherketon，pEEK)或半晶狀熱塑聚酯 • (Semi-CryStallne Thermoplastic polyester)等聚合物材質。該 研磨環30用於接觸研磨墊（圖未示）之接觸面可依需求進= 抛光’以便於研磨時平順地接觸研磨墊。 參照圖3，其係圖2中hi剖面線之剖視圖，顯示設置於 該基環20中之第一螺孔22。參照圖4,其係圖2中3-3剖 面線之d視圖，顯示設置於該研磨環3 〇中之第二螺孔Μ。 α亥第一螺孔22與該第二螺孔32係相應設置，用以將該基 裒0及研磨環3 〇兩者璺設結合。該研磨環3 〇中於該第二 • 螺孔32的周圍形成第一凸塊％，且於該基環2〇相應位置 • 形成第一凹槽26,用以將該第一凸塊36迫緊卡入該第一凹 槽26，以避免兩者結合時產生縫細。 ί “、、圖5其係圖2中2-2剖面線之剖視圖，顯示設置於 孩基％ 20中之第三螺孔24。參照圖6，其係圖2中4_4剖 面線之剖視圖，顯示設置於該研磨環3〇中之第四螺孔Μ。 該第三螺孔24與該第四螺孔34係相應設置，用以將該基 環20及研磨環3 〇固定於研磨頭（圖未示）。該研磨環3〇中 於該第四螺孔34的周圍形成第二凸塊S8，且於該基環2〇 M342608 相應位置形成第-ftrj描9 δ Α弟一凹槽28,而得以將該第二凸塊38迫緊卡 弟-凹槽28 ’以避免兩者結合時產生縫，田。 顯示本創作另-實施例，其中顯示利用螺絲52透過M342608 VIII. New Description: [New Technology Field] This creation is about a wafer grinding retaining ring, especially for a combined wafer grinding positioning ring. [Prior Art] 1 In the current semiconductor manufacturing process, in order to avoid the phenomenon that the yellow light process is out of focus during focusing, the flattening process has become an indispensable step in wafer fabrication. In the deep micron or even nano generation, chemical mechanical polishing (CMP) technology has gradually replaced the traditional etching back or spin-on glass (Spin_〇nGlass, s〇G) And become the mainstream of semiconductor flattening process. Most of today's chemical mechanical polishing machines use a polishing head to hold a wafer for grinding. Each polishing head has a % of a positioning ring around the periphery of the wafer to limit the wafer to avoid The wafer slides out of the polishing head during grinding to cause damage. • The S-ring is made of a polymer material f. A round rod made of a polymer is cut into a disc according to its cross-section, and the disc is processed. The circle must be hollowed out in the middle of the disk to accommodate the wafer, and the upper surface of the disk is drilled with a screw hole to fit the polishing head. Thereafter, the positioning is polished to contact the lower surface of the polishing pad to prevent damage to the polishing pad during polishing. According to the above method, if the positioning ring is partially scratched, it must be completely replaced, which is quite uneconomical. [New Content] M342608 This creation department provides a kind of wafer grinding positioning ring. With its combined design, it can save material cost and facilitate partial replacement. The wafer grinding positioning ring of the present invention comprises a grinding ring and a base ring. The base ring is provided with a plurality of equiangular annular row-shaped snail holes, and the grinding ring is provided with a plurality of second screw holes arranged in an equiangular annular shape. The first screw hole and the second screw hole are correspondingly arranged for the screw to superimpose the base ring and the grinding ring. According to the present invention, in the embodiment, the base ring is provided with a first groove around the first screw hole, and the grinding ring is provided with a first bump around the saw hole. The first bump is forced into the first groove to avoid seam thinning. When the grinding ring of the present invention is worn, it is only necessary to replace the damaged grinding ring without the need to replace it as a whole, so that the maintenance cost can be effectively reduced. [Embodiment] This creation will be described in the following figures to clearly illustrate the technical features of the creation. 1 shows a perspective exploded view of a wafer grinding locating ring 10 that includes a -base ring 20 and a grinding ring 30. FIG. 2 is a perspective exploded view of the wafer grinding positioning piano of FIG. The base ring 2G is fixed to the grinding ring 3 . The wafer grinding positioning ring 10 of this embodiment is used for 12 wafer polishing. The base ring 20 is provided with 18 first screw holes U arranged in an equiangular annular shape. The grinding ring 3G is provided with 18 equiangular annular arrangements and corresponding to the second screw holes 3 2 of the first screw holes 2 2 . In order to lock the first screw hole 2 2 and the second screw hole 32 with the screw, the bonding base ring 20 and the grinding ring 3 叠 are stacked. In addition, the base ring 2〇 is further provided with 18 third-spiral M342608 holes of equal angular arrangement: 4, the grinding s3〇 is additionally provided with 18 equal-angle annular arrangements and corresponding to: the: screw holes 24 The fourth screw hole 34' is for fixing the wafer grinding position 10 to a polishing head (not shown) by means of a screw. Wire % 2G can be made of unrecorded or unalloyed to increase overall rigidity and toughness. The grinding ring 3〇 can be selected from P〇lyPhenylene Sulfide (pps), Polyether-etherketon (pEEK) or semi-crystalline thermoplastic polyester with wear resistance and corrosion resistance. (Semi-CryStallne Thermoplastic polyester) and other polymer materials. The contact surface of the grinding ring 30 for contacting the polishing pad (not shown) can be optionally polished to facilitate smooth contact with the polishing pad during polishing. Referring to Fig. 3, which is a cross-sectional view taken along line hi of Fig. 2, the first screw hole 22 provided in the base ring 20 is shown. Referring to Fig. 4, which is a view taken along line 3-3 of Fig. 2, a second screw hole 设置 disposed in the grinding ring 3 显示 is shown. The first screw hole 22 is disposed corresponding to the second screw hole 32 for combining the base 裒0 and the grinding ring 3 。. Forming a first bump % around the second screw hole 32 in the grinding ring 3, and forming a first groove 26 at the corresponding position of the base ring 2 to force the first bump 36 The first groove 26 is tightly caught to avoid seam thinning when the two are combined. Figure 5 is a cross-sectional view taken along the line 2-2 of Figure 2, showing the third screw hole 24 provided in the child base 20. Referring to Figure 6, it is a cross-sectional view of the 4_4 line in Figure 2, showing a fourth screw hole 设置 disposed in the grinding ring 3〇. The third screw hole 24 is disposed corresponding to the fourth screw hole 34 for fixing the base ring 20 and the grinding ring 3 于 to the polishing head (Fig. A second bump S8 is formed around the fourth screw hole 34 in the grinding ring 3, and a first-ftr9 δ Α 一 凹槽 groove 28 is formed at a corresponding position of the base ring 2 〇 M342608. The second bump 38 can be pressed against the card-groove 28' to avoid seaming when the two are combined. The present embodiment is further shown, wherein the display is transmitted through the screw 52.
第一螺孔22(相當於第_ ^ M #凹槽26的位置)將基環20及研磨 知30進行結合。另，其淨 基衣20及研磨裱30間可另設置複數 個定位銷50,以便配衫位孔5以位結合，並增加定位的 準確度。 本創作之研磨環30可利用螺絲和基環2〇相結合，故當 研磨環30磨損或已達使用壽命時，僅需更換研磨環如即 可’而不需整體更換，故可有效降低維護及材料成本。 本創作之技術内容及技術特點已揭示如上，然而熟悉本 項技術之人士仍可能基於本創作之教示及揭示而作種種不 背離本創作精神之替換及修飾。因此，本創作之保護範圍 應不限於實施例所揭示者’而應包括各種不背離本創作之 替換及修飾，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 i 圖1及2係本創作之晶圓研磨定位環之立體圖； 圖3係圖2中沿1 -1剖面線之剖面圖，· 圖4係圖2中沿3-3剖面線之剖面圖； 圖5係圖2中沿2-2剖面線之剖面圖； 圖6係圖2中沿4-4剖面線之剖面圖；以及 圖7係本創作另一實施例之晶圓研磨定位環之立體圖 【主要元件符號說明】 〇 20基環 10 晶圓研磨定位環 M342608 22 第一螺孔 24 第三螺孔 26 第一凹槽 28 第二凹槽 30 研磨環 32 第二螺孔 34 第四螺孔 36 第一凸塊 38 第二凸塊 50 定位銷 52 螺絲 54 定位孔The first screw hole 22 (corresponding to the position of the _ ^ M # groove 26) combines the base ring 20 and the grinding 30. In addition, a plurality of positioning pins 50 may be additionally disposed between the net base 20 and the grinding bowl 30, so that the shirt holes 5 are combined in position and the positioning accuracy is increased. The grinding ring 30 of the present invention can be combined with the screw and the base ring 2,, so when the grinding ring 30 is worn or has reached the service life, only the grinding ring needs to be replaced, so that the whole replacement is not required, so the maintenance can be effectively reduced. And material costs. The technical content and technical features of the present invention have been disclosed as above, but those skilled in the art may still make various substitutions and modifications without departing from the spirit of the present invention based on the teachings and disclosures of the present invention. Therefore, the scope of protection of the present invention should not be limited to the scope of the present invention, and should be construed as a substitute for the present invention. [Simple diagram of the drawing] i Figures 1 and 2 are perspective views of the wafer grinding positioning ring of the present invention; Fig. 3 is a sectional view taken along line 1-1 of Fig. 2, and Fig. 4 is a 3-3 along line 3 of Fig. 2. Figure 5 is a cross-sectional view taken along line 2-2 of Figure 2; Figure 6 is a cross-sectional view taken along line 4-4 of Figure 2; and Figure 7 is a crystal of another embodiment of the present invention Perspective view of the circular grinding positioning ring [Main component symbol description] 〇20 base ring 10 wafer grinding positioning ring M342608 22 First screw hole 24 Third screw hole 26 First groove 28 Second groove 30 Grinding ring 32 Second screw Hole 34 fourth screw hole 36 first bump 38 second bump 50 positioning pin 52 screw 54 positioning hole