M340633 八、新型說明： 【新型所屬之技術領域】 本創作關於一種電連接器，尤指一種可電性連接晶片模組至電路板之電連 接器。 【先前技術】 目前，用於電性連接晶片模組至電路板之平面柵格陣列（LandGrid^吵， LGA)插座連接器，其導電端子與晶片模組採用按壓接觸之方式實現電性連接， 晶片模組組裝後，其一般僅靠絕緣本體之夾持力達到固定之目的，如第一圖揭 φ 不了一種習知平面柵格陣列（Land Grid Array，LGA)插座連接器，用於電性連接 晶^模組11至電路板13，其包括絕緣本體1〇及導電端子(未圖示），絕緣本體 1〇設有收容空間(未圖示)用於收容晶片模組n，晶片模組n組裝後，其上一 般會組裝散熱裝置12，達到散熱之目的，此類電連接器常因爲絕緣本體1〇之 •夾持力不夠，於拆除散鋪置12時，常常會帶出晶片模組u，導致晶片模植 11之損壞。 '' 針對以上技術問題，本申請人於2007 ^^ $ 9日向中國大陸提出了申請 號爲2⑻72_212似之專利申請。上述專利中請之電連接器具體結構如第二 圖所不·-種電連接器，可用於電性連接晶片模組2〇至電路板(未圖示），盆包 括絕緣本體21魏容於絕緣本體狀複數導電端子(糊示）。絕緣本體^、包 括基體22及基體周圍之側牆23，基體22及側牆23形成收容晶片模㈣之收 广空巧示广其中，該絕緣本體h之側牆Μ設有扣持晶片模組2〇之卡 tr 24於受水平力之作用下可以打開或閉合，以簡單方便之放入或 =晶片模組20。上述電連接器2藉於側牆23上設置之卡扣24，從而可以於 、、且衣散熱裝置(未圖示)之前對晶片模組2〇進行定位，其不足之處係者 ΓίΓ f〇?af ^ 24 ^ 片板組2〇^之散熱裝置造成干涉，導致晶片模組20散熱不良。 鑒於前述狀況’確有必要提供—賴型之電連接如解決習知技術 存在之缺陷。 y' 【新型内容】 本創作之目的係提供一種可方便簡單地將晶片模組扣持於電連接器内且 6 M340633 不會對安裝於晶 >;模組上方之散熱裝置造成干涉之電連接器。 本創作之目的係這樣實現：-種電連接器，可用於電性連接晶片触 路板，其包括絕緣本體及收容於絕緣本體内之複數導電端子;絕緣本 及基體周圍之側壁，基體及側壁形成收容晶片模組之收容空腔，該 側壁設有扣持晶片模組之卡扣，該卡扣於橫向力之作用下可以打開或閉人盆 所述卡扣包括設於絕緣本體侧壁内部之主體部、自主體部延伸出之 =、y 片模組之干涉部及施力部，所述施力部與干涉部處於同一高度。 口曰曰 與習知技術相比’本創作之功效係：藉於絕緣本體之側壁上設 模組之卡扣，可以於組裝散熱裝置之祕晶片模組穩定地固定於電哭:. 同時將卡扣之施力部與干涉部設置爲同一高度，從而使卡扣之整^於 晶片模組之高度，避免對安裝於晶片模組上方之散熱裝置造成干涉。a冋於 【實施方式】 下面結合圖式及實施方式對本創作進一步說明。 第三圖和第四圖所示’其爲本創作電連接器3 —種較佳實施例，可 用於電性連接晶片模組至印刷電路板(未圖示）。該電連接器 及收容於絕緣本體30 Θ之複數導電端子以岡+、㈣士^ 巴缘本體30 祕31遞t 未）_本體％包括平板狀之 基體31及圍s又於基體31四周之侧壁32,基體31與側壁32組成一收 ^用於收容⑸餘33，導電端子收容於基體31上設置之容置槽^曰未標 絕緣本體30於側壁32上_有卡扣34，於本實施例中，呈 3 ,中部分別設置有一個卡扣34，兩卡扣34相對於側壁32、目二 =弋閱第四圖、苐五圖和第六圖所示’卡扣％包括主體部34ι、自主體 二=3，之干_42及施力部祕。主體部341大致呈倒“L”狀，其 匕“直方向上之根部3411和水平方向上與側壁 ，之未端内側延伸出倒刺3413，藉該等倒刺3413，根部:二二= 收谷於侧壁32中部設置之凹样μ〗寰，伯士挪^ 連接邻3412心曰t 體部131與側壁32僅部分相連接。 i u ^ ^ fr奸轉342，_壁32㈣赌魏力部 ^置/。片模組％之侧邊且其高度不高於晶片模組33之最 π»地42 Α致呈楔形’其上部朝向晶片模組33設置有引導面 M340633 3421，引導面3421於晶片模組33放入絕緣本體3〇起到引導作用。施力部343 之尾端凸起，形成便於手指操作施力之頭部3431。 卡扣Μ採用具有-定彈性之材料加工而成，當對施力部343施加一水平 方向之按壓力時，施力部343會帶動主體部如之連接部則向外彈性外張， 從而使干涉部342向外移動。 組裝曰曰片模級33時，對施力部343施加-水平方向按壓力F，使卡扣34 彈1*生外使曰曰片模組33藉卡扣34上之引導面輕易之組裝至絕緣本體 jo之收谷工間内’然後釋放力量F，此時，干涉部342會與晶片模組％相卡 2，·使晶片模組33牢固定位於絕緣本體30之收容空間内，不會出鱗落之現 ,，當需要拆除晶片模組2時，同樣對施力部如施加一水平方向按壓力F， 干涉部342脫離與晶片模組33卡扣之狀態，從而輕易地 本創作重點結構在於：本創作電連接器3之絕緣本體3〇至少 個 .部342及施力部343，干涉部343用於卡扣晶片模組33且 m處同一水平高度，藉對施力部343施加一水平方向之按壓力f， 散数壯性外張，以方便之組裝或者取出晶片模組33，從而可以於組裝 =熱衣置(未圖示)之前對晶胤㈣進行穩定地定位 述者僅作ίΐΓ新型專利要件，爰依法提出專利中請。惟，以上所 • 例，本創作之範圍並不以前述實施例為限，舉凡孰 ▲本案技藝之人士援依本創作之精神所作二: .申請專利範圍内。 ρ飞文化，白應涵盍於以下 【圖式簡單說明】 第-圖係與本創作相關之電連接器之立體組合圖； 立體獅請人提出之中請號爲膽2_212似之專利中請電連接器之 ，三圖係本創作電連接器之立體組合圖； 第四圖係本創作電連接器之立體分解圖； 第五圖係本創作電連接器之側視圖； 第六圖係本創作電連接器卡扣之立體圖。 8 M340633 【主要元件符號説明】 電連接器 3 基體 31 凹槽 321 卡扣 34 根部 3411 倒刺 3413 引導面 3421 頭部 3431 絕緣本體 30 側壁 32 晶片模組 33 主體部 341 連接部 3412 干涉部 342 施力部 343M340633 VIII. New Description: [New Technology Field] This work is about an electrical connector, especially an electrical connector that can electrically connect a chip module to a circuit board. [Prior Art] At present, a planar grid array (LandGrid, noisy, LGA) socket connector for electrically connecting a chip module to a circuit board has an electrical connection between the conductive terminal and the wafer module by pressing contact. After the wafer module is assembled, it generally only relies on the clamping force of the insulating body to achieve a fixed purpose. For example, the first figure discloses that a conventional Land Grid Array (LGA) socket connector is used for electrical properties. The module 11 is connected to the circuit board 13 and includes an insulative housing 1 and a conductive terminal (not shown). The insulative housing 1 is provided with a receiving space (not shown) for receiving the chip module n and the chip module. After assembly, the heat dissipating device 12 is generally assembled to achieve the purpose of dissipating heat. Such an electrical connector often has insufficient clamping force of the insulating body 1 , and often takes out the wafer mold when the dispersing device 12 is removed. Group u results in damage to the wafer mold 11 . '' In response to the above technical problems, the applicant filed a patent application with the application number 2(8)72_212 on the mainland on 2007^^$9. The specific structure of the electrical connector in the above patent is as shown in the second figure. The electrical connector can be used to electrically connect the chip module 2 to the circuit board (not shown). The basin includes the insulating body 21. Insulated body-shaped complex conductive terminals (paste). The insulating body ^ includes a base body 22 and a side wall 23 around the base body. The base body 22 and the side wall 23 form a wide-opening and accommodating manner for accommodating the wafer mold (4). The side wall of the insulating body h is provided with a fastening chip module. The 2 〇 card tr 24 can be opened or closed under the action of horizontal force, and can be put into or = the wafer module 20 simply and conveniently. The electrical connector 2 is provided with a buckle 24 disposed on the side wall 23, so that the wafer module 2 can be positioned before the heat sink (not shown), and the disadvantages are ΓίΓ f〇 The af ^ 24 ^ chip group 2 〇 ^ heat dissipation device causes interference, resulting in poor heat dissipation of the wafer module 20 . In view of the foregoing, it is indeed necessary to provide an electrical connection such as a solution to the drawbacks of the prior art. Y' [New content] The purpose of this creation is to provide a convenient and simple way to hold the wafer module in the electrical connector and the 6 M340633 does not interfere with the heat sink mounted on the crystal module. Connector. The purpose of the present invention is as follows: an electrical connector for electrically connecting a wafer touch panel, comprising an insulating body and a plurality of conductive terminals received in the insulating body; a sidewall of the insulating body and the substrate, a substrate and a sidewall Forming a receiving cavity for accommodating the wafer module, the side wall is provided with a buckle for holding the wafer module, the buckle can be opened or closed by the lateral force, and the buckle comprises a sidewall disposed inside the insulating body The main body portion, the interference portion extending from the main body portion, the interference portion of the y-chip module, and the urging portion, the urging portion and the interference portion being at the same height. Compared with the conventional technology, the function of the creation is: by means of the buckle of the module on the side wall of the insulating body, the secret chip module of the heat dissipating device can be stably fixed to the electric crying: The urging portion of the buckle is disposed at the same height as the interference portion, so that the buckle is integrated with the height of the wafer module to avoid interference with the heat sink mounted on the wafer module. [Embodiment] The present invention will be further described below in conjunction with the drawings and embodiments. The third and fourth figures show a preferred embodiment of the present invention, which can be used to electrically connect a wafer module to a printed circuit board (not shown). The electrical connector and the plurality of conductive terminals received in the insulating body 30 以 冈 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The side wall 32, the base body 31 and the side wall 32 form a receiving portion for receiving (5) the remaining 33, and the conductive terminal is received on the base body 31. The receiving slot is provided on the side wall 32 with a buckle 34. In this embodiment, there are 3, and a middle portion is respectively provided with a buckle 34, and the two buckles 34 are opposite to the side wall 32, and the second buckle is shown in the fourth figure, the fifth figure and the sixth figure. Part 341, from the main body two = 3, the dry _42 and the force department secret. The main body portion 341 is substantially in the shape of an inverted "L", and the root portion 3411 in the straight direction and the side wall in the horizontal direction extend from the inner side of the end to the barb 3413. By the barbs 3413, the root portion: the second two = the valley The concave shape provided in the middle of the side wall 32 is 寰, and the Bossou ^ connecting the adjacent 3412 曰 t body 131 is only partially connected to the side wall 32. iu ^ ^ 奸 转 342, _ wall 32 (four) gambling Wei Li ^ set / The side of the chip module % is not higher than the most π» ground of the wafer module 33. The upper portion faces the wafer module 33 with a guiding surface M340633 3421, and the guiding surface 3421 is on the wafer module. 33 is placed in the insulating body 3 to guide the function. The tail end of the urging portion 343 is convex to form a head 3431 which is easy to be operated by a finger. The snap Μ is made of a material having a constant elasticity, when the pair is applied When the force portion 343 applies a pressing force in the horizontal direction, the urging portion 343 drives the main body portion such as the connecting portion to elastically outwardly expand, thereby causing the interference portion 342 to move outward. When assembling the cymbal mold stage 33, The urging portion 343 applies a pressing force F in the horizontal direction, so that the buckle 34 is bounced 1* and the slap module 33 is borrowed. The guiding surface on the buckle 34 is easily assembled into the receiving chamber of the insulating body jo and then the force F is released. At this time, the interference portion 342 is stuck with the wafer module 2, and the wafer module 33 is firmly positioned. In the accommodating space of the insulative housing 30, there is no smearing. When the wafer module 2 needs to be removed, a horizontal pressing force F is applied to the urging portion, and the interference portion 342 is detached from the wafer module 33. The state of the buckle is so that the key structure of the present invention is that the insulative body 3 of the present electrical connector 3 has at least a portion 342 and a force applying portion 343, and the interference portion 343 is used to buckle the wafer module 33 and the same at m The horizontal height is applied to the urging portion 343 by a pressing force f in the horizontal direction, and the outer diameter is expanded to facilitate assembly or removal of the wafer module 33, so that it can be assembled before the hot clothes (not shown). The stable positioning of the crystal crucible (4) is only for the new patent requirements, and the patent is requested in accordance with the law. However, the above examples, the scope of this creation is not limited to the above examples, and the person who is skilled in the case According to the spirit of this creation, two are made: Within the scope of patent application. ρ飞文化, 白应涵盍在于【Simple description of the diagram】 The first-picture is a three-dimensional combination diagram of the electrical connector related to the creation; the three-dimensional lion invites the person to ask for the number 2_212 In the patent, the electrical connector is required, the three drawings are the three-dimensional combination diagram of the original electrical connector; the fourth figure is the exploded view of the original electrical connector; the fifth figure is the side view of the original electrical connector; Fig. 3 M340633 [Description of main component symbols] Electrical connector 3 Base 31 Groove 321 Buckle 34 Root 3411 Barb 3413 Guide surface 3421 Head 3431 Insulating body 30 Side wall 32 Wafer die Group 33 main body portion 341 connecting portion 3412 interference portion 342 urging portion 343