M337176 八、新型說明： 【新型所屬之技術領域】 電路板 之電涉及—種電連接器，尤指—種將晶片模組電性連接至印刷 【先前技術】 習知用以電性連接晶片模組和電路板之電連接器一般包括 端子及將晶倾_定_接於絕緣本體 之一種電連接器，該電連接器用以固定晶片模組 m、置L括上鐵#、下鐵片及扣持上、下鐵片之撥桿。 使得電連接器之組裝比較煩J貞，° ' 小型化之發展趨勢。 而且側^也比較大，不.電子設備 二:ίϊ:種固持晶片模組之方法’其包括電連接器、組裝於晶片模 組上之散«置及固持散録置之扣持裝置。組料，先 =路=，然後將晶賴域置於t連接財，散織置放置於^片模 持裝置將散熱裝置及晶片模組固定於電連接器上。然，該種組 祕’而且在拆除散熱裝置時，㈣會帶出晶片顯，導致晶 缺陷 雲於此，實有必要提供—種改進之電連接器，喊服上述電連接器之 【新型内容】 片模題係提供—種電連接11，其可方便簡單地將晶 ，解决上^4技術問題’本創作提供—種電連接器，可用以電性連接晶 i她至印刷電職，其包括職本體、收容概緣本_之複數導電端 tit緣本體包括基體及基體周圍之_，基體及·形成收容晶片模組 ，空腔’其中，該絕緣本體之側牆設有扣持晶片模組之卡扣，該卡扣 在文水平力之作用下可以打開或閉合。 與習知技術相比，本創作具有以下優點：由於卡扣設於絕緣本體之側 6 M337176 I取出日日片她，不需要增加元件和借助其他工具對晶片模組進行固 【實施方式】 實現圖所示’其爲本創作之—種較佳實施例，可用以 1之_性連接。該電連接器包括絕 緣本體2及複數導電端子（未圖示）。 21 圖至第五圖所示，絕緣本體2爲絕緣材料製成，包括基體 未 ，紐21繼22形献容晶片模組1 23，二=======陳軒收容槽 牆22之上表面延伸至配孔221，裝配孔221從側 -斜面2213、第二斜面2214 ^衣，1之一侧上部開始依次設置有第 以逐漸減小配合之大小弟;二2214大致呈階梯狀， 則設於第二斜面2214之下，3；西=21内設有支撐部2211，支撐部 下了以將I配孔221全部封住，也可以部分封 ^ 21，本實施例之裝配孔221採用部分封住方式。裝配孔221内還 j位於支卿2211上方，_讀部2211 ，2212，該播止部2212不需要將裝配孔221 == 裝配孔221之侧壁即可。 而I刀、1甲出 ；fe + 閱第，、圖所不’卡扣4裝配於絕緣本體2之侧牆22上，卡扣4包 ==41、干涉部42及鎖固部43。干涉部42位於主 匕 = Γ41、^ΓΓ直凸伸㈣小尺寸，鎖_43從主體部41之中部延 伸而出’用以扣持晶片模組1，錯 施力部44。 上方留有可供使用者方便施力之 ^且衣日守將卡扣4攸側牆22之裝配孔221之上部裝入，由於卡扣4之 干尺寸很小，是故只需要將卡扣4塞入裝配孔2 Μ由；衣配孔221 _逐漸變小之結構，是故卡扣*裝配於裝配孔功中 7 M337176 後不會任意晃動，而且此種結構之裝配孔221在上部留有較大空間可以使 '^扣4上部在該裝配孔221中前後擺動。使用時，使用者可以用手也可以 藉機械方式對卡扣4之施壓部44施加水平向外之力，使卡扣4向外張開， ^後放^晶片模組丨，再對卡扣4施加水平之反向力，使卡扣4之鎖固部 43緊緊壓住晶片模組卜從而實現了鎖固晶片模組【之功能。 一本創作之卡扣4設置之數目並不局限於兩個，其可以根據需要設置不 同之數目，卡扣4可以設置於絕緣本體2之側牆22上之任何地方，如側牆 22之角落處。 回 綜上所述，本創作確已符合新型專利之要件，爰依法提出專M337176 VIII. New description: [New technical field] The electrical circuit of the circuit board involves a kind of electrical connector, especially the electrical connection of the chip module to the printing. [Prior Art] It is known to electrically connect the wafer module. The electrical connector of the group and the circuit board generally comprises a terminal and an electrical connector for connecting the crystal body to the insulating body, wherein the electrical connector is used for fixing the chip module m, the L-mounting iron #, the lower iron piece and Hold the levers of the upper and lower iron pieces. The assembly of the electrical connector is annoying, and the trend of miniaturization is decreasing. Moreover, the side ^ is also relatively large, and the electronic device 2: ϊ ϊ 种 种 种 种 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ The material, first = road =, then the crystal immersion field is placed in the t-connection, and the scatter is placed on the slab clamping device to fix the heat sink and the wafer module to the electrical connector. However, this kind of group secret 'and when the heat sink is removed, (4) will bring out the wafer display, resulting in crystal defects cloud here, it is necessary to provide an improved electrical connector, shouting the above-mentioned electrical connector [new content] 】 The film model provides an electrical connection 11, which can be easily and simply crystallized to solve the technical problem of '4'. This kind of creation provides an electrical connector, which can be used to electrically connect the crystal to her. The body of the plurality of conductive ends includes a substrate and a substrate around the substrate, and the substrate and the substrate are formed into a cavity, wherein the sidewall of the insulating body is provided with a wafer die. The buckle of the group can be opened or closed under the action of the horizontal force. Compared with the prior art, the present invention has the following advantages: since the buckle is disposed on the side of the insulative body 6 M337176 I takes out the sun piece, it is not necessary to add components and use other tools to fix the chip module. The figure shows a preferred embodiment of the present invention, which can be connected by a sigmoid. The electrical connector includes an insulating body 2 and a plurality of conductive terminals (not shown). 21 to the fifth figure, the insulative housing 2 is made of an insulating material, including a base body, and the neon 21 is followed by a 22-shaped chip module 1 23, and the second ======= Chen Xuan receiving groove wall 22 The upper surface extends to the matching hole 221, and the mounting hole 221 is provided with a first step from the side of the side-bevel 2213, the second inclined surface 2214, and the upper side of the one side of the first step, and the second portion 2214 is substantially stepped. The second inclined surface 2214 is disposed under the second inclined surface 2214, and the supporting portion 2211 is disposed in the west=21. The supporting portion is lowered to completely seal the I matching hole 221, or may be partially sealed. The mounting hole 221 of the embodiment is adopted. Partially sealed. The mounting hole 221 is also located above the branch 2211, the reading portion 2211, 2212, and the stopping portion 2212 does not need to have the mounting hole 221 == the side wall of the mounting hole 221. The I knife, the 1st armor, the fe + reading, and the latching 4 are mounted on the side wall 22 of the insulative housing 2, and the buckle 4 pack == 41, the interference portion 42 and the locking portion 43. The interference portion 42 is located at a main 匕 = Γ 41, a straight projection (four) small size, and the lock _43 extends from the middle portion of the main body portion 41 for holding the wafer module 1 and the erroneous force portion 44. The upper part of the mounting hole 221 for the side wall 22 of the buckle 4 is placed on the top of the mounting hole 221 of the side wall 22 of the buckle. Since the dry size of the buckle 4 is small, only the buckle needs to be buckled. 4The assembly hole 2 is inserted into the assembly hole 2; the structure is equipped with a hole 221 _ gradually smaller structure, so the buckle * is assembled in the assembly hole work 7 M337176 does not arbitrarily shake, and the assembly hole 221 of this structure is left in the upper part The large space allows the upper portion of the '^ buckle 4 to swing back and forth in the fitting hole 221. When in use, the user can apply a horizontal outward force to the pressing portion 44 of the buckle 4 by hand or mechanically, so that the buckle 4 is opened outward, and then the chip module is placed, and then the card is pressed. The buckle 4 applies a horizontal reverse force, so that the locking portion 43 of the buckle 4 is pressed tightly against the wafer module to realize the function of the locking wafer module. The number of the clips 4 of one creation is not limited to two, and the number of the buckles 4 can be set as needed. The buckles 4 can be disposed anywhere on the side wall 22 of the insulative housing 2, such as the corner of the side wall 22. At the office. In summary, this creation has indeed met the requirements of the new patent, and
>士=上所姑_本_之較佳實施方式，本鋪之範®並不以上述每 ’舉凡熟f本案技藝之人士援依本創作之精神所作之等效修ΐ 或艾化，^應涵蓋於以下申請專利範圍内。 乂 【圖式簡單說明】 第一圖係本創作電連接器與晶片模組之立體分解圖； 第二圖係本創作電連接器與晶片模組之立體組裝圖； 第三圖係本創作電連接器中裝配孔之頂面放大視圖； 第四圖係本創作電連接器t裝配孔之底部放大視圖； 第五圖係第一圖所示之裝配孔沿v—v線之剖視圖； 第六圖係本創作電連接器中卡扣之立體圖。 【主要元件符號說明】 晶片模組 1 基體 21 裝配孔 221 擋止部 2212 第二斜面 2214 卡扣 4 干涉部 42 絕緣本體 2>士=上上所_本_ The preferred embodiment of this book, the Fan of the Shop® does not use the above-mentioned equivalents of the person who is familiar with the skill of the case to support the equivalent repair or Aihua in the spirit of this creation, ^ should be covered by the following patent application.乂 [Simple diagram of the diagram] The first diagram is an exploded view of the electrical connector and the chip module; the second diagram is the three-dimensional assembly diagram of the electrical connector and the chip module; The top view of the mounting hole in the connector is enlarged; the fourth drawing is an enlarged view of the bottom of the assembly hole of the present electrical connector; the fifth figure is a sectional view of the mounting hole shown in the first figure along the v-v line; The figure is a perspective view of the buckle in the present electrical connector. [Major component symbol description] Wafer module 1 Base 21 Mounting hole 221 Stopper 2212 Second slope 2214 Buckle 4 Interference section Insulation body 2
側牆 XI 支標部 2211 第一斜面 2213 端子收容槽 23 主體部 41 鎖固部 43 8 ‘ M337176 施力部 44Side wall XI branch part 2211 First inclined surface 2213 Terminal receiving groove 23 Main body part 41 Locking part 43 8 ‘ M337176 Force part 44