M340550 八、新型說明： 【新型所屬之技術領域】 本創作疋關於一種半導體測試座的手測裝置，尤指 種應用在半導體檢測設備領域之新型創作。 【先前技術】 按’為維護半導體元件製造之產品品質，於製程中除 了設置多道檢測機構以外，在半導體元件完成構裝後，仍 會對半導體元件作最後的功能性檢測，而在檢測過程中， 即係將待測的半導體元件放置於檢測設備之測試座上，而 可以透過手測裝置扣持定位及施力1以檢測半導體元件 受壓時之電路導通及各項性能參數。 配合翏看第八圖所示，該手測裝置係由—美座（8 〇)、一驅動套（82)、一旋紐（84)、_;把（8 5 )及一柱桿（9 0 )所組成，於基座（8 〇 )上於置一 樞鈕（8 1 )及一鎖n r R q^ ^ 口又 r Q n, 鎖問（8 3)，該驅動套（）m 又置於基座（8 0 )巾，於驅動套 設置一散熱鰭片（R、 ^ Z )中 乃〔8 6 )，散熱鰭片（8 6 ) 扇（87)，於基座) 上叹置一風 土丛Q 8 0 )内壁面設置内 套（8 2 )下側彤成芦m ^ 累紋’於驅動 J形成％圈，並於環圈外圍 驅動套（8 2 )〜總 固〜成外螺紋’使 1 ^ )此螺設於基座（8 〇 )中，“ 中設置一散熱鰭片（ 、％鈕（8 4 ) ^ 1 y 6 )，散熱鰭片（8r、 柱桿（9 0 )上方，茲& b )底端位於 上方，猎此，可將基座（8 〇 ^弋位設置在 4 M340550 測试座上方，使柱桿（9 Q)位於半導體元件上方， 工作人員可旋轉手把（8 5 )帶動驅動套（8 2 )旋轉: 並以散熱藉片（8 6 )底端抵壓柱桿（9 ◦)，使柱桿 〇)能抵於半導體元件上方進行檢測工作。 于 上述半導體測試座的手測裝置，雖可以手把（8 旋轉帶動驅動# (82)旋轉’使相關元件下壓而進行、; 试工作’然而，隨著半導體元件的腳數增力口，在測試時所 f生的反作用力也越來越大，而經常有下壓力量不足的問 題產生，造成工作人M需使用更多的旋轉力量來完成㈣ 工作，而工作人員每天要面對數百個待測物件，導致工作 :員易產生疲勞現象，其原因主要是因為螺牙間的接觸是 屬於面接觸’而會產生較大的摩擦力所致。 &又’半導體元件測試需考量其平整度，才能使其下壓 此保持緊密接觸’^ ’上述半導體測試座的手測裝置僅 早純形成機構下麼，沒有平整度之跟隨調整變化設計，而 谷易造成平整度不佳，使測試工作失去準確性。 【新型内容】 货Μ本創作設計目的在於，提供一種「半導體測試座的手 2凌置」，其係形成螺旋槽及鋼珠的螺旋接觸，可減少下 件旋轉日守之摩擦力，而能降低工作人員操作負擔，並 ^二中叹置一可跟隨調整變化設計，使其能對於待測的半 導體兀件之下壓接觸，能形成良好的平整度，@能提高測 試工作之可靠度。 M340550 、為達成上述目的之結構特徵及技術内容，本創作「半 導體測試座的手測裝置」，其包括： ☆ 土座⑨基座中形成容置空間，容置空間中設置一 汙動板、-底板及-框座，基座頂端形成開口，於開口内 壁設置螺旋槽，螺旋槽中佈設鋼珠； 一驅動套’其周面設置螺旋槽’驅動套設置在基座開 口中’是以螺旋槽與基座内壁之鋼珠接觸而螺入其中。 所述之浮動板與底板間設置黃片，而形成下壓平整度 接觸的跟隨調整結構。 所述之基座頂端設置一定位桿，定位桿中設置一伸缩 t ’以及在外套筒底端設置—定位凹部，外㈣旋轉—角 度’能使伸縮桿頂端插入定位凹部中。 珠接驅動套在基座中旋轉，能以螺旋槽與鋼 朱接觸減少其摩擦力，而能降低工作人員操作負擔，並且， 在洋動板與底板之間設置簧片，使零組件下壓待判 體凡件能獲得較佳的平整度，以 、 丁 τ 兄又刀不均之側向傾斜 的不平整壓掣，而能提高測試之可靠度。 Π彳貞針 【實施方式】 配合參看第一圖、第二圖、第 示口弟一圖及弟四圖所示，豆 中，本創作「半導體測試座的手測裝置」包括： / 一基座（10)，於基座（10)中形成容置空間（i 1 ) ’容置空$’（ ；[ i )中接續設置一浮動板（2 〇 底板（30)及一框座（40)，基座 从、丄〇 )頂端形 6 M340550 成開口，並於開口周緣設置一凸環圈（1 2 )，於開口内 壁设置螺旋槽（1 3 )，螺旋槽（1 3 )中佈設鋼珠（1 4 )； 一驅動套（5 〇 )，其周面設置螺旋槽（5 1 )，驅 動套（5 0 )設置在基座（1 〇 )開口中，是以螺旋槽（5 1)接觸鋼珠（1 4)並螺入其中，於驅動套（5〇)底 端设置環槽（54)，環槽（54)中佈設鋼珠（55)。 ‘ 所述之驅動套（50)上方設置一外套筒（6〇)， # 於外套筒（60)上設置一把手（64)。 所述之基座（1 〇 )周緣各角落設置沈埋孔（1 7 )， 於每一沈埋孔（i 7 )中設置彈簧（丄8 )，並以一螺絲 (1 9 )穿入及螺設在浮動板（2 〇 )各角落所設置之螺 孔（2 2 )中。 ° 所述之浮動板（2 0 )周緣設置數個沈埋孔（2 4 )， 以及在底板（30)上設置相對的凹槽（32)，凹；I：接（3M340550 VIII. New Description: [New Technology Field] This is a hand-testing device for a semiconductor test stand, especially a new type of application in the field of semiconductor test equipment. [Prior Art] According to the quality of the products manufactured for the maintenance of semiconductor components, in addition to the installation of multiple inspection mechanisms in the process, after the semiconductor components are completed, the final functional inspection of the semiconductor components is still performed, and during the inspection process. The semiconductor component to be tested is placed on the test socket of the detecting device, and the positioning and the biasing force 1 can be held by the hand measuring device to detect the circuit conduction and various performance parameters when the semiconductor component is under pressure. In conjunction with the eighth picture, the hand-measuring device is made up of - (3 〇), a drive (82), a knob (84), _; (8 5) and a pole (9 0), on the base (8 〇) on a hub (8 1 ) and a lock nr R q ^ ^ port and r Q n, lock (8 3), the drive sleeve () m again In the pedestal (80) towel, in the driving sleeve, a heat dissipating fin (R, ^Z) is provided [8 6 ), and the heat dissipating fin (8 6 ) fan (87) is placed on the pedestal. Wind soil Q 8 0) inner wall surface is provided with inner sleeve (8 2 ) lower side 彤 彤 m m ^ 纹 ' ' 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在'Make 1 ^' This screw is placed in the base (8 〇), "Set a heat sink fin ( , % button (8 4 ) ^ 1 y 6 ), heat sink fins (8r, pole (9 0) Above, the bottom of the b&b; is located above. For this, the pedestal (8 〇^ 弋 position can be placed above the 4 M340550 test cradle so that the post (9 Q) is above the semiconductor component, the staff can rotate The handle (8 5 ) drives the drive sleeve (8 2 ) to rotate: and the bottom end of the heat sink (8 6 ) is pressed against the column (9 ◦), so that the post 〇) can be tested above the semiconductor component. In the above-mentioned semiconductor test stand, the hand test device can be rotated by the handle (8 rotation drive # (82) to reduce the relevant components) However, the test work 'However, as the number of pins of the semiconductor component increases, the reaction force generated during the test is also getting larger and larger, and the problem of insufficient underpressure is often generated, resulting in the need of the worker M. Use more rotational force to complete (4) work, and the staff face hundreds of objects to be tested every day, resulting in work: the staff is prone to fatigue, mainly because the contact between the screws is a face contact' It will cause a large friction. & And 'semiconductor component test needs to consider its flatness, in order to make it under pressure to keep close contact '^ 'The above test device of the semiconductor test stand is only purely formed under the mechanism There is no flatness to follow the adjustment and change design, and Gu Yi causes poor flatness, which makes the test work lose accuracy. [New content] The purpose of this design is to provide a kind of The semiconductor test stand's hand 2 is set, which forms a spiral contact between the spiral groove and the steel ball, which can reduce the friction of the rotating part of the lower part, and can reduce the workload of the staff, and can be adjusted to follow the adjustment. Designed to make a good flatness under the pressure contact of the semiconductor component under test, @ can improve the reliability of the test work. M340550, in order to achieve the above-mentioned structural features and technical content, the creation of "semiconductor The hand test device of the test stand comprises: ☆ a accommodating space is formed in the base of the earth seat 9 , and a dirty plate, a bottom plate and a frame seat are arranged in the accommodating space, and an opening is formed at the top end of the pedestal, and is disposed on the inner wall of the opening A spiral groove is arranged in the spiral groove; a drive sleeve is provided with a spiral groove on its circumference, and the drive sleeve is disposed in the opening of the base. The spiral groove is in contact with the steel ball of the inner wall of the base and screwed therein. A yellow sheet is disposed between the floating plate and the bottom plate to form a follow-up adjustment structure for pressing the flatness. A positioning rod is disposed on the top end of the base, a telescopic t' is disposed in the positioning rod, and a positioning recess is disposed at the bottom end of the outer sleeve, and the outer (four) rotation-angle is configured to insert the top end of the telescopic rod into the positioning recess. The beading drive sleeve rotates in the base, can reduce the friction of the spiral groove and the steel Zhu, and can reduce the workload of the worker, and a reed is arranged between the ocean plate and the bottom plate to press the component down. The condition of the object to be judged can obtain better flatness, and the unevenness of the lateral tilt of the Ding τ brother and the unevenness of the knife can improve the reliability of the test. Π彳贞 【 [Embodiment] With reference to the first picture, the second picture, the first picture of the younger brother and the fourth figure, in the bean, the creation of the "semiconductor test stand hand test device" includes: / a base The seat (10) forms an accommodation space (i 1 ) in the pedestal (10). The vacant space is placed in the vacant space (2); (2) is connected to a floating plate (2 〇 bottom plate (30) and a frame seat (40). ), the base is opened from the top, 6 M340550, and a convex ring (1 2 ) is arranged on the periphery of the opening, and a spiral groove (13) is arranged on the inner wall of the opening, and steel balls are arranged in the spiral groove (13) (1 4 ); a driving sleeve (5 〇), the spiral groove (5 1 ) is arranged on the circumference thereof, and the driving sleeve (50) is disposed in the opening of the base (1 〇), and is contacted by the spiral groove (5 1) The steel ball (14) is screwed therein, and a ring groove (54) is arranged at the bottom end of the driving sleeve (5〇), and a steel ball (55) is arranged in the ring groove (54). ‘ An outer sleeve (6〇) is disposed above the driving sleeve (50), and a handle (64) is disposed on the outer sleeve (60). A buried hole (1 7 ) is disposed at each corner of the periphery of the base (1 〇), and a spring (丄8) is disposed in each of the buried holes (i 7 ), and is inserted and screwed by a screw (1 9 ) In the screw holes (2 2 ) provided at each corner of the floating plate (2 〇). ° The floating plate (20) is provided with a plurality of buried holes (2 4 ) at the periphery, and opposite grooves (32) are provided on the bottom plate (30), concave; I: connected (3)
2)中設置螺孔’於凹槽（3 2)中設置圓圈狀中間a凸起 之簧片（3 3 ) ’並以螺絲（2 3 )穿入沈埋孔（2 4 ) 及簧片（3 3 )及螺入凹槽（3 2 )的螺孔中。 所述之框座（4 0 )中設置一穿孔（4 i )，框座（4 0 )位於底板（3 0 )底端並以螺絲螺設加以固^士。 所述之底板（3 0 )中設置透孔（3 1 )，所述之浮 動板（2 0 )中設置穿孔（2 1 )，浮動板（2 〇 )之穿 孔（2 1 )内側設置内凸部（2 1 1 )，内凸部（2工工： 處設置螺孔。 7 M340550 該螺設於基座（1 Ο )中的驅動套（5 Ο )内設置一 散熱器（7 0 )，該散熱器（7 〇 )頂端設置一風扇（7 4 )，散熱器（7 0 )底端具有一柱桿（7 1 )，柱桿（7 1 )與散熱器（7 0 )可為一體式設計或分離式設計，該 柱桿（7 1 )藉由套設有彈簧（7 2 )的螺絲（7 3 )組 接該浮動板（2 0 )，且該柱桿（7 1 )底端穿過浮動板 (2 0 )及底板（3 0 )伸入該框座（4 〇 )的穿孔中。 • 柱桿（7 1 )底側設置數個定位孔（7 1 1 )，於定 馨位孔（7 1 1 )處設置彈簧（7 2 )，並以螺絲（7 3 ) 穿入彈簧（7 2 )、定位孔（7 1 1 )及螺入浮動板（2 〇 )内凸部（2 1 1 )的螺孔中。 外套筒（6〇)設置在驅動套（5〇)上方，是在外 套筒（6 0 )底緣設置沈埋孔（6 1 )，以及在驅動套（5 〇 ) 了員端形成一凸環邊（5 2 )，於凸環邊（5 2 )上設 置螺孔（5 3 )，而可以螺絲（6 2 )穿入沈埋孔（6 1 ) _ 及螺入凸環邊（5 2 )之螺孔（5 3 )中加以固結定位。 外套筒（6 〇)設置於驅動套（5 〇)上方而圍繞在 、 設置一起的風扇（7 4 )及散熱器（7 0 )外圍。 - 如第二圖所示，於基座（10)頂端之凸環圈（12) 外圍設置一定位桿（1 Θ )，定位桿（1 β )中設置一可 彈^伸縮之伸縮桿（i 6 i )，並於基座（i 〇 )頂端之 凸％圈（1 2 )外圍與定位桿（1 6 )呈90度位置設/ 擋桿（1 5 )。 配5參看第五圖及第六圖所示，在外套筒（6〇)底 8 M340550 端設置-孤槽（63) ’弧槽（63)二端擴 120度，所述之擔桿（15)伸入弧槽（6 3)中，並於 = )(::):端設置一定位凹部（“），當外套筒 (6〇)疑轉一角度，能使伸縮桿（16!)頂端插入定 位凹部（6 5 )中加以定位。 士配合參看第六圖及第七圖所示’其中’本創作操作使 用才係將待測半導體凡件（7 6 )放置於檢測設 試座（75) + ’再將手測裳置之基座（！0)側邊料 置的扣片（1 0 1 )卡掣於測試座（7 5 )頂緣，使框座 (4 0 )、散熱器（7 〇 )之柱桿（7丄）位於該待測半 :體疋件（76)上方，此時，工作人員旋轉把手（64) 咿動驅動套（50)向下旋轉，可藉由螺旋槽(1 3)之間所設置的鋼珠（14)來減少螺旋時之摩擦力’ 使作人員此更省力的進行操作，並藉由該驅動套（5 〇 ) 推動該浮動板（20)、底板（30)及框座（4〇)下 降’使框座（4 0 )以及散熱器（7 〇 )柱桿（7工）屙 抵於待測半導體元#(76)上，令待測半導體以牛（7土 6)各接腳透過測試座（7 5 ”的導電元件與檢測設備 的主機板電性連接，復由該檢測設備對該半導體元件（7 6)進行檢側，半導體元件（76)力檢測時產生的敎可 透過散熱器、（70)之柱桿（71)向上傳導，並由風扇 (7 4 )所提供散熱氣流加以冷卻。 本創作在浮動板（2 0 )與底板（3 〇 )之間設置簧 片（3 3 )，並於基座（丄〇 )各角落設置螺絲（丄9 9 M340550 穿設彈簣（1 8 )及螺設在_ ( 2 〇 )上，使驅動套 (5 〇 )向下旋轉時，可以驅動套（5 〇 )底端的鋼珠（5 5 )抵於浮動板（2 〇 )表面下壓，使浮動板（2 於底端有簧片（33)、上方有彈簧（18)之浮動調整， 使向下抵壓的力量能平均分佈，以避免集中一側，而能確 保下壓平整度，以提高測試之可靠性。 配。苓看第五圖及第六圖所示，其中 伸=槽(…*中，可作為外套筒（6〇;= 〜、而擋止，而外套筒（60)旋轉角度，使預壓於外套 言 〇 )底々而之伸縮桿（1 β 1 )位於定位凹部（6 5 ) 底端時，則可以預堡之回復彈性，使伸縮桿（ΐ6ι)能 =定位凹部（65)巾，形成-止迴設計，以防止驅動 套（5〇)迴轉現象發生。 综上所述，本創作設計，可藉由螺旋槽與鋼珠接觸減 、摩擦力’而能降低工作人員操作負擔，並且，能使下 座力平均分佈在接觸面上，而能確保向下抵壓之平整度， 二提高測試可靠度，且具有定位桿、伸縮桿與定位凹部之 :對止吸疋位作用，而能避免驅動套旋轉後回造成下 塗力不足之缺點，而能提高半導體元件之職準確性。 【圖式簡單說明】 第一圖：本創作立體外觀圖。 第二圖：本創作立體分解圖。 第三圖：本創作組合剖視圖。 10 M340550 第四圖：本創作另一側組合剖視圖。 第五圖：第四圖的5 — 5剖視圖。 第六圖：本創作旋轉外套筒帶動驅動套旋轉之示意 圖。 第七圖：本創作設置在半導體測試座上之實施例剖視 圖 第八圖：習用半導體測試座的手測裝置示意圖 【主要元件符號說明】2) Set the screw hole 'in the groove (3 2) to set the circle-shaped middle a-protted reed (3 3 ) ' and penetrate the buried hole (2 4 ) and the reed with the screw (2 3 ) 3) and screw into the screw hole of the groove (3 2 ). A through hole (4 i ) is disposed in the frame seat (40), and the frame seat (40) is located at the bottom end of the bottom plate (30) and is screwed to fix the weight. A through hole (3 1 ) is disposed in the bottom plate (30), a perforation (2 1 ) is disposed in the floating plate (20), and a perforation is disposed on the inner side of the perforation (2 1 ) of the floating plate (2 〇) Part (2 1 1 ), inner convex part (2 workers: screw holes are provided. 7 M340550 This screw is set in the drive sleeve (5 Ο ) in the base (1 Ο ) to set a radiator (7 0 ), A fan (7 4 ) is disposed at a top end of the heat sink (7 〇), and a pole (7 1 ) is disposed at a bottom end of the heat sink (7 0 ), and the pole (7 1 ) and the heat sink (7 0 ) can be integrated In a design or a separate design, the post (7 1 ) is assembled by a screw (7 3 ) that is sleeved with a spring (72) and the bottom end of the post (7 1 ) is worn. The floating plate (20) and the bottom plate (30) extend into the perforations of the frame (4 〇). • Several positioning holes (7 1 1) are arranged on the bottom side of the column (7 1 ). A spring (7 2 ) is arranged at the hole (7 1 1 ), and the spring (7 2 ), the positioning hole (7 1 1 ) and the convex portion (2 〇) in the floating plate (2 〇) are screwed with the screw (7 3 ) (2 1 1) in the screw hole. The outer sleeve (6〇) is placed above the drive sleeve (5〇) and is in the outer sleeve (6 0) The bottom edge is provided with a buried hole (6 1 ), and a convex ring edge (5 2 ) is formed at the end of the driving sleeve (5 〇), and a screw hole (5 3 ) is disposed on the convex ring side (5 2 ), and The screw (6 2 ) is inserted into the buried hole (6 1 ) _ and screwed into the screw hole (5 3 ) of the convex ring side (5 2 ) to be fixed and positioned. The outer sleeve (6 〇) is set on the drive sleeve (5) 〇) above and around the fan (7 4 ) and the heat sink (7 0 ). - As shown in the second figure, a positioning is placed on the periphery of the convex ring (12) at the top of the base (10). A rod (1 Θ ), a telescopic telescopic rod (i 6 i ) is disposed in the positioning rod (1 β ), and is located at the periphery of the pedestal (i 〇) at the periphery of the convex ring (1 2 ) and the positioning rod ( 1 6 ) Positioned at 90 degrees / bar (1 5 ). With 5 as shown in the fifth and sixth figures, at the end of the outer sleeve (6〇) 8 M340550 - slot (63) 'arc slot (63) The two ends are expanded by 120 degrees, the support rod (15) is inserted into the arc groove (63), and a positioning recess (") is set at the end of the =) (::): when the outer sleeve ( 6〇) Suspecting the angle, the top end of the telescopic rod (16!) can be inserted into the positioning recess (6 5 ) In conjunction with the sixth and seventh figures, the 'in this' is used to place the semiconductor part to be tested (7 6 ) in the test set (75) + ' The gusset (!0) side of the gusset (1 0 1 ) is clamped on the top edge of the test seat (75), so that the frame (40) and the radiator (7 〇) are poles (7).丄) is located in the half to be tested: above the body member (76), at this time, the staff rotates the handle (64) and the drive sleeve (50) is rotated downward, which can be set by the spiral groove (1 3) The steel ball (14) to reduce the frictional force of the screw' enables the operator to operate more effortlessly, and pushes the floating plate (20), the bottom plate (30) and the frame seat by the driving sleeve (5 〇) 〇) Drop 'Make the frame (4 0 ) and the radiator (7 〇) column (7 work) 屙 on the semiconductor element #(76) to be tested, so that the semiconductor to be tested is connected to the cow (7 soil 6) The conductive member of the test piece (7 5 ” is electrically connected to the main board of the detecting device, and the semiconductor device (76) is inspected by the detecting device, and the semiconductor element (76) is detected by force detection. Through the radiator (70) of the mast (71) upward conduction by the fan (74) is cooled by providing cooling airflow. In this creation, a reed (3 3 ) is arranged between the floating plate (20) and the bottom plate (3 〇), and screws are arranged at each corner of the base (丄9 9 M340550 to wear the magazine (1 8 ) And the screw is set on _ ( 2 〇), so that when the drive sleeve (5 〇) is rotated downward, the steel ball (5 5 ) at the bottom end of the sleeve (5 〇) can be driven down against the surface of the floating plate (2 〇), so that The floating plate (2 has a reed (33) at the bottom end and a floating adjustment of the spring (18) at the bottom, so that the downward pressing force can be evenly distributed to avoid the concentrated side, and the flatness can be ensured to Improve the reliability of the test. Matching. See the fifth and sixth figures, where the extension = slot (...*, can be used as the outer sleeve (6〇; = ~, and the outer sleeve ( 60) The angle of rotation is such that when the telescopic rod (1 β 1 ) is placed at the bottom end of the positioning recess (6 5 ), the elastic force can be restored, so that the telescopic rod (ΐ6ι) can = positioning recess (65) towel, forming a non-return design to prevent the rotation of the drive sleeve (5〇). In summary, the design of the spiral can be reduced by contact with the steel ball. Friction' can reduce the workload of the staff, and can distribute the lower seat force evenly on the contact surface, and ensure the flatness of the downward pressure. Secondly, the test reliability is improved, and the positioning rod and the telescopic rod are provided. Positioning the concave portion: the action of the stop suction position, and avoiding the disadvantage of insufficient under-coating force after the rotation of the driving sleeve, and improving the accuracy of the semiconductor component. [Simplified drawing] First figure: The stereoscopic appearance of the creation Fig. 2: The exploded view of the creation. The third picture: a cross-sectional view of the creation. 10 M340550 Figure 4: A cross-sectional view of the other side of the creation. Figure 5: Section 5-5 of the fourth figure. Figure: Schematic diagram of the rotation of the outer sleeve to drive the rotation of the drive sleeve. Figure 7: The cross-sectional view of the embodiment of the present invention set on the semiconductor test socket. Figure 8: Schematic diagram of the hand-measuring device of the conventional semiconductor test socket [Key component symbol description]
(10)基座 (1 1 )容置空間 (13)螺旋槽 (1 5 )擋桿 (1 6 1 )伸縮桿 (1 8 )彈簧 (2 0 )浮動板 (211)内凸部 (2 3 )螺絲 (101)扣片 (12)凸環圈 (1 4 )鋼珠 (16)定位桿 (1了）沈埋孔 (1 9 )螺絲 (2 1 )穿孔 (2 2 )螺孔 (2 4 )沈埋孔 (3 0 )底板 (3 2 )凹槽 (4 0 )框座 (5 0 )驅動套 (5 2 )凸環邊 (5 4 )環槽 (6 0 )外套筒 (31)透孔 (3 3 )簧片 (4 1 )穿孔 (51)螺旋槽 (5 3 )螺孔 (5 5 )鋼珠 (6 1 )沈埋孔 11 M340550 (6 2 )螺絲 (6 4 )把手 (7 0 )散熱器 (7 1 1 )定位孔 (7 3 )螺絲 (7 5 )測試座 (8 0 )基座 (8 2 )驅動套 (8 4 )旋鈕 (8 6 )散熱鰭片 (9 0 )柱桿 (6 3 )孤槽 (6 5 )定位凹部 (7 1 )柱桿 (7 2 )彈簧 (7 4 )風扇 (7 6 )半導體元件 (8 1 )樞鈕 (8 3 )鎖閂 (8 5 )手把 (8 7 )風扇(10) Base (1 1 ) accommodating space (13) Spiral groove (1 5 ) Stop lever (1 6 1 ) Telescopic rod (1 8 ) Spring (20) Floating plate (211) Inner convex part (2 3 Screw (101) clasp (12) convex ring (1 4) steel ball (16) positioning rod (1) sinking hole (1 9) screw (2 1) perforated (2 2) screw hole (2 4) buried Hole (3 0 ) bottom plate (3 2 ) groove (40) frame seat (50) drive sleeve (52) convex ring side (5 4) ring groove (60) outer sleeve (31) through hole ( 3 3) Reed (4 1 ) perforated (51) spiral groove (5 3 ) screw hole (5 5 ) steel ball (6 1 ) buried hole 11 M340550 (6 2 ) screw (6 4 ) handle (7 0 ) heat sink (7 1 1 ) Locating hole (7 3 ) Screw (7 5 ) Test socket (8 0 ) Base (8 2 ) Drive sleeve (8 4 ) Knob (8 6 ) Heat sink fin (9 0 ) Post (6 3) Solvent (6 5 ) Positioning recess (7 1 ) Post (7 2 ) Spring (7 4 ) Fan (7 6 ) Semiconductor component (8 1 ) Hub (8 3 ) Latch (8 5 ) Handle ( 8 7) Fan
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