M340490 凹下空間23 開口 24 軸流風扇3〇 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種散熱裝置，供應用於高能量密度之 電子構裝產品的板卡上使用，尤指一種將軸流風扇以斜置 _ 狀態固設在散熱翼片中之一凹下空間位置處，使軸流風扇 產生之風量可在複數片平行排列之散熱翼片之間強制流動 以排除熱量，並可藉其斜置狀態以使部分風量可由凹下空 間之側邊開口吹向板卡上之其他熱源，藉以增加軸流風扇 之風量的流動方向及範圍而增進散熱效果者。 【先前技術】 隨著半導體科技的發展，微影與其他製程技術進步的 情況下，使得電子元件的尺寸大幅縮小，越來越多的電晶 體被放入積體電路（1C)中，換言之，單位面積内的電晶 體數目急遽增加，再加上1C的運算速度增加，導致1C在運 作時產生非常大的熱功率，以目前個人電腦内的中央處理 器（CPU )而言，發熱量從Pentium的20W到Pentium Π的 30W甚至43W，而PentiumlV估計約在150W以上，CPU 的接面溫度(junction temperature)更可高達150 °C，若不能有 效且迅速的移除CPU所產生的熱量，將使得CPU因熱量累 積溫度甚高而導致當機甚至損壞。目前，為了避免電子元 件因高熱高溫而影響其工作性能甚至損毀，通常都於設有 數個電子元件（如CPU)之板卡上加裝一利用散熱鰭片 3 p M340490M340490 recessed space 23 opening 24 axial fan 3〇8, new description: [New technical field] This creation is about a heat sink that is used on boards for high energy density electronic components, especially Refers to an axial fan fixed in an oblique position _ state at a recessed space in the heat dissipating fin, so that the airflow generated by the axial fan can be forced to flow between the plurality of heat dissipating fins arranged in parallel to exclude heat And can be inclined to make part of the air volume can be blown to the other heat source on the board by the side opening of the recessed space, thereby increasing the flow direction and range of the air flow of the axial fan to improve the heat dissipation effect. [Prior Art] With the development of semiconductor technology, the advancement of lithography and other process technologies has greatly reduced the size of electronic components, and more and more transistors are placed in the integrated circuit (1C), in other words, The number of transistors per unit area increases sharply, and the speed of operation of 1C increases, causing 1C to generate very large thermal power during operation. In the current central processing unit (CPU) in a personal computer, the heat is generated from the Pentium. 20W to Pentium Π 30W or even 43W, while PentiumlV is estimated to be above 150W, CPU junction temperature can be as high as 150 °C, if you can not effectively and quickly remove the heat generated by the CPU, it will make The CPU is damaged even when the heat is accumulated at a high temperature. At present, in order to prevent the electronic components from affecting their working performance or even being damaged due to high heat and high temperature, a heat sink fin is usually installed on a board with several electronic components (such as CPU). 3 p M340490
(fin)與軸流風扇組成之散熱裝置，也就是在板卡之數個 電子元件（如C^U)上面設置一散熱鰭片（fm)，並以一 軸流風扇強制空氣對流而增加其移除熱量能力，藉以達成 該散熱裝置之散熱效果，此為傳統電子元件散熱裝置之架 構。一般而言，空氣強制對流熱傳係數隨著熱傳表面積增 加而提高，因此，為增加熱傳率，通常都以增加散熱鰭片 面積或使用空氣流量較大的軸流風扇來達成，但增加表面 積及空氣流量卻相對帶來體積增大及產生振動噪音的缺點 上述散熱裝置所使用之散熱鰭片（fm)，一般 工藝製成之鋁擠型體’其上部設有複數片平行 主要m J裝時，使散減片之底面貼覆於板卡上之 ϋ或其導熱片（spreader)的上表面，再於… LL片ΐΓ上以水平狀態固設-轴流心^ 扇之全ί二 有適度深度之凹下空間供轴流風 置之體積。辦;二：埋設其内，藉以減少整體散熱震 以移除散熱轉片Γ :所產生之風量雖可強制空氣流動 但其強制流動== 平行排列之翼片的熱量， 蓋範圍内之數片；設置之轴流風扇所涵 ==二 降 件⑽‘1:’板卡上所設會形成熱心: 之主要熱源c可藉電子元件佈局-使其中 風扇（即散熱，置）u古面儘篁安排設置散熱鰭片及軸流 裝置）以有效移除熱量，但板卡上其他會形 4 M340490 成熱源之電子元件（如其他汇晶片），因其產生熱量可能 比主要熱源低故在此視為一次要熱源，則無法利用主要熱 源之散熱裝置以移除該次要熱源之熱量，而若增加散熱鰭 片面積或使用空氣流量較大的軸流風扇來達成一板卡上整 體電子元件之散熱效果，卻又有相對增大體積的缺點及問 題，因此，如何運用現有散熱裝置的佈局及體積以增進其 散熱效果，也就是在既不增加散熱鰭片面積也不選用空氣 流量較大的軸流風扇的條件下來增進一板卡之整體性散熱 效果’確實已有其需要性，而本創作即是針對該需要性而 設計者。 【新型内容】 本創作主要目的在於提供一種板卡之散熱裝置，供應 用於高能量密度之電子構裝產品如工業電腦、車用數位錄 影裝置（MD VR )等的板卡上，其係利用一散熱|蓄片及一 軸流風扇構成，其中該散熱鰭片之底面係貼覆於板卡上至 少一個主要熱源如晶片的上表面，其上部設有複數片平行 排列之翼片，並在複數片翼片中設有一凹下空間，且該凹 下空間之至少一側邊設有一開口以對向板卡上主要熱源以 外的其他至少一個次要熱源；該軸流風扇係以斜置狀態固 設在散熱翼片中之凹下空間處，使軸流風扇產生之流動風 量可在複數片平行排列之翼片之間強制空氣對流以移除熱 量，並藉其斜置狀態以使部分風量可由凹下空間之側邊開 口吹向板卡上之次要熱源，藉以增加該軸流風扇之流動風 量的流動方向及範圍，俾可在不增加散熱鰭片面積也不改 變軸流風扇規格的條件下增進該散熱裝置之散熱效果。 5 ,M340490 本創作再一目的在於提供一板卡之散熱裝置，其中該 散熱鰭片係利用鋁擠型成型工藝製成之鋁擠型體，其可藉 機械加工以在其上部之複數片翼片之間開設一凹下空間及 該凹下空間周圍至少一側邊之開口，並可藉機械加工形成 一翼片延伸區域，以使該翼片延伸區域之底面可對應貼覆 於板卡上主要熱源以外的其他熱源，且該翼片延伸區域之 底面在利用鋁擠型成型工藝成型時可設計與對應貼覆於板 卡上主要熱源之底面為不同平面（即不同高度），使散熱 鰭片的形狀，包含複數片翼片貼覆在板卡上的範圍及其底 面高度，並可隨板卡上電子元件（熱源）之佈局而對應配 合，藉以提昇散熱裝置相對於板卡之配合性，以相對減少 散熱裝置之體積並增進其散熱效果。 本創作又一目的在於提供一板卡之散熱裝置，其中該 軸流風扇在凹下空間中之斜置方位及斜置角度之大小並不 限制，如其斜置角度可對向該凹下空間之一侧邊的開口或 對向另一側邊之複數片翼片，藉以控制該軸流風扇所產生 流動風量吹向複數片平行排列之翼片間及吹向侧邊開口的 風量比例，藉以配合板卡上電子元件（熱源）之佈局，以 提昇板卡整體性之散熱功效。 本創作另一目的在於提供一板卡之散熱裝置，其中該 軸流風扇可藉自攻螺絲鎖固在凹下空間側邊之散熱鰭片之 翼片上，如使自攻螺絲穿設在二翼片之間的空隙中，以方 便於該軸流風扇以斜置狀態鎖固在凹下空間内之組裝作 業。 【實施方式】 6 M340490 參照圖i、2、3淋，特徵詳述如後·' 立體、上视及橫向斷面示：囷。、：：係本創作-實施例之 裝置2，主要是靡：： 創作係-種板卡之散熱 ，、車用數位錄影裝置（MDVR)= 構裝產品如工業 以：效解決該板卡1之散熱問題。其2反：1上使用， 電：几件佈局（—t)(圖未示），；：卡1上具有-少包含中央處理器（CPU)或其他IC曰曰=子元件佈局至 元件在運作時相對會 埶 ^片荨，且該等電子 該等熱源可分為主要熱源二u或次^ …所示丨但上述板卡丨上之電子:::二口如、 及其主要熱源1G、11或次要熱源12等的 [ay〇ut ) 可隨板卡1之功能設計需要而改變佈局方式亚=限制，其 例之板卡1僅是其中一實施例，並非用來二二，本實施 本創作板卡之散熱裝置2主要包含一散熱鳍^作。 軸流風扇30，其中，該散熱鰭片20係固設在^ 20及一 固設方式不限制；又其上部設有複數片平行排列上’其 形翼片21，其底面22貼覆於板卡1上之主要熱源=長條片 其導熱片（spreader)的上表面，並在複數片翼片11或 位置處設有一凹下空間23 ’本貫施例為一方形凹下办、^ 23，供一方形箱形軸流風扇3〇容設其内；又該凹下:間 之周緣至少一側邊設有一開口24，本實施例之開口^曰23 向係垂直於長條片形翼片21之長度方向如圖1、0 β白方 供可對向板卡1上至少一個次要熱源12的位置。 Μ ’ 7 H340490 該轴流風扇30-般為-扁箱形風扇，其係以斜置狀 固設在散熱翼片21+之凹下空間加，使軸流風扇3〇產= 之流動風量可在複數片平行排列之翼片21之間強制 流如圖卜2、3中箭頭A、B所示，藉以移除主要熱‘ 10、11的熱里，又進步可藉轴流風扇3〇之斜置狀態走 軸流風扇30部分流動風量如圖丨、2、3中箭頭c所八笟 可由凹下空間23之侧邊開。24向外吹送以吹：板卡二 :欠要熱源⑴藉此’可增力，軸顏㈣職生流動風^ 的流動方向及範圍如圖1、2、3中箭頭A、B、c所 示，以增進散«置2之散熱效果，並相對降低散熱裝置 2之設備成本’也就是在不増加散熱籍片2〇的面積也不改 變軸流風扇30的規格（如空氣流量較大者）的條件下增 該散熱裝置2之散熱效果。 ^ 本創作板卡之散熱裝置2之散熱鰭片2〇—般係利用鋁 掩型成型工藝製成之銘擠型體，其中該凹下空間23可藉機 械加工製作；又該凹下空間23之空間形狀不拘，也就^凹 下空間23内之翼片21可藉機械加讀除至其根底端（即凹 下空，23内之翼片21整片裁除）如圖i、3所示，或裁除 至-南度處而仍保留翼片21之下段部分（圖未示）；又軸 完全埋設在凹下空間23内如_ 3所示而不外露為佳，但當 翼片高度不大致凹下空間23之深度不^時該軸流風扇 30之相體亦可部分埋設在凹下空間23内而部分外露（圖未 示）。 該軸流風扇30係以斜置狀態固設在散熱翼片2ι中之凹 8 ;M340490 下空間23内，而其斜置方位及斜置角度大小並不限制，如 軸流風扇30之斜置角度可對向該凹下空間23之一侧邊之開 口 24如圖1、3所示，也就是斜置角度的張開方向係垂直 • 於長條片形翼片21之長度方向；或對向該凹下空間23之另 ^ 一側邊之複數片翼片21如圖7、8、9所示，也就是斜置 角度的張開方向係平行於長條片形翼片21之長度方向；或 • 對向該凹下空間23之其他不同方位（圖未示）；而且斜置 角度之大小可隨凹下空間23之深度而作選擇；而由於軸流 • 風扇30係以斜置狀態固設在凹下空間23内，故軸流風扇30 所產生之流動風量可藉其斜置角度而部分流向該凹下空間 23之側邊開口 24，也就是會有部分風量如圖1、2、3中 前頭C所示，可由凹下空間23之側邊開口 24向外吹向板卡 1上之次要熱源12。至於軸流風扇30在凹下空間23内之斜 置方位及斜置角度大小的選擇，可藉以控制該軸流風扇30 所產生流動風量吹向複數片平行排列之翼片21及吹向側邊 開口 24二者之間的風量比例，其可配合板卡1上電子元件 φ (熱源）的佈局而適當改變，以提昇板卡1之整體性散熱 效果。 又該軸流風扇30斜置在凹下空間23内之架設方式不限 • 制，如其可藉自攻螺絲穿設在凹下空間23側邊之翼片21 上’如使自攻螺絲迫緊在側邊之二翼片21之間的空隙中， 以將輛流風扇30以斜置狀態鎖固在凹下空間23内；由於軸 流風扇30可藉其他架設方式而鎖固在凹下空間23内如另藉 預設嵌槽之嵌設方式等，且其架設方式並非本創作之特徵 所在，故在此不再贅述。. 9 M340490 參照圖4、5、6所示，其分別係本創作另一實施例 之立體、上視及橫向斷面示意圖。本實施例板卡之散熱裝 置2的主要技徵特徵及目的功效與圖i、2、3所示實施 - 例完全相同，其中該散熱鰭片20進一步可藉機械加工以在 . 主要翼片作用區域之外圍另向外延伸形成一翼片延伸區域 25，使該翼片延伸區域25之底面26可對應貼覆於板卡1上 • 主要熱源10、11及次要熱源12等以外的其他熱源13，而且 該翼片延伸區域25之底面26在利用鋁擠型成型工藝成型時 _ 可與對應貼覆於板卡1上主要熱源之底面22設計為不同平 面（即不同高度）如圖6所示，使散熱鰭片20的形狀，包 含複數片翼片21貼覆在板卡上的範圍及其底面（22、26) 之高度，可隨板卡1上電子元件（熱源）之佈局而對應配 合，藉以提昇散熱裝置2相對於板卡1之配合性，以相對 減少散熱裝置2之體積並增進其散熱效果。 參照圖7、8、9所示，其分別係本創作又另一實施 例之立體、上視及橫向斷面示意圖。本實施例板卡之散熱 馨 裝置2的主要技徵特徵及目的功效與圖1、2、3所示實 施例完全相同，二者之間主要不同處在於本實施例之凹下 空間23之周緣侧邊設有兩開口，其中一開口係設在凹下空 間23—側邊乏開口 24，也就是如同圖1、2、3所示實施 例之開口24，其開口之方向係垂直於長條片形翼片21之長 度方向，可對向板卡1上另一熱源（次要熱源）13的位置 如圖8中箭頭C所示；其中另一開口係設在凹下空間另 一侧邊之開口 27，其開口方向係平行於長條片形翼片21之 長度方向，可對向板卡1上一次要熱源12的位置如圖8中 M340490 前頭B所不，而本貫施例之轴流風扇3〇之斜晉备择旅縣& 該凹下空間23之開口 27如圖7、8、9所示，也^是斜^ 角度的開張方向係平行於長條片形翼片21之長产方向·貝 使用時，本實施例之軸流風扇30所產生之流動風量可藉其 斜置角度而大部分流向該開口 27及複數片平行排列之翼片 21之間，藉以形成強制性空氣對流如圖7、8、9中箭頭 A、B所示’用以移除主要_ 10、11及次要熱源12的熱 量；而小部分流動風量可流向該侧邊開〇24如圖7、8中 箭頭c所示，藉以移除另一熱源（次要熱源）13的熱量； 藉此，可增加該軸流風扇30所產生流動風量的流動向及 散熱範圍如圖7、8、9中箭頭A、B、J:動= 散熱裝置2之散熱效果，並相對降低散熱裝置2之設備成 本，也就是在不增加散熱鰭片20的面積也不改變軸流風扇 =的規格（如空氣流量較大的軸流風扇）的條件下增進該 散熱裝置2之散熱效果。又參照圖9所示，其中該^下空 = ΐ機械加工製作，且該凹下空間23之空間雜係對 成面f裁成一斜面（即凹下空間23内之翼片21裁 凹下9所示，使轴流風扇3〇之箱體完全埋設在 凹下二間23内而不外露且呈斜置狀態。 是：所示僅為本新型之較佳實施例，對本新型而-僅 =利要求所限定的精神4=二=本 變’修改’甚至等效變更，二入：：進仃心改 内。 但都將落入本新型的保護範園 ,M340490 【圖式簡單說明】 圖1係本創作一實施例之立體示意圖。 圖2係圖1之上視示意圖。 - 圖3係圖1之一侧面剖面示意圖。 ， 圖4係本創作另一實施例之立體示意圖。 圖5係圖4之上視示意圖。 - 圖6係圖4之一側面剖面示意圖。 圖7係本創作再一實施例之立體示意圖。 φ 圖8係圖7之上視示意圖。 圖9係圖7之一侧面剖面示意圖。 【主要元件符號說明】 板卡1 熱源 10、11、12、13 散熱裝置2 散熱鰭片20 翼片21 • 底面22 凹下空間23 開口 24 " 翼片延伸區域25 底面26 開口 27 軸流風扇30 12(fin) and a heat sink composed of an axial fan, that is, a heat sink fin (fm) is disposed on a plurality of electronic components (such as C^U) of the board, and an axial flow fan is used to force air convection to increase The heat capacity is removed to achieve the heat dissipation effect of the heat sink, which is the structure of the conventional electronic component heat sink. In general, the air forced convection heat transfer coefficient increases as the heat transfer surface area increases. Therefore, in order to increase the heat transfer rate, it is usually achieved by increasing the fin area or using an axial flow fan with a large air flow rate, but increasing Surface area and air flow rate are relatively large in volume and vibration noise. The heat sink fin (fm) used in the heat sink is generally made of aluminum extruded body. When mounting, the bottom surface of the diffuser is attached to the upper surface of the raft or its spreader on the board, and then fixed on the LL sheet in a horizontal state - the axial flow is completely ί A recessed space of moderate depth for the volume of the axial flow. Second; buried inside, in order to reduce the overall heat shock to remove the heat transfer rotor Γ: the generated air volume can force air flow but its forced flow == heat of the fins arranged in parallel, several pieces within the cover range The axial flow fan is set to == two lower parts (10) '1: 'The set on the board will form an enthusiasm: the main heat source c can be laid out by electronic components - so that the fan (ie heat, set) u篁 Arrange the heat sink fins and axial flow device to effectively remove heat, but other electronic components (such as other sinks) that form 4 M340490 heat source on the board may generate heat lower than the main heat source. As a primary heat source, it is impossible to use the heat sink of the main heat source to remove the heat of the secondary heat source, and if the fin area is increased or an axial flow fan with a large air flow rate is used to achieve the overall electronic components on a board. The heat dissipation effect has the disadvantages and problems of relatively increasing the volume. Therefore, how to use the layout and volume of the existing heat dissipation device to enhance the heat dissipation effect, that is, neither increase the heat dissipation fin area nor select Conditions larger axial fan air flow cooling down enhance the overall effect of a board 'does have its necessity, and this requires the creation of that is for the designer. [New content] The main purpose of this creation is to provide a heat sink for boards, which is used for boards of high energy density electronic components such as industrial computers and digital video recorders (MD VR). a heat dissipating|storing sheet and an axial flow fan, wherein a bottom surface of the heat dissipating fin is attached to at least one main heat source of the card, such as an upper surface of the wafer, and a plurality of fins arranged in parallel are arranged on the upper portion thereof, and a plurality of recessed spaces are disposed in the plurality of fins, and at least one side of the recessed space is provided with an opening to face at least one secondary heat source other than the main heat source on the card; the axial fan is inclined Fixed in the recessed space in the heat dissipating fin, so that the flowing air volume generated by the axial fan can force air convection between the plurality of parallelly arranged fins to remove heat, and tilted to make part of the air volume The secondary heat source on the card can be blown to the side opening of the recessed space, so as to increase the flow direction and range of the flowing air volume of the axial fan, and the area of the fin can be increased without increasing the fin area. The heat dissipation effect of the heat sink is improved under the condition of the axial fan specification. 5, M340490 Another object of the present invention is to provide a heat sink for a card, wherein the heat sink fin is an aluminum extruded body formed by an aluminum extrusion molding process, which can be machined to have a plurality of wings on the upper portion thereof. A recessed space is formed between the sheets and an opening of at least one side of the recessed space, and a fin extension region is formed by machining, so that the bottom surface of the fin extension region can be correspondingly attached to the board. Other heat sources other than the heat source, and the bottom surface of the fin extension region can be designed and corresponding to the bottom surface of the main heat source on the card to be different planes (ie different heights) when being formed by the aluminum extrusion molding process, so that the heat dissipation fins The shape includes a range of a plurality of fins attached to the board and a height of the bottom surface thereof, and can be matched with the layout of the electronic components (heat source) on the board, thereby improving the fit of the heat sink relative to the board, In order to reduce the volume of the heat sink and increase the heat dissipation effect. Another object of the present invention is to provide a heat sink for a card, wherein the axial direction of the axial fan in the concave space and the angle of the oblique angle are not limited, as the oblique angle can be opposite to the concave space. An opening on one side or a plurality of fins facing the other side, thereby controlling the flow rate of the axial flow fan to be blown to the ratio of the air volume of the plurality of parallel-arranged fins and the opening to the side opening, thereby cooperating The layout of the electronic components (heat source) on the board to improve the overall heat dissipation of the board. Another object of the present invention is to provide a heat sink for a card, wherein the axial fan can be locked on the fins of the fins on the side of the recessed space by self-tapping screws, such as the self-tapping screws are disposed on the two wings. In the gap between the sheets, the assembly work for facilitating the axial fan to be locked in the recessed space in an inclined state is facilitated. [Embodiment] 6 M340490 Refer to Figures i, 2, and 3, and the features are detailed as follows: 'Three-dimensional, top view and horizontal cross-section: 囷. , :: This is the creation of the device - the device of the embodiment 2, mainly: : creation system - heat dissipation of the board, digital video recorder (MDVR) for the vehicle = construction products such as industry to solve the board 1 The problem of heat dissipation. 2 reverse: 1 used, electricity: several pieces of layout (-t) (not shown);: card 1 has - less CPU (CPU) or other IC 曰曰 = sub-component layout to component When operating, the heat source can be divided into two pieces, and the heat sources of the electrons can be divided into two main heat sources: i or the second, but the electrons on the above-mentioned board:: two, such as, and its main heat source, 1G. [11〇ut] of the 11th or the secondary heat source 12 may change the layout mode _=limit according to the functional design requirements of the card 1, and the card 1 of the example is only one embodiment, not for the second and second. The heat sink 2 of the present invention mainly comprises a heat sink fin. The axial flow fan 30, wherein the heat dissipating fins 20 are fixed at 20 and not fixed, and the upper portion is provided with a plurality of parallel rows of 'shaped fins 21, the bottom surface 22 of which is attached to the plate The main heat source on the card 1 = the upper surface of the strip of the spreader, and a recessed space 23 is provided at the plurality of fins 11 or the position. The present embodiment is a square recess, ^ 23 , a square box-shaped axial fan 3 is disposed therein; and the recess: at least one side of the periphery is provided with an opening 24, and the opening of the embodiment is perpendicular to the elongated blade The length direction of the sheet 21 is as shown in Fig. 1, 0 β white for the position of at least one secondary heat source 12 on the opposite card 1. Μ ' 7 H340490 The axial fan 30 is a flat-box fan, which is fixed in a recessed shape on the recessed space of the heat dissipating fin 21+, so that the flow volume of the axial fan 3 can be reduced. The forced flow between the plurality of parallel-arranged fins 21 is as shown by arrows A and B in Figures 2 and 3, thereby removing the heat of the main heat '10, 11 and improving the axial flow fan 3 The flow air volume of the axial flow fan 30 in the inclined state is as shown in the figure 丨, 2, and 3, and the arrow c can be opened by the side of the recessed space 23. 24 blown outwards to blow: board 2: owing to the heat source (1) to increase the force, the axial direction (four) the flow direction and range of the employee's flowing wind ^ as shown in arrows 1, A, B, c in Figures 1, 2, and 3. In order to improve the heat dissipation effect of the heat sink and reduce the equipment cost of the heat sink 2, that is, the area of the heat sink 2 is not changed, and the specifications of the axial fan 30 are not changed (for example, the air flow is larger) The heat dissipation effect of the heat sink 2 is increased under the condition of . ^ The heat sink fins of the heat sink 2 of the present board are generally made of an aluminum extrusion molding process, wherein the recessed space 23 can be machined; and the recessed space 23 The shape of the space is not limited, so that the fins 21 in the recessed space 23 can be mechanically read and removed to the bottom end of the root (i.e., the recessed space, the flaps 21 in the 23 are cut off), as shown in Figures i and 3. Show, or cut to - south and still retain the lower part of the wing 21 (not shown); the shaft is completely buried in the recessed space 23 as shown in _ 3 is not exposed, but when the wing If the height is not substantially the depth of the recessed space 23, the phase body of the axial flow fan 30 may be partially buried in the recessed space 23 to be partially exposed (not shown). The axial flow fan 30 is fixed in an inclined state in the recess 8 of the heat dissipating fin 2; M340490 in the lower space 23, and the oblique orientation and the oblique angle are not limited, such as the tilt of the axial fan 30 The angle can be opposite to the opening 24 of one side of the recessed space 23 as shown in Figs. 1 and 3, that is, the opening direction of the oblique angle is perpendicular to the length direction of the elongated sheet-shaped flap 21; or The plurality of flaps 21 toward the other side of the recessed space 23 are as shown in Figs. 7, 8, and 9, that is, the opening direction of the oblique angle is parallel to the length of the elongated flap 21 Or or to other different orientations of the recessed space 23 (not shown); and the magnitude of the oblique angle may be selected depending on the depth of the recessed space 23; and due to the axial flow, the fan 30 is tilted. The air flow generated by the axial fan 30 can be partially flowed to the side opening 24 of the recessed space 23 by its oblique angle, that is, a part of the air volume is as shown in FIG. 1 and FIG. As shown in the front head C of the middle portion 3, the secondary heat source 12 on the card 1 can be blown outward from the side opening 24 of the recessed space 23. As for the selection of the oblique orientation and the oblique angle of the axial fan 30 in the recessed space 23, the flow air volume generated by the axial fan 30 can be controlled to be blown to the plurality of parallel-arranged fins 21 and blown to the side. The proportion of the air volume between the openings 24 can be appropriately changed in accordance with the layout of the electronic component φ (heat source) on the card 1 to improve the overall heat dissipation effect of the card 1. Moreover, the erection mode in which the axial fan 30 is obliquely disposed in the recessed space 23 is not limited, as it can be applied by the self-tapping screws on the fins 21 on the side of the recessed space 23, such as the self-tapping screws are tightened. In the gap between the two side flaps 21, the flow fan 30 is locked in the recessed space 23 in an inclined state; since the axial fan 30 can be locked in the recessed space by other erection means In the case of 23, if the preset embedding method is used, and the erection method is not the feature of the creation, it will not be described here. 9 M340490 Referring to Figures 4, 5 and 6, respectively, it is a schematic view of a three-dimensional, a top view and a transverse section of another embodiment of the present invention. The main technical features and the purpose of the heat dissipating device 2 of the card of this embodiment are exactly the same as those of the embodiment shown in Figures i, 2 and 3, wherein the heat dissipating fin 20 can be further processed by mechanical processing. The outer periphery of the region further extends outward to form a fin extension region 25, so that the bottom surface 26 of the fin extension region 25 can be correspondingly attached to the card card 1. Other heat sources 13 other than the main heat source 10, 11 and the secondary heat source 12 And the bottom surface 26 of the fin extension region 25 is formed in a different plane (ie, different height) as the bottom surface 22 corresponding to the main heat source on the board 1 when formed by the aluminum extrusion molding process. The shape of the heat dissipation fins 20, including the range of the plurality of fins 21 attached to the board and the height of the bottom surface (22, 26), can be matched with the layout of the electronic components (heat source) on the card 1 In order to improve the compatibility of the heat sink 2 with respect to the card 1, the volume of the heat sink 2 is relatively reduced and the heat dissipation effect is enhanced. Referring to Figures 7, 8, and 9, these are respectively a perspective view of a three-dimensional, a top view and a transverse section of another embodiment of the present invention. The main technical features and the purpose of the heat sink device 2 of the embodiment are the same as those of the embodiment shown in Figures 1, 2 and 3. The main difference between the two is the periphery of the recessed space 23 of this embodiment. The opening is provided with two openings, one of which is disposed in the recessed space 23 - the side lacking opening 24, that is, the opening 24 of the embodiment shown in Figures 1, 2, and 3, the direction of the opening is perpendicular to the strip In the longitudinal direction of the sheet-shaped flap 21, the position of the other heat source (secondary heat source) 13 on the opposite card 1 is as shown by an arrow C in FIG. 8; the other opening is provided on the other side of the recessed space. The opening 27 has an opening direction parallel to the length direction of the elongated sheet-shaped flap 21, and the position of the heat source 12 on the opposite side of the card 1 is as shown in the front of the M340490 in FIG. 8, but the present embodiment The axial flow fan 3〇 obliquely is ready for the county and the opening 27 of the recessed space 23 is as shown in Figs. 7, 8, and 9, and the opening direction of the oblique angle is parallel to the long sheet-shaped flap. When the long-term production direction of 21 is used, the flow air volume generated by the axial flow fan 30 of the present embodiment can be increased by the oblique angle thereof. Divided between the opening 27 and the plurality of parallel-arranged fins 21 to form a mandatory air convection as shown by arrows A and B in Figures 7, 8, and 9 'to remove the main _ 10, 11 and secondary The heat of the heat source 12; and a small portion of the flow of air can flow to the side opening 24 as shown by the arrow c in FIGS. 7, 8 to remove the heat of the other heat source (secondary heat source) 13; thereby, the The flow direction and the heat dissipation range of the flow volume generated by the axial fan 30 are as shown in arrows 7, A, B, and J in FIG. 7, 8, and 9: the heat dissipation effect of the heat sink 2, and the equipment cost of the heat sink 2 is relatively reduced, that is, The heat dissipation effect of the heat sink 2 is improved without increasing the area of the heat dissipation fins 20 and changing the specifications of the axial flow fan = (such as an axial flow fan having a large air flow rate). Referring to FIG. 9 again, wherein the space is ΐ machined, and the space of the recessed space 23 is cut into a slope by the surface f (ie, the fins 21 in the recessed space 23 are recessed 9 As shown, the housing of the axial fan 3 is completely embedded in the recessed two compartments 23 without being exposed and inclined. Yes: the preferred embodiment of the present invention is shown, but for the present invention - only = The spirit of the requirement is limited to 4 = two = this change 'modification' or even the equivalent change, the second entry:: into the heart of the reform. But all will fall into the new protection of the park, M340490 [simple description of the map] BRIEF DESCRIPTION OF THE DRAWINGS Fig. 2 is a top plan view of Fig. 1. Fig. 3 is a side cross-sectional view of Fig. 1. Fig. 4 is a perspective view of another embodiment of the present invention. Figure 4 is a schematic side view of a side view of Figure 4. Figure 7 is a perspective view of another embodiment of the present invention. φ Figure 8 is a top view of Figure 7. Figure 9 is a schematic view of Figure 7. Schematic diagram of the side profile. [Main component symbol description] Board 1 heat source 10, 11, 12, 13 heat sink 2 heat dissipation 20 21 • sheet flap bottom surface 22 recessed space 23 opening 24 " flaps 25 extending the bottom surface area of the opening 27 of the axial fan 26 3012